CN103594437A - Heat dissipation apparatus used for electronic assembly and LED module possessing the heat dissipation apparatus - Google Patents
Heat dissipation apparatus used for electronic assembly and LED module possessing the heat dissipation apparatus Download PDFInfo
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- CN103594437A CN103594437A CN201210291030.3A CN201210291030A CN103594437A CN 103594437 A CN103594437 A CN 103594437A CN 201210291030 A CN201210291030 A CN 201210291030A CN 103594437 A CN103594437 A CN 103594437A
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- heat abstractor
- radiator
- heat
- substrate
- building brick
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Abstract
A heat dissipation apparatus used for an electronic assembly and a LED module possessing the heat dissipation apparatus are disclosed. The invention provides a heat dissipation apparatus used for the electronic assembly. A working fluid used for transmitting heat energy generated by at least one electronic assembly is accommodated in the heat dissipation apparatus. The heat dissipation apparatus comprises a substrate used for installing the at least one electronic assembly and a radiator which forms a cavity with the substrate. The radiator possesses at least one hollow continuous bending structure. The radiator comprises plural hollow portions forming the continuous bending structure and a joint portion which is jointed with the substrate so that the cavity is sealed.
Description
Technical field
The present invention relates to a kind of heat abstractor for electronic building brick and the LED module with this heat abstractor.
Background technology
For guaranteeing the performance of electronic building brick, the heat energy producing while needing to get rid of electronic building brick running.Current heat abstractor adopts the design of fan, heat pipe, fin or its combination mostly, in the mode that sees through conduction (conduction), convection current (convection) and/or radiation (radiation) by the heat energy dissipation that electronic building brick was produced.For example, central processing unit (CPU, Central Processing Unit) known heat abstractor used is generally fan collocation thin thin and radiating fin or heat pipe perfect in workmanship closely.Yet, under the structure of the main body of considering cost, production method, comprising electronic building brick or other factors and cannot adopt heat abstractor as used in CPU time, just be often difficult to reach the radiating effect of expectation.In addition; in adopting the known heat abstractor of heat pipe-fin design; owing to making the surface area between working fluid evaporation and two regions of condensation differ very little in heat pipe; therefore in the situation that the long-time known heat abstractor that uses this type of design often can day by day dwindle radiating effect is significantly glided because of the temperature difference between evaporation and condensation 2nd district.
Summary of the invention
Because previously sayed, for improveing the disappearance of known heat abstractor, the present invention proposes a kind of heat abstractor, to can provide good radiating effect for electronic building brick; In addition, the present invention also proposes a kind of light-emitting diode (LED, Light-Emitting Diode) module that adopts heat abstractor of the present invention, on various lighting.
The invention provides a kind of heat abstractor for electronic building brick, in this heat abstractor, accommodate to transmit a working fluid of the heat energy that at least one electronic building brick produces, this heat abstractor comprises: in order to install a substrate of this at least one electronic building brick, and and this substrate form a radiator of a chamber.In the present invention, this radiator has the Curved Continuous folded structure of at least one hollow, and this radiator comprise form this Curved Continuous folded structure plural hollow part and and this substrate engage so that a junction surface of this cavity seal.In addition, the present invention also provides a kind of LED module that can be used for various lighting, and this LED module comprises heat abstractor of the present invention and is installed at least one LED on this heat abstractor.
The Curved Continuous folded structure that sees through above-mentioned hollow, heat abstractor of the present invention has the condensation space that more known heat abstractor is larger, thereby causes heat abstractor of the present invention can obtain the better radiating effect of more known heat abstractor.
Accompanying drawing explanation
See through the alterations of describing and arrange in pairs or groups above, can more understand advantage of the present invention and feature, wherein:
Figure 1A is the sectional arrangement drawing according to the heat abstractor of one embodiment of the invention;
Figure 1B is the drawing in side sectional elevation along the B-B tangent line of Figure 1A;
Fig. 1 C is the drawing in side sectional elevation along the C-C tangent line of Figure 1A;
Fig. 1 D is the drawing in side sectional elevation along the D-D tangent line of Figure 1A;
Fig. 1 E is the stereogram according to the heat abstractor of one embodiment of the invention;
Fig. 1 F is the stereogram according to the heat abstractor of another embodiment of the present invention;
Fig. 1 G ~ 1J is the schematic diagram of the heat abstractor with radiating fin and kuppe according to another embodiment of the present invention; And
Fig. 2 is the sectional arrangement drawing according to the heat abstractor of another embodiment of the present invention.
The assembly conventional letter simple declaration of this case representative graph:
1,1 ' substrate
11 ' opening
2,2 ' radiator
21 hollow parts
22 solid part
23 junction surfaces
3,3 ' chamber
4,4 ' electronic building brick
5,5 ' air-flow guide member
6 capillary structures
7,7 ' metal sheeting
8 radiating fins
81 first surfaces
82 second
9 kuppes
91 first ends
92 second ends
100,100 ' heat abstractor
Embodiment
Figure 1A ~ 1F presents the heat abstractor 100 according to one embodiment of the invention.
Figure 1A is the sectional arrangement drawing according to the heat abstractor 100 of one embodiment of the invention.Heat abstractor 100 comprises substrate 1 and radiator 2, and the two joins and forms chamber 3, and in chamber 3, accommodates working fluid (not indicating in figure).In addition, as shown in Figure 1A, in the heat abstractor 100 according to one embodiment of the invention, substrate 1 can be in order to be installed up to a few electronic building brick 4, and can install in addition at least one air-flow guide member 5 in the chamber 3 being formed by substrate 1 and radiator 2, and can lay on the inwall of capillary structure 6 at least one part in chamber 3, for example, capillary structure 6 can be positioned at substrate 1 in a side of chamber 3 inside.And, the metal sheeting 7 of porous also can be additionally housed on capillary structure 6, cause capillary structure 6 can be close to the inwall of chamber 3, or, this metal sheeting 7 also can be installed on substrate 1, avoids when the pressure of chamber 3 inside is less than external environment condition substrate 1 to chamber 3 inner recess.
Referring now to Figure 1B ~ 1D, further describe according to one embodiment of the invention the structure of the radiator 2 of heat abstractor 100.Figure 1B is the drawing in side sectional elevation along the B-B tangent line of Figure 1A, and Fig. 1 C is the drawing in side sectional elevation along the C-C tangent line of Figure 1A, and Fig. 1 D is the drawing in side sectional elevation along the D-D tangent line of Figure 1A.From with reference to Figure 1B ~ 1D the Figure 1A that arranges in pairs or groups, radiator 2 has the Curved Continuous folded structure of at least one hollow, and as shown in Figure 1B ~ 1C, in the present embodiment, the radiator 2 with this structure can consist of with plural solid part 22 the plural hollow part 21 of alternative arrangement, or in another embodiment, the radiator 2 with Curved Continuous folded structure also can form (as shown in Fig. 1 F) by plural hollow part 21 entirely; In addition, by known with reference to Figure 1A and Fig. 1 D, in the present embodiment, in approaching substrate 1 place, radiator 2 still comprises junction surface 23, it is surrounded on the surrounding (as shown in Fig. 1 D) of plural hollow part 21 and/or plural solid part 22, and sees through the known juncture of bolt, trip, adhesive agent etc., and substrate 1 engages with the junction surface 23 of radiator 2 and chamber 3 is sealed.
Below continue, with reference to Figure 1A ~ 1D, the radiating mode according to the heat abstractor 100 of one embodiment of the invention is described.When for example light-emitting diode (LED), central processing unit (CPU), or graphic process unit (GPU, Graphics Processing Unit) etc. when at least one electronic building brick 4 of high power electronic assembly is installed in the substrate 1 of heat abstractor 100, the heat energy that electronic building brick 4 produces can conduct in the chamber 3 of heat abstractor 100 via substrate 1, and in the present embodiment, for guaranteeing that heat energy can be concentrated, reach in chamber 3 in order to follow-up heat energy loss operation, the part contacting with electronic building brick 4 in substrate 1 can for example, be formed by the good metal material of heat conductivility (copper), all the other parts that do not contact electronic building brick 4 can adopt ceramic material, resin material, elastomeric material, or plastic material, but in other embodiments, substrate 1 also can be formed and do not affected the normal operation of heat abstractor 100 of the present invention by commaterial.
Next, after absorbing the heat energy suitable with its latent heat of vaporization value, the workflow cognition that is arranged in chamber 3 is evaporated to gaseous state, because the air-flow guide member 5 in chamber 3 is to extend upward 1/3 to 2/3 of about radiator 2 height from the bottom of radiator 2, therefore, the working fluid of gaseous state can be subject to the guiding of this air-flow guide member 5 and flow in the region of court and thermal source (approaching electronic building brick 4 places) apart from each other, cause the working fluid of gaseous state can condensation in the region of stow away from heat, avoid in chamber 3 as crossing and closely make the two temperature difference reduce because of mutual distance between working fluid evaporation and two regions of condensation, thereby cause radiating effect to decline.And in the present embodiment, air-flow guide member 5 can be one of the forming with radiator 2 or separately manufacture, and the profile of air-flow guide member 5 radiator 2 of also can arranging in pairs or groups is made.Although air-flow guide member 5 can further promote the heat dissipation of heat abstractor 100 of the present invention, know present technique person when knowing, heat abstractor 100 also can not have air-flow guide member 5 and still can reach the radiating effect that is better than known heat abstractor.Now continue and be described as follows.
After the working fluid of gaseous state leaves the evaporation region that approaches thermal source, the structure of radiator 2 can absorb the entrained heat energy of working fluid, impel the working fluid that is previously evaporated to gaseous state to be condensed into liquid state, liquid working fluid is again by gravity or be installed in the capillary structure 6 at least one part inwall in chamber 3 and be back to thermal source place or approach the region of thermal source.See through the evaporation-condensation circulation that repeats above-mentioned working fluid, heat abstractor 100 can be defined as away the heat energy that electronic building brick 4 produces.By known with reference to Figure 1A ~ 1D, in an embodiment of the present invention, because radiator 2 has plural hollow part 21, so compared to the known heat abstractor that adopts the additional solid fin of heat pipe, in the chamber 3 of heat abstractor 100 of the present invention, obviously there is the more internal surface area as working fluid condenser zone, therefore, even if use for a long time heat abstractor 100, in chamber 3, still have the temperature in part region lower than condensing temperature, the working fluid that causes this region can cooling condensing and completes the duty cycle of evaporation-condensation, continue the heat radiation running of heat abstractor 100.For guaranteeing the radiating effect of heat abstractor 100, in the present embodiment, the sheet metal thickness of each major part (more than 80%) of the plural hollow part 21 of radiator 2 is not more than 6mm, and it is preferably between between 1mm to 4mm; In addition, in the outside (comprising periphery and end face) of radiator 2, also can be provided with in addition the radiating fin of suitable area of dissipation to improve radiating effect, and the length of radiating fin from radiator 2 toward extension is not more than 70mm, and the length of most of radiating fin is preferably not more than 50mm.
Then with reference to Fig. 1 E, it is the stereogram according to the heat abstractor 100 of one embodiment of the invention.From Fig. 1 E, in the present embodiment, the profile of heat abstractor 100 can be bell.Yet, by changing each development length, angle or other simple space configuration variation each other of the size in each cross section of radiator 2 or the plural hollow part 21 of radiator 2 and/or plural solid part 22, also can be according to required and be bulb type, cylinder type, box (as shown in Fig. 1 F) or other suitable shapes according to the profile of the heat abstractor 100 of another embodiment of the present invention.Therefore, the correlative type of the heat abstractor shown in this specification should only be considered as illustrating use, but not in order to limit the shape according to heat abstractor of the present invention.
Moreover, according to one embodiment of the invention, except above-mentioned feature, in being provided with the heat abstractor 100 of radiating fin 8, also can install in addition at least kuppe 9 of one deck, as shown in Fig. 1 G ~ 1J.At the first surface 81 of radiating fin 8, the side towards second 82 extends upward kuppe 9, and the cross sectional area of its first end 91 is more preferably greater than the cross sectional area of the second end 92, cause the gas (indicating as the arrow in Fig. 1 G ~ 1J) in heat abstractor 100 outsides can be subject to the guiding of kuppe 9 and flow, thereby take away the heat energy that heat abstractor 100 absorbs from electronic building brick 4, can further improve the heat dispersion of heat abstractor 100.And, see through suitable processing procedure, kuppe 9 can for example, be one of the forming, also can independently manufacture individually with other assemblies (radiator 2, radiating fin 8 etc.) of heat abstractor 100, and can be according to profile required and that suitably change kuppe 9 and position with radiating effect preferably.For example, in heat abstractor 100 as shown in Figure 1 G, the kuppe 9 of a upside down funnel runs through radiating fin 8 and radiator 2 seemingly, wherein especially should be appreciated that the part that kuppe 9 runs through radiator 2 is through special selection, cause the gas in heat abstractor 100 outsides can not flow in the chamber 3 of heat abstractor 100; In the heat abstractor 100 of Fig. 1 H and 1I, kuppe 9 coordinates the profile (shape of radiator 2 that can its inner side and different) of radiating fins 8 to make to change and cover radiating fin 8; And in Fig. 1 J, heat abstractor 100 has the kuppe 9 of two layers, one deck runs through radiating fin 8, and another layer covers radiating fin 8.Fig. 1 G ~ 1J only presents several kenels according to kuppe 9 of the present invention, knows this skill person when being thought by above-mentioned teaching and various different variation, thereby improperly shown in Fig. 1 G ~ 1J, is limited.
In addition, Fig. 2 presents the vertical section according to the heat abstractor 100 ' of another embodiment of the present invention.Heat abstractor 100 ' has the structure similar with heat abstractor 100, and similarly element numbers represents identical assembly, and the Main Differences of the two is in the present embodiment, the substrate 1 ' of heat abstractor 100 ' has at least one opening 11 ', in order to put at least one electronic building brick 4 '.See through this opening design, just without electronic building brick 4 ' is welded on substrate 1 ', but electronic building brick 4 ' down can be entered in substrate 1 ', the working fluid that causes electronic building brick 4 ' directly to contact to hold in heat abstractor 100 ' (not indicating in figure), thereby reduce the thermal resistance between electronic building brick 4 ' and radiator 2 ' and can further improve radiating effect.
Just as above-mentioned, say, because heat abstractor of the present invention (routine as directed heat abstractor 100 or 100 ') has good heat dispersion, and can be according to required and form various suitable profile, therefore, LED module in conjunction with the LED of heat abstractor of the present invention and right quantity can be used on various lighting, for example indoor lamp, street lamp, Tunnel Lamp, searchlight or projecting lamp etc.For example, as Figure 1A or embodiment illustrated in fig. 2 in, when bulb adapter and lamp housing etc. assembly being set in addition when thering is the LED module of heat abstractor of the present invention, can obtain the good LED bulb of heat radiation.
Although know that for asking adopting some details encyclopaedizes the present invention, yet have the knack of present technique person when being carried out by above teaching various variation and the correction of the category that falls into appended claims.Therefore, described embodiment should be considered as to explanation and unrestricted, and the present invention is not limited to listed details herein, but contains all simple change of doing according to appended claims of the present invention and equivalent person.
Claims (16)
1. a heat abstractor, for electronic building brick, accommodates to transmit a working fluid of the heat energy that at least one electronic building brick produces in this heat abstractor, this heat abstractor comprises:
One substrate, in order to install this at least one electronic building brick; And
One radiator, and this substrate forms a chamber, this radiator has the Curved Continuous folded structure of at least one hollow, and wherein this radiator comprises:
Plural number hollow part, forms this Curved Continuous folded structure; And
One junction surface, and this substrate engages so that this cavity seal.
2. the heat abstractor as described in the 1st of claim, more comprises:
At least one air-flow guide member, is installed in this chamber, in order to guide the flowing of this working fluid of gaseous state.
3. the heat abstractor as described in the 1st of claim, more comprises:
One capillary structure, is installed on the inwall of at least one part of this chamber.
4. the heat abstractor as described in the 3rd of claim, more comprises:
At least one metal sheeting, be configured on this substrate or this capillary structure, and this metal sheeting has loose structure.
5. the heat abstractor as described in the 1st of claim, wherein
This substrate has at least one opening, in order to put this at least one electronic building brick, causes this at least one electronic building brick can directly contact this working fluid.
6. the heat abstractor as described in the 1st of claim, wherein
The material of this substrate at least comprise metal material and ceramic material, resin material, elastomeric material and plastic material wherein at least one.
7. the heat abstractor as described in the 1st of claim, wherein
This radiator more comprises plural solid part, forms this Curved Continuous folded structure of this radiator together with this plural number hollow part.
8. the heat abstractor as described in the 7th of claim, wherein
Each sheet metal thickness of at least 80% of this plural number hollow part of this radiator is not more than 6mm.
9. the heat abstractor as described in the 1st of claim, wherein
The outside of this radiator is provided with radiating fin.
10. the heat abstractor as described in the 9th of claim, more comprises:
The kuppe of one deck at least, the side at the first surface of this radiating fin towards second extends upward, cause gas in this heat abstractor outside be subject to this at least the kuppe of one deck guiding and flow.
11. heat abstractors as described in the 10th of claim, wherein
This at least the kuppe of one deck run through this radiating fin and/or this radiator, and can not cause the gas in this heat abstractor outside to flow in this chamber of this heat abstractor.
12. heat abstractors as described in the 10th of claim, wherein
This at least the kuppe of one deck cover this radiating fin.
13. heat abstractors as described in the 10th of claim, wherein
This at least the cross sectional area of the first end of the kuppe of one deck be greater than the cross sectional area of its second end.
14. heat abstractors as described in the 1st of claim, wherein
The profile of this radiator is bulb type, cylinder type, box, bell or other suitable shapes.
15. heat abstractors as described in the 1st of claim, wherein
This at least one electronic building brick is LED, central processor CPU, graphic process unit GPU or other high power electronic assemblies.
16. 1 kinds of LED modules, comprise:
One heat abstractor, as the heat abstractor of 1st ~ 14 any one of claim; And
At least one LED, is installed on this heat abstractor
Wherein, this LED module can be used for indoor lamp, street lamp, Tunnel Lamp, searchlight, projecting lamp or other lightings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210291030.3A CN103594437A (en) | 2012-08-15 | 2012-08-15 | Heat dissipation apparatus used for electronic assembly and LED module possessing the heat dissipation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210291030.3A CN103594437A (en) | 2012-08-15 | 2012-08-15 | Heat dissipation apparatus used for electronic assembly and LED module possessing the heat dissipation apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN103594437A true CN103594437A (en) | 2014-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210291030.3A Pending CN103594437A (en) | 2012-08-15 | 2012-08-15 | Heat dissipation apparatus used for electronic assembly and LED module possessing the heat dissipation apparatus |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105202504A (en) * | 2014-06-23 | 2015-12-30 | 进声Eng株式会社 | Heat radiating device |
| CN107448918A (en) * | 2017-09-14 | 2017-12-08 | 杨林 | A kind of heat spreader structures applied to LED lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1760798A (en) * | 2004-10-12 | 2006-04-19 | 奇鋐科技股份有限公司 | Mechanism of heat elimination module |
| CN201035492Y (en) * | 2007-01-26 | 2008-03-12 | 袁世俊 | Cone type secondary heat superconduction heat radiator for CPU, display card |
| US20090266521A1 (en) * | 2008-04-28 | 2009-10-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| TW201144679A (en) * | 2010-06-08 | 2011-12-16 | zong-zhi Hou | Autologous omni-directions circulating cooling device |
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2012
- 2012-08-15 CN CN201210291030.3A patent/CN103594437A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1760798A (en) * | 2004-10-12 | 2006-04-19 | 奇鋐科技股份有限公司 | Mechanism of heat elimination module |
| CN201035492Y (en) * | 2007-01-26 | 2008-03-12 | 袁世俊 | Cone type secondary heat superconduction heat radiator for CPU, display card |
| US20090266521A1 (en) * | 2008-04-28 | 2009-10-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| TW201144679A (en) * | 2010-06-08 | 2011-12-16 | zong-zhi Hou | Autologous omni-directions circulating cooling device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105202504A (en) * | 2014-06-23 | 2015-12-30 | 进声Eng株式会社 | Heat radiating device |
| CN107448918A (en) * | 2017-09-14 | 2017-12-08 | 杨林 | A kind of heat spreader structures applied to LED lamp |
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Application publication date: 20140219 |