CN105202504A - Heat radiating device - Google Patents
Heat radiating device Download PDFInfo
- Publication number
- CN105202504A CN105202504A CN201510349563.6A CN201510349563A CN105202504A CN 105202504 A CN105202504 A CN 105202504A CN 201510349563 A CN201510349563 A CN 201510349563A CN 105202504 A CN105202504 A CN 105202504A
- Authority
- CN
- China
- Prior art keywords
- heat
- dissipating casing
- luminous component
- producing medium
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
- F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat radiating device for an illuminating component. The heat radiating device for the illuminating component according to an embodiment of the invention comprises the components of a heat radiating housing which is arranged behind the substrate of the illuminating component and is provided with an injecting part that is used for selectively injecting refrigerant; and a heat radiating board which extends to outside of the heat radiating housing and radiates heat that is generated by the substrate that performs heat exchange with the refrigerant.
Description
Technical field
The present invention relates to a kind of heat abstractor, relate more specifically to a kind of luminous component heat abstractor, it is arranged at after the substrate of the street lamp being provided with light emitting diode, and for the hot gas produced from described substrate that sheds.
Background technology
General light emitting diode (LightEmittingDiode:LED) refers to make and utilizes the P-N junction of compound semiconductor to close the minority carrier (electronics or hole) constructing and inject, and combining and the semiconductor element of diverging light again according to them.The electric power that described LED consumes compared with existing bulb or fluorescent lamp is less, life-span reaches several times to decades of times, so outstanding in reduction power consumption and durability, therefore use in the following manner: LED element (Chip) be installed on lead-frame and form LED component, multiple LED component being installed on substrate and forming LED module.
But described LED element regulates its brightness according to the size of current applied, recently along with LED element technology growing can apply big current and breakthrough the brightness improving LED element.But, produce a large amount of heat while bright light being produced when LED element applies big current, therefore do not solve described problem and can cause LED element deterioration and the problem of breaking.
In order to prevent described problem, in the system utilizing LED illumination, propose the solve scheme for heat radiation, but heat radiation is when having some setbacks, bad etc. the problem of reliability of luminous efficiency step-down, colour temperature variation, the reduced lifespan of LED and circumferential component, system can occur.Particularly, the step-down of luminous efficiency can become the key element of product price rise, and then can become the principal element of the price competitiveness reducing LED illumination System.
Thereupon in order to use high brightness (30 ~ 200W) LED element, the maximum temperature of LED element should maintain less than 80 DEG C, extra radiator structure be set at the back side of LED module for this reason and use, existing radiator structure is like this in order to effectively transmit heat to heat sink, bury heat pipe in heat sink inside underground and inject cold-producing medium therein, utilize the vaporization of cold-producing medium and liquefaction to enable the heat resulting from LED element be passed to heat sink upper end, thus improve radiating efficiency.
But, such radiator structure will manufacture heat pipe especially and be inserted into the central authorities of heat sink, so have following problem points: be not easy to manufacture also additional extra-pay, and in order to after cold-producing medium is vaporized to heat sink transmission heat will inevitably through the heat pipe outer wall of entreating wherein, so can lose when transmitting heat, if there is hole between heat pipe and heat sink, then described hole can play the effect of heat-barrier material, so be difficult to heat radiation rapidly.
Look-ahead technique document
Patent document
No. 10-2011-0130202nd, (patent document 0001) Korean Patent Laid (publication date: on December 5th, 2011)
Summary of the invention
The object of embodiments of the invention is to provide a kind of heat abstractor, and it is by being provided with the hot gas that produces as the substrate of the luminous components such as street lamp and cold-producing medium carries out heat exchange and stably implements to dispel the heat.
According to an aspect of the present invention, comprising: heat-dissipating casing, it is positioned at after the substrate of luminous component, and is provided with the injection unit optionally injecting cold-producing medium; And heat sink, it is to the lateral of described heat-dissipating casing, and the heat produced at the substrate carrying out heat exchange with described cold-producing medium that sheds.
Described heat-dissipating casing and described heat sink are made into integration.
Described heat abstractor comprises connecting plate, and described connecting plate is formed: insertion groove, and it is for heat-dissipating casing described in insertion portion; First fastener hole, its lateral septal certain distance to described insertion groove for being that medium is arranged on described heat-dissipating casing with secure component; Second fastener hole, it is for being that medium is arranged on described substrate with secure component.
The feature of described heat sink is, alongst multiple with irradiance profile configuration with the guide center of described heat-dissipating casing.
Described heat sink comprises, the radiating groove that groove is formed to length direction.
Described heat sink comprises: stream, and it is communicated with the inside of described heat-dissipating casing and for making cold-producing medium flow to the inner side of described heat sink.
Described stream also comprises: extend stream, it is to the lateral of described heat sink.
Described heat abstractor comprises: the first sealing, its sealing in order to described heat-dissipating casing and inserting.
Described injection unit comprises: inlet, and it is provided with opening portion to flow into cold-producing medium; Piston, it is positioned at the inner side of described inlet and is supported by spring and be set to move to the length direction of described inlet, and has the protrusion district that the Outboard Sections to described opening portion protrudes.
Described injection unit comprises: the second sealing, its be inserted into described inlet outside and for remaining airtight.
It is some that described heat-dissipating casing and heat sink optionally use in aluminium or copper or aluminium copper.
Described heat-dissipating casing is formed with identical or approximate thickness with heat sink.
The feature of luminous component heat abstractor is according to another embodiment of the invention, comprise: heat-dissipating casing, it is arranged in and is provided with after the circle of luminous component or the some of quadrangle or the substrate that is made up of other shapes and is provided with the injection unit injecting cold-producing medium; And heat sink, it is to the lateral of described heat-dissipating casing, and the heat produced at the substrate carrying out heat exchange with described cold-producing medium that sheds, and described heat sink extends to the most gabarit of described substrate.
Luminous component heat abstractor according to another embodiment again of the present invention comprises: heat-dissipating casing, and it is provided with the injection unit optionally injecting cold-producing medium; Connecting plate, it is connected to the one side of described heat-dissipating casing under the state being provided with multiple luminous component; And heat sink, its lateral to described heat-dissipating casing the heat produced at the connecting plate carrying out heat exchange with described cold-producing medium that sheds.
Embodiments of the invention are easy to realize the air remaining in heat-dissipating casing to discharge the injection with cold-producing medium, therefore the operability of operator is improved, and by discharging rapidly the hot gas of the high temperature produced at substrate, thus the damage of the luminous component that can prevent Yin Gaowen and occur.
Accompanying drawing explanation
Fig. 1 is the stereogram of luminous component heat abstractor according to an embodiment of the invention.
Fig. 2 is the longitudinal section of luminous component heat abstractor according to an embodiment of the invention.
Fig. 3 is the cross-sectional view of luminous component heat abstractor according to an embodiment of the invention.
Fig. 4 represents the figure of the injection unit at luminous component heat abstractor according to an embodiment of the invention in conjunction with the state of coupler.
Fig. 5 is the stereogram of luminous component heat abstractor according to another embodiment of the invention.
Fig. 6 is the state sectional view being attached with substrate at luminous component heat abstractor according to an embodiment of the invention.
Fig. 7 is the mode of operation figure of luminous component heat abstractor according to an embodiment of the invention.
Detailed description of the invention
The formation of luminous component heat abstractor according to an embodiment of the invention is described with reference to accompanying drawing.
Referring to figs. 1 through Fig. 3, the heat abstractor 1 according to the present embodiment comprises: inject the heat-dissipating casing (housing) 100 of cold-producing medium, and the heat sink 200 of lateral to described heat-dissipating casing 100.
The substrate 2 being positioned at luminous component according to the heat-dissipating casing 100 of the present embodiment below and be provided with the injection unit 10 of optionally injecting cold-producing medium and be made into integration with described heat sink 200.
Between described heat-dissipating casing 100 and substrate 2, arrange connecting plate 300, described connecting plate 300 is to be close to the one side that state is installed on described heat-dissipating casing 100.
Connecting plate 300 comprises: insertion groove 310, and it is for heat-dissipating casing described in insertion portion 100; First fastener hole 320, its lateral septal certain distance to described insertion groove 310 for described connecting plate 300 being arranged on described heat-dissipating casing 10 with secure component 3 for medium; Second fastener hole 330, it is for being arranged on described substrate 2 for medium by described connecting plate 300 with secure component 3.
The setting of described connecting plate 300 is conducted to described heat-dissipating casing 100 to the heat of conducting from substrate 2 be received and discharge more hot gas by cold-producing medium to heat sink 200, and because heat-dissipating casing 100 with the combinations of states of partial insertion in insertion groove 310, so the hot gas produced from described substrate 2 can conduct to heat-dissipating casing 100 swimmingly.
First fastener hole 320 is formed to install connecting plate 200 at heat-dissipating casing 100, and carry out screw with secure component 3 and be combined, form the installing hole of secure component 3 partial insertion at the heat-dissipating casing 100 facing with described first fastener hole 320, thus maintain the state of stable bond.
Forming the second fastener hole 330 is in order to fixing base 2, and stably fixes for medium with secure component 3.
Use the liquid refrigerant of mixing water and ethanol as injecting inner cold-producing medium according to the heat-dissipating casing 100 of the present embodiment, but can change to other compositions must not be defined in described composition, shows also can use gas refrigerant at this.
Heat sink according to an embodiment of the invention is described.
With reference to Fig. 2 and Fig. 3, heat sink 200 is alongst multiple with irradiance profile configuration with the guide center of heat-dissipating casing 100, in order to improve the alloy that heat sinking function uses heat conductivity high.
Heat sink 200 when substrate 2 is with disk morphosis, below being formed with the size corresponding with substrate 2 or relative large size and being extended laterally with irradiance profile at described substrate 2, and the radiating groove 202 comprising that groove formed to length direction.
Described radiating groove 202 increases the area being used for heat sink 200 and dispelling the heat, thus realizes dispelling the heat by carrying out heat exchange with outer gas with larger area, and the form of radiating groove 202 must not be defined in the form shown in accompanying drawing.
Heat sink 200 according to the present embodiment comprises: stream 210, and it is communicated with the inside of described heat-dissipating casing 100, flows inside described heat sink 200 for making cold-producing medium.
Described stream 210 also non-maintenance cold-producing medium is only injected into the state of the inside of heat-dissipating casing 100, but maintain the state that cold-producing medium is also injected into described heat sink 200 inside, thus can more promptly transmit the hot gas from substrate 2 generation to heat sink 200 and implement heat radiation.
Stream 210, with the thickness opening of relative thin, to prevent distortion and the breakage of heat sink 200, and is not particularly limited numerical value.
Described stream 210 also comprises the prolongation stream 212 of the lateral to described heat sink 200, arranging described prolongation stream 212 is in order to more hot by heat sink 200 promptly conduction laterally, as shown in the drawing, prolongation stream is set with the thickness of the thinner thickness than stream 212, thus prevents the structural strength of heat sink 200 from dying down.
First sealing 10 according to an embodiment of the invention is inserted into the outside of connecting plate 300, thus maintains the state of combining closely with heat-dissipating casing 100, although use the O type ring of quality of rubber materials, shows also can change to other materials at this.
With reference to accompanying drawing, injection unit according to an embodiment of the invention is described.
With reference to (a) to (b) of Fig. 4, injection unit 110 comprises: inlet 112, and it is provided with opening portion 112a so that cold-producing medium flows into; Piston (plunger) 114, it is positioned at the inner side of described inlet 112 and is set to can to move to the length direction of described inlet 112 by spring s resiliency supported, and has the protrusion district 114a that the Outboard Sections to described opening portion 112a protrudes.
The setting of described inlet 112 is injected the function of cold-producing medium to heat-dissipating casing 100 to maintain and before injecting cold-producing medium, make the inner space of heat-dissipating casing 100 maintain vacuum state.Preferably, the inner space of described heat-dissipating casing 100 has the volume of regulation and inner space maintains vacuum state, to improve the heat transference efficiency to described heat sink 200.
Be provided with inside described inlet 12 and to the piston 114 of length direction movement, therefore, when not injecting cold-producing medium to inlet 112 or after cold-producing medium all injects, the open state that district 114a closes opening portion 112 can be protruded.
Piston 114 is by spring s resiliency supported and utilize the second sealing 110a to maintain the sealing of inlet 112, so can not there is the phenomenon that cold-producing medium leaks outside the 113a of opening portion.
The state to heat-dissipating casing injection cold-producing medium according to the present embodiment is described.
In order to inject cold-producing medium to heat-dissipating casing 100, the inside of first described heat-dissipating casing 100 should maintain vacuum state, inserts the insertion projection 32 of the coupler 30 be connected with vacuum plant (not shown) at opening portion 112a for this reason.
Describedly insert protruding 32 and make to be provided with the piston 114 that protrudes district 114a and move to the length direction of inlet 112, meanwhile maintain the elastic compression of spring s, and remain described and insert the state that protruding 32 are inserted into the inner side of inlet 112.
The insertion projection 32 that described heat-dissipating casing 110 passes through combined coupler 30 is all drawn onto outside by remaining in inner air, thus be converted to vacuum state, and when coupler 30 being moved to outside inlet 112 after certain hour, the spring s of resiliency supported gets back to original position, thus while the protruding 32 releasing insertions of the insertion being inserted into opening portion 112a, protrusion district 114a closes described opening portion 112a and maintains vacuum state.
Heat-dissipating casing 100, the process that cold-producing medium injects also is injected in an identical manner by the coupler (not shown) of supply cold-producing medium, so operator can be convenient and correctly inject cold-producing medium.
Optionally use in aluminium or copper or aluminium copper according to the heat-dissipating casing 100 of the present embodiment and heat sink 200 some, and must not be defined in aforesaid material.
Described heat-dissipating casing 100 is formed with identical or approximate thickness with heat sink 200, and during from described heat-dissipating casing 100 to heat sink 200 heat by conduction, the loss caused because of thickness realizes minimizing.
With reference to accompanying drawing explanation luminous component heat abstractor according to another embodiment of the invention.
With reference to Fig. 5, luminous component heat abstractor 1a comprises: heat-dissipating casing 100, and it is positioned at after the substrate 2a of the quadrangle being provided with luminous component, and is provided with the injection unit 110 injecting cold-producing medium; Heat sink 200, its lateral to described heat-dissipating casing 100 heat produced from the substrate 2a carrying out heat exchange with described cold-producing medium that sheds, and described heat sink 200 extends to the most gabarit of described substrate 2a.
In the present embodiment, when substrate 2a is with quadrangle morphosis, heat sink 200 is also in order to more promptly be received in the transmission of the heat that described substrate 2a produces, thus multiplely to extend with the most gabarit of irradiance profile to substrate 2a, stably can implement the heat radiation to the hot gas produced at described substrate 2a thus.
The extending length of heat sink 200, longer from the Angle Position of central authorities more close to substrate 2a of heat-dissipating casing 100, position beyond angle then length relatively shortens, in the full field of described substrate 2a, the hot gas of the high temperature produced at the ad-hoc location of substrate 2a mutually heat sink 200 is set across a certain distance, so can not be concentrated.
As a reference, unaccounted injection unit 110 is identical with the formation of the embodiment illustrated above, so omit detailed description.
With reference to accompanying drawing, the luminous component heat abstractor according to another embodiment again of the present invention is described.
With reference to Fig. 6, the luminous component heat abstractor 1b according to the present embodiment comprises: heat-dissipating casing 100, and it is provided with the injection unit 110 optionally injecting cold-producing medium; Connecting plate 300a, it is connected to the one side of described heat-dissipating casing 100 under the state being provided with multiple luminous component; And heat sink 200, its lateral to described heat-dissipating casing 100 also sheds and is carrying out with described cold-producing medium heat that the connecting plate 300a of heat exchange produces.
According to the connecting plate 300a of the present embodiment different from aforesaid connecting plate and be used as substrate, and install with the state be directly close to described heat-dissipating casing 100, the heat produced according to the operation of luminous component thus, via described heat-dissipating casing 100 and cold-producing medium, is more promptly conducted to heat sink 200 and realizes heat radiation.
The mode of operation of the luminous component heat abstractor according to an embodiment of the invention formed in this way is described with reference to accompanying drawing.
Referring to figs. 1 through Fig. 3 and Fig. 7, the hot gas of high temperature that heat abstractor 1 will produce from substrate 2, arrow as shown, is delivered to by connecting plate 300 and heat-dissipating casing 100 inside being injected with cold-producing medium, and conducts to heat sink 200.
Described heat sink 200 receives by stream 210 and the hot gas transmission extending stream 212 conduction, and be rapidly to the outer conductive of heat sink 200, because be that the contact area contacted with outer gas by radiating groove 202 is increased and realizes dispelling the heat, so the hot gas produced at substrate 2 that can shed restfully.
Above, although to being illustrated according to one embodiment of present invention, but the people in the art with general knowledge can understand not departing from the thought range of the present invention recorded in right, can by inscape additional, change, delete or add etc. and multiple correction and change are carried out to the present invention, but it is still included in interest field of the present invention.
Symbol description
2: substrate
10: the first sealings
100: heat-dissipating casing
110: injection unit
110a: the second sealing
112: inlet
112a: opening portion
114: piston
114a: protrude district
200: heat sink
202: radiating groove
210: stream
212: extend stream
300: connecting plate
310: insertion groove
320: the first fastener holes
330: the second fastener holes
Claims (13)
1. a luminous component heat abstractor, is characterized in that, comprising:
Heat-dissipating casing, it is positioned at after the substrate of luminous component, and is provided with the injection unit optionally injecting cold-producing medium; And
Heat sink, it is to the lateral of described heat-dissipating casing, and the heat produced at the substrate carrying out heat exchange with described cold-producing medium that sheds,
Described heat sink is provided with and is communicated with the inside of described heat-dissipating casing and stream for making described cold-producing medium flow inside described heat sink.
2. luminous component heat abstractor according to claim 1,
Described heat-dissipating casing and described heat sink are made into integration.
3. luminous component heat abstractor according to claim 1, is characterized in that, described heat abstractor comprises connecting plate,
Described connecting plate is formed:
Insertion groove, it is for heat-dissipating casing described in insertion portion;
First fastener hole, its lateral septal certain distance to described insertion groove for being that medium is arranged on described heat-dissipating casing with secure component;
Second fastener hole, it is for being that medium is arranged on described substrate with secure component.
4. luminous component heat abstractor according to claim 1, is characterized in that:
Described heat sink is alongst multiple with irradiance profile configuration with the guide center of heat-dissipating casing.
5. luminous component heat abstractor according to claim 1, is characterized in that, described heat sink comprises:
The radiating groove that groove is formed to length direction.
6. luminous component heat abstractor according to claim 1, wherein, described stream also comprises:
Extend stream, it is to the lateral of described heat sink.
7. luminous component heat abstractor according to claim 1, is characterized in that, described heat abstractor comprises:
First sealing, its sealing in order to described heat-dissipating casing and inserting.
8. a luminous component heat abstractor, it comprises:
Heat-dissipating casing, is provided with the injection unit optionally injecting cold-producing medium after its substrate being positioned at luminous component; And
Heat sink, its lateral to described heat-dissipating casing the heat produced at the substrate carrying out heat exchange with described cold-producing medium that sheds;
Described injection unit, it comprises:
Inlet, it is provided with opening portion to flow into cold-producing medium;
Piston, it is positioned at the inner side of described inlet and is supported by spring and be set to move to the length direction of described inlet, and has the protrusion district that the Outboard Sections to described opening portion protrudes.
9. luminous component heat abstractor according to claim 8, is characterized in that, described inlet, comprising:
Second sealing, its be inserted into described inlet outside and for remaining airtight,
Space is formed with in inside in order to remain airtight.
10. luminous component heat abstractor according to claim 1, wherein, described heat-dissipating casing and heat sink,
What optionally use in aluminium or copper or aluminium and copper alloy is some.
11. luminous component heat abstractors according to claim 1, wherein, described heat-dissipating casing and heat sink,
Formed with identical thickness.
12. 1 kinds of luminous component heat abstractors, is characterized in that, comprising:
Heat-dissipating casing, it is positioned at after the substrate of the quadrangle being provided with luminous component, and is provided with the injection unit injecting cold-producing medium; And
Heat sink, its lateral to described heat-dissipating casing the heat produced at the substrate carrying out heat exchange with described cold-producing medium that sheds,
Described heat sink is provided with and is communicated with the inside of described heat-dissipating casing and stream for making described cold-producing medium flow inside described heat sink, and extends to the most gabarit of described substrate.
13. 1 kinds of luminous component heat abstractors, is characterized in that, comprising:
Heat-dissipating casing, it is provided with the injection unit optionally injecting cold-producing medium;
Connecting plate, it is connected to the one side of described heat-dissipating casing under the state being provided with multiple luminous component; And
Heat sink, its lateral to described heat-dissipating casing the heat produced at the connecting plate carrying out heat exchange with described cold-producing medium that sheds,
Described heat sink is provided with and is communicated with the inside of described heat-dissipating casing and stream for making described cold-producing medium flow inside described heat sink.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0076639 | 2014-06-23 | ||
| KR1020140076639A KR20150146278A (en) | 2014-06-23 | 2014-06-23 | Radiation member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105202504A true CN105202504A (en) | 2015-12-30 |
Family
ID=54950330
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510349563.6A Pending CN105202504A (en) | 2014-06-23 | 2015-06-23 | Heat radiating device |
| CN201520433786.6U Expired - Fee Related CN205026617U (en) | 2014-06-23 | 2015-06-23 | Radiator |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520433786.6U Expired - Fee Related CN205026617U (en) | 2014-06-23 | 2015-06-23 | Radiator |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20150146278A (en) |
| CN (2) | CN105202504A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150146278A (en) * | 2014-06-23 | 2015-12-31 | 주식회사 진성이앤지 | Radiation member |
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| CN102597619A (en) * | 2009-11-05 | 2012-07-18 | 株式会社Elm | Large led lighting apparatus |
| CN103594437A (en) * | 2012-08-15 | 2014-02-19 | 黄贵明 | Heat dissipation apparatus used for electronic assembly and LED module possessing the heat dissipation apparatus |
| CN205026617U (en) * | 2014-06-23 | 2016-02-10 | 进声Eng株式会社 | Radiator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101126074B1 (en) | 2010-05-27 | 2012-03-16 | 주식회사 세명알엔지 | Heat-release LED lighting device with a multipurpose radiator |
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2014
- 2014-06-23 KR KR1020140076639A patent/KR20150146278A/en not_active Application Discontinuation
-
2015
- 2015-06-23 CN CN201510349563.6A patent/CN105202504A/en active Pending
- 2015-06-23 CN CN201520433786.6U patent/CN205026617U/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1576670A (en) * | 2003-06-26 | 2005-02-09 | 太平洋工业株式会社 | Valve core |
| CN1677016A (en) * | 2004-03-30 | 2005-10-05 | 株式会社日立空调系统 | Refrigeration system |
| CN101349412A (en) * | 2007-07-18 | 2009-01-21 | 富准精密工业(深圳)有限公司 | LED lamp |
| CN201304242Y (en) * | 2008-11-20 | 2009-09-09 | 庄德诚 | Air-filled toy with spring structure uni-directional gas charging valve |
| CN102597619A (en) * | 2009-11-05 | 2012-07-18 | 株式会社Elm | Large led lighting apparatus |
| CN103594437A (en) * | 2012-08-15 | 2014-02-19 | 黄贵明 | Heat dissipation apparatus used for electronic assembly and LED module possessing the heat dissipation apparatus |
| CN205026617U (en) * | 2014-06-23 | 2016-02-10 | 进声Eng株式会社 | Radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN205026617U (en) | 2016-02-10 |
| KR20150146278A (en) | 2015-12-31 |
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