CN202769609U - Loop circuit typed radiating device for high-power light emitting diode (LED) - Google Patents
Loop circuit typed radiating device for high-power light emitting diode (LED) Download PDFInfo
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- CN202769609U CN202769609U CN2012204840758U CN201220484075U CN202769609U CN 202769609 U CN202769609 U CN 202769609U CN 2012204840758 U CN2012204840758 U CN 2012204840758U CN 201220484075 U CN201220484075 U CN 201220484075U CN 202769609 U CN202769609 U CN 202769609U
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- heat sink
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Abstract
The utility model discloses a loop circuit typed radiating device for a high-power light emitting diode (LED). The Loop circuit typed radiating device for the high-power LED comprises a shell and an inner pipe installed in the shell. The peripheral face of the shell is provided with radiating fins. The inner wall of the shell and the outer wall of the inner pipe are at mutual intervals to form a steam inner cavity. The outer bottom of the shell is provided with a baseplate, the outer surface of the baseplate is provided with a LED light source, the middle portion of the inner surface of the baseplate is provided with a central channel which is communicated with the inner pipe, the periphery of the central channel is provided with a plurality of bar-typed channels which are communicated with the central channel, and the bar-typed channel is filled with liquid working medium. The periphery of the pipe wall of the lower end of the inner pipe is provided with a capillary core layer. The Loop circuit typed radiating device for the high-power LED has the advantages of being compact, efficient, energy-saving, friendly environmental, simple in structure, low in cost, convenient to install, stable and reliable in operation, diversified in function and the like. The Loop circuit typed radiating device for the high-power LED is not only used for the high-power LED light source, but also is used for the heat management of other electron components, including heat dissipation, heating, working temperature controlling, waste heat recycling utilization and the like. The Loop circuit typed radiating device for the high-power LED is wide in market prospect.
Description
Technical field
The utility model relates to light source radiating device, relates in particular to a kind of loop heat sink device towards high-capacity LED.
Background technology
The LED semiconductor lighting be after incandescent lamp, fluorescent lamp and rare gas lamp the 4th generation electric light source, because of its high efficiency, long-life, the advantage of energy-saving and environmental protection, oneself becomes the target that all over the world light source and light fixture research institution are competitively developed, made great efforts to obtain, and is the star industry of following lighting field.Along with the continuous progress of LED manufacturing technology and exploitation and the application of new material (element nitride crystal and fluorescent material), the LED semiconductor solid-state optical source performance of the coloured light that turns white is constantly improved and entered the practical stage, oneself progressively moves towards the fields such as auto lamp street lamp led light source from special sources such as initial signal lamp, indicator lamps.The LED energy consumption of white light only is 1/8 of incandescent lamp, 1/2 of fluorescent lamp, and its life-span was l ten thousand hours, illumination is for average family " put things right once and for all ".Also can realize simultaneously mercurylessly, reclaim easily, this is significant for environmental protection and energy savings.Therefore national governments all vigorously support.LED needs the above power output of watt level as illumination light source, therefore how to improve light extraction efficiency, solves the key that the great power LED cooling problem is the LED illumination.The continuous increase of LED power, the application subject matter that solves LED is exactly heat dissipation problem.
Along with the development of LED technology, some high-power LEDs have appearred in also gradually the increase of the power of single LEDs, 1W for example, 5W etc.Although the application of great power LED has solved the problem of area occupied,, its caloric value also can increase along with the increase of power.So, development along with high-power LED lamp, the power of encapsulation is more and more higher, but the structure of light fixture then requires compactness, and this is just so that the heat dissipation problem of chip seems especially outstanding, and the heat conduction efficiency of single radiating fin is low, the heat of led chip can not be transmitted on the radiating fin fast, thereby cause led chip heat accumulation to occur, temperature raises, and affects the service life of LED.Therefore only use single radiating fin can't satisfy the radiating requirements of high-capacity LED.
Summary of the invention
The purpose of this utility model is to overcome the shortcoming and defect of above-mentioned prior art, a kind of loop heat sink device towards high-capacity LED is provided, and it is large that it has heat dissipation capacity, and efficient is high, simple in structure, can solve efficiently the heat dissipation problem of high-capacity LED and other electronic devices and components.
The utility model is achieved through the following technical solutions:
A kind of loop heat sink device towards high-capacity LED comprises shell, places the inner tube in the shell, and the outer peripheral face of described shell is equipped with radiating fin; The outer wall space of the inwall of described shell and inner tube forms the steam inner chamber; The outer bottom of described shell is provided with substrate, the outer surface of substrate is provided with led light source, described substrate inner surface middle part offers the central channel that communicates with inner tube, offers a plurality of bar shaped conduits that are communicated with central channel around the central channel, is perfused with liquid working substance in the bar shaped conduit; The periphery of described inner tube lower end tube wall is provided with wick layer, and wick layer is positioned at the top of substrate inner surface.
Offer the liquid injection port for liquid perfusion working medium on the bar shaped conduit.
Liquid working substance is ethanol or acetone.
Combine closely by the heat conduction glue-line between wick layer and the substrate.
Led light source comprises pcb board and the LED that is installed on the pcb board.
The section shape of shell is " protruding " font.
Angle between each bar shaped conduit is 30 °.
Compared with prior art, advantage of the present utility model and effect are:
(1) heat of led light source is passed on the substrate, liquid working substance in the bar shaped conduit is heated and is evaporated to steam, enter in the inner tube by central channel, after the top discharge by inner tube, by by after the steam inner chamber cooling that forms between shell and the inner tube, be back to again wick layer, by the liquid working substance after the wick layer absorption, leak in the bar shaped conduit and store evaporation after the next time heat absorption of wait, so loop of iterative cycles formation.Adopt this structure, the radiating effect that brings is apparent, be that the latent heat that heat that pcb board produces is converted into liquid working substance steam is pulled away, liquid working substance is converted into steam and contacts with the wall of shell and inner tube in the process that rises, heat is dispersed in the outside environment by shell and radiating fin continuously, has effectively played the effect of led light source heat radiation.
(2) utilize the phase change of internal liquid working medium to realize the quick conveying of heat, its capacity of heat transmission increases many times than a simple metallic plate.Substrate (being metal material) surface flat, the pcb board close contact of heated parts and LED, thermal contact resistance reduces greatly.
(3) the cavity flow resistance of liquid working substance in metallic plate is little, therefore can start rapidly.
(4) have compactness, efficient, energy-saving and environmental protection, simple in structure, cost is low, easy for installation, stable and reliable, the advantages such as functional diversities.Need not external force or need not the additive decrementation energy, the heat of led light source is arrived radiating fin by liquid working substance by fast transportation, can effectively realize temperature control to high-capacity LED.In addition, except being applicable to high-power led light source, can also be applied in other the heat management of electronic devices and components, comprise heat radiation, heating, operating temperature control, recycling residual heat etc., have wide market prospects.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is A-A cutaway view among Fig. 1;
Fig. 3 is B-B cutaway view among Fig. 1;
Fig. 4 is C-C cutaway view among Fig. 1.
The specific embodiment
Below in conjunction with specific embodiment the utility model is done further concrete detailed description the in detail.
Embodiment
Such as Fig. 1～shown in Figure 4, the utility model comprises shell 6, places the inner tube 5 in the shell 6 towards the loop heat sink device of high-capacity LED, at the outer peripheral face of shell 6 radiating fin 7 is installed; The outer wall space of the inwall of described shell 6 and inner tube 5 forms steam inner chamber 56; The outer bottom of described shell 6 is provided with substrate 1, the outer surface of substrate 1 is provided with led light source, described substrate 1 inner surface middle part offers the central channel 2 that communicates with inner tube 5, offer a plurality of bar shaped conduits 3 that are communicated with central channel 2 around the central channel 2, be perfused with liquid working substance in the bar shaped conduit 3; The periphery of described inner tube 5 lower end tube walls is provided with wick layer 4, and wick layer 4 is positioned at the top of substrate 1 inner surface.Described led light source comprises pcb board 9 and the LED10 that is installed on the pcb board 9.
Offer the liquid injection port 8 for liquid perfusion working medium on the described bar shaped conduit 3.After filling liquid working medium (liquid filled ratio is at 20%-80%), sealing liquid injection port 8.This liquid working substance can adopt ethanol or acetone, perhaps can long-term compatible liquid with aluminium.
Combine closely by the heat conduction glue-line between described wick layer 4 and the substrate 1, well contact is conducive to better transferring heat, further reduces thermal resistance.
The section shape of described shell 6 is " protruding " font.Angle between each bar shaped conduit 3 is 30 °.
This is substantially as follows towards the loop heat sink device operation principle of high-capacity LED:
The heat of led light source is passed on the substrate 1, liquid working substance (not shown) in the bar shaped conduit 3 is heated and is evaporated to steam, enter in the inner tube 5 by central channel 2, after the top discharge by inner tube 5, by by after steam inner chamber 56 coolings that form between shell 6 and the inner tube 5, be back to again wick layer 4, by the liquid working substance after wick layer 4 absorptions, leak into the 3 interior storages of bar shaped conduit, wait for the rear evaporation of next time heat absorption, so iterative cycles forms a loop.Adopt this structure, the radiating effect that brings is apparent, be that the latent heat that heat that the PCB9 plate produces is converted into liquid working substance steam is pulled away, liquid working substance is converted into steam and contacts with the wall of shell 6 and inner tube 5 in the process that rises, heat is dispersed in the outside environment by shell 6 and radiating fin 7 continuously, has effectively played the effect of led light source heat radiation.
Need to prove, this loop heat sink device inside towards high-capacity LED is vacuum state, and the size of each parts, ratio can be formulated according to actual needs; Inner tube 5 and shell 6 and radiating fin have consisted of condensation end, and substrate 1 is heating end; Shell 6, inner tube 5, wick layer 4, substrate 1, the junction between them welds together closely.
As mentioned above, just can realize preferably the utility model.
Embodiment of the present utility model is not restricted to the described embodiments; other are any not to deviate from change, the modification done under Spirit Essence of the present utility model and the principle, substitute, combination, simplify; all should be the substitute mode of equivalence, be included within the protection domain of the present utility model.
Claims (7)
1. loop heat sink device towards high-capacity LED is characterized in that: comprise shell, place the inner tube in the shell, the outer peripheral face of described shell is equipped with radiating fin; The outer wall space of the inwall of described shell and inner tube forms the steam inner chamber; The outer bottom of described shell is provided with substrate, the outer surface of substrate is provided with led light source, described substrate inner surface middle part offers the central channel that communicates with inner tube, offers a plurality of bar shaped conduits that are communicated with central channel around the central channel, is perfused with liquid working substance in the bar shaped conduit; The periphery of described inner tube lower end tube wall is provided with wick layer, and wick layer is positioned at the top of substrate inner surface.
2. require 1 described loop heat sink device towards high-capacity LED according to claim, it is characterized in that: offer the liquid injection port for liquid perfusion working medium on the described bar shaped conduit.
3. require 2 described loop heat sink devices towards high-capacity LED according to claim, it is characterized in that: described liquid working substance is ethanol or acetone.
4. require each described loop heat sink device towards high-capacity LED in 1～3 according to claim, it is characterized in that: combine closely by the heat conduction glue-line between described wick layer and the substrate.
5. require 4 described loop heat sink devices towards high-capacity LED according to claim, it is characterized in that: described led light source comprises pcb board and the LED that is installed on the pcb board.
6. require 4 described loop heat sink devices towards high-capacity LED according to claim, it is characterized in that: the section shape of described shell is " protruding " font.
7. require 4 described loop heat sink devices towards high-capacity LED according to claim, it is characterized in that: the angle between each bar shaped conduit is 30 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204840758U CN202769609U (en) | 2012-09-20 | 2012-09-20 | Loop circuit typed radiating device for high-power light emitting diode (LED) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204840758U CN202769609U (en) | 2012-09-20 | 2012-09-20 | Loop circuit typed radiating device for high-power light emitting diode (LED) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202769609U true CN202769609U (en) | 2013-03-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204840758U Expired - Fee Related CN202769609U (en) | 2012-09-20 | 2012-09-20 | Loop circuit typed radiating device for high-power light emitting diode (LED) |
Country Status (1)
| Country | Link |
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| CN (1) | CN202769609U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107328277A (en) * | 2017-07-13 | 2017-11-07 | 特能热交换科技（中山）有限公司 | A kind of preparation method for making heat pipe |
-
2012
- 2012-09-20 CN CN2012204840758U patent/CN202769609U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107328277A (en) * | 2017-07-13 | 2017-11-07 | 特能热交换科技（中山）有限公司 | A kind of preparation method for making heat pipe |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130306 Termination date: 20150920 |
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| EXPY | Termination of patent right or utility model |