CN102901069A - Loop type heat-dissipation device for high power light-emitting diode (LED) - Google Patents
Loop type heat-dissipation device for high power light-emitting diode (LED) Download PDFInfo
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- CN102901069A CN102901069A CN2012103522894A CN201210352289A CN102901069A CN 102901069 A CN102901069 A CN 102901069A CN 2012103522894 A CN2012103522894 A CN 2012103522894A CN 201210352289 A CN201210352289 A CN 201210352289A CN 102901069 A CN102901069 A CN 102901069A
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Abstract
The invention discloses a loop type heat-dissipation device for a high power light-emitting diode (LED). The loop type heat-dissipation device comprises a shell and an inner pipe arranged in the shell, heat-dissipation fins are installed on the peripheral surface of the shell, the inner wall of the shell and the outer wall of the inner pipe are mutually spaced to form a steam inner cavity, a substrate is arranged at the outer bottom of the shell, an LED light source is arranged on the outer surface of the substrate, a central groove channel which is communicated with the inner pipe is arranged in the middle of the inner surface of the substrate, a plurality of strip-shaped groove channels communicated with the central groove channel are arranged on the periphery of the central groove channel, a liquid working medium is poured into the strip-shaped groove channels, and a capillary core layer is arranged on the periphery of the pipe wall at the lower end of the inner pipe. The loop type heat-dissipation device for the high power LED has the advantages of being compact, efficient, energy saving, environment-friendly, simple in structure, low in cost, convenient to install, stable and reliable in operation, diversified in function and the like, the loop type heat-dissipation device is suitable for the high power LED light source and also can be applied to heat management of other electron components such as heat dissipation, heating, work temperature controlling and residual heat recycle, and the loop type heat-dissipation device has a wide market prospect.
Description
Technical field
The present invention relates to light source radiating device, relate in particular to a kind of loop heat sink device towards high-capacity LED.
Background technology
The LED semiconductor lighting be after incandescent lamp, fluorescent lamp and rare gas lamp the 4th generation electric light source, because of its high efficiency, long-life, the advantage of energy-saving and environmental protection, oneself becomes the target that all over the world light source and light fixture research institution are competitively developed, made great efforts to obtain, and is the star industry of following lighting field.Along with the continuous progress of LED manufacturing technology and exploitation and the application of new material (element nitride crystal and fluorescent material), the LED semiconductor solid-state optical source performance of the coloured light that turns white is constantly improved and entered the practical stage, oneself progressively moves towards the fields such as auto lamp street lamp led light source from special sources such as initial signal lamp, indicator lamps.The LED energy consumption of white light only is 1/8 of incandescent lamp, 1/2 of fluorescent lamp, and its life-span was l ten thousand hours, illumination is for average family " put things right once and for all ".Also can realize simultaneously mercurylessly, reclaim easily, this is significant for environmental protection and energy savings.Therefore national governments all vigorously support.LED needs the above power output of watt level as illumination light source, therefore how to improve light extraction efficiency, solves the key that the great power LED cooling problem is the LED illumination.The continuous increase of LED power, the application subject matter that solves LED is exactly heat dissipation problem.
Along with the development of LED technology, some high-power LEDs have appearred in also gradually the increase of the power of single LEDs, 1W for example, 5W etc.Although the application of great power LED has solved the problem of area occupied,, its caloric value also can increase along with the increase of power.So, development along with high-power LED lamp, the power of encapsulation is more and more higher, but the structure of light fixture then requires compactness, and this is just so that the heat dissipation problem of chip seems especially outstanding, and the heat conduction efficiency of single radiating fin is low, the heat of led chip can not be transmitted on the radiating fin fast, thereby cause led chip heat accumulation to occur, temperature raises, and affects the service life of LED.Therefore only use single radiating fin can't satisfy the radiating requirements of high-capacity LED.
Summary of the invention
The object of the invention is to overcome the shortcoming and defect of above-mentioned prior art, a kind of loop heat sink device towards high-capacity LED is provided, and it is large that it has heat dissipation capacity, and efficient is high, simple in structure, can solve efficiently the heat dissipation problem of high-capacity LED and other electronic devices and components.
The present invention is achieved through the following technical solutions:
A kind of loop heat sink device towards high-capacity LED comprises shell, places the inner tube in the shell, and the outer peripheral face of described shell is equipped with radiating fin; The outer wall space of the inwall of described shell and inner tube forms the steam inner chamber; The outer bottom of described shell is provided with substrate, the outer surface of substrate is provided with led light source, described substrate inner surface middle part offers the central channel that communicates with inner tube, offers a plurality of bar shaped conduits that are communicated with central channel around the central channel, is perfused with liquid working substance in the bar shaped conduit; The periphery of described inner tube lower end tube wall is provided with wick layer, and wick layer is positioned at the top of substrate inner surface.
Offer the liquid injection port for liquid perfusion working medium on the bar shaped conduit.
Liquid working substance is ethanol or acetone.
Combine closely by the heat conduction glue-line between wick layer and the substrate.
Led light source comprises pcb board and the LED that is installed on the pcb board.
The section shape of shell is " protruding " font.
Angle between each bar shaped conduit is 30 °.
Compared with prior art, advantage of the present invention and effect are:
(1) heat of led light source is passed on the substrate, liquid working substance in the bar shaped conduit is heated and is evaporated to steam, enter in the inner tube by central channel, after the top discharge by inner tube, by by after the steam inner chamber cooling that forms between shell and the inner tube, be back to again wick layer, by the liquid working substance after the wick layer absorption, leak in the bar shaped conduit and store evaporation after the next time heat absorption of wait, so loop of iterative cycles formation.Adopt this structure, the radiating effect that brings is apparent, be that the latent heat that heat that pcb board produces is converted into liquid working substance steam is pulled away, liquid working substance is converted into steam and contacts with the wall of shell and inner tube in the process that rises, heat is dispersed in the outside environment by shell and radiating fin continuously, has effectively played the effect of led light source heat radiation.
(2) utilize the phase change of internal liquid working medium to realize the quick conveying of heat, its capacity of heat transmission increases many times than a simple metallic plate.Substrate (being metal material) surface flat, the pcb board close contact of heated parts and LED, thermal contact resistance reduces greatly.
(3) the cavity flow resistance of liquid working substance in metallic plate is little, therefore can start rapidly.
(4) have compactness, efficient, energy-saving and environmental protection, simple in structure, cost is low, easy for installation, stable and reliable, the advantages such as functional diversities.Need not external force or need not the additive decrementation energy, the heat of led light source is arrived radiating fin by liquid working substance by fast transportation, can effectively realize temperature control to high-capacity LED.In addition, except being applicable to high-power led light source, can also be applied in other the heat management of electronic devices and components, comprise heat radiation, heating, operating temperature control, recycling residual heat etc., have wide market prospects.
Description of drawings
Fig. 1 is structural representation of the present invention;
Fig. 2 is A-A cutaway view among Fig. 1;
Fig. 3 is B-B cutaway view among Fig. 1;
Fig. 4 is C-C cutaway view among Fig. 1.
The specific embodiment
Below in conjunction with specific embodiment the present invention is done further concrete detailed description the in detail.
Embodiment
Such as Fig. 1～shown in Figure 4, the present invention comprises shell 6, places the inner tube 5 in the shell 6 towards the loop heat sink device of high-capacity LED, at the outer peripheral face of shell 6 radiating fin 7 is installed; The outer wall space of the inwall of described shell 6 and inner tube 5 forms steam inner chamber 56; The outer bottom of described shell 6 is provided with substrate 1, the outer surface of substrate 1 is provided with led light source, described substrate 1 inner surface middle part offers the central channel 2 that communicates with inner tube 5, offer a plurality of bar shaped conduits 3 that are communicated with central channel 2 around the central channel 2, be perfused with liquid working substance in the bar shaped conduit 3; The periphery of described inner tube 5 lower end tube walls is provided with wick layer 4, and wick layer 4 is positioned at the top of substrate 1 inner surface.Described led light source comprises pcb board 9 and the LED10 that is installed on the pcb board 9.
Offer the liquid injection port 8 for liquid perfusion working medium on the described bar shaped conduit 3.After filling liquid working medium (liquid filled ratio is at 20%-80%), sealing liquid injection port 8.This liquid working substance can adopt ethanol or acetone, perhaps can long-term compatible liquid with aluminium.
Combine closely by the heat conduction glue-line between described wick layer 4 and the substrate 1, well contact is conducive to better transferring heat, further reduces thermal resistance.
The section shape of described shell 6 is " protruding " font.Angle between each bar shaped conduit 3 is 30 °.
This is substantially as follows towards the loop heat sink device operation principle of high-capacity LED:
The heat of led light source is passed on the substrate 1, liquid working substance (not shown) in the bar shaped conduit 3 is heated and is evaporated to steam, enter in the inner tube 5 by central channel 2, after the top discharge by inner tube 5, by by after steam inner chamber 56 coolings that form between shell 6 and the inner tube 5, be back to again wick layer 4, by the liquid working substance after wick layer 4 absorptions, leak into the 3 interior storages of bar shaped conduit, wait for the rear evaporation of next time heat absorption, so iterative cycles forms a loop.Adopt this structure, the radiating effect that brings is apparent, be that the latent heat that heat that the PCB9 plate produces is converted into liquid working substance steam is pulled away, liquid working substance is converted into steam and contacts with the wall of shell 6 and inner tube 5 in the process that rises, heat is dispersed in the outside environment by shell 6 and radiating fin 7 continuously, has effectively played the effect of led light source heat radiation.
Need to prove, this loop heat sink device inside towards high-capacity LED is vacuum state, and the size of each parts, ratio can be formulated according to actual needs; Inner tube 5 and shell 6 and radiating fin have consisted of condensation end, and substrate 1 is heating end; Shell 6, inner tube 5, wick layer 4, substrate 1, the junction between them welds together closely.
As mentioned above, just can realize preferably the present invention.
Embodiments of the present invention are not restricted to the described embodiments; other are any not to deviate from change, the modification done under Spirit Essence of the present invention and the principle, substitute, combination, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (7)
1. loop heat sink device towards high-capacity LED is characterized in that: comprise shell, place the inner tube in the shell, the outer peripheral face of described shell is equipped with radiating fin; The outer wall space of the inwall of described shell and inner tube forms the steam inner chamber; The outer bottom of described shell is provided with substrate, the outer surface of substrate is provided with led light source, described substrate inner surface middle part offers the central channel that communicates with inner tube, offers a plurality of bar shaped conduits that are communicated with central channel around the central channel, is perfused with liquid working substance in the bar shaped conduit; The periphery of described inner tube lower end tube wall is provided with wick layer, and wick layer is positioned at the top of substrate inner surface.
2. require 1 described loop heat sink device towards high-capacity LED according to claim, it is characterized in that: offer the liquid injection port for liquid perfusion working medium on the described bar shaped conduit.
3. require 2 described loop heat sink devices towards high-capacity LED according to claim, it is characterized in that: described liquid working substance is ethanol or acetone.
4. require each described loop heat sink device towards high-capacity LED in 1～3 according to claim, it is characterized in that: combine closely by the heat conduction glue-line between described wick layer and the substrate.
5. require 4 described loop heat sink devices towards high-capacity LED according to claim, it is characterized in that: described led light source comprises pcb board and the LED that is installed on the pcb board.
6. require 4 described loop heat sink devices towards high-capacity LED according to claim, it is characterized in that: the section shape of described shell is " protruding " font.
7. require 4 described loop heat sink devices towards high-capacity LED according to claim, it is characterized in that: the angle between each bar shaped conduit is 30 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103522894A CN102901069A (en) | 2012-09-20 | 2012-09-20 | Loop type heat-dissipation device for high power light-emitting diode (LED) |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012103522894A CN102901069A (en) | 2012-09-20 | 2012-09-20 | Loop type heat-dissipation device for high power light-emitting diode (LED) |
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| CN2012103522894A Pending CN102901069A (en) | 2012-09-20 | 2012-09-20 | Loop type heat-dissipation device for high power light-emitting diode (LED) |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103775879A (en) * | 2014-01-28 | 2014-05-07 | 海宁伊满阁太阳能科技有限公司 | LED (light emitting diode) lamp with multiple-cold-end type glass heat pipe |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201145244Y (en) * | 2007-12-18 | 2008-11-05 | 陈炳武 | Self-refrigeration cooling LED lamp |
| CN201764459U (en) * | 2010-08-12 | 2011-03-16 | 华南理工大学 | Annular steam chamber cooling device for high-power LEDs |
| CN202132882U (en) * | 2011-03-11 | 2012-02-01 | 陈淑英 | Heat radiation module applicable to high power LED lamp |
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2012
- 2012-09-20 CN CN2012103522894A patent/CN102901069A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201145244Y (en) * | 2007-12-18 | 2008-11-05 | 陈炳武 | Self-refrigeration cooling LED lamp |
| CN201764459U (en) * | 2010-08-12 | 2011-03-16 | 华南理工大学 | Annular steam chamber cooling device for high-power LEDs |
| CN202132882U (en) * | 2011-03-11 | 2012-02-01 | 陈淑英 | Heat radiation module applicable to high power LED lamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103775879A (en) * | 2014-01-28 | 2014-05-07 | 海宁伊满阁太阳能科技有限公司 | LED (light emitting diode) lamp with multiple-cold-end type glass heat pipe |
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Application publication date: 20130130 |