CN1851379A - Heating part-distribution type vaporation-cooling radiating structure - Google Patents
Heating part-distribution type vaporation-cooling radiating structure Download PDFInfo
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- CN1851379A CN1851379A CN 200610011902 CN200610011902A CN1851379A CN 1851379 A CN1851379 A CN 1851379A CN 200610011902 CN200610011902 CN 200610011902 CN 200610011902 A CN200610011902 A CN 200610011902A CN 1851379 A CN1851379 A CN 1851379A
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Abstract
The invention relates to a heat emission component distributing type vaporizing cooling heat emission structure. The insulating tube of the vaporizing box connects to the distributing tube of liquid distributing unit and connects to gas collecting tube through steam pipe. The gas collecting tube connects to condenser, which is connected to liquid distributing unit. The vaporizing cooling medium is poured into the liquid distributing unit and vaporizing box. The heat emission component is fixed on the carrying plate of vaporizing box. The heat quantity could transfer to cooling medium and make the medium vaporize. The vaporized medium taking heat exchange with secondary cooling water to condensate to liquid and flow back to liquid distributing unit. The invention optimizes the structure and ensures the safety and reliability of the circuit.
Description
Technical field
The present invention relates to the heat radiation of various heat generating components, particularly adopt the heat generating components heat radiation of evaporative cooling self-circulation system.
Background technology
At present, along with improving constantly of various control technologys, the capacity of various device is increasing, and the volume of design is more and more littler, the weak link that causes the heat radiation of heat generating components to become place capacity to further develop, for example in big capacity frequency conversion inverter circuit, whether power device can normally work, and is that to influence equipment crucial reliably, and can power device operate as normal, except that the quality of device itself, depend on also that to a great extent device cooperates with the reasonable of radiator.Power device rises junction temperature owing to producing thermal losses in the knot in working order down, if method that need not be suitable is dissipated to the outside with this heat waste, junction temperature will be too high, thereby make power device damage the entire equipment fault.Therefore, must solve the cooling of power device, satisfy the needs of different operating modes.
The type of cooling of heat generating components can be divided into nature cooling, forced air cooling, liquid cools, boiling cooling four big classes.
Nature cooling heat dissipation efficient is low, and the volume of unit power is big, is applicable to that usually rated current is on the less parts of the device below the 20A or caloric value.
Forced air cooling radiating efficiency height is 2～4 times of nature cooling, but noise suck greatly, easily dust, difficult in maintenance, reliability is low relatively, and under the higher working condition of ambient temperature, radiating effect can obviously descend.
The liquid cools mainly cooling medium of usefulness is water or oil.Replace air-cooledly with water-filled radiator, can improve the capacity of device greatly.Because the insulating properties of water are very poor, and can galvano-cautery and leaky occur under high voltage, voltage is high more, and then galvanic corrosion phenomenon is more serious, needs to take extra corrosion protection measure sometimes.Therefore concerning high-pressure installation, its cooling water must be handled by spent ion exchange resin, adopts complicated circulation simultaneously.
The radiating efficiency of oil cooling water-cooled and air-cooled between, oil viscosity is big, needs bigger circulation power, and burning easily.
The boiling cooling has high cooling effectiveness, and the heat transfer efficiency of boiling cooling is than the high several times of oil cooling, and is higher tens times than air cooling, also surpasses water-cooled.Therefore, the volume ratio of boiling cooling device is but much smaller with self-cooling set with the capacity oil cooling.
The cooling effect of immersion type boiling cooling is fabulous, changes the device difficulty, though the effect difference of non-steeped formula cooling, it is very convenient to change device.
Chinese patent CN200320129492.1 " device for high-power power electronic evaporation-cooled device ", proposing the power power electronic devices is the outer panel surface that power model is installed in the evaporative cooling case, the heat that produces during power model work reaches the evaporative cooling case that contacts with module, cooling fluid heat absorption in the case, the boiling cooling.Its heat-transfer effect is better, but its structure particularly requires each heat generating components for the system that heat generating components distributes and relatively disperses, and does not exist under the situation of electricity relation, can not use, must be from newly carrying out structural design.And whole cooling can cause the layout of internal system part to cause restriction, makes whole device volume increase to some extent, and cooling effectiveness does not reach performance preferably.
Summary of the invention
The objective of the invention is to overcome the shortcoming of prior art,, proposed a kind of distribution type vaporation-cooling radiating structure, make the heat generating components of independent distribution keep original various electricity condition, reduce volume, improve radiating efficiency at the heat generating components of independent distribution.The present invention can reduce dielectric leakage that hermetic unit causes to system, shortcoming such as complexity is installed, and relies on the medium latent heat of vaporization to take away heat, the cooling effectiveness height.
The present invention is made up of evaporation box, liquid storage allocation units, discharge, condenser, air inlet pipe and insulation tube, and the mode that adopts boiling to cool off realizes the cooling of device.The heat of heat generating components relies on the effect of conduction and convection current, pass to the cooling medium in the evaporation box, cooling medium heat absorption boiling is taken heat out of by the latent heat of vaporization, and is risen to discharge along pipeline, enter in the condenser by air inlet pipe then and finish exchange heat with cooling pipe, heat is taken away by secondary cooling water, and medium steam becomes liquid, flows back down into the liquid storage allocation units, carry out liquid and distribute recirculation, so form airtight self-circulation system.
The method of the fixedly employing nut screwing clamping of heat generating components of the present invention is fixed on heat generating components on the support plate of evaporation box.Support plate relies on conduction and convection current with the cooling medium in the heat transferred evaporation box heat, the cooling medium heat absorption, and when reaching the saturation temperature under the certain pressure, boiling is taken away heat by the vaporization heat absorption.Support plate outer surface among the present invention, i.e. heat generating components stationary plane polishing, reducing the thermal contact resistance of device and support plate face, support plate the back side designed three kinds of structures, to improve radiating efficiency, the screw of evaporation box dependence both sides is fixed.
Liquid storage allocation units of the present invention are skeletons of entire heat dissipation system cools medium.The liquid storage allocation units are made up of liquid reserve tank, distributing pipe, liquid back pipe, finish respectively and store cooling medium, distribute cooling medium, cooling medium backflow functionality.Material adopts stainless steel, and the capacity of liquid reserve tank designs according to the caloric value of practical devices.Distributing pipe be in charge of number and heat generating components is complementary (being in charge of number=evaporation box number).In order to reduce the current potential influence between each heat generating components, being connected between distributing pipe and the evaporation box relies on insulation tube to connect, as polytetrafluoroethylene (PTFE), rubber tube etc.Liquid back pipe connects with adopting flange connection or flexible pipe being connected of condenser according to actual needs.
The used evaporative cooling medium of the present invention is the evaporative cooling medium that environmental requirement is stablized, satisfied in high insulation, low boiling, physical and chemical performance, as new fluorocarbons Fla, 4310,3000 etc. and the F-113 medium that adopting at present.Normal temperature for liquid, is heated to about 50～60 ℃ down, and the heat absorption evaporation becomes gas.
The present invention has tangible advantage: the cooling effectiveness height, simple in structure, noise is little, reliability is high and the layout of heat generating components is not limited to some extent, optimizes structure.
Description of drawings
Fig. 1 is a specific embodiment of the invention vaporation-cooling radiating structure schematic diagram, among the figure: 10 evaporation boxes, 20 liquid storage allocation units, 30 discharges, 40 condensers, 50 air inlet pipe, 60 insulation tubes;
Fig. 2 is evaporation box 10 structural representations of the present invention.101 tank bodies, 102 feed tubes, 103 steam pipes, 104 support plates, 105 screws;
Fig. 3 a, 3b, 3c are the carrying board structure schematic diagrames of heat generating components of the present invention, and wherein Fig. 3 a is a front view, and figure b, c, d are Fig. 3 a cutaway view; Wherein Fig. 3 b is a light face structure, and Fig. 3 c is a structure with ribbing, and Fig. 3 d is the notch board structure; Screw among Fig. 3 a is used for fixing heat generating components, can design according to the fixing feet or the fixed form of heat generating components;
Fig. 4 is liquid storage allocation units 20 structural representations of the present invention.201 liquid storage casings, 202 liquid back pipes, 203 band valve leakage fluid drams, 204 distributing pipes.
The specific embodiment
The invention will be further described below in conjunction with the drawings and specific embodiments.
Specific implementation method of the present invention as shown in Figure 1.Square evaporation box 10 links to each other with the distributing pipe 204 of liquid storage allocation units 20 by insulation tube 60.Square evaporation box 10 links to each other with discharge 30 by the steam pipe 103 above it.Discharge 30 is connected with condenser 40 by air inlet pipe 50 above it.The liquid storage allocation units 20 of condenser 40 below it are connected by flexible pipe or flange, have formed the airtight self-loopa radiator structure of a kind of heating part-distribution type evaporative cooling medium.Inlet by condenser 40 tops charges into evaporative cooling medium, and the amount of pouring into is advisable for the liquid storage casing 201 with liquid storage allocation units 20 soaks completely.Heat generating components adopts the method for nut screwing clamping, parts are fixed on 104 of the support plates of evaporation box 10, the heat of heat generating components relies on the effect of conduction and convection current when operation, pass to the cooling medium in the evaporation box 10, cooling medium heat absorption boiling, by heat of vaporization heat is taken out of, and rise to discharge 30 along steam pipe 103 pipelines, enter in the condenser 40 by air inlet pipe 50 then and finish exchange heat with cooling pipe, heat is taken away by secondary cooling water, and medium steam becomes liquid, flows back down into liquid storage allocation units 20, the circulation of reallocating so just forms airtight self-circulation system.
Fig. 2 is evaporation box 10 structural representations of the present invention.Tank body 101 adopts the welding or the casting of the high metal material of thermal conductivitys such as copper or aluminium to form, and forms a square box.Heat generating components is fixed in support plate 104 by screw 105.Feed tube 102 is used for irritating liquid to tank body 101, and when the heat generating components adstante febre, with the cooling medium of heat transferred tank body 101 inside, during temperature under reaching certain saturation pressure, medium comes to life, and steam bubble rises to discharge by steam pipe 103.The through hole of the right and left of the one side (bottom surface) relative with support plate 104 is used for fixing evaporation box 10 in the tank body 101.
Fig. 3 is the carrying board structure schematic diagram of heat generating components of the present invention.In order to improve cooling effectiveness, and do not influence the weight capacity of device, the present invention has designed three kinds of different carrying board structures.Light face structure as Fig. 3 a: the outer surface of support plate 104, promptly the heat generating components stationary plane requires to grind, polish, and guarantees flatness, reduces thermal contact resistance, and the back side contacts with cooling medium, does not deal with.Fig. 3 b is a structure with ribbing: in order to reduce the weight of liquid storage box, and improve heat transfer efficiency, the polishing of support plate 104 outer surfaces guarantees flatness, reduces thermal contact resistance, and the back side and cooling medium contact portion make with ribbing, comprises level, vertical.Notch board structure shown in Fig. 3 c: the back of screw 105 is thicker, and the part attenuate that contacts with heat generating components reduces thermal resistance and weight reduction.
Fig. 4 is a liquid storage dispense unit configurations schematic diagram of the present invention.Total can adopt stainless steel material to be welded.Liquid storage casing 201 adopts welding method to constitute one with distributing pipe 204 and liquid back pipe 202, and the pipe that distributing pipe 204 is done the minor diameter of house steward and some by a bigger pipe of diameter is welded.Liquid back pipe 202 connects with adopting flexible pipe or flange being connected of condenser 40, and band valve leakage fluid dram 203 is arranged in the bottom of distributing pipe 204, is used to discharge cooling medium.
The present invention adopts evaporative cooling, and is simple in structure, easy for installation, cooling effectiveness height and noiseless etc.The present invention is applicable to the cooling that is applied to the various device heat generating components, as diode, triode, IGBT, IGCT, IGCT, can turn-off transistor and circuit board etc.
Claims (4)
1. a heating part-distribution type vaporation-cooling radiating structure is characterized in that comprising evaporation box [10], liquid storage allocation units [20], discharge [30], condenser [40], air inlet pipe [50], insulation tube [60]; Square evaporation box [10] links to each other with the distributing pipe [204] of liquid storage allocation units [20] by the insulation tube [60] of its side, and links to each other with discharge [30] by the steam pipe [103] above it; Discharge [30] is connected with condenser [40] by air inlet pipe [50] above it; The liquid storage allocation units [20] of condenser [40] below it are connected by flexible pipe or flange; Evaporative cooling medium pours into liquid storage allocation units [20] and evaporation box [10], and medium soaks liquid storage allocation units [20] liquid storage casings [201] full; Heat generating components is fixed on the support plate [104] of evaporation box [10] by screw [105]; Discharge [30] will be a little more than liquid reserve tank body [201] on structural configuration.
2. according to the described heating part-distribution type vaporation-cooling radiating structure of claim 1, it is characterized in that evaporation box [10] adopts Metal Material Welding such as the high copper of thermal conductivity, aluminium or casting to form; The support plate [104] of evaporation box [10] can adopt tabula rasa [3a] or ribbed plate [3b] or notch board [3c] structure.
3. according to the described heating part-distribution type vaporation-cooling radiating structure of claim 1, it is characterized in that liquid storage allocation units [20] are made up of liquid storage casing [201], liquid back pipe [202], band valve leakage fluid dram [203], distributing pipe [204]; The quantity of being in charge of of distributing pipe [204] equates with evaporation box quantity; Be connected by insulation tube between distributing pipe [204] and the evaporation box [10], band valve leakage fluid dram [203] is arranged at the bottom of distributing pipe [204]; Liquid back pipe [202] is connected with flange with condenser [40] or flexible pipe connects.
4. according to the described heating part-distribution type vaporation-cooling radiating structure of claim 1, it is characterized in that the evaporative cooling medium of placing in the described evaporation box [10], liquid storage allocation units [20] is the evaporative cooling medium that environmental requirement is stablized, satisfied in high insulation, low boiling, physical and chemical performance, as Fla, 4310, AE3000 etc. and F-113.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610011902 CN1851379A (en) | 2006-05-16 | 2006-05-16 | Heating part-distribution type vaporation-cooling radiating structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200610011902 CN1851379A (en) | 2006-05-16 | 2006-05-16 | Heating part-distribution type vaporation-cooling radiating structure |
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| CN1851379A true CN1851379A (en) | 2006-10-25 |
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| CN 200610011902 Pending CN1851379A (en) | 2006-05-16 | 2006-05-16 | Heating part-distribution type vaporation-cooling radiating structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102032822A (en) * | 2011-01-11 | 2011-04-27 | 浙江大学 | Loop heat pipe (LHP) by use of air lift pump effect |
| CN102185463A (en) * | 2011-03-24 | 2011-09-14 | 中国电力科学研究院 | Direct-current converter valve cooling device based on constant-pressure type evaporating and cooling technology |
| CN111682555A (en) * | 2020-04-17 | 2020-09-18 | 新风光电子科技股份有限公司 | Cascade high-voltage SVG power cabinet with oil as insulation and self-circulation cooling |
-
2006
- 2006-05-16 CN CN 200610011902 patent/CN1851379A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102032822A (en) * | 2011-01-11 | 2011-04-27 | 浙江大学 | Loop heat pipe (LHP) by use of air lift pump effect |
| CN102185463A (en) * | 2011-03-24 | 2011-09-14 | 中国电力科学研究院 | Direct-current converter valve cooling device based on constant-pressure type evaporating and cooling technology |
| CN111682555A (en) * | 2020-04-17 | 2020-09-18 | 新风光电子科技股份有限公司 | Cascade high-voltage SVG power cabinet with oil as insulation and self-circulation cooling |
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Open date: 20061025 |