CN1851908A - Power semi-conductor device evaporation cooling apparatus - Google Patents
Power semi-conductor device evaporation cooling apparatus Download PDFInfo
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- CN1851908A CN1851908A CN 200610011952 CN200610011952A CN1851908A CN 1851908 A CN1851908 A CN 1851908A CN 200610011952 CN200610011952 CN 200610011952 CN 200610011952 A CN200610011952 A CN 200610011952A CN 1851908 A CN1851908 A CN 1851908A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
This invention relates to an evaporating and cooling device of a power semiconductor device, in which, a hollow pipeline is collocated in its radiator, a solution inlet pipe and a gas outlet are set at the top and bottom of the radiator and an evaporating and cooling medium is charged in the pipe, a large power semiconductor device is installed on the surface of the outside plate of the radiator and the heat generated by the power semiconductor device at work is transferred to the radiator contacted with the device, the medium absorbs heat and evaporates to generate phase change at the boil according to the boiling heat exchange mechanism, since the density voltage difference generates a flowing press head acted by the acceleration of gravity to overcome the resistant pressure drop to form circulation of a certain flux to drive the cooling medium to evaporate to the steam state at the boiling point and rise to the top of the condenser then exchanges with the cooling circulation water in it to be condensed to liquid and flows back to the radiator.
Description
Technical field
The present invention relates to a kind of cooling device of power semiconductor, especially relate to the evaporation-cooled device of power semiconductor.
Background technology
Along with increasingly extensive application in aspect such as high-voltage AC transmission technology, ac variable speed technologies, the compact of power electronic equipment and integrity problem more and more receive vast power technology personnel's concern.In influencing the multiple factor of power electronic equipment reliability, heat radiation is vital one.The heat that is produced during large power semiconductor device (also claiming power electronic device) work, to cause the rising of chip temperature, if there is not suitable cooling measure, may makes the temperature of chip surpass the maximum junction temperature that is allowed, thereby cause the deterioration so that the damage of device performance.So in circuit design, select suitable radiating mode, and reasonably design, be that the potentiality of device are not fully exerted, improve one of circuit reliability important key link.
The modern power electronic device generally adopts air cooling or water-cooled.Should, from the angle of heat radiation, water-cooled is very desirable.But water circulation system technological requirement height is installed complexity, and in a single day maintenance workload is big, and leaks, can bring potential safety hazard.So the occasion that the enough air coolings of energy are dealt with problems does not just adopt water-cooled.The reliability and the corrosion two large problems of system when adopting water-cooled must solve the purity of cooling water and long-time running.In a word, developing and select new and effective heat dissipation technology that power electronic equipment is cooled off, is important measures of assurance device reliability and reduction equipment volume.
Chinese patent 200320129492.1 discloses a kind of device for high-power power electronic evaporation-cooled device, comprises evaporative cooling case 8 and condenser 9, and condenser 9 places on the evaporative cooling case 8, and condenser pipe 3, water inlet 1 and delivery port 2 are arranged in the condenser 9; Evaporative cooling case 8 and condenser 9 be linked as one whole or with condenser 9 splits, both are communicated with by tube connector 7; Wall with device contacts in the evaporative cooling case 8 is the plane, in be filled with cooling fluid 5, power model 4 is fixed on the outer panel surface of evaporative cooling case 8.This evaporative cooling case adopts the positive displacement structure, and internal volume is bigger, and amount of liquid is many, and casing wall seam adopts welding manner, and venthole is arranged at top, carries out heat transmission with device.Through repeatedly prototype test, find that its structure has following shortcoming,, solder side big as: volume, sealing surface are many, make the installation and processing maintenance all inconvenient; The coolant cost is higher and than great, pouring amount is many, and cost is also high, and weight is big, and design margin is excessive simultaneously.
Summary of the invention
For overcoming the shortcoming of prior art, the present invention has optimized the design of prior art, and a kind of evaporation-cooled device of follow-on non-steeped mode is provided.The present invention processing is simpler, good seal performance, volume are little, can reduce cost.Can under certain specific condition, act on.
The present invention is made up of the evaporative cooling for heat radiation device and the condenser that are used for installing device, condenser places on the evaporative cooling for heat radiation device, be communicated with tube connector, the base contact-making surface of evaporative cooling for heat radiation device and device distribute heat is the plane, device is anchored on evaporative cooling for heat radiation wall face, condenser pipe is arranged in the condenser, and the condenser outside has water inlet and delivery port to be convenient to be connected service pipe, logical secondary cooling water in the condenser pipe.Fill evaporative cooling medium in the evaporative cooling for heat radiation device, coolant adopts the evaporative cooling medium of moderate boiling point compliance with environmental protection requirements.
Power semiconductor is the outer panel surface that base that power electronic device is used for distribute heat is installed in the evaporative cooling for heat radiation device, the evaporative cooling for heat radiation device is filled with coolant, the heat that power semiconductor when work produces reaches evaporative cooling for heat radiation device with device contacts by the device heating face, according to boiling heat transfer mechanism, coolant heat absorption in the evaporative cooling for heat radiation device, produce phase transformation in the boiling point evaporation, because the flow head that density pressure reduction generates under the acceleration of gravity effect, overcome the circulation that resistance pressure drop forms certain flow, make coolant flash to steam state and rise to condenser top at fluidizing point, and with its in cooling circulating water carry out heat exchange and be condensed into liquid after, flow back to the evaporative cooling for heat radiation device again.So vapor cooling system is because the decalescence amount is big, so can cool off efficiently device for high-power power electronic.This structure power device aggregate erection is convenient, also can with the chip of power device directly with evaporative cooling for heat radiation device encapsulation one, radiator adopts conductive metallic material, does contact conductor simultaneously, is that whole electrical system architecture is simple and flexible.A box typed structure power device concentrates on the casing wall, and device is installed and the electrical connecting wires inconvenience.
Evaporative cooling for heat radiation device of the present invention is the duct type structure, and radiator inside is hollow pipe, can be screwed pipe, micro-rib pipe, collapsible tube, or porous surface tube, adopts section bar or casting to make, to reduce solder side.The radiator upper and lower end parts is provided with inlet and venthole.Coolant flows in pipeline, carries out heat transmission with device.Owing to adopted the duct type structure, the present invention is littler than the structural volume of Chinese patent 200320129492.1, and pouring amount is little, and the sealing structure face reduces.
The present invention is based on flow boiling and heat transfer principle in the pipe.Flow boiling is meant liquid under differential pressure action, the boiling phenomenon that is taken place when flowing through heating surface with certain flow velocity.The evaporative cooling case positive displacement structure of prior art adopts big volume boiling heat transfer principle, and so-called big volume saturation boiling is meant the boiling phenomenon that heating surface is taken place in the liquid of no forced convertion by infiltration.Because the heating surface place gets air bubble growth and is subjected to adjection on the fluid flow direction, be that local gasification changes, as change initial boiling condition, reduce the bubble disengagement diameter, increase the bubble ease from frequency, influence bubbling polymerization process etc., therefore, the mechanism of boiling in ducts is more more complicated than big volume boiling.The factor that influences boiling in ducts is a lot, at first is the influence of liquid flowing velocity in pipe, by forcing mobile convection heat transfer equation
When heat load is very low, i.e. boiling is when very weak, and the exothermic coefficient α convection heat transfer when not seething with excitement basically is consistent.Only just demonstrate the humidification of boiling to heat release when flow velocity w is very little, when q constantly increased, the numerical value of α also constantly increased, and the influence of flowing velocity then weakens gradually; When having only flow velocity very high, just demonstrate influential to α.
The condition that the steam bubble of formation breaks away from from heating surface is depended in the arrival of critical condition to a great extent during boiling in ducts.So when flowing velocity improved, steam bubble was washed away from heating surface by liquid stream easily, makes critical point come a little later, thereby has improved q
KPThe numerical value of (critical thermal load).
The pipe in steam content what to the boiling heat release very big influence is also arranged, above-mentioned relational expression about liquid exothermic coefficient of flow boiling in pipe, the little situation of steam content in the liquid when being meant boiling, when steam content in the unit volume is very big, α just increases sharply, this is because account for the most steam of volume in the pipe center flow, liquid then is pressed against wall and forms thin film, this layer film is flowing at high speed, thereby formed the advantage of heat release, improved the heat exchange efficiency of liquid.
During big volume boiling, by the free convection that the temperature difference causes, flow boiling is with certain flow velocity heating surface of flowing through, the boiling phenomenon identical with the bubble direction, heat transfer has invigoration effect to nucleate boiling, and caliber is more little, invigoration effect is obvious more, h free convection＜h convection current of flowing.
Owing to adopt pipeline configuration, can be by changing the surface configuration of runner, to improve the forced-convection heat transfer coefficient, pipeline can adopt various forms of internally finned tubes, inner helix pipe, the convergent-divergent pipe, band pipe etc., as adopt the vertical lifting screwed pipe, its thermal transmission coefficient is 1.6～2 times of light pipe. or adopt inner micro-rib pipe, the micro-rib pipe thermal transmission coefficient is 1.2～1.5 times of light pipe, changing flow channel shape can make boiling be strengthened, reason is because the violent whirlpool of fluid particle velocity variations or generation, constantly wash away flow boundary layer, make correspondingly attenuate of flow boundary layer and heat transfer boundary layer, thereby can improve heat transfer efficiency.Porous surface tube also is a kind of formed heat exchange after covering porous layer on the smooth surface, and it also can be strengthened significantly to boiling heat transfer.By the processing technology difference, be divided into four kinds on slug type, machining type, spary coating type and electrochemical corrosion type etc.Its thermal transmission coefficient can reach about 5 times of smooth surface.Why porous surface can be obtained preferably, and the enhanced heat exchange effect is that it has a large amount of gasification cores and higher bubble disengagement frequency, the two-phase flow velocity improves, thermal transmission coefficient is raise, simultaneously, its design feature makes that can set up stable gas-liquid two-phase in the porous layer flows and the heat and mass circulation.
The body structure of Chinese patent 200320129492.1 belongs to free convection heat transfer, and the present invention adopts the measure of duct type structure and multiple augmentation of heat transfer, improves convective heat transfer efficient, and therefore from principle analysis, heat-transfer effect of the present invention is better.Evaporative cooling for heat radiation device inner tubular structure can be determined according to parameter such as heat load ability, velocity of medium and mutual calculating of critical heat flux density.
Increase because the failure rate of power device is pressed exponential function with the rising of junction temperature, so must guarantee that its inner junction temperature remains within the junction temperature of permission during the device operation.For reducing device junction temperature, must design the alap heat flow path of thermal resistance, the heat of device can be exhaled as early as possible by it, according to the basic principle of thermal conduction study, promptly to improve convection transfer rate and reduce surperficial contact heat resistance.Duct type structure of the present invention from the above improves than the heat exchange coefficient of the body structure of Chinese patent 200320129492.1.Promptly can reduce the wall thickness that radiator contacts with the element heating face for reducing surperficial contact heat resistance, can adopt the good metal of thermal conductivity (as red copper), and add the good silicone grease of thermal conductivity between contact-making surface, to reduce the space between the contact-making surface, these measures all can reduce thermal resistance.
Cooling effectiveness height of the present invention, structure is simple relatively, it is convenient that device is installed and overhauled, simultaneously because coolant itself has insulating properties, therefore improved the reliability of device, the fault that the dewfall of no water-cooled, water route current potential are fixing, water route obstruction, corrosion etc. bring and the investment of water treatment facilities, better economy.
Description of drawings
Fig. 1 a is one of embodiment of the invention: aerial condenser formula evaporative cooling for heat radiation device split-type structural schematic diagram, and Fig. 1 b is a radiator private side view;
Fig. 2 a is two of the embodiment of the invention: a plurality of evaporative cooling for heat radiation device of water condenser formula parallel-connection structure schematic diagram, Fig. 2 b are radiator side-looking internal cross section figure;
Fig. 3 a is three of the embodiment of the invention: wind outside cold type evaporative cooling for heat radiation device integral structure schematic diagram, Fig. 3 b is that radiator is faced internal cross section figure.
Among the figure: 1 evaporative cooling for heat radiation device, 2 power semiconductors, 3 water condensers or aerial cooler, 4 cooling waters or wind inlet, 5 cooling waters or wind outlet, 6 collector tubes, 7 liquid back pipes, 8 balance pipes, 9 steam outlet pipes, 10 evaporative cooling mediums, 11 set bolts, 12 electrical connectors, 13 fin, 14 radiator casings, 15 feed tubes.
Embodiment
The present invention is further described below in conjunction with the drawings and specific embodiments.
One embodiment of the present of invention as shown in Figure 1a, aerial condenser formula evaporative cooling for heat radiation device split-type structural.Condenser is an aerial cooler 3, evaporative cooling for heat radiation device 1 and aerial cooler 3 splits, and aerial cooler 3 places on the evaporative cooling for heat radiation device 1, and both are communicated with by steam outlet pipe 9, and blower fan blows into cold wind from import 4, produces by boasting from exporting 5.Evaporative cooling for heat radiation device 1 external dimensions: wide * thick * height is 100mm * 30mm * 630mm.Shown in Fig. 1 b, evaporative cooling for heat radiation device 1 wide 100mm * thick 30mm * high by 590, inside is the square pipe of wide 90mm * thick 15mm * high 590, the inner surface spraying is porous surface, increases the bubble disengagement frequency of gasification core and raising, the enhanced heat exchange effect.Charge into evaporative cooling medium 10 in the inside of radiator 1.The outer panel Surface Machining of evaporative cooling for heat radiation device 1 becomes smooth plane, installation power semiconductor device 2.The outer panel of the heat of power semiconductor 2 by evaporative cooling for heat radiation device 1 reaches the evaporative cooling medium 10 in it, coolant 10 evaporates at boiling point, produce decalescence, because the flow head that density pressure reduction generates under the acceleration of gravity effect, overcome the circulation that resistance pressure drop forms certain flow, make coolant 10 flash to steam state and rise to aerial cooler 3 tops at fluidizing point, and with its in cold air carry out heat exchange and condense into liquid after, flow back to evaporative cooling for heat radiation device 1 again.The aerial cooler of this mode or water condenser are placed more flexible, simple in structure, easy to maintenance.A plurality of power devices are installed in same surface, because electric conducting materials such as employing copper are made radiator, can draw electric connection line at the device pole plate again, and the double battery lead plate lead-in wire of doing of available radiator is connected with external power cord by electrical connector 12.As Fig. 1 b is shown in the internal structure profile.
Experiment shows: this embodiment operating current is 2520A, and when pressure was 0.008MPa, 63 ℃ of power semiconductor 2 mean wall temperatures were in 76 ℃ of the shell temperature; Operating current is 2520A, when pressure is 0.015MPa, and 64 ℃ of power semiconductor 2 mean wall temperatures, the shell temperature can be controlled in 78 ℃; Operating current is 2520A, and pressure is 0.0225MPa, voltage 3.79v, and when power is 3528w, 65 ℃ of power semiconductor 2 mean wall temperatures, the shell temperature can be controlled in 78 ℃; Along with the coolant steam pressure in the evaporative cooling for heat radiation device 1 raises, the shell temperature has slightly and raises, and this is because the boiling point of coolant 10 raises with pressure, causes that wall temperature raises, if be negative pressure, wall temperature can reduce, and the shell temperature also can be along with reduction.
Adopt non-steeped formula vapor cooling system cooling high power device can reach desirable cooling effect.And a radiator can cool off a plurality of power devices, cooling effectiveness height simple in structure.
An alternative embodiment of the invention, a plurality of evaporative cooling for heat radiation devices are in parallel split type shown in Fig. 2 a with water condenser, and 6 evaporative cooling for heat radiation devices 1 are communicated with by steam outlet pipe 15 and balance pipe 8, are communicated with water condenser 3 at its top, and condenser is equipped with condenser pipe.Power semiconductor 2 is installed between the outer panel surface of evaporative cooling for heat radiation device 1, and is fixing with set bolt 11.For improving thermal conductivity, evaporative cooling for heat radiation device 1 is a hollow shell, and outer surface is processed smooth smooth.Radiator 1 internal structure is shown in Fig. 2 b, and in the inside of radiator 1, the inside spin pipe that is 10mm with 9 uniform side by side diameters of Width is central authorities, and moulding is built with copper in the outside, and is leaving feed tube 15 and the steam outlet pipe 9 that confluxes up and down.Smear thermal grease conduction between the wall to reduce thermal resistance at power semiconductor 2 with contacting, hollow shell in the evaporative cooling for heat radiation device 1 fills evaporative cooling medium 10, water condenser 3 comprises water inlet 4, delivery port 5, six evaporative cooling for heat radiation device 1 tops are communicated with balance pipe 8 by end steam outlet pipe 9, the bottom is communicated with collector tube 6 by end feed tube 15, and collector tube 6 is communicated with evaporator overhead condenser 3 by liquid back pipe 7.The outer panel of the heat that produces during power semiconductor 2 work by evaporative cooling for heat radiation device 1 reaches the coolant 10 in it, coolant 10 heat absorptions in the evaporative cooling for heat radiation device 1, produce phase transformation in the boiling point evaporation, because the flow head that density pressure reduction generates under the acceleration of gravity effect, overcome the circulation that resistance pressure drop forms certain flow, make coolant flash to steam state and rise to condenser 3 tops at fluidizing point, and with its in cooling circulating water carry out heat exchange and be condensed into liquid after, through condenser 3, liquid back pipe 7, collector tube 6 and feed tube 15 flow back into evaporative cooling for heat radiation device 1 again.Owing to adopt internal pipeline, strengthened nucleate boiling, improve heat exchange efficiency.
Three of the embodiment of the invention: wind outside cold type evaporative cooling for heat radiation device integral structure is shown in Fig. 3 a.The evaporative cooling for heat radiation device 1 of horizontal layout is connected as a single entity with the air-cooling fin 13 of vertical layout.Be provided with the circulation passage of coolant 10 in the air-cooling fin 13, these passages communicate with the pipeline of horizontal evaporation cooling radiator 1, and its internal structure is shown in Fig. 3 b.Evaporative cooling for heat radiation device 1 base plate is wide * thick * longly be 100mm * 30mm * 200mm, inner wide * thick * height is the hollow cuboid of 80mm * 24mm * 180mm, top is the cylinder fin of boring, increases heat exchange area, improve cooling effect, similar heat pipe radiating fin.Be full of evaporative cooling medium 10 in the radiator 1.Power semiconductor 2 is installed in the outer panel surface of evaporative cooling for heat radiation device 1, the outer panel of the heat of power semiconductor 2 by the evaporative cooling for heat radiation device reaches the coolant 10 in the radiator 1, coolant 10 evaporates at boiling point, produce decalescence, because density pressure reduction generates flow head under the acceleration of gravity effect, overcome the circulation that resistance pressure drop forms certain flow, making coolant 10 flash to steam state at fluidizing point rises in the air-cooling fin 13, carry out heat exchange by air-cooling fin 13 and cool exterior air, after condensing into liquid, flow back to evaporative cooling for heat radiation device 1 downwards through air-cooling fin 13 inner surfaces.The air-cooling fin volume of this mode is little, can use in the particular surroundings of lack of water.A plurality of power devices are installed in same surface, because electric conducting materials such as employing copper are made radiator, can draw electric connection line at the device pole plate again, the double battery lead plate lead-in wire of doing of available radiator, be connected with external power cord by connector 12, simple in structure, easy to installation and maintenance.Shown in Fig. 3 b.
The advantage of these three kinds of structures is that power semiconductor 2 is fixed on evaporative cooling for heat radiation device 1 outer surface by set bolt and heat-conducting glue (fat), and it is convenient to install and overhaul, and does not need to open the evaporative cooling for heat radiation device when changing device.Because the boiling point of coolant 10 is low, thereby make the maximum temperature of power semiconductor 2 be controlled at the scope that device junction temperature allows.
Claims (7)
1, a kind of power semi-conductor device evaporation cooling apparatus, comprise evaporative cooling for heat radiation device [1] and condenser [3], condenser [3] places on the evaporative cooling for heat radiation device [1], and condenser pipe, cooling water or cold wind import [4] and cooling water or hot-blast outlet [5] are arranged in the condenser [3]; It is characterized in that evaporative cooling for heat radiation device [1] radiator inside is provided with the pipeline that adopts section bar or casting to make, pipeline can be screwed pipe, micro-rib pipe, collapsible tube, or porous surface tube, it is shaped as rectangle, circle or polygon, radiator [1] upper and lower end parts is provided with feed tube [15] and steam outlet pipe [9], charges into evaporative cooling medium [10] in the pipeline; Outer panel surface with device contacts in the evaporative cooling for heat radiation device [1] is a smooth flat, and power semiconductor [2] is fixed on surface of side plate in addition; The heat that large power semiconductor device [2] when work produces reaches evaporative cooling for heat radiation device [1] with device contacts by the device heating face, evaporative cooling medium [10] in evaporative cooling for heat radiation device [1] pipeline produces phase transformation in the boiling point evaporation, because the flow head that density pressure reduction generates under the acceleration of gravity effect, overcome the circulation that resistance pressure drop forms certain flow, make coolant flash to steam state and rise to condenser [3] top at fluidizing point, and carry out heat exchange with cooling circulating water or cold wind in it, after being condensed into liquid, flow back to evaporative cooling for heat radiation device [1] again.
2,, it is characterized in that condenser [3] is air cooling cast [3] or air-cooling fin type [13] according to the evaporation-cooled device of the said power semiconductor of claim 1; When evaporative cooling for heat radiation device [1] and air cooling cast cooler [3] split, both are communicated with by steam outlet pipe [9]; Air-cooling fin [13] is during as condenser, the horizontal layout of evaporative cooling for heat radiation device [1], be connected as a single entity with the air-cooling fin [13] of vertical layout, be provided with the circulation passage of coolant [10] in the air-cooling fin [13], circulation passage communicates with the pipeline of horizontal evaporation cooling radiator [1].
3, according to the evaporation-cooled device of the said power semiconductor of claim 1, it is characterized in that between two evaporative cooling for heat radiation devices [1], to clamp one or more power semiconductors [2], or clamp a plurality of power semiconductors [2] in the middle of a plurality of evaporative cooling for heat radiation device [1].
4, according to the evaporation-cooled device of the said power semiconductor of claim 1, when it is characterized in that a plurality of evaporative cooling for heat radiation devices [1] are communicated with, evaporative cooling for heat radiation device [1] top is communicated with balance pipe [8] by end steam outlet pipe [9], the bottom is communicated with collector tube [6] by feed tube [15], and collector tube [6] is communicated to top condenser [3] or cooler [3] with liquid back pipe [7].
5,, it is characterized in that the evaporative cooling medium circulation can provide circulation power or not have the pump self-loopa by pump according to the evaporation-cooled device of the said power semiconductor of claim 1.
6,, it is characterized in that its fluidizing point of evaporative cooling medium is no more than 70 ℃ according to the evaporation-cooled device of the said power semiconductor of claim 1.
7,, it is characterized in that and between power semiconductor [2] and evaporative cooling for heat radiation device [1], to smear thermal grease conduction (glue) according to the evaporation-cooled device of the said power semiconductor of claim 1.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610011952 CN1851908A (en) | 2006-05-22 | 2006-05-22 | Power semi-conductor device evaporation cooling apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610011952 CN1851908A (en) | 2006-05-22 | 2006-05-22 | Power semi-conductor device evaporation cooling apparatus |
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| CN101958297A (en) * | 2009-07-16 | 2011-01-26 | 王玉富 | Array flexible welding stud-connected and evaporation-cooled semiconductor device package |
| CN102013416A (en) * | 2009-09-08 | 2011-04-13 | 王玉富 | Semiconductor power device packaging adopting two-sided evaporation, cooling and press welding |
| CN101632172B (en) * | 2007-02-08 | 2011-06-01 | 丰田自动车株式会社 | Structure for cooling semiconductor element |
| CN102460689A (en) * | 2009-04-16 | 2012-05-16 | 莫列斯公司 | Cooling device, electronic substrate and electronic device |
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| CN102460689A (en) * | 2009-04-16 | 2012-05-16 | 莫列斯公司 | Cooling device, electronic substrate and electronic device |
| US8917507B2 (en) | 2009-04-16 | 2014-12-23 | Molex Incorporated | Cooling device, electronic substrate and electronic device |
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| CN101562158B (en) * | 2009-06-02 | 2013-03-13 | 中国电力科学研究院 | Heat removal system for high-power semiconductor device |
| CN101958297A (en) * | 2009-07-16 | 2011-01-26 | 王玉富 | Array flexible welding stud-connected and evaporation-cooled semiconductor device package |
| CN102013416A (en) * | 2009-09-08 | 2011-04-13 | 王玉富 | Semiconductor power device packaging adopting two-sided evaporation, cooling and press welding |
| CN102545240A (en) * | 2012-02-02 | 2012-07-04 | 中国科学院电工研究所 | Evaporative cooling system of reactive compensation device |
| US9402336B2 (en) | 2012-04-10 | 2016-07-26 | Ntn Corporation | Cooling structure for inverter device |
| CN104935184A (en) * | 2015-07-02 | 2015-09-23 | 中国科学院电工研究所 | Evaporative cooling system of high-power rectifier device |
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| CN109755193B (en) * | 2017-11-01 | 2020-09-29 | 中车株洲电力机车研究所有限公司 | Cooling device for service life test of power module |
| CN112815759A (en) * | 2021-01-04 | 2021-05-18 | 深圳市天利五金制品有限公司 | Radiator capable of recovering heat energy |
| CN113347507A (en) * | 2021-07-01 | 2021-09-03 | 山西兴潮科技有限公司 | Liquid submergence cooling formula switch and exchange unit |
| CN113347507B (en) * | 2021-07-01 | 2022-12-27 | 北京奕信通科技有限公司 | Liquid submergence cooling formula switch and exchange unit |
| CN113631019A (en) * | 2021-08-17 | 2021-11-09 | 远景能源有限公司 | Evaporative cooling system for high-power converter |
| CN113488418A (en) * | 2021-09-06 | 2021-10-08 | 江苏煜晶光电科技有限公司 | Cooling device for semiconductor production |
| CN113488418B (en) * | 2021-09-06 | 2021-11-05 | 江苏煜晶光电科技有限公司 | Cooling device for semiconductor production |
| CN114337375A (en) * | 2021-12-22 | 2022-04-12 | 北京化工大学 | Passive radiator, thermoelectric power generation device and thermoelectric power generation system |
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