CN113488418B - Cooling device for semiconductor production - Google Patents
Cooling device for semiconductor production Download PDFInfo
- Publication number
- CN113488418B CN113488418B CN202111039479.6A CN202111039479A CN113488418B CN 113488418 B CN113488418 B CN 113488418B CN 202111039479 A CN202111039479 A CN 202111039479A CN 113488418 B CN113488418 B CN 113488418B
- Authority
- CN
- China
- Prior art keywords
- cooling
- pipe
- plate
- air
- outer shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of semiconductor production, and discloses a cooling device for semiconductor production, which comprises an outer shell and a refrigerating mechanism arranged at the upper end of the outer shell, wherein the upper end of the outer shell is provided with a refrigerating shell, the upper surface of the refrigerating shell is provided with an air inlet pipeline, a cooling cavity is fixedly arranged inside the outer shell, the cooling cavity is arranged on the outer surface of the air inlet pipeline, a cooling water pipe is arranged inside an air pipe, one end of the cooling water pipe is arranged inside the cooling cavity, when cooling water inside the cooling water pipe circulates, the temperature of air blown into the outer shell by the air pipe is reduced, the cooling effect is convenient to improve, the air enters the inside of the air inlet pipeline, the opening diameter at the upper end of the air inlet pipeline is larger than that at the lower end, the pressure at the small end of the opening is changed, the air flow is cooled before entering the air pipe, and dust can be prevented from blocking the air inlet pipeline by a filter screen, the air inlet pipeline is communicated with the air pipe, so that air can enter the inner part of the outer shell through the air pipe.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to a cooling device for semiconductor production.
Background
The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, etc., for example, diodes are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and economic point of view. Most electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to a semiconductor. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., with silicon being one of the most influential of various semiconductor material applications.
Patent document No. cn201880064190.x discloses a semiconductor cooling device bonded to a semiconductor module having a semiconductor element mounted on one surface of an insulating substrate via a wiring layer, the semiconductor cooling device including: a heat dissipating substrate bonded to the other surface side of the insulating substrate; a fin provided on a surface of the heat dissipating substrate opposite to the surface to which the insulating substrate is bonded; and a warpage preventing plate bonded to the front ends of the fins and formed of a material having a coefficient of linear expansion smaller than that of the heat dissipating substrate, in which a semiconductor is overlapped on the upper end of the heat dissipating plate to dissipate heat, but only one set of the heat dissipating plate can be cooled during cooling, and a plurality of sets of the heat dissipating plate cannot be continuously cooled.
In order to solve the problems, the invention provides a cooling device for semiconductor production.
Disclosure of Invention
The invention aims to provide a cooling device for semiconductor production, a refrigeration shell is arranged at the upper end of an outer shell, an air inlet pipeline is arranged on the upper surface of the refrigeration shell, a cooling cavity is fixedly arranged in the outer shell and is arranged on the outer surface of the air inlet pipeline, a cooling water pipe is arranged in an air pipe, one end of the cooling water pipe is arranged in the cooling cavity, the other end of the cooling water pipe penetrates through the air pipe and the outer shell and is fixedly connected with a top cover mechanism, when cooling water in the cooling water pipe circulates, the cooling water can cool air in the air pipe, so that the temperature of air blown into the outer shell by the air pipe is reduced, the cooling effect is convenient to improve, a sealing cover is hinged on one side of the air pipe extending to the inner part of the outer shell, a filter screen is fixedly arranged in the inner part of the air inlet pipeline, the air pipe penetrates through one side of the air inlet pipeline, one side of the air pipe is externally connected with a fan and is arranged in the outer shell, wind gets into the inside of admission line, and the upper end opening diameter of admission line is greater than lower extreme opening diameter for the little one end pressure of opening changes, and the air current is cooled off before getting into the tuber pipe, and the filter screen can avoid the dust to block up the admission line, and the admission line communicates with each other with the tuber pipe, can make wind pass through the inside that the tuber pipe got into the shell body, has solved the problem among the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a cooling device for semiconductor production comprises an outer shell and a refrigerating mechanism arranged at the upper end of the outer shell, wherein a supporting leg is fixedly arranged at the lower end of the outer shell, a discharge port is formed in one side of the outer shell, a discharge slideway is fixedly arranged at the outer end of the discharge port, a supporting mechanism is fixedly arranged in the outer shell, and a top cover mechanism is fixedly arranged at the upper end of the supporting mechanism;
refrigerating mechanism includes the refrigeration shell of fixed mounting in shell body upper end and sets up the admission line at the refrigeration shell upper surface, the upper end opening diameter of admission line is greater than lower extreme opening diameter, and the inside fixed mounting of shell body has the cooling chamber, the cooling chamber sets up the surface at the admission line, one side of admission line is run through and is installed the tuber pipe, the external fan of one side of tuber pipe, the fan sets up the inside at the shell body, the inside of tuber pipe is provided with condenser tube, condenser tube's one end sets up the inside at the cooling chamber, the other end runs through tuber pipe and shell body and top cap mechanism fixed connection, the tuber pipe extends to the inside articulated sealed lid of installing in one side of shell body, and the inside fixed mounting of admission line has the filter screen.
Further, the inside fixed mounting of shell body has the riser, and the both sides fixed mounting of riser has the pole of bending, and the pole setting of bending is in the both sides of supporting mechanism and top cap mechanism, and the inside lateral wall fixed mounting of shell body has the elastic component, and the other end fixed mounting of elastic component has the extruded article, and extruded article fixed mounting is in the upper end of sealed lid.
Further, the supporting mechanism comprises a base fixedly installed inside the outer shell and a bearing seat hinged to the base, a supporting frame is fixedly installed at the lower end of the base, stabilizing frames are fixedly installed at two ends of the base, one end, far away from the base, of each stabilizing frame is fixedly installed on the inner wall of the corresponding vertical plate, a communication hole is formed in one side, close to the discharge hole, of the bearing seat, the communication hole is consistent with the position of the discharge hole, and an air inlet communicated with the inside of the outer shell is formed in the lower end of the base.
Further, the bearing seat is including articulated the bearing seat of installing in the base upper end and offer the settling passageway of seting up at bearing seat upper surface, settle the one end of keeping away from the intercommunicating pore of passageway and seted up the feed inlet, and settle the opening that the passageway is close to the one end of feed inlet and be greater than the opening that is close to intercommunicating pore one side, settle the upper surface of passageway and seted up the cooling tuyere, the cooling tuyere link up with the air inlet mutually, the side groove has been seted up to the side of bearing plate, the inside movable mounting of side groove has stop gear, the one end of feed inlet is higher than the one end of intercommunicating pore.
Further, stop gear includes that one end is articulated to be installed at the inside connecting rod of side channel and the arc of fixed mounting at the connecting rod other end, the one end fixed mounting of arc have with side channel activity through connection's extension rod, the other end and the extruded article position of extension rod are unanimous.
Furthermore, the inner wall of the connecting rod is hinged with two groups of elastic pieces, the other ends of the elastic pieces are movably arranged in the side grooves, and the two groups of elastic pieces are symmetrically arranged relative to the transverse center line of the connecting rod.
Further, the top cover mechanism comprises a top cover plate and a through pipe fixedly installed at the upper end of the top cover plate, the through pipe is communicated with the cooling cavity, an embedded plate is fixedly installed at the lower end of the top cover plate, a bolt penetrates through the upper surface of the top cover plate, the lower end of the bolt is in threaded penetrating connection with the embedded plate and the bearing plate, a connecting mechanism is fixedly installed at the lower end of the embedded plate, and the connecting mechanism is arranged at the upper end of the connecting rod.
Further, the upper end fixed mounting of built-in board has the protrusion, the lower extreme of built-in board seted up with intercommunicating pore upper end assorted cell body, the inner chamber has been seted up to the inside of protrusion, the inside of inner chamber is flooded phase change material, the hole of dodging has been seted up in the outside of protrusion.
Furthermore, the connecting mechanism comprises a connecting bottom plate arranged at the lower end of the built-in plate and a cut-off channel arranged on the upper surface of the connecting bottom plate, the upper surface of the connecting bottom plate is also provided with a storage groove, the cut-off channel is transversely arranged on the upper surface of the connecting bottom plate, and two ends of the cut-off channel extend to the inside of the storage groove longitudinally arranged on the upper surface of the connecting bottom plate.
Furthermore, the depth of the storage tank is greater than that of the intercepting flow channel, a connecting pipe which is connected with the avoiding hole in a penetrating mode is fixedly installed on the outer side of the storage tank, and the other end of the connecting pipe is fixedly connected with one side, far away from the cooling cavity, of the cooling water pipe.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention provides a cooling device for semiconductor production, a refrigeration shell is arranged at the upper end of an outer shell, an air inlet pipeline is arranged on the upper surface of the refrigeration shell, a cooling cavity is fixedly arranged in the outer shell, the cooling cavity is arranged on the outer surface of the air inlet pipeline, a cooling water pipe is arranged in the air pipe, one end of the cooling water pipe is arranged in the cooling cavity, the other end of the cooling water pipe penetrates through the air pipe and the outer shell and is fixedly connected with a top cover mechanism, when cooling water in the cooling water pipe circulates, the cooling water can cool air in the air pipe, so that the temperature of the air blown into the outer shell by the air pipe is reduced, the cooling effect is convenient to improve, a sealing cover is hinged on one side of the air pipe extending to the inner part of the outer shell, a filter screen is fixedly arranged in the air inlet pipeline, the air pipe penetrates through one side of the air inlet pipeline, one side of the air pipe is externally connected with a fan and is arranged in the outer shell, wind gets into the inside of admission line, and the upper end opening diameter of admission line is greater than lower extreme opening diameter for the little one end pressure of opening changes, and the air current is cooled off before getting into the tuber pipe, and the filter screen can avoid the dust to block up the admission line, and the admission line communicates with each other with the tuber pipe, can make wind pass through the inside that the tuber pipe got into the shell body.
2. According to the cooling device for semiconductor production, when cooling water in the cooling water pipe circulates, the air in the air pipe can be cooled, the temperature of air blown into the outer shell by the air pipe is reduced, the cooling effect is convenient to improve, a sealing cover is hinged to one side of the air pipe extending into the outer shell, a filter screen is fixedly mounted in the air inlet pipeline, the air pipe penetrates through one side of the air inlet pipeline, a fan is connected to one side of the air pipe and is arranged in the outer shell, the air enters the air inlet pipeline, the diameter of an opening at the upper end of the air inlet pipeline is larger than that of an opening at the lower end of the air inlet pipeline, the pressure of one end with a small opening is changed, airflow is cooled before entering the air pipe, dust can be prevented from blocking the air inlet pipeline by the filter screen, the air inlet pipeline is communicated with the air pipe, and the air can enter the inner part of the outer shell through the air pipe.
3. The invention provides a cooling device for semiconductor production, wherein two ends of a semiconductor enter the interior of an arranging channel through an arc-shaped plate, a connecting rod is extruded in the process, an elastic sheet is deformed and extruded towards two sides, an extension rod moves towards one end of an extrusion piece until the extension rod contacts the extrusion piece, the extrusion piece is fixedly connected with the upper end of a sealing cover, the sealing cover is convenient to open, wind enters the interior of an outer shell, after the semiconductor completely enters the interior of the arranging channel, the resilience of the elastic sheet can enable the connecting rod to recover the original position, continuous conveying is convenient, a phase-change material forms a solid structure by placing a condensing sheet towards two sides of an inner cavity, when the high-temperature semiconductor enters the arranging channel, heat exchange is carried out with the phase-change material, the phase-change material is changed into a liquid state from the solid state and continuously absorbs heat, the semiconductor can be rapidly cooled, and the phase-change material forms condensed water at the lower end of the inner plate when being heated, the condensed water flows into the storage tank through the cut-off channel for storage, the connecting pipe is externally connected with the water pump, the condensed water flows into the cooling cavity through the connecting pipe and the cooling water pipe, the lower end of the cooling cavity is communicated with the top cover plate through the through pipe, the condensed water flows back to the inner cavity again, cooling circulation can be formed, and the cooling effect is good.
Drawings
FIG. 1 is a schematic view of the overall structure of a cooling apparatus for semiconductor production according to the present invention;
FIG. 2 is an overall sectional view of a cooling apparatus for semiconductor manufacturing according to the present invention;
FIG. 3 is an enlarged view of the cooling apparatus for semiconductor manufacturing in FIG. 2;
FIG. 4 is a schematic view of the mounting structure of the supporting mechanism and the top cover mechanism of the cooling device for semiconductor production according to the present invention;
FIG. 5 is a schematic structural diagram of a supporting mechanism of the cooling apparatus for semiconductor manufacturing according to the present invention;
FIG. 6 is an enlarged view of the cooling apparatus for semiconductor manufacturing in FIG. 5 at B;
FIG. 7 is a schematic structural diagram of a top cover mechanism of a cooling device for semiconductor manufacturing according to the present invention;
FIG. 8 is a schematic view of the connecting mechanism of the cooling device for semiconductor manufacturing according to the present invention.
In the figure: 1. an outer housing; 11. a vertical plate; 12. bending the rod; 13. an elastic member; 14. an extrusion; 2. a refrigeration mechanism; 21. a refrigeration housing; 22. an air intake duct; 23. a cooling chamber; 24. an air duct; 25. a cooling water pipe; 26. a sealing cover; 27. a filter screen; 3. supporting legs; 4. a discharge port; 5. a discharge chute; 6. a support mechanism; 61. a base; 62. a load bearing seat; 621. a bearing plate; 622. arranging a channel; 623. a feed inlet; 624. a cooling tuyere; 625. a side groove; 626. a limiting mechanism; 6261. a connecting rod; 6262. an arc-shaped plate; 6263. an extension rod; 6264. an elastic sheet; 63. a support frame; 64. a stabilizing frame; 65. a communicating hole; 66. an air inlet; 7. a top cover mechanism; 71. a top cover plate; 72. pipe passing; 73. a built-in plate; 731. a protruding member; 732. an inner cavity; 733. a trough body; 734. avoiding holes; 74. a bolt; 75. a connecting mechanism; 751. connecting the bottom plate; 752. intercepting the flow channel; 753. a storage tank; 754. and (4) connecting the pipes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 2, a cooling device for semiconductor production, including shell body 1 and the refrigerating mechanism 2 of installing in shell body 1 upper end, the lower extreme fixed mounting of shell body 1 has supporting leg 3, one side of shell body 1 is provided with discharge gate 4, the outer end fixed mounting of discharge gate 4 has ejection of compact slide 5, be used for quick ejection of compact, the inside fixed mounting of shell body 1 has supporting mechanism 6, the upper end fixed mounting of supporting mechanism 6 has top cap mechanism 7, the semiconductor sets up the inside at supporting mechanism 6 and top cap mechanism 7, through setting up shell body 1, can play heat retaining effect to this cooling device, avoid exchanging heat with the surrounding environment, influence the cooling effect.
Referring to fig. 2, the refrigerating mechanism 2 includes a refrigerating housing 21 fixedly installed at the upper end of the outer housing 1 and an air inlet pipe 22 provided on the upper surface of the refrigerating housing 21, a cooling cavity 23 is fixedly installed inside the outer housing 1, the cooling cavity 23 is provided on the outer surface of the air inlet pipe 22, a cooling water pipe 25 is provided inside the air pipe 24, one end of the cooling water pipe 25 is provided inside the cooling cavity 23, the other end thereof penetrates through the air pipe 24 and the outer housing 1 and is fixedly connected with the top cover mechanism 7, when the cooling water inside the cooling water pipe 25 circulates, the air inside the air pipe 24 can be cooled, so that the temperature of the air blown into the outer housing 1 by the air pipe 24 is reduced, thereby facilitating the improvement of the cooling effect, a sealing cover 26 is hinged to one side of the air pipe 24 extending to the inside of the outer housing 1, a filter screen 27 is fixedly installed inside the air inlet pipe 22, an air pipe 24 is installed on one side of the air inlet pipe 22, the external fan in one side of tuber pipe 24, the fan sets up the inside at shell body 1, wind gets into the inside of admission line 22, the upper end opening diameter of admission line 22 is greater than lower extreme opening diameter for the little one end pressure of opening changes, the air current is cooled off before getting into tuber pipe 24, filter screen 27 can avoid the dust to block up admission line 22, admission line 22 communicates with each other with tuber pipe 24, can make wind pass through the inside that tuber pipe 24 got into shell body 1.
Referring to fig. 2 and 3, the inside fixed mounting of shell body 1 has riser 11, the both sides fixed mounting of riser 11 has bending rod 12, bending rod 12 sets up the both sides at supporting mechanism 6 and top cap mechanism 7, and shell body 1 inside lateral wall fixed mounting has elastic component 13, the other end fixed mounting of elastic component 13 has extruded article 14, extruded article 14 fixed mounting is in the upper end of sealed lid 26, when extension bar 6263 extrudes extruded article 14, sealed lid 26 is rotatory with articulated department with tuber pipe 24 as the centre of a circle, can make sealed lid 26 keep away from tuber pipe 24, tuber pipe 24 can communicate with each other with shell body 1 is inside, can make wind blow into the inside of shell body 1, can make wind blow to the upper and lower both ends of supporting mechanism 6 and top cap mechanism 7 through the guide effect of riser 11 and bending rod 12, be convenient for wind to get into the inside of air inlet 66, be convenient for contact the semiconductor.
Referring to fig. 4 and 5, the supporting mechanism 6 includes a base 61 fixedly installed inside the outer casing 1 and a bearing seat 62 hinged on the upper end of the base 61, a supporting frame 63 is fixedly installed on the lower end of the base 61, stabilizing frames 64 are fixedly installed on both ends of the base 61, one end of each stabilizing frame 64 far away from the base 61 is fixedly installed on the inner wall of the vertical plate 11, a communicating hole 65 is opened on one side of the bearing seat 62 near the discharge port 4, the position of the communicating hole 65 is consistent with that of the discharge port 4, an air inlet 66 communicated with the inside of the outer casing 1 is opened on the lower end of the base 61, the bearing seat 62 includes a bearing seat 62 hinged on the upper end of the base 61 and an installation channel 622 opened on the upper surface of the bearing seat 62, a feed port 623 is opened on one end of the installation channel 622 far away from the communicating hole 65, and the opening on one end of the installation channel 622 near the feed port 623 is larger than the opening on one side near the communicating hole 65, the upper surface of the arranging channel 622 is provided with a cooling air opening 624, the cooling air opening 624 is communicated with the air inlet 66, the side end of the bearing plate 621 is provided with a side groove 625, a limiting mechanism 626 is movably arranged in the side groove 625, an operator can enable a semiconductor needing to be cooled to enter the upper surface of the arranging channel 622 through the feed inlet 623 to finish cooling, and the semiconductor can automatically slide down due to the fact that one end of the feed inlet 623 is higher than one end of the communicating hole 65, so that continuous blanking of the semiconductor can be achieved.
Referring to fig. 5 and 6, the limiting mechanism 626 includes a connecting rod 6261 with one end hinged inside the side groove 625 and an arc-shaped plate 6262 fixedly installed at the other end of the connecting rod 6261, one end of the arc-shaped plate 6262 is fixedly installed with an extending rod 6263 movably connected with the side groove 625 in a penetrating way, the other end of the extending rod 6263 is in accordance with the position of the extruding part 14, the inner wall of the connecting rod 6261 is hinged with an elastic sheet 6264, the other end of the elastic sheet 6264 is movably installed inside the side groove 625, and two sets of the elastic sheets 6264 are provided, the two sets of the elastic sheets 6264 are symmetrically installed about the transverse center line of the connecting rod 6261, the two ends of the semiconductor enter the arranging channel 622 through the arc-shaped plate 6262, the connecting rod 6261 is extruded in the process, the elastic sheet 6264 is deformed and extruded to the two sides, at this time, the extending rod 6263 moves towards one end of the extruding part 14 until contacting the extruding part 14, the extruding part 14 is fixedly connected with the upper end of the sealing cover 26, the sealing cover 26 is opened conveniently, so that wind enters the inside of the outer shell 1, and after the semiconductor completely enters the inside of the placing channel 622, the resilience force of the elastic sheet 6264 can restore the connecting rod 6261, and the continuous conveying is convenient.
Referring to fig. 4 and 7, the top cover mechanism 7 includes a top cover plate 71 and a through pipe 72 fixedly installed on the upper end of the top cover plate 71, the through pipe 72 is communicated with the cooling chamber 23, the lower end of the top cover plate 71 is fixedly installed with an internal plate 73, the upper surface of the top cover plate 71 is installed with a bolt 74 in a penetrating manner, the lower end of the bolt 74 is in threaded penetrating connection with the internal plate 73 and a bearing plate 621, the lower end of the internal plate 73 is fixedly installed with a connecting mechanism 75, the connecting mechanism 75 is arranged on the upper end of a connecting rod 6261, the upper end of the internal plate 73 is fixedly installed with a protruding part 731, the lower end of the internal plate 73 is provided with a groove 733 matched with the upper end of the communicating hole 65, the inside of the protruding part 731 is provided with an inner chamber 732, the inner chamber 732 is filled with a phase change material, condensation sheets are placed on both sides of the inner chamber 732 to form a solid structure, when a high temperature semiconductor enters the inside of the placing channel 622, heat exchange is performed with the phase change material, the phase-change material changes from solid to liquid and continuously absorbs heat, so that the semiconductor can be rapidly cooled, and the outside of the protruding part 731 is provided with an avoiding hole 734 for the penetration of the connecting pipe 754.
Referring to fig. 2 and 8, the connection mechanism 75 includes a connection bottom plate 751 disposed at the lower end of the built-in plate 73 and a cut-off channel 752 disposed on the upper surface of the connection bottom plate 751, the upper surface of the connection bottom plate 751 is further provided with a storage groove 753, the cut-off channel 752 is disposed transversely on the upper surface of the connection bottom plate 751, and both ends of the cut-off channel 752 extend to the interior of the storage groove 753 longitudinally disposed on the upper surface of the connection bottom plate 751, the depth of the storage groove 753 is greater than the depth of the cut-off channel 752, and a connection pipe 754 penetrating and connected with the relief hole 734 is fixedly mounted at the outer side, the other end of the connection pipe 754 is fixedly connected with one side of the cooling water pipe 25 far away from the cooling chamber 23, the phase change material forms condensed water at the lower end of the built-in plate 73 while being heated, the condensed water flows into the storage groove 753 for storage through the cut-off channel 752, the connection pipe 754 is externally connected with a water pump, the condensed water flows into the cooling chamber 23 through the connection pipe 754 and the cooling water pipe 25, the lower end of the cooling chamber 23 is communicated with the top cover plate 71 through the through pipe 72, the cooling liquid flows back to the inner cavity 732 again to form cooling circulation, and the cooling effect is good.
The working principle is as follows: an operator enables a semiconductor to be cooled to enter the upper surface of the arranging channel 622 through the feeding hole 623 to finish cooling, the semiconductor can automatically slide down due to the fact that one end of the feeding hole 623 is higher than one end of the communicating hole 65, therefore, continuous blanking of the semiconductor can be achieved, two ends of the semiconductor enter the inside of the arranging channel 622 through the arc-shaped plate 6262, the connecting rod 6261 is extruded in the process, the elastic sheet 6264 is deformed and extruded towards two sides, the extension rod 6263 moves towards one end of the extrusion piece 14 until contacting the extrusion piece 14, when the extension rod 6263 extrudes the extrusion piece 14, the sealable cover 26 rotates by taking the hinged position with the air pipe 24 as a circle center, the sealable cover 26 can be far away from the air pipe 24, the air pipe 24 can be communicated with the inside of the outer shell 1, air can be blown into the inside of the air inlet pipe 22, and the diameter of the upper end opening of the air inlet pipe 22 is larger than that of the lower end opening, the pressure at one end with a small opening is changed, the air flow is cooled before entering the air pipe 24, the filter screen 27 can prevent dust from blocking the air inlet pipeline 22, the air inlet pipeline 22 is communicated with the air pipe 24, namely, the air can enter the inside of the outer shell 1 through the air pipe 24, the air can be blown towards the upper end and the lower end of the supporting mechanism 6 and the top cover mechanism 7 through the guiding action of the vertical plate 11 and the bending rod 12, the air can enter the inside of the air inlet 66 conveniently to be contacted with the semiconductor, the phase change material inside the inner cavity 732 forms a solid structure through placing the condensing sheets towards the two sides of the inner cavity 732, when the high-temperature semiconductor enters the placing channel 622, the heat exchange is carried out with the phase change material, the phase change material is changed into a liquid from a solid state and continuously absorbs heat, the semiconductor can be rapidly cooled, and the phase change material is heated and forms condensed water at the lower end of the placing plate 73, the condensed water flows into the storage tank 753 through the intercepting flow channel 752 to be stored, the connecting pipe 754 is externally connected with a water pump, the condensed water flows into the cooling cavity 23 through the connecting pipe 754 and the cooling water pipe 25, the lower end of the cooling cavity 23 is communicated with the top cover plate 71 through the through pipe 72, the condensed water flows back to the inner cavity 732 again, cooling circulation can be formed, when the cooling water in the cooling water pipe 25 circulates, the air in the air pipe 24 can be cooled, the temperature of the air blown into the shell body 1 by the air pipe 24 is reduced, two cooling effects can be achieved, and after the semiconductor completely enters the inside of the arranging channel 622, the resilience force of the elastic sheet 6264 can enable the connecting rod 6261 to recover the original position.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (10)
1. The utility model provides a cooling device for semiconductor manufacture, includes shell body (1) and installs in the refrigeration mechanism (2) of shell body (1) upper end, its characterized in that: the lower end of the outer shell (1) is fixedly provided with a supporting leg (3), one side of the outer shell (1) is provided with a discharge port (4), the outer end of the discharge port (4) is fixedly provided with a discharge slideway (5), the inside of the outer shell (1) is fixedly provided with a supporting mechanism (6), and the upper end of the supporting mechanism (6) is fixedly provided with a top cover mechanism (7);
the refrigerating mechanism (2) comprises a refrigerating shell (21) fixedly installed at the upper end of the outer shell (1) and an air inlet pipeline (22) arranged on the upper surface of the refrigerating shell (21), the upper end opening diameter of the air inlet pipeline (22) is larger than the lower end opening diameter, a cooling cavity (23) is fixedly installed inside the outer shell (1), the cooling cavity (23) is arranged on the outer surface of the air inlet pipeline (22), an air pipe (24) is installed on one side of the air inlet pipeline (22) in a penetrating mode, a fan is externally connected to one side of the air pipe (24), the fan is arranged inside the outer shell (1), a cooling water pipe (25) is arranged inside the air pipe (24), one end of the cooling water pipe (25) is arranged inside the cooling cavity (23), the other end of the cooling water pipe penetrates through the air pipe (24) and the outer shell (1) and is fixedly connected with the top cover mechanism (7), a sealing cover (26) is hinged to the side, of the air pipe (24) extending to the inside of the outer shell (1), and a filter screen (27) is fixedly arranged in the air inlet pipeline (22).
2. A cooling apparatus for semiconductor manufacturing according to claim 1, wherein: the inside fixed mounting of shell body (1) has riser (11), the both sides fixed mounting of riser (11) has bending pole (12), bending pole (12) set up the both sides at supporting mechanism (6) and top cap mechanism (7), and shell body (1) inside lateral wall fixed mounting has elastic component (13), the other end fixed mounting of elastic component (13) has extruded article (14), extruded article (14) fixed mounting is in the upper end of sealed lid (26).
3. A cooling apparatus for semiconductor manufacturing according to claim 2, wherein: supporting mechanism (6) include base (61) and articulated bearing seat (62) of installing in base (61) upper end of fixed mounting in shell body (1) inside, the lower extreme fixed mounting of base (61) has support frame (63), the both ends fixed mounting of base (61) has firm frame (64), the one end fixed mounting that base (61) were kept away from in firm frame (64) is at the inner wall of riser (11), intercommunicating pore (65) have been seted up to one side that bearing seat (62) are close to discharge gate (4), and intercommunicating pore (65) and discharge gate (4) position are unanimous, air inlet (66) that link up mutually with shell body (1) inside are seted up to the lower extreme of base (61).
4. A cooling apparatus for semiconductor manufacturing according to claim 3, wherein: bearing seat (62) including articulated install bearing seat (62) in base (61) upper end and offer settling passageway (622) of seting up at bearing seat (62) upper surface, settle the one end of keeping away from intercommunicating pore (65) of passageway (622) and seted up feed inlet (623), and settle the opening that passageway (622) is close to the one end of feed inlet (623) and be greater than the opening that is close to intercommunicating pore (65) one side, settle the upper surface of passageway (622) and seted up cooling wind gap (624), cooling wind gap (624) link up with air inlet (66) mutually, side channel (625) have been seted up to the side of bearing plate (621), the inside movable mounting of side channel (625) has stop gear (626), the one end of feed inlet (623) is higher than the one end of intercommunicating pore (65).
5. The cooling apparatus for semiconductor production according to claim 4, wherein: the limiting mechanism (626) comprises a connecting rod (6261) and an arc-shaped plate (6262), wherein one end of the connecting rod (6261) is hinged to the inside of the side groove (625), the arc-shaped plate (6262) is fixedly installed at the other end of the connecting rod (6261), an extension rod (6263) is fixedly installed at one end of the arc-shaped plate (6262) and movably connected with the side groove (625) in a penetrating mode, and the other end of the extension rod (6263) is consistent with the position of the extrusion part (14).
6. The cooling apparatus for semiconductor production according to claim 5, wherein: the inner wall of the connecting rod (6261) is hinged with elastic pieces (6264), the other ends of the elastic pieces (6264) are movably arranged in the side grooves (625), two groups of elastic pieces (6264) are arranged, and the two groups of elastic pieces (6264) are symmetrically arranged relative to the transverse center line of the connecting rod (6261).
7. A cooling apparatus for semiconductor manufacturing according to claim 6, wherein: the top cover mechanism (7) comprises a top cover plate (71) and a through pipe (72) fixedly installed at the upper end of the top cover plate (71), the through pipe (72) is communicated with the cooling cavity (23), a built-in plate (73) is fixedly installed at the lower end of the top cover plate (71), a bolt (74) penetrates through the upper surface of the top cover plate (71), the lower end of the bolt (74) is in threaded through connection with the built-in plate (73) and a bearing plate (621), a connecting mechanism (75) is fixedly installed at the lower end of the built-in plate (73), and the connecting mechanism (75) is arranged at the upper end of a connecting rod (6261).
8. A cooling apparatus for semiconductor manufacturing according to claim 7, wherein: the upper end of the built-in plate (73) is fixedly provided with a protruding part (731), the lower end of the built-in plate (73) is provided with a groove body (733) matched with the upper end of the communicating hole (65), the inside of the protruding part (731) is provided with an inner cavity (732), the inside of the inner cavity (732) is filled with a phase change material, and the outside of the protruding part (731) is provided with an avoiding hole (734).
9. A cooling apparatus for semiconductor manufacturing according to claim 8, wherein: the connecting mechanism (75) comprises a connecting bottom plate (751) arranged at the lower end of the built-in plate (73) and a flow intercepting channel (752) arranged on the upper surface of the connecting bottom plate (751), the upper surface of the connecting bottom plate (751) is also provided with a storage groove (753), the flow intercepting channel (752) is transversely arranged on the upper surface of the connecting bottom plate (751), and two ends of the flow intercepting channel extend to the interior of the storage groove (753) longitudinally arranged on the upper surface of the connecting bottom plate (751).
10. A cooling apparatus for semiconductor manufacturing according to claim 9, wherein: the depth of the storage groove (753) is larger than that of the intercepting flow passage (752), a connecting pipe (754) which is connected with the avoiding hole (734) in a penetrating mode is fixedly installed on the outer side of the storage groove, and the other end of the connecting pipe (754) is fixedly connected with one side, far away from the cooling cavity (23), of the cooling water pipe (25).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111039479.6A CN113488418B (en) | 2021-09-06 | 2021-09-06 | Cooling device for semiconductor production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111039479.6A CN113488418B (en) | 2021-09-06 | 2021-09-06 | Cooling device for semiconductor production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113488418A CN113488418A (en) | 2021-10-08 |
| CN113488418B true CN113488418B (en) | 2021-11-05 |
Family
ID=77946548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111039479.6A Active CN113488418B (en) | 2021-09-06 | 2021-09-06 | Cooling device for semiconductor production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113488418B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1851908A (en) * | 2006-05-22 | 2006-10-25 | 中国科学院电工研究所 | Power semi-conductor device evaporation cooling apparatus |
| WO2020141053A1 (en) * | 2019-01-02 | 2020-07-09 | Rolls-Royce Deutschland Ltd & Co Kg | Electrical circuit having a cooling means, in particular for applications in aircraft |
| CN111987051A (en) * | 2020-07-10 | 2020-11-24 | 浙江天毅半导体科技有限公司 | Novel IGBT packaging structure with temperature measurement function and packaging method |
| CN112420622A (en) * | 2020-10-27 | 2021-02-26 | 王海魁 | Chip packaging structure easy to dissipate heat and packaging method thereof |
-
2021
- 2021-09-06 CN CN202111039479.6A patent/CN113488418B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1851908A (en) * | 2006-05-22 | 2006-10-25 | 中国科学院电工研究所 | Power semi-conductor device evaporation cooling apparatus |
| WO2020141053A1 (en) * | 2019-01-02 | 2020-07-09 | Rolls-Royce Deutschland Ltd & Co Kg | Electrical circuit having a cooling means, in particular for applications in aircraft |
| CN111987051A (en) * | 2020-07-10 | 2020-11-24 | 浙江天毅半导体科技有限公司 | Novel IGBT packaging structure with temperature measurement function and packaging method |
| CN112420622A (en) * | 2020-10-27 | 2021-02-26 | 王海魁 | Chip packaging structure easy to dissipate heat and packaging method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113488418A (en) | 2021-10-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7262966B2 (en) | Heat sink modules for light and thin electronic equipment | |
| US10874036B2 (en) | Cabinet and electronic device | |
| CN101141868A (en) | Non-fan chip heat radiator | |
| CN207321431U (en) | A kind of vehicle-mounted hard disk videocorder Fanless radiation structure | |
| CN207219278U (en) | A kind of electrical equipment and its radiator structure | |
| CN112918930A (en) | Heat dissipation storage device for semiconductor chip | |
| CN113488418B (en) | Cooling device for semiconductor production | |
| CN1664747A (en) | Sealed dust-proof temperature control cabinet for computers | |
| CN115371287B (en) | Compact thermoelectric semiconductor refrigeration module with high refrigeration power density | |
| EP3806143A1 (en) | Variable heat conductor | |
| CN111935956A (en) | Heat dissipation assembly and electronic device | |
| CN111315183B (en) | Heat conduction assembly for electronic component, refrigerating device and electronic equipment | |
| KR100622547B1 (en) | Telecomunication system box for repeater | |
| CN211424839U (en) | Refrigerating machine heat abstractor for refrigeration plant | |
| CN112711310A (en) | Quick radiating radar machine case | |
| WO2022184244A1 (en) | Heat sink comprising container for accommodating cooling fluid | |
| US10314203B1 (en) | Apparatuses, systems, and methods for cooling electronic components | |
| CN214378404U (en) | Chip heat radiation structure | |
| CN220874932U (en) | Heat pipe unidirectional heat conduction internal circulation cabinet | |
| CN221468182U (en) | Micro-groove group composite phase-change heat dissipation structure | |
| CN216313689U (en) | Heat dissipation device of integrated circuit board | |
| CN215010552U (en) | 5G wireless communication interaction device | |
| CN218550045U (en) | Ten-thousand-million access switch | |
| CN217849232U (en) | Power adapter stacks box convenient to heat dissipation | |
| CN220358073U (en) | Novel IGBT module with heat dissipation function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |