CN111935956A - Heat dissipation assembly and electronic device - Google Patents
Heat dissipation assembly and electronic device Download PDFInfo
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- CN111935956A CN111935956A CN202010831166.3A CN202010831166A CN111935956A CN 111935956 A CN111935956 A CN 111935956A CN 202010831166 A CN202010831166 A CN 202010831166A CN 111935956 A CN111935956 A CN 111935956A
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- air
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- source chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the field of thermodynamics and discloses a heat dissipation assembly and an electronic device. In the invention, the circuit board is provided with the ventilation structure with the air channel, and the heat source chip is arranged on the circuit board in the area of the air channel, therefore, when the heat source chip works and the temperature rises, the external cold air can enter the shell from the air inlet arranged on the side wall of the shell in a penetrating way and then enters the air channel from the air inlet of the air channel, when cold air rises to the area where the heat source chip is located, the cold air rapidly passes through the area where the heat source chip is located by means of negative pressure formed by the cold air and the hot air in the air pipeline, the hot air in the area where the heat source chip is located is taken away, the effect of reducing the heat source chip is achieved, the hot air flows out through an air outlet of the air channel and a heat dissipation port arranged through the side wall of the shell and is released to the outside, namely, the heat dissipation assembly provided by the invention utilizes the 'wind-pulling' effect, enhances the heat exchange speed, and achieves the purpose of air-cooling heat dissipation, thereby greatly improving the heat dissipation efficiency.
Description
Technical Field
The present invention relates to the field of thermodynamics, and in particular, to a heat dissipation assembly and an electronic device.
Background
The existing high-power hardware products mainly focus on a main chip (hereinafter, referred to as a heat source chip). Therefore, the heat dissipation problem of the heat source chip can be solved.
However, in the current heat dissipation scheme, heat dissipation holes are arranged on the product shell, so that the heat source chip on the internal circuit board is subjected to heat convection with the external air through the heat dissipation holes to dissipate heat, but the heat dissipation mode is passive heat dissipation, so that the heat dissipation efficiency is low, and the cooling requirement of the heat source chip cannot be met for products with high power and small volume; or the electric fan is arranged in the area where the heat source chip is located, and the air convection is enhanced by the electric fan, so that the heat dissipation efficiency is improved.
Disclosure of Invention
An object of embodiments of the present invention is to provide a heat dissipation assembly and an electronic device, which are designed to solve the above technical problems.
In order to solve the above technical problem, an embodiment of the present invention provides a heat dissipation assembly, including:
the shell is provided with an installation cavity, an air inlet and a heat dissipation port, wherein the air inlet and the heat dissipation port are arranged on the side wall of the shell in a penetrating manner;
a circuit board mounted in the mounting cavity;
the ventilation structure is arranged on the circuit board and provided with an air inlet and an air outlet which are respectively opposite to the air inlet and the heat dissipation port, and the air inlet and the air outlet are mutually communicated to form an air channel;
and the heat source chip is positioned in the air channel and is electrically connected with the circuit board.
An embodiment of the present invention also provides an electronic apparatus, including: the heat sink assembly described above.
Compared with the prior art, the embodiment of the invention has the advantages that the ventilation structure with the air channel is arranged on the circuit board, the heat source chip is arranged on the circuit board in the area of the air channel, so that when the heat source chip works and the temperature rises, the external cold air can enter the shell from the air inlet penetrating through the side wall of the shell and then enters the air channel from the air inlet of the air channel, when the cold air rises to the area of the heat source chip, the cold air quickly passes through the area of the heat source chip by virtue of the negative pressure formed by the cold air and the hot air in the air channel to take away the hot air in the area of the heat source chip, the effect of reducing the heat source chip is achieved, the hot air flows out from the air outlet of the air channel and the heat dissipation port penetrating through the side wall of the shell and is released to the outside, namely, the heat dissipation assembly provided by the invention, thereby the heat source chip can be cooled down rapidly.
In addition, as can be seen from the above description, compared with the prior art, the heat dissipation assembly of the embodiment of the present invention utilizes the "wind pulling" effect, so that the heat dissipation assembly has the condition of air-cooling heat dissipation, and thus the passive manner of automatic convection heat dissipation is converted into the active heat dissipation manner, thereby greatly improving the heat dissipation efficiency.
In addition, as can be seen from the above description, compared with the prior art, the active heat dissipation is implemented based on the condition of air-cooled heat dissipation instead of using a heat dissipation device such as a fan, so that the heat dissipation efficiency is improved and the implementation cost is effectively reduced.
In addition, the opening of the air channel is arranged from the air inlet to the air outlet in a gradually narrowing mode. By selecting the ventilation structure with narrow top and wide bottom, the canyon effect can be formed after external cold air enters the air channel, and the heat exchange speed is greatly enhanced by the mutual matching of the wind pulling effect and the canyon effect, so that the aim of quick air cooling and heat dissipation can be fulfilled by utilizing canyon wind formed in the heat source chip region.
In addition, the heat source chip is positioned on one side of the air channel close to the air outlet. Through setting up the heat source chip in the one side that air passage is close to the air outlet, the narrower part of air duct promptly for after external cold air penetrated the air inlet that establishes on the casing and got into air passage, cold air flows through the high-temperature region at heat source chip place, forms "canyon wind", flows out fast from the air outlet, and then takes away the temperature of heat source chip fast, makes the temperature of heat source chip descend rapidly.
In addition, the heat dissipation assembly further includes: a heat sink; the radiating fin is fixed on the heat source chip, faces back to one side of the heat source chip, and is provided with a plurality of ventilation channels along the air channel. The radiating fins of a plurality of ventilation channels are fixedly arranged on the heat source chip in a penetrating mode, so that the 'draught' effect and the 'canyon effect' are further enhanced, and the temperature of the heat source chip can be rapidly reduced.
In addition, a silicone grease layer is arranged between the radiating fin and the heat source chip, and the radiating fin is fixed on the silicone grease layer through screws. Through setting up the silicone grease layer, with the screw fixation in the silicone grease layer, avoid causing the damage of heat source chip.
In addition, a heat conducting member is arranged between the silicone grease layer and the heat radiating fin. The heat conducting member is arranged between the heat radiating fin and the silicone grease layer, so that the temperature of the heat source chip can be better transferred to the heat radiating fin.
In addition, the housing includes: a housing body and a housing cover; the mounting cavity is arranged in the shell body, and the air inlet and the heat dissipation port penetrate through the side wall of the shell body; the shell cover is detachably fixed on one surface of the shell body, wherein the installation cavity is formed in the shell body. Through adopting the mode of dismantling to fix, the convenient maintenance to installing circuit board, heat source chip, the ventilation structure in the installation cavity.
In addition, the surface of the circuit board, which is back to the heat source chip, is far away from the shell body and is fixed. The circuit board is not attached to the shell body, so that cold air can conveniently pass through a gap between the circuit board and the shell body, and partial waste heat can be taken away.
In addition, a support piece is arranged on the side wall of the shell body, which is provided with the air inlet in a penetrating way; when the shell body is placed on the horizontal plane, the support piece forms a gap with the horizontal plane, so that external cold air can conveniently enter the shell from the air inlet and can flow out along the air channel to take away waste heat of the heat source chip.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is an exploded schematic view of a heat dissipation assembly according to a first embodiment;
fig. 2 is a side view of the heat dissipation assembly in the first embodiment;
FIG. 3 is a schematic diagram illustrating a heat dissipation principle of the heat dissipation assembly according to the first embodiment;
fig. 4 is an exploded view of the heat dissipating module according to the second embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation of the present invention, and the embodiments may be mutually incorporated and referred to without contradiction.
A first embodiment of the present invention relates to a heat dissipating assembly including: the shell is provided with an installation cavity, an air inlet and a heat dissipation port, wherein the air inlet and the heat dissipation port are arranged on the side wall of the shell in a penetrating manner; a circuit board mounted in the mounting cavity; the ventilation structure is arranged on the circuit board and provided with an air inlet and an air outlet which are respectively opposite to the air inlet and the heat dissipation port, and the air inlet and the air outlet are mutually communicated to form an air channel; and the heat source chip is positioned in the air channel and is electrically connected with the circuit board.
In order to better understand the heat dissipation assembly provided in the present embodiment, a specific structure of the heat dissipation assembly of the present embodiment will be described below with reference to fig. 1 and 2.
As shown in fig. 1 and 2, the heat dissipation assembly includes a housing 10, a circuit board 20, a ventilation structure 30, and a heat source chip 40.
The housing 10 further includes a housing body 11 and a housing cover 12. The installation cavity is opened in the shell body 11, the air inlet with the thermovent runs through and is located on the lateral wall of shell body 11.
In addition, it should be noted that, the specific penetration position of the air inlet and the heat dissipation port may be determined according to the placement condition of the housing 10.
For example, when the housing 10 is a vertical structure, that is, the circuit board 20, the ventilation structure 30 and the heat source chip 40 located in the housing body 11 are all perpendicular to the horizontal plane, the air inlet is formed through a side wall facing the horizontal plane, and the heat sink opposite to the air inlet is formed through a side wall away from the horizontal plane, where detailed positions are shown as the air inlet 111 and the heat sink 112 in fig. 1.
In addition, since the circuit board 20, the ventilation structure and the heat source chip 40 are all installed in the installation cavity in the housing body 11, in order to facilitate subsequent maintenance of these components, in the present embodiment, the housing cover 12 is detachably fixed to the side of the housing body 11 where the installation cavity is opened, so that after the housing cover 12 is fixed to the housing body 11, a sealed accommodating space can be formed, and the circuit board 20, the ventilation structure 30 and the heat source chip 40 installed in the installation cavity are protected.
It should be understood that, in practical applications, the detachable manner described above may be a screw manner or a snap manner, which is not listed here, and the present embodiment is not limited thereto.
In addition, it is worth mentioning that, in order to further improve the heat dissipation effect of the heat dissipation assembly and reduce the temperature of the heat source chip 40 as soon as possible, in practical application, when the circuit board 20 is fixed in the mounting cavity formed in the housing body 11, the surface of the circuit board 20 facing away from the heat source chip 40, that is, the surface without the heat source chip 40 and the ventilation structure 30 is fixed away from the housing body 11.
Specifically, a plurality of protrusions, for example, 4 protrusions capable of being matched with the bolts 21, such as 113 in fig. 1 or fig. 2 (only one is shown in fig. 1, and two are shown in fig. 2) may be injection-molded on the bottom surface of the mounting cavity opened in the housing body 11, so that after the circuit board 20 is fixed in the mounting cavity by the bolts 21, there is a slight gap with the housing body, and the detailed structure is shown in fig. 2.
Through the structure, namely the circuit board 20 and the shell body 11 are not attached, cold air can penetrate through a gap between the circuit board 20 and the shell body 11 to take away partial waste heat, and therefore the speed of reducing the temperature of the heat source chip 40 is increased.
Further, to the casing 10 of vertical structure, in practical application, in order to guarantee that the outside cold air can pass through the air inlet that establishes on the lateral wall of the casing body 11 and get into the air pipe that is formed through structure 30 and sets up in the installation cavity, the casing body 11 passes through and is equipped with still need to set up support piece on the lateral wall of air inlet to when making the casing body 11 place perpendicularly on the horizontal plane, can form certain clearance with the horizontal plane.
In order to ensure that the housing body 11 can stably stand on a horizontal plane, 4 supporting members may be disposed through the side wall (hereinafter referred to as bottom surface) of the housing body 11, specifically at four top corners of the bottom surface, as shown in fig. 2 (two supporting members 114 are shown in fig. 2).
In addition, it is worth mentioning that, in order to improve the heat dissipation effect, the housing 10 may be made of an aluminum alloy material that is easy to dissipate heat.
It should be understood that the above is only a specific structure and preparation material of the housing 10, and in practical application, the skilled person can make reasonable adjustments according to the needs, and the present embodiment does not limit this.
In addition, regarding the air channel formed by the air inlet 31 and the air outlet 32 communicating with each other in the ventilation structure 30, in the present embodiment, the opening thereof is arranged from the air inlet 31 to the air outlet 32 in a gradually narrowing manner, that is, the ventilation structure 30 in the present embodiment is narrow at the top (towards the heat dissipation opening formed on the sidewall of the shell body 11) and wide at the bottom (towards the air inlet formed on the sidewall of the shell body 11), and based on the air duct formed by such a structure, the formation of the "wind pulling" effect and the "canyon effect" can be facilitated, so that the heat exchange speed is greatly enhanced by the mutual cooperation of the "wind pulling" effect and the "canyon effect", and the purpose of rapid air cooling and heat dissipation is achieved by utilizing the "canyon wind" formed in the region where the heat source chip 40 is located.
For ease of understanding, this embodiment shows a specific ventilation structure, and is shown in detail in the ventilation structure 30 shown in fig. 1 and 2.
It should be understood that the above examples are only examples for better understanding of the technical solution of the present embodiment, and are not to be taken as the only limitation to the present embodiment, and in practical applications, the ventilation structure 30 may be set so that the opening of the air channel formed by the air inlet 31 and the air outlet 32 communicating with each other is gradually narrowed from the air inlet 31 to the air outlet 32.
Further, when specifically realizing, in order to better reach the effect of reducing the temperature of heat source chip 40 fast with the help of "canyon effect", heat source chip 40 specifically can set up the one side that is close to air outlet 32 at air passage, the narrower part of air duct promptly, thereby make outside cold air pass through air inlet 111 that establishes on shell body 11 and get into the air passage after, the cold air flows through the high temperature region that heat source chip 40 is located, form "canyon valley wind", from air outlet 32, thermovent 12 flows out fast, and then take away the waste heat of heat source chip 40 fast, make the temperature of heat source chip 40 descend rapidly.
In addition, it is worth mentioning that, in the present embodiment, in order to ensure that the heat source chip 40 and the circuit board 20 can be electrically connected, and the heat source chip 40 can be fixed on the circuit board 20, a material capable of achieving the electrical connection may be specifically selected to be welded together, or an SMT patch manner is adopted to fix the two together, and a specific implementation manner may be selected by a person skilled in the art as needed, and the present embodiment does not limit the present embodiment.
In addition, in order to fix the ventilation structure 30 on the circuit board 20, the fixing manner, such as soldering, clamping, etc., may also be selected by one skilled in the art as needed in the specific implementation, and the present embodiment is not limited thereto.
In order to facilitate understanding of the heat dissipation principle of the heat dissipation assembly provided in the present embodiment, the following description is made in detail with reference to fig. 3:
before describing the heat dissipation principle of the heat dissipation assembly, the technical names of "draught effect," canyon effect "and" canyon wind "are explained first.
The term "draft" refers to that when hot air rises to form a negative pressure zone at the bottom, cold air is supplemented to increase the flow of the atmosphere, and is generally applied to a chimney at present.
The "canyon effect", also called "canyon effect" or "canyon effect", is like the wind in a canyon is always stronger than the plain wind, and the wind force in narrow zones between high buildings in an urban area is also very strong.
The term "canyon wind" refers to an local wind that is generated by passing through a mountain area. When air enters the mouth of a mountain canyon from an open area, the cross-sectional area of the air flow is reduced, and since air mass cannot be accumulated there, the air flow is accelerated (the principle of continuity of the fluid), thereby forming a strong wind.
As can be seen from the above description and the above description of the structure of the heat dissipation assembly, the heat dissipation assembly provided in this embodiment is just that the ventilation structure 30 with a narrow top and a wide bottom is adopted, so that the ventilation duct formed after the structure 30 is fixed on the circuit board 20 can satisfy the "draught" effect and the "canyon effect", and the heat source chip 40 is disposed in the region where the "canyon wind" is easily formed, so that the heat dissipation assembly provided in this embodiment has the condition of air-cooling heat dissipation.
As shown in fig. 3, the heat source chip 40 is disposed on the area of the circuit board 20 corresponding to the side close to the air outlet 32 of the ventilation duct, when the heat source chip 40 works, the area becomes a high temperature area along with the rise of temperature, so that the area (the area on the side of the air inlet 31 of the ventilation duct) where the heat source chip 40 is not disposed can form a negative pressure area, at this time, the external cold air can be supplemented to the negative pressure area in the ventilation duct through the air inlet 111 penetrating through the housing body 11 and the air inlet 31 opening formed on the ventilation structure 30, because the temperature of the external air corresponding to the heat dissipation opening 112 penetrating through the housing body 11, the temperature of the high temperature area in the ventilation duct, and the temperature of the negative pressure area are different, thereby causing a gas density difference, the pressure generated by the density difference is wind pulling force, also referred to as chimney suction force, so that the cold air in the negative pressure area pushes the hot air in, through the louvers 112.
It is obvious from the above description that, in the heat dissipation assembly provided in the present embodiment, the ventilation structure having the air channel is installed on the circuit board, and the heat source chip is disposed on the circuit board in the area where the air channel is located, so that when the heat source chip operates and the temperature rises, the external cold air can enter the housing through the air inlet penetrating through the side wall of the housing, and then enter the air channel through the air inlet of the air channel, when the cold air rises to the area where the heat source chip is located, the cold air rapidly passes through the area where the heat source chip is located by the negative pressure formed by the cold air and the hot air in the air channel, and takes away the hot air in the area where the heat source chip is located, so as to achieve the effect of reducing the heat source chip, and the hot air flows out through the air outlet of the air channel and the heat dissipation port penetrating through the side wall of the housing, and is released to the, thereby the heat source chip can be cooled down rapidly.
In addition, as can be seen from the above description, compared with the prior art, the heat dissipation assembly of the embodiment of the present invention utilizes the "wind pulling" effect, so that the heat dissipation assembly has the condition of air-cooling heat dissipation, and thus the passive manner of automatic convection heat dissipation is converted into the active heat dissipation manner, thereby greatly improving the heat dissipation efficiency.
In addition, as can be seen from the above description, compared with the prior art, the active heat dissipation is implemented based on the condition of air-cooled heat dissipation instead of using a heat dissipation device such as a fan, so that the heat dissipation efficiency is improved and the implementation cost is effectively reduced.
A second embodiment of the present invention relates to a heat dissipating assembly. As shown in fig. 4, the heat dissipation assembly provided by the second embodiment is substantially the same as the heat dissipation assembly provided by the first embodiment, and the main differences are that: in the second embodiment, the heat dissipating module further includes a heat sink 50 fixed to the heat source chip 40.
In particular, the "draught" effect and the "canyon effect" are further enhanced, so that the temperature of the heat source chip 40 can be rapidly lowered, in the embodiment, the heat sink 50 is opposite to one surface of the heat source chip 40, that is, the surface which is not in contact with the heat source chip 40, and a plurality of ventilation channels are arranged along the air channel formed by the ventilation structure 30, so that the air flowing through the high-temperature region where the heat source chip 40 is located can form stronger "canyon wind", and further flow through the heat source chip 40 more rapidly, and the hot air in the region is taken away, so that the heat source chip 40 is rapidly cooled.
In order to fix the heat sink 50 to the heat source chip 40, the heat sink 50 is fixed to the heat source chip 40 by a silicone layer and screws.
Specifically, the silicone layer (not shown in fig. 4) is disposed between the heat sink 50 and the heat source chip 40, and then screws (not shown in fig. 4) are inserted through holes (not shown in fig. 4) formed in the heat sink 50 and screwed into the silicone layer, thereby fixing the heat sink 50 to the heat source chip 40.
It should be understood that when the heat sink 50 is fixed to the heat source chip 40 by using the silicone grease layer and the screws, corresponding holes are required to be formed in the heat sink 40.
Through setting up the silicone grease layer, fix the screw in the silicone grease layer to avoid causing the damage of heat source chip.
Further, in order to enable the temperature of the heat source chip 40 to be better transferred to the heat sink 50, the heat sink assembly further includes a heat conductive member (not shown in fig. 4).
Specifically, the heat conducting member is disposed between the silicone grease layer and the heat sink.
It should be understood that the above-mentioned embodiment is only one specific structure, and the heat dissipation assembly provided in the present embodiment is not limited in any way, and in practical applications, one skilled in the art can set the above-mentioned specific structure as needed and select suitable materials, such as a heat conduction member made of graphite or copper foil material, a ventilation structure 30 and a heat dissipation member 50 made of aluminum alloy material.
Through the above description, it is not difficult to find that the heat dissipation assembly provided by the embodiment is provided with the heat dissipation part with the plurality of ventilation channels through the fixing on the high-temperature chip, so that the air flowing through the high-temperature region where the heat source chip is located can form stronger canyon wind, and then the air flowing through the heat source chip more quickly takes away the hot air in the region, so that the heat source chip is quickly cooled, and the heat dissipation efficiency is further improved.
A third embodiment of the present invention relates to an electronic apparatus. Wherein the electronic device comprises the heat dissipation assembly according to the first embodiment or the second embodiment.
For the specific structure of the heat dissipation assembly, reference is made to the above embodiments, which are not repeated herein.
In addition, the electronic device adopts the technical scheme of the embodiment, so that the electronic device has the beneficial effects brought by the technical scheme of the embodiment.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific embodiments for practicing the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (10)
1. A heat sink assembly, comprising:
the shell is provided with an installation cavity, an air inlet and a heat dissipation port, wherein the air inlet and the heat dissipation port are arranged on the side wall of the shell in a penetrating manner;
a circuit board mounted in the mounting cavity;
the ventilation structure is arranged on the circuit board and provided with an air inlet and an air outlet which are respectively opposite to the air inlet and the heat dissipation port, and the air inlet and the air outlet are mutually communicated to form an air channel;
and the heat source chip is positioned in the air channel and is electrically connected with the circuit board.
2. The heat dissipating assembly of claim 1, wherein the opening of the air channel narrows from the air inlet to the air outlet.
3. The heat dissipation assembly of claim 1 or 2, wherein the heat source chip is located on a side of the air channel near the air outlet.
4. The heat dissipation assembly of claim 1, further comprising: a heat sink;
the radiating fin is fixed on the heat source chip, faces back to one side of the heat source chip, and is provided with a plurality of ventilation channels along the air channel.
5. The heat sink assembly of claim 4, wherein a silicone layer is disposed between the heat sink and the heat source chip, and the heat sink is fixed to the silicone layer with screws.
6. The heat sink assembly of claim 5, wherein a thermally conductive member is disposed between the silicone layer and the heat sink.
7. The heat dissipation assembly of claim 1, wherein the housing comprises: a housing body and a housing cover;
the mounting cavity is arranged in the shell body, and the air inlet and the heat dissipation port penetrate through the side wall of the shell body;
the shell cover is detachably fixed on one surface of the shell body, wherein the installation cavity is formed in the shell body.
8. The heat sink assembly of claim 7, wherein a side of the circuit board facing away from the heat source chip is fixed away from the housing body.
9. The heat dissipating assembly of claim 7, wherein a support member is disposed through a sidewall of the housing body where the air inlet is disposed;
the support member forms a gap with the horizontal plane when the housing body is placed on the horizontal plane.
10. An electronic device, comprising: the heat removal assembly of any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010831166.3A CN111935956B (en) | 2020-08-18 | 2020-08-18 | Heat dissipation assembly and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010831166.3A CN111935956B (en) | 2020-08-18 | 2020-08-18 | Heat dissipation assembly and electronic device |
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| CN111935956A true CN111935956A (en) | 2020-11-13 |
| CN111935956B CN111935956B (en) | 2023-04-07 |
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| CN202010831166.3A Active CN111935956B (en) | 2020-08-18 | 2020-08-18 | Heat dissipation assembly and electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113466518A (en) * | 2021-05-20 | 2021-10-01 | 李嘉齐 | Multifunctional electric meter for smart power grid |
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| CN111935956B (en) | 2023-04-07 |
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