CN111935956A - Heat dissipation assembly and electronic device - Google Patents

Abstract

The invention relates to the field of thermodynamics, and discloses a heat dissipation component and an electronic device. In the present invention, by installing a ventilation structure with an air channel on the circuit board, and arranging the heat source chip on the circuit board in the area where the air channel is located, when the heat source chip works and the temperature rises, the cold air from the outside can escape from the shell. The air inlet through the side wall of the body enters the housing, and then enters the air channel from the air inlet of the air channel. When the cold air rises to the area where the heat source chip is located, the negative pressure formed by the hot and cold air in the air channel quickly penetrates the air channel. The area where the heat source chip is located takes away the hot air in the area where the heat source chip is located to achieve the effect of reducing the heat source chip. The provided heat dissipation component enhances the heat exchange speed by using the "pulling air" effect, and achieves the purpose of air cooling and heat dissipation, thereby greatly improving the heat dissipation efficiency.

Description

Thermal components and electronics

technical field

The invention relates to the field of thermodynamics, in particular to a heat dissipation component and an electronic device.

Background technique

The main heat source of existing high power consumption hardware products is mainly concentrated on the main chip (hereinafter referred to as: heat source chip). Therefore, solving the heat dissipation problem of the heat source chip can solve the heat dissipation problem of the whole machine.

However, the current heat dissipation scheme is either by arranging heat dissipation holes on the product shell, so that the heat source chip on the internal circuit board is dissipated by heat convection with the outside air through the heat dissipation holes, but because this heat dissipation method is passive heat dissipation, the heat dissipation Low efficiency, for high-power, small-volume products, it is often impossible to meet the cooling requirements of the heat source chip; either by setting up an electric fan in the area where the heat source chip is located, and using the electric fan to enhance air convection, thereby improving the heat dissipation efficiency, although this method changes The above-mentioned deficiencies of active heat dissipation are eliminated, but an additional electric fan is required, which leads to an increase in product cost.

SUMMARY OF THE INVENTION

The purpose of the embodiments of the present invention is to provide a heat dissipation assembly and an electronic device to solve the above technical problems.

In order to solve the above technical problems, embodiments of the present invention provide a heat dissipation assembly, including:

a housing, which has an installation cavity, and an air inlet and a heat dissipation port extending through the side wall of the housing, and the air inlet and the heat dissipation port are arranged opposite to each other;

a circuit board, installed in the installation cavity;

A ventilation structure is installed on the circuit board, the ventilation structure has an air inlet and an air outlet respectively arranged opposite to the air inlet and the heat dissipation port, and the air inlet and the air outlet communicate with each other to form air aisle;

The heat source chip is located in the air channel and is electrically connected with the circuit board.

Embodiments of the present invention also provide an electronic device, comprising: the heat dissipation assembly described above.

Compared with the prior art, the embodiment of the present invention installs a ventilation structure with an air channel on the circuit board, and sets the heat source chip on the circuit board in the area where the air channel is located, so that the heat source chip works and the temperature rises. When the cold air from outside can enter the casing from the air inlet through the side wall of the casing, and then enter the air passage from the air inlet of the air passage, when the cold air rises to the area where the heat source chip is located, the cold and heat in the air duct can be used for cooling and heating. The negative pressure formed by the air quickly passes through the area where the heat source chip is located, and takes away the hot air in the area where the heat source chip is located to achieve the effect of reducing the heat source chip. , released to the outside world, that is, the heat dissipation component provided by the present invention enhances the heat exchange speed by utilizing the "pulling wind" effect, so that the heat source chip can be rapidly cooled.

In addition, it can be seen from the above description that, compared with the prior art, in the embodiments of the present invention, since the heat dissipation component utilizes the "pulling wind" effect, the heat dissipation component has the conditions for air cooling and heat dissipation, so that the existing passive heat dissipation using automatic convection heat dissipation is changed. The method is converted into an active heat dissipation method, which greatly improves the heat dissipation efficiency.

In addition, it can be seen from the above description that, compared with the prior art, since the active heat dissipation is realized based on the condition of air-cooled heat dissipation, rather than by means of a heat dissipation device such as a fan, the embodiment of the present invention improves the heat dissipation efficiency while effectively reducing heat dissipation. Reduced implementation costs.

In addition, the opening of the air passage is gradually narrowed from the air inlet to the air outlet. By choosing a ventilation structure with a narrow top and a wide bottom, after the outside cold air enters the air passage, it can form a "canopy tube effect". Therefore, the "canyon wind" formed in the heat source chip area can be used to achieve the purpose of rapid air cooling and heat dissipation.

In addition, the heat source chip is located on the side of the air channel close to the air outlet. By arranging the heat source chip on the side of the air passage close to the air outlet, that is, the narrower part of the air passage, after the outside cold air enters the air passage through the air inlet on the casing, the cold air flows through the heat source chip In the high temperature area, a "canyon wind" is formed, which quickly flows out from the air outlet, and then quickly takes away the temperature of the heat source chip, causing the temperature of the heat source chip to drop rapidly.

In addition, the heat dissipation assembly further includes: a heat dissipation fin; the heat dissipation fin is fixed on the heat source chip, and the heat dissipation fin faces the side of the heat source chip, and there are several ventilation channels running through the air channel . By fixing the heat sink with a number of ventilation channels through the heat source chip, the "pulling air" effect and the "gorge tube effect" are further enhanced, so that the temperature of the heat source chip can be rapidly decreased.

In addition, a silicone grease layer is disposed between the heat sink and the heat source chip, and the heat sink is fixed on the silicone grease layer by screws. By setting the silicone grease layer, fix the screws in the silicone grease layer to avoid damage to the heat source chip.

In addition, a heat conducting member is arranged between the silicone grease layer and the heat sink. By arranging a heat conducting member between the heat sink and the silicone grease layer, the temperature of the heat source chip can be better transferred to the heat sink.

In addition, the casing includes: a casing body and a casing cover; the installation cavity is opened in the casing body, the air inlet and the heat dissipation port are penetrated through the side wall of the casing body; the casing cover is It is detachably fixed on the side of the housing body on which the mounting cavity is opened. By being fixed in a detachable manner, the maintenance of the circuit board, the heat source chip and the ventilation structure installed in the installation cavity is facilitated.

In addition, the side of the circuit board facing away from the heat source chip is fixed away from the shell body. The circuit board is not arranged against the shell body, so that the cold air can pass through the gap between the circuit board and the shell body to take away part of the waste heat.

In addition, a support member is provided through the side wall of the housing body with the air inlet; the support member forms a gap with the horizontal surface when the housing body is placed on a horizontal plane, so as to facilitate the flow of cold air from the outside world. The air port enters the housing and flows out along the air channel to take away the waste heat of the heat source chip.

Description of drawings

One or more embodiments are exemplified by the pictures in the corresponding drawings, and these exemplifications do not constitute limitations of the embodiments, and elements with the same reference numerals in the drawings are denoted as similar elements, Unless otherwise stated, the figures in the accompanying drawings do not constitute a scale limitation.

FIG. 1 is a schematic exploded schematic diagram of the structure of the heat dissipation assembly in the first embodiment;

2 is a side view of the heat dissipation assembly in the first embodiment;

3 is a schematic diagram of the heat dissipation principle of the heat dissipation assembly in the first embodiment;

FIG. 4 is a schematic exploded view of the structure of the heat dissipation assembly in the second embodiment.

Detailed ways

In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, each embodiment of the present invention will be described in detail below with reference to the accompanying drawings. However, those of ordinary skill in the art can appreciate that, in the various embodiments of the present invention, many technical details are set forth in order for the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the present application can be realized.

The following divisions of the various embodiments are for the convenience of description, and should not constitute any limitation on the specific implementation of the present invention, and the various embodiments may be combined with each other and referred to each other on the premise of not contradicting each other.

The first embodiment of the present invention relates to a heat dissipation assembly including: a housing having an installation cavity, and an air inlet and a heat dissipation port extending through the side wall thereof, and the air inlet and the heat dissipation port are arranged opposite to each other The circuit board is installed in the installation cavity; the ventilation structure is installed on the circuit board, and the ventilation structure has an air inlet and an air outlet respectively arranged opposite to the air inlet and the heat dissipation port, so The air inlet and the air outlet are communicated with each other to form an air channel; the heat source chip is located in the air channel and is electrically connected with the circuit board.

In order to better understand the heat dissipation assembly provided in this embodiment, the specific structure of the heat dissipation assembly in this embodiment will be described below with reference to FIG. 1 and FIG. 2 .

As shown in FIG. 1 and FIG. 2 , the heat dissipation assembly includes a casing 10 , a circuit board 20 , a ventilation structure 30 and a heat source chip 40 .

The housing 10 further includes a housing body 11 and a housing cover 12 . The installation cavity is opened in the case body 11 , and the air inlet and the heat dissipation port are formed on the side wall of the case body 11 .

In addition, it should be noted that the specific penetration positions of the air inlet and the heat dissipation port can be determined according to the placement of the housing 10 .

For example, if the casing 10 is a vertical structure, that is, the circuit board 20 , the ventilation structure 30 and the heat source chip 40 located in the casing body 11 are in a vertical relationship with the horizontal plane, the air inlet is arranged on the side facing the horizontal plane. The heat dissipation port opposite to the air inlet is arranged on the side wall away from the horizontal plane. For details, please refer to the air intake port 111 and the heat dissipation port 112 in FIG. 1 for details.

In addition, since the circuit board 20 , the ventilation structure and the heat source chip 40 are all installed in the installation cavity beginning in the case body 11 , in order to facilitate subsequent maintenance of these components, in this embodiment, the case cover 12 is detachable It is fixed on the side of the casing body 11 with the installation cavity, so that after the casing cover 12 is fixed on the casing body 11, a sealed accommodating space can be formed to protect the circuit installed in the installation cavity. The function of the board 20 , the ventilation structure 30 and the heat source chip 40 .

It should be understood that, regarding the above-mentioned detachable manners, in practical applications, the manners of screws or snaps may be used, which are not listed here one by one, and are not limited in this embodiment.

In addition, it is worth mentioning that, in order to further improve the heat dissipation effect of the heat dissipation component and reduce the temperature of the heat source chip 40 as soon as possible, in practical applications, when the circuit board 20 is fixed in the mounting cavity opened in the shell body 11, the circuit The side of the board 20 facing away from the heat source chip 40 , that is, the side on which the heat source chip 40 and the ventilation structure 30 are not installed is fixed away from the case body 11 .

Specifically, several pieces of the bottom surface of the mounting cavity opened in the housing body 11 can be injected, for example, four projections that can be matched with the bolts 21, such as 113 in FIG. 1 or FIG. 2 (only one is shown in FIG. two), so that after the circuit board 20 is fixed in the installation cavity by the bolts 21, there can be a little gap between the circuit board 20 and the shell body.

Through the above structure, that is, the circuit board 20 and the case body 11 are not attached to each other, the cold air can pass through the gap between the circuit board 20 and the case body 11 to take away part of the waste heat, thereby accelerating the temperature reduction speed of the heat source chip 40 .

Further, for the casing 10 with a vertical structure, in practical applications, in order to ensure that the outside cold air can enter the ventilation duct formed by the structure 30 provided in the installation cavity from the air inlet provided on the side wall of the casing body 11. , the side wall of the casing body 11 through which the air inlet is provided also needs to be provided with a support, so that when the casing body 11 is placed vertically on a horizontal plane, a certain gap can be formed with the horizontal plane.

In order to ensure that the shell body 11 can stand stably on the horizontal plane, the side wall (hereinafter referred to as the bottom surface) of the air inlet can be penetrated through the shell body 11, and four support members can be provided, specifically, four support members can be provided on the bottom surface. For the position of the apex, see support 114 in FIG. 2 (two are shown in FIG. 2 ).

In addition, it is worth mentioning that, in order to improve the heat dissipation effect, the casing 10 may be preferably made of an aluminum alloy material that is easy to dissipate heat.

It should be understood that the above is only a specific structure and preparation material of the casing 10 , and in practical applications, those skilled in the art can make reasonable adjustments as needed, which is not limited in this embodiment.

In addition, regarding the air passage formed by the air inlet 31 and the air outlet 32 of the ventilation structure 30 that communicate with each other, in this embodiment, the opening of the ventilation structure 30 is gradually narrowed from the air inlet 31 to the air outlet 32, that is, the ventilation structure in this embodiment. 30 is narrow at the top (towards the heat dissipation port running through the side wall of the shell body 11) and wide at the bottom (towards the air inlet running through the side wall of the shell body 11). The air duct formed based on this structure can help " The formation of the "pulling wind" effect and the "canyon tube effect" can greatly enhance the heat exchange speed through the mutual cooperation of the "pulling wind" effect and the "canyon tube effect", and then use the "canyon wind" formed in the area where the heat source chip 40 is located. To achieve the purpose of rapid air cooling and heat dissipation.

For ease of understanding, a specific ventilation structure is provided in this embodiment, and details are shown in the ventilation structure 30 shown in FIG. 1 and FIG. 2 .

It should be understood that the above examples are only examples listed for better understanding of the technical solutions of the present embodiment, and are not intended to be the sole limitation of the present embodiment. In practical applications, the ventilation structure 30 only needs to satisfy the requirements of The openings of the air passages formed by the interconnected air openings 32 may be gradually narrowed from the air inlet 31 to the air outlet 32 .

Further, in the specific implementation, in order to better achieve the effect of rapidly reducing the temperature of the heat source chip 40 by means of the "canyon tube effect", the heat source chip 40 may be specifically arranged on the side of the air passage close to the air outlet 32, that is, the air passage is narrower. so that after the outside cold air enters the air passage through the air inlet 111 provided on the shell body 11, the cold air flows through the high temperature area where the heat source chip 40 is located, forming a "canyon wind", from the air outlet 32, The heat dissipation port 12 flows out quickly, thereby quickly taking away the waste heat of the heat source chip 40 , so that the temperature of the heat source chip 40 drops rapidly.

In addition, it is worth mentioning that, in this embodiment, in order to ensure that the heat source chip 40 and the circuit board 20 can be electrically connected, and the heat source chip 40 can be fixed on the circuit board 20, a material that can realize electrical connection can be selected specifically. The two are welded together, or the two are fixed together by means of SMT patches. The specific implementation manner can be selected by those skilled in the art as required, which is not limited in this embodiment.

In addition, in order to fix the ventilation structure 30 on the circuit board 20 , a person skilled in the art can also select a fixing method according to needs, such as welding, clamping, etc., which is not limited in this embodiment.

In order to facilitate the understanding of the heat dissipation principle of the heat dissipation component provided in this embodiment, the following is a detailed description with reference to FIG. 3 :

Before introducing the heat dissipation principle of the heat dissipation component, the technical names such as "pulling wind" effect, "canyon tube effect" and "canyon wind" are explained first.

The so-called "pulling wind" specifically means that when the hot air rises, a negative pressure area is formed at the bottom, and the cold air will enter to supplement and increase the atmospheric flow. It is usually used in chimneys at present.

The "canyon tube effect", also known as the "narrow tube effect" or "canyon effect", is like the wind in the canyon is always stronger than the plain wind, and the wind in the narrow area between the tall buildings in the city is also particularly strong.

The so-called "canyon wind" currently refers to the local wind formed by passing through the mountains. When the air enters the mouth of the mountain canyon from the open area, the cross-sectional area of the airflow decreases. Since the air mass cannot be accumulated here, the airflow accelerates (the principle of fluid continuity), thereby forming a strong wind.

It can be seen from the above introduction and the above description of the structure of the heat dissipation assembly that the heat dissipation assembly provided in this embodiment adopts the ventilation structure 30 with a narrow top and a wide bottom, so that the ventilation structure 30 is fixed to the circuit board 20 and formed after the ventilation structure 30 is used. The pipes can satisfy the "wind pulling" effect and the "canyon pipe effect", and by disposing the heat source chip 40 in an area where "canyon pipe wind" is easily formed, the heat dissipation assembly provided by this embodiment has the conditions for air cooling and heat dissipation.

As shown in FIG. 3 , the heat source chip 40 is arranged on the area of the circuit board 20 corresponding to the side of the air outlet 32 of the ventilation duct. When the heat source chip 40 is working, as the temperature increases, this area will become a high temperature area. As a result, the area where the heat source chip 40 is not provided (the area on the side of the air inlet 31 of the ventilation duct) will form a negative pressure area, and the cold air from the outside will pass through the air inlet 111 on the casing body 11. The air inlet 31 opened on the structure 30 is supplemented to the negative pressure area in the ventilation duct, because the temperature of the outside air, the temperature of the high temperature area in the ventilation duct, and the temperature of the negative pressure area corresponding to the heat dissipation port 112 on the shell body 11 The difference in gas density causes the difference in gas density. The pressure generated by this density difference is the pulling force, also known as the chimney pulling force, which overcomes the resistance and makes the cold air in the negative pressure area push the hot air in the high temperature area to flow upwards and release through the cooling holes 112 .

It is not difficult to find from the above description that the heat dissipation component provided in this embodiment works on the heat source chip by installing a ventilation structure with an air channel formed on the circuit board, and arranging the heat source chip on the circuit board in the area where the air channel is located. When the temperature rises, the outside cold air can enter the casing from the air inlet through the side wall of the casing, and then enter the air passage from the air inlet of the air passage. When the cold air rises to the area where the heat source chip is located, the air The negative pressure formed by the cold and hot air in the pipe quickly passes through the area where the heat source chip is located, and takes away the hot air in the area where the heat source chip is located to achieve the effect of reducing the heat source chip. The hot air passes through the air outlet of the air channel and the side wall of the casing The heat dissipation port of the present invention flows out and is released to the outside world, that is, the heat dissipation component provided by the present invention enhances the heat exchange speed by using the "pulling wind" effect, so that the heat source chip can be rapidly cooled.

In addition, it can be seen from the above description that, compared with the prior art, in the embodiments of the present invention, since the heat dissipation component utilizes the "pulling wind" effect, the heat dissipation component has the conditions for air cooling and heat dissipation, so that the existing passive heat dissipation using automatic convection heat dissipation is changed. The method is converted into an active heat dissipation method, which greatly improves the heat dissipation efficiency.

In addition, it can be seen from the above description that, compared with the prior art, since the active heat dissipation is realized based on the condition of air-cooled heat dissipation, rather than by means of a heat dissipation device such as a fan, the embodiment of the present invention improves the heat dissipation efficiency while effectively reducing heat dissipation. Reduced implementation costs.

A second embodiment of the present invention relates to a heat dissipation assembly. As shown in FIG. 4 , the heat dissipation assembly provided in the second embodiment is substantially the same as the heat dissipation assembly provided in the first embodiment, and the main difference is that in the second embodiment, the heat dissipation assembly further includes a heat dissipation assembly fixed on the heat source chip 40 . Heat sink 50 .

Specifically, the "wind-pulling" effect and the "gorge tube effect" are further enhanced, so that the temperature of the heat source chip 40 can be rapidly decreased. On the non-contact side of the chip 40, there are several ventilation channels running through the air channel formed by the ventilation structure 30, so that the air flowing through the high temperature area where the heat source chip 40 is located can form a stronger "canyon wind", and then flow more quickly. The overheating source chip 40 takes away the hot air in this area to rapidly cool down the heat source chip 40 .

In addition, in order to fix the heat sink 50 on the heat source chip 40 , in this embodiment, the heat sink 50 is fixed on the heat source chip 40 by combining a silicone grease layer with screws.

Specifically, the silicone grease layer (not shown in FIG. 4 ) is disposed between the heat sink 50 and the heat source chip 40 , and then screws (not shown in FIG. 4 ) are used to pass through the holes (not shown in FIG. 4 ) opened on the heat sink 50 . 4 ), and screw the screws into the silicone grease layer, so as to fix the heat sink 50 on the heat source chip 40 .

It should be understood that, when the heat sink 50 is fixed on the heat source chip 40 by combining the silicone grease layer with screws, corresponding holes need to be opened on the heat sink 40 in advance.

By setting the silicone grease layer, the screws are fixed in the silicone grease layer, so as to avoid damage to the heat source chip.

Further, in order to better transmit the temperature of the heat source chip 40 to the heat sink 50 , the heat sink assembly further includes a heat conduction member (not shown in FIG. 4 ).

Specifically, the heat conducting member is disposed between the silicone grease layer and the heat sink.

It should be understood that what is given above is only a specific structure, and does not constitute any limitation to the heat dissipation assembly provided in this embodiment. In practical applications, those skilled in the art can set as required and select suitable materials For example, a heat-conducting member made of graphite or copper foil material is selected, and a ventilation structure 30 and a heat-dissipating member 50 made of aluminum alloy material are selected.

It is not difficult to find from the above description that the heat dissipation component provided in this embodiment can form a more powerful "canyon" for the air flowing through the high temperature area where the heat source chip is located by fixing a heat dissipation member with several ventilation channels on the high temperature chip. Wind”, and then flow the heat source chip more quickly, take away the hot air in this area, make the heat source chip cool down quickly, and further improve the heat dissipation efficiency.

A third embodiment of the present invention relates to an electronic device. Wherein, the electronic device includes the heat dissipation assembly described in the first embodiment or the second embodiment.

For the specific structure of the heat dissipating assembly, reference may be made to the foregoing embodiments, which will not be repeated in this embodiment.

In addition, since the electronic device adopts the technical solutions of the above-mentioned embodiments, it has the beneficial effects brought by the technical solutions of the above-mentioned embodiments.

Those of ordinary skill in the art can understand that the above-mentioned embodiments are specific embodiments for realizing the present invention, and in practical applications, various changes can be made in form and details without departing from the spirit and the spirit of the present invention. scope.

Claims (10)

1. A heat dissipation assembly, characterized in that, comprising: a housing, which has an installation cavity, and an air inlet and a heat dissipation port extending through the side wall of the housing, and the air inlet and the heat dissipation port are arranged opposite to each other; a circuit board, installed in the installation cavity; A ventilation structure is installed on the circuit board, the ventilation structure has an air inlet and an air outlet respectively arranged opposite to the air inlet and the heat dissipation port, and the air inlet and the air outlet communicate with each other to form air aisle; The heat source chip is located in the air channel and is electrically connected with the circuit board. 2 . The heat dissipation assembly according to claim 1 , wherein the opening of the air passage is gradually narrowed from the air inlet to the air outlet. 3 . 3 . The heat dissipation assembly according to claim 1 or 2 , wherein the heat source chip is located on a side of the air channel close to the air outlet. 4 . 4. The heat dissipation assembly according to claim 1, wherein the heat dissipation assembly further comprises: a heat dissipation fin; The heat sink is fixed on the heat source chip, and a side of the heat sink facing away from the heat source chip is provided with several ventilation channels along the air channel. 5 . The heat dissipation assembly according to claim 4 , wherein a silicone grease layer is disposed between the heat sink and the heat source chip, and the heat sink is fixed on the silicone grease layer by screws. 6 . 6 . The heat dissipation assembly according to claim 5 , wherein a heat conducting member is disposed between the silicone grease layer and the heat sink. 7 . 7. The heat dissipation assembly according to claim 1, wherein the casing comprises: a casing body and a casing cover; The installation cavity is opened in the shell body, and the air inlet and the heat dissipation port are penetrated through the side wall of the shell body; The shell cover is detachably fixed on the side of the shell body on which the installation cavity is opened. 8 . The heat dissipation assembly according to claim 7 , wherein a side of the circuit board facing away from the heat source chip is fixed away from the case body. 9 . 9 . The heat dissipation assembly according to claim 7 , wherein a support member is provided on the side wall of the housing body through which the air inlet is provided; 10 . When the support member makes the housing body placed on a horizontal plane, a gap is formed with the horizontal plane. 10. An electronic device, comprising: the heat dissipation assembly according to any one of claims 1 to 9.

Images