CN209649763U - LED lamp assembly for UV printing and curing - Google Patents

LED lamp assembly for UV printing and curing Download PDF

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Publication number
CN209649763U
CN209649763U CN201920071636.3U CN201920071636U CN209649763U CN 209649763 U CN209649763 U CN 209649763U CN 201920071636 U CN201920071636 U CN 201920071636U CN 209649763 U CN209649763 U CN 209649763U
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led light
assembly apparatus
outer housing
light assembly
internal box
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李源
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Qingdao Laiyidi Optoelectronics Technology Co Ltd
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Qingdao Laiyidi Optoelectronics Technology Co Ltd
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Abstract

The utility model relates to print cured LED light assembly apparatus for UV, it includes outer housing, the lower port of outer housing lower end is set, the air inlet of outer housing upper end is set, the blower of air inlet is set, the internal box at lower port and being located in outer housing is set, the lower installing port of internal box lower end is set, the LED light being mounted at lower installing port, the upper installing port of internal box upper end is set, the radiator being mounted on installing port, cabinets cavity in the inner box is set, semiconductor chilling plate in cabinets cavity is set, and the air outlet of outer housing lower end is set;It is the utility model is designed reasonably, compact-sized and easy to use.

Description

用于UV印刷固化的LED灯总成装置LED lamp assembly for UV printing and curing

技术领域technical field

本实用新型涉及用于UV印刷固化的LED灯总成装置。The utility model relates to an LED lamp assembly device used for UV printing and curing.

背景技术Background technique

目前LED灯珠功率可达每粒3W,其中有50%左右的能量在PN结处发热,而PN结的温度要求不能超过125度;PN结与金属基板直接连接,基板温度要求不超过80度,才能达到灯粒温度要求。高能量LED灯基板的冷却问题,一直困扰高能量LED灯行业的发展,基板温度要求小于80度普通风冷、水冷方式接近或超出80度,对灯粒寿命影响较大;一般冷却方式,较难顺利把基板的热量带走,温度积聚过高,光衰快,灯粒寿命大大缩短。At present, the power of LED lamp beads can reach 3W per chip, and about 50% of the energy is generated at the PN junction, and the temperature of the PN junction should not exceed 125 degrees; the PN junction is directly connected to the metal substrate, and the temperature of the substrate must not exceed 80 degrees , in order to meet the lamp particle temperature requirements. The cooling problem of the high-energy LED lamp substrate has always plagued the development of the high-energy LED lamp industry. The temperature of the substrate is required to be less than 80 degrees. Ordinary air-cooled and water-cooled methods are close to or exceed 80 degrees. It is difficult to take away the heat of the substrate smoothly, the temperature accumulation is too high, the light decays quickly, and the life of the lamp particles is greatly shortened.

实用新型内容Utility model content

本实用新型所要解决的技术问题总的来说是提供一种用于UV印刷固化的LED灯总成装置;详细解决的技术问题以及取得有益效果在后述内容以及结合具体实施方式中内容具体描述。The technical problem to be solved by the utility model is generally to provide an LED lamp assembly device for UV printing and curing; the technical problem solved in detail and the beneficial effects achieved are described in detail in the following content and in conjunction with specific embodiments .

为解决上述问题,本实用新型所采取的技术方案是:For solving the problems referred to above, the technical scheme that the utility model takes is:

一种用于UV印刷固化的LED灯总成装置,包括外壳体、设置在外壳体下端的下端口、设置在外壳体上端的进风口、设置在进风口处的风机、设置在下端口处且位于外壳体中的内箱体、设置在内箱体下端的下安装口、安装在下安装口处的LED灯、设置在内箱体上端的上安装口、安装在上安装口上的散热器、设置在内箱体中的箱体内腔、设置在箱体内腔中的半导体制冷片、以及设置在外壳体下端的出风口;An LED lamp assembly device for UV printing and curing, comprising an outer casing, a lower port arranged at the lower end of the outer casing, an air inlet arranged at the upper end of the outer casing, a fan arranged at the air inlet, an The inner box in the outer shell, the lower installation opening arranged at the lower end of the inner box, the LED lamp installed at the lower installation opening, the upper installation opening arranged at the upper end of the inner box, the radiator installed on the upper installation opening, and the The inner cavity of the inner box, the semiconductor cooling chip arranged in the inner cavity of the box, and the air outlet arranged at the lower end of the outer casing;

半导体制冷片下端的吸热侧面与LED灯上表面接触设置;The heat-absorbing side of the lower end of the semiconductor refrigeration sheet is set in contact with the upper surface of the LED lamp;

半导体制冷片上端的散热侧面与散热器下表面接触设置。The radiating side of the upper end of the semiconducting refrigerating sheet is arranged in contact with the lower surface of the radiator.

作为上述技术方案的进一步改进:As a further improvement of the above technical solution:

散热器与LED灯通过连接螺栓连接。The radiator and the LED lamp are connected by connecting bolts.

风机为轴流风机、离心风机或幕风机。The fan is an axial fan, a centrifugal fan or a curtain fan.

在散热器上端的散热片上设置有纵向通道,在散热片上还设置有横向开口。Longitudinal passages are arranged on the cooling fins at the upper end of the radiator, and transverse openings are also arranged on the cooling fins.

连接螺栓和/或内箱体采用隔热板材。The connecting bolts and/or the inner box shall be made of heat-insulating boards.

出风口为进口小出口大的锥形出风嘴。The air outlet is a tapered air outlet with a small inlet and a large outlet.

散热侧面上部或吸热侧面上部露出于上安装口上方。The upper part of the heat dissipation side or the upper part of the heat absorption side is exposed above the upper mounting opening.

出风口设置在内箱体外侧。本实用新型的有益效果半导体制冷的优势寿命长,使用方便,安全稳定等优势,不限于此描述,为了更好的便于理解,在具体实施方式部分进行了更加详细的描述。The air outlet is arranged outside the inner box body. Beneficial Effects of the Utility Model The semiconductor refrigeration has advantages such as long service life, convenient use, safety and stability, etc., which are not limited to this description. For better understanding, a more detailed description is made in the specific implementation mode.

附图说明Description of drawings

图1是本实用新型侧向剖开的结构示意图。Fig. 1 is a schematic structural view of the utility model cut sideways.

图2是本实用新型爆炸的结构示意图。Fig. 2 is a structural schematic diagram of the explosion of the utility model.

其中:1、外壳体;2、内箱体;3、进风口;4、LED灯;5、半导体制冷片;6、连接螺栓;7、散热器;8、风机;9、出风口;10、箱体内腔;11、下安装口;12、上安装口;13、吸热侧面;14、散热侧面;15、纵向通道;16、横向开口;17、下端口;18、锥形出风嘴。Among them: 1. Outer shell; 2. Inner box; 3. Air inlet; 4. LED light; 5. Semiconductor cooling chip; 6. Connecting bolts; 7. Radiator; 8. Fan; 9. Air outlet; 10. 11. Lower installation opening; 12. Upper installation opening; 13. Heat-absorbing side; 14. Heat dissipation side; 15. Longitudinal channel; 16. Transverse opening; 17. Lower port; 18. Tapered air outlet.

具体实施方式Detailed ways

如图1-2所示,本实施例的用于UV印刷固化的LED灯总成装置,包括外壳体1、设置在外壳体1下端的下端口17、设置在外壳体1上端的进风口3、设置在进风口3处的风机8、设置在下端口17处且位于外壳体1中的内箱体2、设置在内箱体2下端的下安装口11、安装在下安装口11处的LED灯4、设置在内箱体2上端的上安装口12、安装在上安装口12上的散热器7、设置在内箱体2中的箱体内腔10、设置在箱体内腔10中的半导体制冷片5、以及设置在外壳体1下端的出风口9;As shown in Figure 1-2, the LED lamp assembly device for UV printing and curing in this embodiment includes an outer casing 1, a lower port 17 arranged at the lower end of the outer casing 1, and an air inlet 3 arranged at the upper end of the outer casing 1 , the fan 8 arranged at the air inlet 3, the inner box 2 arranged at the lower port 17 and located in the outer shell 1, the lower installation port 11 arranged at the lower end of the inner box 2, and the LED light installed at the lower installation port 11 4. The upper installation port 12 provided on the upper end of the inner box body 2, the radiator 7 installed on the upper installation port 12, the box inner cavity 10 set in the inner box body 2, and the semiconductor refrigeration unit set in the box inner cavity 10 sheet 5, and the air outlet 9 arranged at the lower end of the outer casing 1;

半导体制冷片5下端的吸热侧面13与LED灯4上表面接触设置;The heat-absorbing side 13 at the lower end of the semiconductor cooling sheet 5 is arranged in contact with the upper surface of the LED lamp 4;

半导体制冷片5上端的散热侧面14与散热器7下表面接触设置。The heat dissipation side surface 14 of the upper end of the semiconductor cooling sheet 5 is arranged in contact with the lower surface of the radiator 7 .

散热器7与LED灯4通过连接螺栓6连接。The radiator 7 is connected with the LED lamp 4 through the connecting bolt 6 .

风机8为轴流风机、离心风机或幕风机。Fan 8 is an axial flow fan, a centrifugal fan or a curtain fan.

在散热器7上端的散热片上设置有纵向通道15,在散热片上还设置有横向开口16。Longitudinal passages 15 are arranged on the cooling fins at the upper end of the radiator 7, and transverse openings 16 are also arranged on the cooling fins.

连接螺栓6和/或内箱体2采用隔热板材。The connecting bolts 6 and/or the inner box body 2 adopt heat insulating boards.

出风口9为进口小出口大的锥形出风嘴18。The air outlet 9 is a tapered air outlet 18 with a small inlet and a large outlet.

散热侧面14上部或吸热侧面13上部露出于上安装口12上方。The upper part of the heat dissipation side 14 or the upper part of the heat absorption side 13 is exposed above the upper installation opening 12 .

出风口9设置在内箱体2外侧。The air outlet 9 is arranged outside the inner box body 2 .

使用本实用新型时,外壳体1为载体,内箱体2实现支撑,还可以实现热隔离,避免热风与LED灯4接触;进风口3实现排风,可以设置在侧面等其他位置,LED灯4用于工作,产生大量的热量,半导体制冷片5为标准件,通过接触实现热传递,将热量传递给散热器7,连接螺栓6实现固定连接,将灯、制冷片、散热器7组成为一体,风机8实现风力输出,出风口9实现将热量排出,可以设置在侧面等其他位置,箱体内腔10方便安装,可以填充隔热介质等避免散热侧面14吸收的热量回传递给LED灯4,提高散热效果,通过下端口17,下安装口11,上安装口12方便安装部件,吸热侧面13,散热侧面14实现热传递,纵向通道15与横向开口16实现中心处的热量快速传出,避免热量堆积,锥形出风嘴18提高排风效果,解决了LED灯散热与冷却的问题。When using the utility model, the outer shell 1 is the carrier, the inner box 2 realizes support, and can also realize thermal isolation, avoiding hot air from contacting the LED lamp 4; 4 is used for work and generates a large amount of heat. The semiconductor cooling sheet 5 is a standard part, which realizes heat transfer through contact, and transfers the heat to the radiator 7. The connecting bolt 6 realizes fixed connection, and the lamp, cooling sheet, and radiator 7 are formed into a Integral, the fan 8 realizes the wind output, the air outlet 9 realizes the discharge of heat, and can be installed in other positions such as the side, the box cavity 10 is convenient for installation, and can be filled with heat insulating medium to prevent the heat absorbed by the heat dissipation side 14 from being transferred back to the LED lamp 4 , to improve the heat dissipation effect, through the lower port 17, the lower mounting port 11, and the upper mounting port 12 to facilitate the installation of components, the heat-absorbing side 13 and the heat-dissipating side 14 realize heat transfer, and the longitudinal channel 15 and the transverse opening 16 realize the rapid heat transfer from the center , to avoid heat accumulation, the tapered air outlet 18 improves the exhaust effect, and solves the problem of heat dissipation and cooling of the LED lamp.

具体工作流程,气流走向为进风口3-风机8-散热器7上部散热片-外壳体1与内箱体2间隙-出风口9(锥形出风嘴18),热量走向,LED灯4-吸热侧面13-散热侧面14-纵向通道15/横向开口16-外壳体1与内箱体2间隙-出风口9(锥形出风嘴18)。The specific working process, the airflow direction is air inlet 3-fan 8-radiator 7 upper heat sink-the gap between outer shell 1 and inner box 2-air outlet 9 (conical air outlet 18), heat direction, LED light 4- Heat-absorbing side 13-radiating side 14-longitudinal channel 15/transverse opening 16-gap between outer shell 1 and inner box 2-air outlet 9 (conical air outlet 18).

本实用新型设计合理、成本低廉、结实耐用、安全可靠、操作简单、省时省力、节约资金、结构紧凑且使用方便。The utility model is reasonable in design, low in cost, strong and durable, safe and reliable, simple in operation, saves time and effort, saves money, has compact structure and is convenient to use.

本实用新型充分描述是为了更加清楚的公开,而对于现有技术就不再一一例举。The full description of the utility model is for a clearer disclosure, and the prior art will not be exemplified one by one.

最后应说明的是:以上实施例仅用以说明本实用新型的技术方案,而非对其限制;尽管参照前述实施例对本实用新型进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;作为本领域技术人员对本实用新型的多个技术方案进行组合是显而易见的。而这些修改或者替换,并不使相应技术方案的本质脱离本实用新型实施例技术方案的精神和范围。Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present utility model, and are not intended to limit it; although the utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; it is obvious for those skilled in the art to combine multiple technical solutions of the present invention. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (8)

1. one kind prints cured LED light assembly apparatus for UV, it is characterised in that: including outer housing (1), be arranged in outer housing (1) lower port (17) of lower end, setting outer housing (1) upper end air inlet (3), blower at air inlet (3) is set (8), be arranged at lower port (17) and be located at outer housing (1) in internal box (2), setting internal box (2) lower end lower peace Dress mouth (11), be mounted at lower installing port (11) LED light (4), setting internal box (2) upper end upper installing port (12), peace Radiator (7) on upper installing port (12), is arranged in cabinets cavity the cabinets cavity (10) being arranged in internal box (2) (10) air outlet (9) of semiconductor chilling plate (5) in and setting in outer housing (1) lower end;
The heat absorption side (13) of semiconductor chilling plate (5) lower end contacts setting with LED light (4) upper surface;
The heat dissipation side (14) of semiconductor chilling plate (5) upper end and radiator (7) following table face contact are arranged.
2. according to claim 1 print cured LED light assembly apparatus for UV, it is characterised in that: radiator (7) Pass through connection bolt (6) connection with LED light (4).
3. according to claim 1 print cured LED light assembly apparatus for UV, it is characterised in that: blower (8) is Axial flow blower, centrifugal blower or curtain blower.
4. according to claim 1 print cured LED light assembly apparatus for UV, it is characterised in that: in radiator (7) it is provided on the cooling fin of upper end vertical passage (15), is additionally provided with transverse opening (16) on a heat sink.
5. according to claim 2 print cured LED light assembly apparatus for UV, it is characterised in that: connection bolt (6) and/or internal box (2) uses thermal insulation plate.
6. according to claim 1 print cured LED light assembly apparatus for UV, it is characterised in that: air outlet (9) For the big taper air outlet (18) in the small outlet of import.
7. according to claim 1 print cured LED light assembly apparatus for UV, it is characterised in that: heat dissipation side (14) top or heat absorption side (13) top are exposed to above installing port (12).
8. according to claim 1 print cured LED light assembly apparatus for UV, it is characterised in that: air outlet (9) Setting is on the outside of internal box (2).
CN201920071636.3U 2019-01-16 2019-01-16 LED lamp assembly for UV printing and curing Active CN209649763U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920071636.3U CN209649763U (en) 2019-01-16 2019-01-16 LED lamp assembly for UV printing and curing

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Application Number Priority Date Filing Date Title
CN201920071636.3U CN209649763U (en) 2019-01-16 2019-01-16 LED lamp assembly for UV printing and curing

Publications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109760415A (en) * 2019-03-19 2019-05-17 青岛莱伊迪光电科技有限公司 Integrated UV Lamp Unit and LED Lamp Assembly Unit for UV Printing Curing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109760415A (en) * 2019-03-19 2019-05-17 青岛莱伊迪光电科技有限公司 Integrated UV Lamp Unit and LED Lamp Assembly Unit for UV Printing Curing
CN109760415B (en) * 2019-03-19 2024-06-07 青岛莱伊迪光电科技有限公司 Integrated UV lamp device and LED lamp assembly device for UV printing and curing

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