200930275 九、發明說明： .【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別涉及一種用於為電子元 件進行散熱之散熱裝置。 【先前技術】 諸如電腦中央處理器、北橋晶片、顯卡等高功率電子元 件在運行時會產生大量之熱量，這些熱量如果不能被有效地 散去，將直接導致溫度急劇上升，而嚴重影響到電子元件之 ®正常運行。為此，需要散熱裝置來對這些電子元件進行散熱。 傳統之散熱裝置通常包括一底座、一散熱片組、一熱管 連接底座與該散熱片組、及一固定於散熱片組一侧之風扇。 電子元件產生之熱量首先傳遞至底座，然後被該熱管底部吸 收；該熱管藉由其内工作流體之相變化將熱量傳遞至其端 部，熱管端部之熱量再經由散熱片組散熱至周圍空氣中。風 扇可提高散熱片之熱交換速度，從而提高散熱效率。 Q 上述散熱裝置中，風扇吹送之氣流沿著散熱片之間之間 隔流動，在極短之時間内即離開該散熱片組，冷空氣利用率 較低，從而使散熱效率較低；且上述散熱裝置由於風扇之固 定需要複雜之結構架設，只能在散熱片一側單設置該風扇， 造成散熱片組另一側氣流流動較弱，造成整個散熱裝置散熱 效率降低。 【發明内容】 有鑒於此，有必要提供一種帶有導風罩且導風能力較 強、散熱效率高之散熱裝置。 6 200930275 一種散熱裝置，用於對一電子元件散熱，包括一與該電 ,子元件貼設之導熱板、複數散熱鰭片及連接導熱板與散熱鰭 片之熱管，該散熱鰭片之間形成複數通風道，該散熱裝置進 一步包括一導風罩，該導風罩包括一頂板及二連接頂板之標 板，該頂板固定在散熱鰭片頂部，該擋板圍住散熱鰭片之兩 端，二風扇固定於導風罩上且置於該散熱鰭片兩側並位於該 通風道之進出口。 上述散熱裝置中，採用於導風罩圍設散熱鰭片及雙風扇 ®結構，大大地增強了散熱鰭片之通風道中空氣之對流強度， 提高了散熱裝置之散熱效率。 【實施方式】 請同時參照圖1和圖2，為本發明第一實施例之散熱裝 置，該散熱裝置安裝於一電路板（圖未示）上用以散發電路板 上之電子元件（圖未示）產生之熱量。該散熱裝置包括一散熱 器組合10、組裝於該散熱器組合10上之導風罩20、及安裝 ❹於該導風罩20相對兩侧之二風扇30。 請一併參閱圖3,該散熱器組合10包括一導熱板12、 一散熱鰭片組14、用以連接導熱板12與散熱鰭片組14之並 行排列之三熱管16、以及固定於散熱鰭片組14頂端之固定 板18，其中： 該導熱板12大致呈矩形板狀體，其底部設有三平行相 隔之凹槽124。二安裝架13藉由螺釘133固定於導熱板12 之底部之相對兩端，每一安裝架13相對兩端凸伸有凸耳 132。導熱板12藉由穿過凸耳132之四緊固件（圖未示）與 7 200930275 電路板連接，並與電子元件保持緊密接觸。 . 每一熱管16呈U形設置包括一水準之吸熱部160及從 吸熱部160兩端豎直向上延伸之二平行放熱部162。該吸熱 部160收容於導熱板12之凹槽124内，其底面與導熱板12 之底面共面，以與導熱板12之底部形成平整之底面以貼設 於電子元件頂面上，吸收來自電子元件之熱量。該二放熱部 162貫穿散熱鰭片組14，使該散熱鰭片組14置於熱管16之 放熱部162上。 ® 該散熱鰭片組14由複數相互平行之散熱鰭片140自上 而下堆疊排列而成，每一散熱鰭片140呈微波浪狀，整體與 導熱板12大致平行。每一散熱鰭片140上兩側部分別設有 三並排之貫穿孔142,這些貫穿孔142用以收容熱管16之放 熱部162。每一散熱鰭片140自這些貫穿孔142邊緣延伸設 有環壁146以增大散熱鰭片140與放熱部162接觸表面積， 並且使相鄰之散熱鰭片140間隔一定之距離以形成通風道 ❹（圖未標）。每一散熱籍片140中部設有矩形分佈之四通孔 144，這些通孔144設於貫穿孔142之間。多層之散熱鰭片 140之通孔144可以組成螺紋孔，以供螺釘19螺合。 固定板18呈矩形板狀設置，其四角落分別設有一通孔 180,這些通孔180對應散熱鰭片140之通孔144,以供螺釘 19穿設將固定板18固定在散熱鰭片組14頂部。該固定板 18中部設有二螺孔185，以固定導風罩20。 請參閱圖4，導風罩20呈倒U型，包括一頂板22及自 該頂板22兩端垂直延伸之二擋板24。該頂板22及擋板24 8 200930275 ^ 之寬度與散熱鰭片組14之寬度相等。該頂板22中部設有二 * 通孔220，這二通孔220對應於上述固定板18之螺孔185。 該每一擋板24相對兩侧各形成一用於安裝風扇30之安裝部 26,每一安裝部26設有一對用於固定風扇30之安裝孔260。 每一風扇30之外形大致呈方形設置，其包括帶有開口 之前後二平板32、34，其中一風扇30之平板32安裝貼緊於 導風罩20同侧之二安裝部26上，另一風扇30之平板34安 裝於導風罩20另一侧之二安裝部26上。 ® 將散熱裝置組裝時，首先散熱鰭片組14穿設焊接在熱 管16之放熱部162上，相鄰散熱鰭片140形成通風道，導 熱板12與熱管16之吸熱部160焊接使得熱管16之吸熱部 160收容於導熱板12之凹槽124内；導熱板12底部兩端固 定該安裝架13，散熱鰭片組14頂部安裝固定板18。然後散 熱器組合10藉由該緊固件固定在電路板上與電子元件緊密 接觸。接著將導風罩20、已經安裝於導風罩20兩側之風扇 φ 30 —併自上而下安裝在散熱器組合10上，使得導風罩20 之擋板24圍住散熱鰭片組14之兩端，二風扇30分別置於 散熱鰭片組14之兩側並置於通風道之進出口。最後用二手 擰螺釘50穿過導風罩20之頂板22之通孔220螺合在固定 板18上，整個散熱裝置安裝完成。 電子元件工作時，其產生之熱量藉由導熱板12、熱管 16傳遞至散熱鰭片組14上，再藉由散熱鰭片組14將部分熱 量散發至通風道之空氣中；由於二風扇30之轉向相同，散 熱鰭片組14 一側之風扇30將散熱鰭片組14通風道中之熱 200930275 - 空氣吸出、另一側之風扇30將冷空氣吹入至散熱鰭片組14 • 之通風道中，增加熱冷空氣之對流交換。由於導風罩20之 二擋板24將散熱鰭片組14兩側圍住，風扇送入之冷空氣在 散熱鰭片組14之通風道中不會向兩側溢出，提高了冷空氣 之利用率；而雙風扇30同時使用，大大地增強了空氣之對 流強度，提高了散熱效率；最後，由於風扇30可以預先安 裝在導風罩20上，拆卸之時候只需要手動擰下螺釘50即可 以將導風罩20與風扇30 —起抽出，無需拆卸風扇30，方便 〇 快捷。 綜上所述，本發明符合發明專利之要件，爰依法提出專利 申請。惟以上所述者僅為本發明之較佳實施例，舉凡熟悉本案 技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應 涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之組合圖。 Q 圖2係圖1之部分組合圖。 圖3係圖2中散熱裝置之散熱器組合之分解圖。 圖4係圖2中散熱裝置之導風罩及風扇之分解圖。 【主要元件符號說明】 散熱器組合 10 導熱板 12 凹槽 124 安裝架 13 凸耳 132 螺釘 133、19 散熱縛片組 14 散熱鰭片 140 10 200930275 貫穿孔 142 通孔 144、220、180 環壁 146 熱管 16 吸熱部 160 放熱部 162 固定板 18 螺孔 185 導風罩 20 頂板 22 擋板 24 安裝部 26 安裝孔 260 風扇 30 平板 32、34 手擰螺釘 50200930275 IX. Description of the Invention: 1. Field of the Invention The present invention relates to a heat sink, and more particularly to a heat sink for dissipating heat from an electronic component. [Prior Art] High-power electronic components such as computer central processing units, north bridge chips, and graphics cards generate a large amount of heat during operation. If this heat cannot be effectively dissipated, it will directly cause a sharp rise in temperature, which will seriously affect the electronics. The component's ® is operating normally. To this end, heat sinks are needed to dissipate these electronic components. A conventional heat sink generally includes a base, a heat sink set, a heat pipe connection base and the heat sink set, and a fan fixed to one side of the heat sink set. The heat generated by the electronic component is first transferred to the base and then absorbed by the bottom of the heat pipe; the heat pipe transfers heat to its end by the phase change of the working fluid therein, and the heat of the heat pipe end is radiated to the surrounding air via the heat sink group. in. The fan increases the heat exchange rate of the heat sink, which improves heat dissipation efficiency. Q In the above heat dissipating device, the airflow blown by the fan flows along the interval between the fins, and leaves the heat sink group in a very short time, and the utilization rate of the cold air is low, so that the heat dissipation efficiency is low; Since the fixing of the fan requires complicated structure erection, the fan can be disposed only on the side of the heat sink, which causes the airflow on the other side of the heat sink group to be weak, resulting in a decrease in heat dissipation efficiency of the entire heat sink. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device having an air guiding hood and having a strong air guiding capability and high heat dissipation efficiency. 6 200930275 A heat dissipating device for dissipating heat from an electronic component, comprising a heat conducting plate attached to the electric and sub-components, a plurality of heat dissipating fins, and a heat pipe connecting the heat conducting plate and the heat dissipating fin, and forming the heat dissipating fin The heat dissipation device further includes an air hood, the air hood includes a top plate and two target plates connected to the top plate, the top plate is fixed on the top of the heat dissipation fin, and the baffle surrounds the two ends of the heat dissipation fin The two fans are fixed on the air hood and placed on both sides of the heat dissipation fins and located at the inlet and outlet of the air passage. In the above heat dissipating device, the air guiding hood is provided with a heat dissipating fin and a double fan ® structure, which greatly enhances the convection intensity of the air in the air passage of the heat dissipating fin, and improves the heat dissipating efficiency of the heat dissipating device. [Embodiment] Please refer to FIG. 1 and FIG. 2 simultaneously, which is a heat dissipating device according to a first embodiment of the present invention. The heat dissipating device is mounted on a circuit board (not shown) for dissipating electronic components on the circuit board (not shown). Show) the heat generated. The heat dissipating device includes a heat sink assembly 10, an air guiding cover 20 assembled on the heat sink assembly 10, and two fans 30 mounted on opposite sides of the air guiding cover 20. Referring to FIG. 3 , the heat sink assembly 10 includes a heat conducting board 12 , a heat sink fin set 14 , three heat pipes 16 for connecting the heat conducting board 12 and the heat radiating fin group 14 in parallel, and fixing to the heat sink fins. The fixing plate 18 at the top of the group 14 is: wherein the heat conducting plate 12 is substantially a rectangular plate-like body, and the bottom portion thereof is provided with three parallel spaced grooves 124. The two mounting brackets 13 are fixed to opposite ends of the bottom of the heat conducting plate 12 by screws 133. The mounting brackets 13 are convexly extended at opposite ends 132. The heat conducting plate 12 is connected to the 7 200930275 circuit board by four fasteners (not shown) passing through the lugs 132 and is kept in close contact with the electronic components. Each of the heat pipes 16 has a U-shaped arrangement including a level of heat absorbing portion 160 and two parallel heat releasing portions 162 extending vertically upward from both ends of the heat absorbing portion 160. The heat absorbing portion 160 is received in the recess 124 of the heat conducting plate 12, and the bottom surface thereof is coplanar with the bottom surface of the heat conducting plate 12 to form a flat bottom surface with the bottom of the heat conducting plate 12 to be attached to the top surface of the electronic component to absorb the electrons. The heat of the component. The heat dissipation fins 162 extend through the heat dissipation fin set 14 to place the heat dissipation fin set 14 on the heat radiation portion 162 of the heat pipe 16. The heat sink fin set 14 is formed by stacking a plurality of mutually parallel heat radiating fins 140 from top to bottom. Each heat sink fin 140 has a micro wave shape and is substantially parallel to the heat conductive plate 12 as a whole. The two sides of each of the heat dissipation fins 140 are respectively provided with three parallel holes 142 for receiving the heat radiating portion 162 of the heat pipe 16. Each of the heat dissipation fins 140 extends from the edge of the through hole 142 to form a ring wall 146 to increase the contact surface area of the heat dissipation fin 140 with the heat radiation portion 162, and to space the adjacent heat dissipation fins 140 by a certain distance to form a ventilation duct. (Figure is not marked). A rectangular through-hole four-hole 144 is disposed in the middle of each of the heat-dissipating fins 140, and the through-holes 144 are disposed between the through-holes 142. The through holes 144 of the plurality of heat dissipation fins 140 may constitute a threaded hole for the screws 19 to be screwed. The fixing plate 18 is disposed in a rectangular plate shape, and a through hole 180 is defined in each of the four corners thereof. The through holes 180 correspond to the through holes 144 of the heat dissipation fins 140 for the screws 19 to pass through to fix the fixing plate 18 to the heat dissipation fin group 14 . top. A second screw hole 185 is defined in the middle of the fixing plate 18 to fix the air guiding cover 20. Referring to FIG. 4, the air hood 20 is of an inverted U shape and includes a top plate 22 and two baffles 24 extending perpendicularly from opposite ends of the top plate 22. The width of the top plate 22 and the baffle 24 8 200930275 ^ are equal to the width of the heat dissipation fin set 14 . Two through holes 220 are defined in the middle of the top plate 22, and the two through holes 220 correspond to the screw holes 185 of the fixing plate 18. A mounting portion 26 for mounting the fan 30 is formed on each of the opposite sides of each of the baffles 24, and each mounting portion 26 is provided with a pair of mounting holes 260 for fixing the fan 30. Each fan 30 has a substantially square shape, and includes a second flat plate 32, 34 with an opening, wherein a flat plate 32 of one fan 30 is mounted on the two mounting portions 26 on the same side of the air guiding cover 20, and the other The flat plate 34 of the fan 30 is mounted on the second mounting portion 26 on the other side of the air guiding cover 20. When the heat dissipating device is assembled, the heat dissipating fin group 14 is firstly welded to the heat radiating portion 162 of the heat pipe 16, the adjacent heat dissipating fins 140 form a ventilation passage, and the heat conducting plate 12 is welded to the heat absorbing portion 160 of the heat pipe 16 so that the heat pipe 16 is The heat absorbing portion 160 is received in the recess 124 of the heat conducting plate 12; the mounting bracket 13 is fixed at both ends of the bottom of the heat conducting plate 12, and the fixing plate 18 is mounted on the top of the heat radiating fin group 14. The heat spreader assembly 10 is then secured to the circuit board by the fasteners in close contact with the electronic components. Then, the air hood 20, the fan φ 30, which has been mounted on both sides of the air hood 20, are mounted on the heat sink assembly 10 from top to bottom, so that the baffle 24 of the air hood 20 surrounds the heat sink fin group 14. At both ends, the two fans 30 are respectively placed on both sides of the heat dissipation fin group 14 and placed on the inlet and outlet of the air passage. Finally, the second-hand screw 50 is screwed through the through hole 220 of the top plate 22 of the air guiding cover 20 to the fixing plate 18, and the entire heat sink is installed. When the electronic component is in operation, the heat generated by the electronic component is transmitted to the heat dissipation fin group 14 through the heat conduction plate 12 and the heat pipe 16, and a part of the heat is radiated to the air of the air passage by the heat dissipation fin group 14; Turning to the same, the fan 30 on the side of the heat dissipation fin group 14 heats the heat in the air passage of the heat dissipation fin group 14 200930275 - the air on the other side blows the cold air into the air passage of the heat dissipation fin group 14 Increase the convective exchange of hot and cold air. Since the two baffles 24 of the air hood 20 enclose the two sides of the heat dissipation fin group 14, the cold air sent by the fan does not overflow to the sides in the air passage of the heat dissipation fin group 14, thereby improving the utilization of the cold air. The dual fan 30 is used at the same time, which greatly enhances the convection intensity of the air and improves the heat dissipation efficiency. Finally, since the fan 30 can be pre-mounted on the air hood 20, it is only necessary to manually unscrew the screw 50 when disassembling. The air hood 20 is taken out together with the fan 30, and the fan 30 is not required to be disassembled, which is convenient and quick. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a combination diagram of a heat sink of the present invention. Q Figure 2 is a partial combination of Figure 1. 3 is an exploded view of the heat sink assembly of the heat sink of FIG. 2. 4 is an exploded view of the air hood and the fan of the heat sink of FIG. 2. [Main component symbol description] Heat sink assembly 10 Thermal plate 12 Groove 124 Mounting bracket 13 Lug 132 Screw 133, 19 Heat sinking plate set 14 Heat sink fin 140 10 200930275 Through hole 142 Through hole 144, 220, 180 Ring wall 146 Heat pipe 16 Heat absorbing part 160 Heat release part 162 Fixing plate 18 Screw hole 185 Air hood 20 Top plate 22 Baffle 24 Mounting part 26 Mounting hole 260 Fan 30 Flat plate 32, 34 Hand screw 50
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