JP3074274U - Integrated heat dissipation device - Google Patents

Abstract

(57) [Summary] (with correction) [PROBLEMS] To provide an integrated heat dissipation device that can greatly reduce the total cost of assembly and manufacturing. SOLUTION: The heat dissipating passage includes a heat dissipating passage 61, a fan mounting chamber, and a heat conductive plate connected to a bottom surface of an outer wall of the heat dissipating passage.
A plurality of ventilation partition plates 612 are provided in the heat radiation passage, and the shaft hole is directly connected to the axis of the fan, and the upper surface of the fan mounting chamber forms an oblique air inlet, and has a plate shape from the heat guide plate to the bottom of the heat radiation passage. A heat tube 64 is provided, a heat radiating member is formed in a direction in which the heat conductive plate extends, and a heat conductive gel is provided on the heat conductive plate, and a heat radiating plate to be brought into contact with the heat generating element; And a rotor coil set, wherein the axial center of the downwardly projecting rotary shaft is inserted into a shaft hole formed in the bottom surface of the fan mounting chamber to achieve an effect of direct connection, and the hole is formed above the fan mounting chamber. And a cover forming an air inlet.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to an integrated heat radiating device, which is designed to radiate heat energy generated when a CPU (microprocessor) of a notebook computer is operated. It can be used for heating elements such as light beam preparation equipment and is formed by an integral molding method, so the number of components to be assembled can be reduced, installation is easy, heat dissipation efficiency can be improved, failure rates can be reduced, assembly and manufacturing The present invention relates to an integrated heat radiating device that can greatly reduce the total cost of the device.

[0002]

[Prior art]

 There are two types of heat radiating devices for the CPU provided in the notebook computer. One type is a device in which heat energy generated by the CPU is taken out by a fan by a convection method. Another type is one in which the heat energy generated by the CPU by way of conduction is taken out by a fan. The fan 10 of the conventional (conduction type) CPU heat radiating device separates the heat radiating plate 20 from the fixing piece 30 (see FIGS. 1 and 2). It has a heat conducting plate 22 communicating with the outer wall of the flow path 21, the fixing piece 30 is a thin plate connected to the heat radiating plate 20, and a screw of a plurality of electric circuit boards is screwed on the side of the fixing piece 30. When the boss 31 that can be attached is vertically set up, the fan 10 is provided on one side of the heat radiation channel 21, and the surface of the heat conductive plate 22 is in contact with the heat generating element by attaching the heat conductive gel, the heat generated by the heat generating element Energy can be blown out of the heat radiation channel by the fan 10 through the heat conductive gel, the heat conductive plate 22 and the heat conductive channel 21 by a conduction method.

The biggest drawbacks of the above-mentioned CPU heat radiating device are that the number of components is large, the assembly takes time, and the casing of the fan 10 is high. To do so, the entire set of fans 10 cannot be introduced and used.

[0004]

[Problems to be solved by the invention]

 The main purpose of the present invention is to provide an integrated heat dissipation device that can directly connect a fan of a heat dissipation device to a heat dissipation plate, improve heat dissipation efficiency, and reduce cost and failure rate.

Another object of the present invention is to provide an integrated heat radiating device having a heat conducting plate capable of effectively contacting a heating element.

The present invention is characterized in that the fan mounting chamber of the heat radiating plate is formed at an oblique opening, and an intake air hole is provided in a side wall of the fan mounting chamber to increase the intake air volume of the fan. It is another object to provide a heat dissipation device.

[0007]

[Means for Solving the Problems]

 In order to achieve the above three objects, first, a structure capable of achieving the above functions is combined so as to form a heat sink and formed by an integral molding method, and a material having a high heat dissipation efficiency (for example, an aluminum alloy) is adopted as a material. The radiator plate has a radiator channel, a fan mounting chamber communicating with the radiator channel, a heat guide plate communicating with the outer wall of the radiator channel, and the like. A shaft hole is formed in the bottom surface of the fan mounting chamber, the shaft hole of the fan having the power means is directly connected to the shaft hole, and a plate-shaped heat tube is provided inside from the heat guide plate to the heat discharge passage. The board is formed in a shape that can cover the heat radiating member, and bosses that can screw the screws of a plurality of electric circuit boards are vertically set up on the side of the heat conducting plate. Seal the upper part of the mounting room In addition, a hole is formed above the fan mounting chamber, an air inlet is formed, a heat conductive gel is applied to the heat conductive plate, and the heat conductive element is brought into contact with the heat generating element. According to the conduction method, the heat can be blown out of the heat radiation channel by a fan through the heat conductive gel, the heat conductive plate, the plate-shaped heat tube, and the heat conductive channel.

[0008]

[Embodiment of the invention]

 In order to attain the object to be achieved by the present invention, an embodiment of the configuration of the present invention will be described in detail below with reference to the accompanying drawings in order to disclose the adopted technology, means, and effects in detail.

FIGS. 3 and 4 are a perspective view and an exploded perspective view of the present invention, respectively. In the figure, an integrated heat dissipating device 6 is disclosed, which comprises a heat dissipating plate 60, a fan 70 and a cover 80, of which the heat dissipating plate 60 has a heat dissipating passage 61 and a fan communicating with the heat dissipating passage 61. A shaft hole 621 is formed in the bottom surface of the fan mounting room 62, which includes a mounting chamber 62 and a heat conducting plate 63 communicating with the bottom surface of the outer wall 611 of the heat radiation flow path, and an axial center 701 of the fan 70 is formed in the shaft hole 621. May be directly connected, and at the same time, an additional ventilation hole (not shown) may be provided at an appropriate position on the side wall of the fan mounting chamber 62. In addition, an upper part of the fan mounting chamber 62 is formed on a slope, and an oblique air inlet 622 is formed, so that the amount of intake air of the fan 70 can be improved, and a plate-like heat tube is provided inside from the heat guide plate 63 to the heat radiation channel 61. A boss 66 is formed on the side of the heat conducting plate 63, and a notch 623 is formed on a wall surface of the fan mounting chamber 62. Passage of the power supply line 703 can be provided. The fan 70 has fan means having power means therein, the fan 70 has a stator coil set and a rotor coil set, and a sleeve 700 is provided on a downwardly projecting rotation axis 701 of the stator coil set. Then, it is inserted into the shaft hole 621 and is directly connected with the shaft hole 621 (the shaft center 701 and the shaft hole 621 may be directly connected). The cover 80 is a thin plate having a hole 81, and the thin plate can seal the heat radiation passage 61 and the upper part of the fan mounting chamber 62 and form the hole 81 above the fan mounting chamber 62. To form an air inlet.

The heat radiating plate 60 is manufactured by an integral molding method, a material having a high heat radiating coefficient (for example, an aluminum alloy) can be adopted as the material thereof, and a plurality of ventilation partition plates 612 can be formed in the heat radiating flow channel 61. In addition, a plurality of heat tubes 64 can be added, and the holes 81 of the cover 80 can be formed in a plurality of small holes, whereby the heat transfer speed and safety can be improved. In the case of attachment, the heat conductive gel 65 is provided on the heat conductive plate 63 and is brought into contact with a heating element (not shown). The thermal energy generated by the heating element can be blown out of the heat radiation channel 61 by the fan 70 via the heat conductive gel 65, the heat conductive plate 63, the plate-shaped heat tube 64, and the heat conductive channel 61 by conduction. Can achieve the purpose.

[0011]

[Effect of the invention]

 As described above, in the integrated heat dissipation device provided by the present invention, the fan is directly connected to the heat dissipation plate, and the heat conduction plate can be effectively brought into contact with the heating element. Forming the air vents can improve heat dissipation efficiency, reduce total cost and failure rate, and ensure all practicality and inventive step.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a conventional heat dissipation device.

FIG. 2 is an exploded perspective view showing a conventional heat dissipation device.

FIG. 3 is a perspective view showing a heat radiating device according to a preferred embodiment of the present invention;

FIG. 4 is an exploded perspective view showing the heat radiating device according to the preferred embodiment of the present invention;

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 fan 20 heat radiating plate 21 heat radiating channel 22 heat conducting plate 30 fixing piece 31 boss 6 integrated heat radiating device 60 heat radiating plate 61 heat radiating flow channel 611 outer wall 612 partition plate 62 fan mounting chamber 621 shaft hole 622 oblique air inlet 623 cutout 63 Heat conducting plate 64 Plate heat tube 65 Heat conducting gel 66 Boss 70 Fan 701 Shaft center 702 Sleeve 703 Power line 80 Cover 81 Hole

Claims (6)

[Utility model registration claims] A heat-dissipating flow path, a fan mounting chamber communicating with the heat-dissipating flow path, and a heat-conducting plate connected to a bottom surface of an outer wall of the heat-dissipating flow path; The fan mounting chamber has a plurality of ventilation partition plates, and a shaft hole is formed in the bottom surface of the fan mounting chamber. The shaft hole is directly connected to the shaft of the fan. A wind hole is formed, a plate-shaped heat tube is provided from the heat guide plate to the bottom of the heat dissipation channel, and a boss to which a screw in the electric circuit board can be screwed vertically on a side of the heat guide plate is provided. A heat dissipating member is formed in the extending direction, a heat conducting gel is provided on the heat conducting plate, and a heat dissipating plate for contacting the heat generating element; a power unit; and a stator coil set and a rotor coil set are provided. The axis of the downwardly projecting rotating shaft of the set A fan that is inserted into a shaft hole formed in the bottom surface of the fan mounting chamber and has a direct coupling effect; and a thin plate having a hole, which seals the heat radiation passage and the upper part of the fan mounting chamber, and And a cover that forms an air inlet through the fan mounting chamber. The heat energy generated by the heat generating element transfers heat energy by a conduction method to a heat conducting gel, a heat conducting plate, a plate heat tube, and a heat radiating flow path. An integrated heat radiating device, wherein the heat is radiated by blowing through the heat radiating channel by a fan. 2. The structure according to claim 1, wherein a sleeve is provided at the axis of the downwardly projecting rotation shaft of the stator coil set provided inside the fan, and then inserted into the shaft hole and connected. Integrated heat dissipation device. 3. The integrated heat radiating device according to claim 1, wherein an air inlet hole is formed at an appropriate position on a side wall of the fan mounting chamber so as to improve the amount of intake air of the fan. 4. The integrated heat radiating device according to claim 1, wherein the hole in the cover comprises a plurality of small holes to improve safety. 5. The integrated heat radiating device according to claim 1, wherein a plurality of plate-shaped heat tubes are provided in the heat radiating flow passage to improve a heat conduction speed. 6. The integrated heat dissipation device according to claim 1, wherein a notch is formed in a wall surface of the fan mounting chamber so as to be provided for passage of a power line of the fan.