200829135 九、發明說明： •【發明所屬之技術領域】 尤其涉及一 種用於電子元 、 本發明涉及一種散熱裝置 件散熱之散熱裝置。 【先前技術】 中央處理器等電子元件在運行過程中產生大量教 確保電子元件之正常運行，其產生之熱需及時地散發出 去。通常，該電子元件上加裝一散熱裝置以為其散熱/ 常用之散熱裝置包括一金屬底板及設於該底板上之一 數平行散熱鰭#。該減平行鰭形錢數氣流通道複 通常，為提升該散熱裝置之散熱性能，該散熱裝置對應該 氣流通道設置-風扇以向該鯖片提供強對流氣流，以加快 散熱。為加快該底板向鰭片之傳熱速度，該散熱裝置還勺、 括-熱管連接該底板和該複制片。使㈣，該底板貼= 於發熱電子元件而吸收該電子元件產生之熱，進而 通過熱管將熱量傳遞至鰭片而散發到周圍空間。一般情^ 下’由於傳熱材料之熱傳導率及元件間之熱阻等因素二 響’電子元件產生之熱量不能很快地穿導至H片散發出: 而積聚於該底板或熱管，從而使該散熱裝置不能滿足電子 元件之散熱需求，故該散熱裝置需進一步改進。 【發明内容】 有鑒於此，實有必要提供一種散熱性能好之散熱裝置。 一種散熱裝置’料電子元件散熱，其包括複數.鰭片、 200829135 /、該複數·、、、曰片接觸以向該鰭片傳遞熱量之導熱，鮮 .間職複數氣流通道，一風扇對應該複數氣流通道設200829135 IX. Description of the Invention: • The technical field to which the invention pertains relates to a heat sink for a heat dissipating device. [Prior Art] Electronic components such as the central processing unit generate a large amount of teaching during operation to ensure the normal operation of the electronic components, and the heat generated by them needs to be released in time. Generally, a heat dissipating device is mounted on the electronic component for dissipating heat. The commonly used heat dissipating device comprises a metal bottom plate and a plurality of parallel heat dissipating fins # disposed on the bottom plate. In order to improve the heat dissipation performance of the heat sink, the heat sink is provided with a fan to provide a strong convection airflow to the diaphragm to accelerate heat dissipation. In order to speed up the heat transfer of the bottom plate to the fins, the heat sink further includes a heat pipe connecting the bottom plate and the replica sheet. (4), the bottom plate is attached to the heat-generating electronic component to absorb the heat generated by the electronic component, and then the heat is transmitted to the fin through the heat pipe to be radiated to the surrounding space. In general, 'the heat generated by the electronic components due to the thermal conductivity of the heat transfer material and the thermal resistance between the components, 'the heat generated by the electronic components cannot be quickly transmitted to the H-chips: it accumulates on the bottom plate or the heat pipes, thereby The heat sink cannot meet the heat dissipation requirements of the electronic component, so the heat sink needs further improvement. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device with good heat dissipation performance. A heat dissipating device 'material electronic component dissipates heat, which includes a plurality of fins, 200829135 /, the plural number, the 曰 接触 contact to transfer heat to the fin, the heat, the fresh air flow channel, a fan corresponding Complex airflow channel
.每一鰭片形成有沿該風扇至該導熱體方向延伸至少一導流 片。 ”L 與驾知技術相比，所述鰭片之導流片沿風扇至導熱體 方向延伸，使風扇產生之氣流較多地吹向該導熱體而帶走 該導熱體上之熱量，從而避免熱量在該導熱體之積聚，該 _散熱裝置之散熱性能得以提升。 【實施方式】 請參閱圖1，其揭示本發明散熱裝置之第一實施例，該 散熱裝置用於對設置於一電路板（圖未示）上之電子元件 (圖未示）放熱。該散熱裝置包括一底板1〇、位於該底板 工〇上之鰭片組、連接該底板10和鰭片組30之三熱管5〇及 通過一固疋架6〇而固定至該鰭片組30一侧之風扇7〇 ^ 所述底板10包括一大致呈方形之主體部100及通過螺 釘（未心示）固疋至該主體部1⑻四角之四固定腳U〇。該 主體部100由導熱性良好之金屬板材製成，其上表面設有三 平行凹槽（未標示）以結合所述三熱管50，其下表面為一 以接觸所述電子元件之平面。每一固定腳110之近末端設有 一固定孔（未標示），該固定孔中收容一固定件120以將該 散熱裝置固定至所述電路板上。 請參閱圖2，所述鰭片組3〇包括沿豎直方向堆疊之相互 平行複數鰭片300。每一鰭片300包括一本體31〇及從該本體 200829135 310相對兩側緣垂直於該本體310同向延伸二折邊320。該本 .體310具有一直線形之前邊緣（未標示）及與該前邊緣相對 之曲線形後邊緣（未標示），該後邊緣之中部突伸出該二 饉 折邊320之端部。該本體310形成有突伸出該本體310之二導 流片311，該本體310對應該二導流片311且在該二導流片 311之間形成二槽孔314。該二導流片311大致垂直於該本體 310而位於該本體310之同一侧。每一導流片311之高度等於 或略小於該折邊320之高度。該二槽孔314在該本體310上呈 ® “八”字形分佈。該二導流片311之一端彼此靠近而其另一 端相對分開而形成一“八”字形結構。該本體310於該二導 流片311之外侧分別設有位於一條直線上之三穿孔316，該 本體310於其一侧延伸一圍繞該穿孔316之環壁317，該環壁 317之高度等於或略小於該折邊320之高度。該本體310之相 對兩侧設有平行於其前邊緣且靠近該前邊緣之二開槽 319，每一開槽319延伸向其相對應之折邊320且橫切該折邊 鲁320。該鰭片組30中，每一鰭片300之折邊320抵接相鄰鰭片 300之本體310。每一鰭片300之導流片311延伸向相鄰鰭片 300之本體310。每一鰭片300之環壁317延伸向相鄰鰭片300 之本體310，該複數鰭片300之穿孔316對應形成收容所述三 熱管50之結合槽330。該複數鰭片300之開槽319對應形成定 位所述固定架60之定位槽340。該鰭片組30中，相鄰鰭片300 間形成供氣流流通之通道（未標示）。 請參閱圖1，所述每一熱管50大致呈“U”形，其包括 一第一傳熱段510及從該第一傳熱段兩端垂直同向延伸二 7 200829135 第二傳熱段530。 . 所述固定架60包括二支架610。每一支架61〇包括一面 板611、一平行於該面板611之定位板613及連接該面板611 和定位板613之連接板615。 請參閱圖1、圖3及圖4，組裝時，所述三熱管5〇之第一 傳熱段510結合至所述底板10主體部1〇〇對應之溝槽内，兮 熱管50之第二傳熱段530垂直該主體部ι〇〇向上延伸。所述 _鰭片組30套設于該熱管50之第二傳熱段53〇上，該第二傳熱 段530結合至該片組30之對應之結合槽330内，且其末端 突伸出該結合槽330。該底板1〇之主體部1〇〇與該鰭片組3〇 之間還置有一鰭片單元40’該籍片單元40由一金屬片材一 體彎折而成。該鰭片單元40位於每一熱管50之二第二傳熱 段530之間，其頂面結合該鰭片組30之最下方之鰭片300， 其底面接觸該主體部100之上表面。所述固定架60支架610 之定位板613嵌十於該鰭片組30之定位槽340内而將該固定 _架60固定至該鰭片組30之一侧。所述風扇70通過複數螺釘 80固定至該固定架之面板上’從而該風扇70對應該鰭 片組30之氣流通道而位於該籍片組3〇鰭片300前邊緣之一 側，其中，該鰭片300之導流片311 —端對應該風扇70而另 一端靠近熱管5〇之弟一傳熱段從而’該二導流片311 於該每一熱管5〇之二第二傳熱段530之間呈“八”字形沿 風扇70至該第二傳熱段530方向延伸’以將風扇70產生之強 對流氣流導向該熱管5 0之第二傳熱段5 3 〇。 使用時，所遂散熱裝置通過所述固定件120固定至所述 8 200829135 電路板上，該散熱裝置之底板10主體部100之下表面接觸所 ^ 述電子元件吸收該電子元件產生之熱量，該底板上之部分 熱量直接傳遞至鰭片單元40而散熱至周圍空間，部分熱量 由所述熱管50之第一傳熱段510吸收進而通過第二傳熱段 530傳遞至所述鰭片組30，所述風扇70向該第二傳熱段530 及鰭片組30提供強對流氣流，其如圖4中箭頭所示，從而， 該第二傳熱段530及鰭片300上之熱量迅速地散發至周圍空 間。 B 與習知技術相比，所述鰭片組30之每一鰭片300沿所述 風扇70至所述熱管50第二傳熱段530方向延伸有所述導流 片311而將風扇70產生之氣流較多地導向該第二傳熱段 530，而帶走該第二傳熱段530上之熱量，從而避免由於熱 管50與鰭片300之接觸面積有限、元件間之熱阻及鰭片300 之傳熱散熱速度等因素造成之熱量在熱管50第二傳熱段 530之積聚，利於電子元件產生之熱量更快地散發出去，該 _散熱裝置之散熱性能提升。 請參閱圖5至圖8,其揭示本發明散熱裝置之第二實施 例，該散熱裝置包括一底板10a、設於該底板10a上之鰭片 組30a及通過一固定架60a而置於該鰭片組30a—侧之風扇 70a 〇 所述底板l〇a包括一大致呈方形之主體部100a及從該 主體部100a四角向外延伸四固定腳110a。該主體部100a之相 對兩側緣對應設有一螺孔101a，以供二螺釘650a將所述固 定架60固定至該底板10a。每一固定腳110a之近末端處設有 200829135 一固定孔Ilia，以供固定件（圖未示）穿置而將該散熱裝 置固定至一電路板（圖未示）上。 所述鰭片組30a包括複數平行設置於所述底板10a上表 黍 面之鰭片300a。每一鰭片300a包括一本體310a及從該本體 310a上、下兩邊緣垂直於該本體310a同向延伸上、下折邊 320a。每一鰭片300a之本體310a沖出斜向下而向該底板10a 主體部100a方向延伸二平行導流片311a，從而該本體310a 上形成二平行槽孔314a。該複數鰭片300a之下折邊320a形成 B接觸該底板l〇a主體部100a上表面之接觸面。該鰭片組30a 之上表面形成以定位所述固定架60a之定位槽340a。 所述固定架60a包括一大致呈“U”形之框架610a。該 框架610a相對兩侧相對延伸二面板620a，該二面板位於所 述鰭片組30a之一侧，該二面板620a之間形成供氣流流通之 開口 621a，所述風扇70a對應該開口 621a而通過螺釘710固定 至該二面板620a。該框架610a頂部向下延伸一定位板630a， 參該定位板630a嵌卡於該鰭片組30a之定位槽340a内。該框架 610a之相對兩侧對應設有二通孔660a，二螺釘650a穿過該通 孔660a而固定至底板10a之螺孔101a内，從而將該固定架60a 及風扇70a固定至該鰭片組30a。其中，該鰭片300a之導流片 311 a沿該風扇7 0 a至底板10 a主體部10 0 a方向延伸。 使用時，所述底板10a主體部100a之下表面接觸設於所 述電路板上之電子元件而吸收該電子元件產生之熱量，該 底板10a上之部分熱量傳遞至所述鰭片組30a，所述風扇70a 向該底板10a及鰭片組30a提供強制對流氣流，部分吹向鰭 200829135 片組3 0 a之氣流由導流片311 a導向該底板10 a ’使該底板10 a 及鰭片組30a上之熱量迅速地散熱至周圍空間。 與習知技術相比，所述第二實施例中鰭片組30a之導流 片311a沿風扇70a至底板10a方向延伸，從而將較多地氣流導 向該底板10a，而將該底板10a上之熱量迅速地散熱出去， 避免電子元件產生之熱量積聚於該底板l〇a。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置第一實施例之立體分解圖。 圖2係圖1中散熱裝置之一鰭片組之立體圖。 圖3係圖1之組裝圖。 圖4係圖3俯視圖。 圖5係本發明散熱裝置第二實施例之立體分解圖。 圖6係圖5中散熱裝置之一鰭片組之立體圖。 圖7係圖5之組裝圖。 圖8係圖7之右視圖。 【主要元件符號說明】 底板 10 、 10a 主體部 100 、 100a 螺孔 101a 固定腳 110 、 110a 固定孔 111a 固定件 120 11 200829135 鰭片組 30、30a 縛片 300、300a 本體 310 、 310a 導流片 311 、 311a 槽孔 314 、 314a 穿孔 316 環壁 317 開槽 319 開槽 319 折邊 320 > 320a 結合槽 330 定位槽 340 > 340a 鰭片單元 40 熱管 50 第一傳熱段510 第二傳熱段530 固定架 60 、 60a 支架 610 框架 610a 面板 611 、 620a 定位板 613 連接板 615 開口 621a 定位板 630a 通孔 660a 風扇 70 螺釘 650a、710、80 12Each fin is formed with at least one deflector extending in the direction of the fan to the heat conductor. L is compared with the driving technique, the fins of the fins extend along the direction of the fan to the heat conductor, so that the airflow generated by the fan is blown to the heat conductor to remove the heat on the heat conductor, thereby avoiding The heat dissipation of the heat dissipating device is improved, and the heat dissipation performance of the heat dissipating device is improved. [Embodiment] Referring to FIG. 1 , a first embodiment of a heat dissipating device of the present invention is disclosed. The heat dissipating device is configured to be disposed on a circuit board. The electronic component (not shown) is exothermic. The heat sink includes a bottom plate, a fin set on the backplane, and three heat pipes connected to the bottom plate 10 and the fin set 30. And a fan 7 fixed to the side of the fin group 30 by a fixing frame 6〇. The bottom plate 10 includes a substantially square main body portion 100 and is fixed to the main body portion by screws (not shown). 1(8) Four fixed corners of the four corners. The main body portion 100 is made of a metal plate having good thermal conductivity, and the upper surface thereof is provided with three parallel grooves (not shown) to join the three heat pipes 50, and the lower surface thereof is in contact with The plane of the electronic component. Each fixed A fixing hole (not shown) is disposed at a proximal end of the leg 110, and a fixing member 120 is received in the fixing hole to fix the heat sink to the circuit board. Referring to FIG. 2, the fin group 3 includes The mutually parallel plurality of fins 300 are stacked in a vertical direction. Each of the fins 300 includes a body 31 〇 and a two-folded edge 320 extending from the opposite sides of the body 200829135 310 perpendicularly to the body 310. The body 310 A straight front edge (not labeled) and a curved rear edge (not labeled) opposite the front edge, the middle of the rear edge projecting from the end of the second folded edge 320. The body 310 is formed with a projection The two guiding strips 311 of the body 310 are opposite to the two guiding strips 311 and two slots 314 are formed between the two guiding sheets 311. The two guiding sheets 311 are substantially perpendicular to the body 310. Located on the same side of the body 310. The height of each of the baffles 311 is equal to or slightly smaller than the height of the hem 320. The two slots 314 are disposed on the body 310 in an "eight" shape. One end of 311 is close to each other and the other end is relatively separated to form a The body 310 is respectively provided with three through holes 316 on a line on the outer side of the two flow guiding sheets 311. The body 310 extends on one side of a ring wall 317 surrounding the through hole 316. The height of the 317 is equal to or slightly smaller than the height of the flange 320. The opposite sides of the body 310 are provided with two slots 319 parallel to the front edge thereof and adjacent to the front edge, and each slot 319 extends corresponding thereto. The flange 320 is transverse to the flange 320. The flange 320 of each fin 300 abuts the body 310 of the adjacent fin 300. The deflector 311 of each fin 300 extends. To the body 310 of the adjacent fin 300. The ring wall 317 of each of the fins 300 extends toward the body 310 of the adjacent fins 300. The through holes 316 of the plurality of fins 300 correspond to the coupling grooves 330 for receiving the three heat pipes 50. The slot 319 of the plurality of fins 300 correspondingly forms a positioning slot 340 for positioning the holder 60. In the fin set 30, a channel (not labeled) for airflow is formed between adjacent fins 300. Referring to FIG. 1 , each of the heat pipes 50 has a substantially “U” shape, and includes a first heat transfer section 510 and vertically extending from the two ends of the first heat transfer section. 2 200829135 The second heat transfer section 530 . The holder 60 includes two brackets 610. Each bracket 61 includes a side plate 611, a positioning plate 613 parallel to the panel 611, and a connecting plate 615 connecting the panel 611 and the positioning plate 613. Referring to FIG. 1 , FIG. 3 and FIG. 4 , during assembly, the first heat transfer section 510 of the three heat pipes 5 结合 is coupled to the corresponding groove of the main body 1 〇〇 of the bottom plate 10 , and the second heat pipe 50 is The heat transfer section 530 extends upwardly perpendicular to the body portion ι. The _ fin group 30 is sleeved on the second heat transfer portion 53 of the heat pipe 50, and the second heat transfer portion 530 is coupled into the corresponding coupling groove 330 of the chip group 30, and the end thereof protrudes. The coupling groove 330. A fin unit 40' is further disposed between the main body portion 1A of the bottom plate 1 and the fin group 3', and the tablet unit 40 is integrally bent from a metal sheet. The fin unit 40 is located between the second heat transfer sections 530 of each of the heat pipes 50, and the top surface thereof is coupled to the lowermost fin 300 of the fin set 30, and the bottom surface thereof contacts the upper surface of the main body portion 100. The positioning plate 613 of the holder 60 bracket 610 is embedded in the positioning groove 340 of the fin group 30 to fix the fixing frame 60 to one side of the fin group 30. The fan 70 is fixed to the panel of the fixing frame by a plurality of screws 80 so that the fan 70 corresponds to the air flow passage of the fin group 30 and is located on one side of the front edge of the chip group 3 〇 fin 300, wherein The baffle 311 of the fin 300 is opposite to the fan 70 and the other end is adjacent to the heat transfer section of the heat pipe 5 从而 so that the two baffles 311 are disposed in the second heat transfer section 530 of each of the heat pipes 5 An "eight" shape extends in the direction of the fan 70 to the second heat transfer section 530 to direct the strong convection current generated by the fan 70 to the second heat transfer section 5 3 该 of the heat pipe 50. In use, the heat sink is fixed to the 8 200829135 circuit board by the fixing member 120, and the lower surface of the main body portion 100 of the bottom plate 10 of the heat dissipating device contacts the electronic component to absorb the heat generated by the electronic component. A portion of the heat on the bottom plate is directly transferred to the fin unit 40 to dissipate heat to the surrounding space, and a portion of the heat is absorbed by the first heat transfer portion 510 of the heat pipe 50 and transmitted to the fin group 30 through the second heat transfer portion 530. The fan 70 provides a strong convective airflow to the second heat transfer section 530 and the fin set 30, as indicated by the arrows in FIG. 4, so that the heat on the second heat transfer section 530 and the fins 300 is quickly dissipated. To the surrounding space. Each of the fins 300 of the fin set 30 extends along the fan 70 to the second heat transfer section 530 of the heat pipe 50 with the baffle 311 to generate the fan 70. The airflow is directed to the second heat transfer section 530, and the heat on the second heat transfer section 530 is taken away, thereby avoiding the limited contact area between the heat pipe 50 and the fin 300, the thermal resistance between the components, and the fins. The heat generated by the heat transfer and heat dissipation rate of 300 is accumulated in the second heat transfer section 530 of the heat pipe 50, so that the heat generated by the electronic component is dissipated more quickly, and the heat dissipation performance of the heat sink is improved. Referring to FIG. 5 to FIG. 8 , a second embodiment of a heat dissipating device of the present invention is disclosed. The heat dissipating device includes a bottom plate 10 a , a fin set 30 a disposed on the bottom plate 10 a , and the fin disposed through the fixing frame 60 a . The sheet set 30a - the side fan 70a 〇 the bottom plate 10a includes a substantially square main body portion 100a and four fixed legs 110a extending outward from the four corners of the main body portion 100a. Correspondingly, the opposite side edges of the main body portion 100a are provided with a screw hole 101a for the two screws 650a to fix the fixing frame 60 to the bottom plate 10a. A fixing hole Ilia is provided at the proximal end of each fixing leg 110a for fixing a fixing member (not shown) to fix the heat dissipating device to a circuit board (not shown). The fin set 30a includes a plurality of fins 300a disposed in parallel on the surface of the bottom plate 10a. Each of the fins 300a includes a body 310a and upper and lower flanges 320a extending from the upper and lower edges of the body 310a perpendicularly to the body 310a. The body 310a of each of the fins 300a is slanted downwardly to extend two parallel baffles 311a toward the main body 100a of the bottom plate 10a, so that two parallel slots 314a are formed in the body 310a. The lower flange 320a of the plurality of fins 300a forms a contact surface where B contacts the upper surface of the main body 100a of the bottom plate 10a. The upper surface of the fin set 30a is formed to position the positioning groove 340a of the fixing frame 60a. The holder 60a includes a frame 610a having a generally "U" shape. The frame 610a extends opposite to the two sides of the two panels 620a. The two panels are located on one side of the fin group 30a. The two panels 620a form an opening 621a for airflow. The fan 70a passes through the opening 621a. A screw 710 is fixed to the second panel 620a. The top of the frame 610a extends downwardly from a positioning plate 630a, and the positioning plate 630a is embedded in the positioning groove 340a of the fin set 30a. The two sides of the frame 610a are correspondingly provided with two through holes 660a. The two screws 650a are fixed to the screw holes 101a of the bottom plate 10a through the through holes 660a, thereby fixing the fixing frame 60a and the fan 70a to the fin group. 30a. The deflector 311 a of the fin 300 a extends along the fan 70 a to the main body 10 a direction of the bottom plate 10 a. In use, the lower surface of the main body portion 100a of the bottom plate 10a contacts the electronic components disposed on the circuit board to absorb the heat generated by the electronic components, and a portion of the heat on the bottom plate 10a is transferred to the fin set 30a. The fan 70a supplies a forced convection airflow to the bottom plate 10a and the fin set 30a, and the airflow partially blown toward the fins 200829135 is directed to the bottom plate 10a by the baffle 311a. The bottom plate 10a and the fin set are The heat on 30a quickly dissipates heat to the surrounding space. Compared with the prior art, the baffle 311a of the fin group 30a in the second embodiment extends in the direction of the fan 70a to the bottom plate 10a, thereby guiding more airflow to the bottom plate 10a, and the bottom plate 10a is The heat is quickly dissipated, and the heat generated by the electronic components is prevented from accumulating on the bottom plate 10a. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective exploded view of a first embodiment of a heat sink according to the present invention. 2 is a perspective view of a fin set of one of the heat sinks of FIG. 1. Figure 3 is an assembled view of Figure 1. Figure 4 is a plan view of Figure 3. Figure 5 is a perspective exploded view of a second embodiment of the heat sink of the present invention. 6 is a perspective view of one of the fin sets of the heat sink of FIG. 5. Figure 7 is an assembled view of Figure 5. Figure 8 is a right side view of Figure 7. [Main component symbol description] Base plate 10, 10a Main body portion 100, 100a Screw hole 101a Fixing leg 110, 110a Fixing hole 111a Fixing member 120 11 200829135 Fin group 30, 30a Baffle 300, 300a Body 310, 310a Baffle 311 311a slot 314, 314a perforation 316 ring wall 317 slot 319 slot 319 flange 320 > 320a coupling slot 330 positioning slot 340 > 340a fin unit 40 heat pipe 50 first heat transfer section 510 second heat transfer section 530 holder 60, 60a bracket 610 frame 610a panel 611, 620a positioning plate 613 connecting plate 615 opening 621a positioning plate 630a through hole 660a fan 70 screws 650a, 710, 80 12