1312653 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別係指一種帶導風罩之 散熱裝置。 【先前技術】 發熱電子元件（如顯示卡）運行時產生大量熱量，使 其本身及系統溫度升高，繼而導致其運行性能下降。為確 保發熱電子元件能正常運行，通常在發熱電子元件上安裝 散熱裝置，排出其所產生熱量。 台灣專利公告511735號揭露了一散熱裝置’該散熱裝 置主要包括一散熱鰭片組、一風扇及一導風罩，藉由該導 風罩可對風扇產生之氣流進行有效導引，提高散熱效率。 不過，在固定該散熱鰭片組時，為了鎖緊固定散熱器之螺 絲，需要將導風罩整體拆卸成兩部分並在罩體上穿孔，不 僅操作繁瑣，並且影響導風罩之導風效果和外觀。 【發明内容】 有鑒於此，有必要提供一種拆裝便利之散熱裝置。 一種散熱裝置，用以對一電路板上之一發熱電子元件 散熱’其包括-散熱器，該散熱器具有複數散熱鰭片；一 風扇，該風扇包括一導風罩，該導風罩包括一蓋板和—殼 體’該+散熱器收容於蓋板和殼體共同圍成之一容置空間 中’該蓋板樞接安裝於該殼體上，該蓋板包括一本體，該 1312653 本體一側邊緣彎折延伸形成一捲筒，該殼體對應該蓋板捲 筒侧邊緣形成一收容樞接於該捲筒中之凸緣。 上述散熱裝置中，導風罩之蓋板與殼體活動連接，很 容易使收容於導風罩容置空間中散熱器暴露出來，從而便 於拆裝該散熱器。 下面參照附圖，結合具體實施例對本發明作進一步描 述。 【實施方式】 請參閱圖1至圖3，為本發明實施例一之散熱裝置100。 所示散熱裝置100安裝於一電路板90上，用以對電路板90上 一發熱電子元件80散熱，該發熱電子元件80藉由一插座連 接器82固定在電路板90上。該散熱裝置100主要包括一散熱 模組10、一風扇50、一底板60及一背板70，其中，該散熱 模組10收容於風扇50内，該底板60固定在電路板90上以承 接風扇5 0。 該散熱模組10包括一散熱器20、一導熱板30及二安裝 於散熱器20和導熱板30上之熱管40。該二熱管40呈11形彎 曲，各包括一吸熱段42及一放熱段44。該散熱器20由複數 相互平行之散熱鰭片22間隔排列而成，鰭片22間形成複數 沿縱向延伸之流道220，該散熱器20側面設有二圓形通孔24 沿橫向貫穿散熱鰭片22，該二通孔24用以收容熱管40之放 熱段44 ;散熱器20底部設有二與通孔24平行之半圓形溝槽 26，該二溝槽26沿橫向貫穿散熱鰭片22 ;在與散熱器20頂 1312653 部相垂直方向，四矩形孔28貫穿散熱鰭片22 ;該散熱器2〇 底部一端沿流道220延伸方向逐漸向上呈弧形彎曲。該導熱 板30位於散熱器20下方，其大致呈矩形，該導熱板3〇之頂 部32設有二沿橫向貫穿導熱板3〇之半圓形凹槽326，該二凹 槽326與散熱器20底部溝槽26相對應配合以收容熱管4〇之 吸熱段42 ;該導熱板30上設有與散熱器2〇之矩形孔28相對 應之四通孔328，在導熱板30頂部32四角上各設有一螺紋孔 322 ;裝配時’所述熱管40與導熱板30、散熱器2〇之間，以 及導熱板30之頂部32與散熱器20之底部均藉由焊接或膠接 成一體’該導熱板30底部向下延伸出一凸臺（圖未示）與 上述發熱電子元件80接觸，用以吸收該發熱電子元件80上 之熱量；在上述插座連接器82四角和電路板90上分別設有 通孔88、98與上述導熱板30之通孔328、散熱器20之矩形孔 28相對應。 該風扇50包括一葉輪52、一殼體53及一蓋板58，該葉 輪52位於該殼體53内並樞接於該殼體53—側，該蓋板58樞 接於該殼體53上與葉輪52相鄰一侧，用以封蓋該殼體53頂 部，由此，蓋板58和殼體53形成一導風罩；該殼體53底部 對應上述導熱板30形狀形成有一矩形開口 532’使得導熱板 30可穿過殼體53上之開口 532與發熱電子元件80接觸。該蓋 板58包括一薄片狀大致呈矩形之本體580，該本體580與殼 體53相樞接之一侧邊緣彎折形成一沿縱向延伸之捲筒 586，該捲筒586與殼體53對應侧邊緣形成之凸緣536樞接； 本體580上與捲筒586相對之一側邊緣向下垂直延伸出一侧 1312653 壁582，該側壁582側面靠近底部處設有二凸出部585，該二 凸出部585用以與殼體53上對應側形成之二卡鉤535相扣 接，從而使蓋板58與殼體53扣合。由此，該殼體53與蓋板 ’ 58圍成一容置空間55，該容置空間55大致呈矩形，用以收 容散熱模組10，該容置空間55—侧與葉輪52相通，另一侧 則藉由殼體53與蓋板58圍成之一開口 57與外界空氣相通。 上述蓋板58與殼體53之樞接結構中，該蓋板58可繞殼體53 一側轉動打開，使收容於容置空間55中之散熱模組10暴露 於外部，方便對散熱模組10進行裝配操作。該殼體53上對 應葉輪52之頂部形成一進風口 537,用以供葉輪52吸收空氣 並持續向收容於該容置空間55内之散熱模組10吹送氣流， 該氣流隨後流經散熱鰭片22間之流道220，並和散熱鰭片22 及其周圍空氣發生熱交換，最後藉由開口57流到外界空氣 中去。 該底板60為一側開口之门形框體，該框體由三本體61 圍成，該等本體61大致呈矩形，相鄰二本體61首尾連接且 相互垂直。該等本體61靠近所圍空間之内側邊緣垂直向上 延伸形成一内壁62，在内壁62四角各形成有一矩形凸臺 65，用以抵靠支撐上述導熱板30，該等凸臺65上設有四通 孔652與導熱板30上之螺紋孔322相對應，四螺釘655從底板 60底部穿過該等通孔652、螺紋孔322以將底板60和導熱板 30連接起來。該底板60上靠近風扇50之葉輪52—側，二本 體61頂部向上延伸出複數相互平行間隔排列之片體66。裝 配時，該等片體66收容於容置空間55中，以便進一步擴大 10 1312653 散熱面積和引導氣流；在底板60之框體四角向下延伸出四 凸柱68，該底板60藉由該等凸柱68抵靠在電路板90上，每 一凸柱68上設有一緊固孔67，上述電路板90上對應該等緊 固孔67設有四通孔97，四緊固件95穿過該等通孔97、緊固 孔67以將電路板90和底板60連接起來。 該背板70位於與上述發熱電子元件80對應之電路板90 之背面，其包括一矩形本體72，該本體72中間設有一矩形 凸塊77，用以支撐及抵頂電路板90中央之發熱電子元件 80 ;該本體72四角上延伸出四圓柱形凸柱75,每一凸柱75 上設有一緊固孔752，該等緊固孔752與上述插座連接器82 之通孔88、電路板90之通孔98對應。四緊固件85和四緊固 件35藉由背板70將散熱模組10固定在電路板90上，其中， 每一緊固件85包括一頭部854和一螺杆852，該頭部854中間 設有一緊固孔856。裝配時，緊固件85穿過上述插座連接器 82之通孔88、電路板90之通孔98並旋入背板70之緊固孔752 中結合，接著，打開蓋板58，操作緊固件35穿過散熱模組 之矩形孔28、導熱板30之通孔328並旋入緊固件85之緊固孔 856結合，從而將散熱裝置100固定。 請參閱圖4至圖6，為本發明實施例二之散熱裝置200， 與實施例一中散熱裝置100所不同之處在於，該散熱裝置 200之蓋板58b樞接於殼體53b之中部。該殼體53b頂部局部 與散熱模組10對應位置形成一矩形開口 530b，該開口 530b 沿縱向一邊緣中部形成一凹槽532b，該凹槽532b沿橫向之 兩端相向形成二凸軸535b，開口 530b上與凹槽532b相對之 11 1312653 一邊緣中間形成一矩形凹孔534b;該蓋板58b包括一與開口 53〇b形狀相似之矩形本體580b，該本體580b—邊緣中間形 成一圓柱形凸出部582b ’該凸出部582b兩端設有凹孔（圖未 不）’該本體580b上與凸出部582b相對邊緣中間彎折延伸出 一卡釣584b。該蓋板58b藉由其凸出部582b收容於殼體53b 之凹槽532b中’並藉由凸出部582b兩端凹孔收容凸軸 535b，從而實現與殼體53b樞接，由此藉由翻轉蓋板58b， 可使得散熱裝置200中之散熱模組10充分暴露於外部，以便 於對散熱模組10進行裝配操作；並且，當蓋板58b翻轉到水 平位置’該蓋板58b藉由卡鉤584b卡扣於殼體53b之凹孔 534b中，以將殼體53b頂部開口 53〇b封閉。 請參閱圖7及圖8，為本發明實施例三之散熱裝置300， 與實施例二中散熱裝置200所不同之處在於，該散熱裝置 300之蓋板58c沿橫向滑扣於殼體53c中部。該殼體53c頂部局 部與散熱模組10對應位置形成一矩形開口 53〇c，該開口 530c沿橫向貫穿殼體53c頂部，該開口53〇〇沿縱向之二相對 邊緣中間形成二導軌532c，同時，該開口 530c上與導軌532c 相鄰之一邊緣中間形成一矩形凹槽534c ;請同時參閱圖9， 該蓋板58c包括一與開口 530c形狀相似之矩形本體580c ’該 本體580c與殼體53c之導執532c相對應二邊緣形成有二導槽 582c ’該二導槽582c用以與導執532c配合，使得蓋板58c沿 橫向自由在殼體53c頂部滑動。另外，該蓋板58c之本體580c 上與導槽582c相鄰一端邊緣向下彎折延伸出一折邊581c， 該折邊581c形狀與該殼體53c開口 530c對應端之形狀相似， 12 1312653 一卡鉤584c自折邊581c中部向下延伸設置，用以卡扣於 口 530c之凹槽534c中，使得蓋板58〇滑扣至可將殼體53〇頂 開口 530c封閉位置時固定。 、°1312653 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device with an air guiding hood. [Prior Art] When a heat-generating electronic component (such as a display card) operates, a large amount of heat is generated, which causes the temperature of the system itself and the system to rise, which in turn causes the running performance to deteriorate. To ensure proper operation of the heat-generating electronic components, a heat sink is usually placed on the heat-generating electronic components to dissipate the heat generated. Taiwan Patent Publication No. 511735 discloses a heat dissipating device. The heat dissipating device mainly includes a heat dissipating fin group, a fan and an air guiding hood. The air guiding hood can effectively guide the airflow generated by the fan to improve heat dissipation efficiency. . However, when fixing the heat sink fin set, in order to lock and fix the screw of the heat sink, the entire air guide cover needs to be disassembled into two parts and perforated in the cover body, which is not only cumbersome to operate, but also affects the air guiding effect of the air guide cover. And appearance. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device that is convenient to disassemble. A heat dissipating device for dissipating heat from a heat-generating electronic component on a circuit board, comprising: a heat sink having a plurality of heat sink fins; a fan, the fan including an air hood, the air hood including a The cover plate and the casing are disposed in a receiving space of the cover plate and the casing. The cover plate is pivotally mounted on the casing. The cover plate includes a body, and the 1312653 body One side edge is bent to extend to form a reel, and the housing forms a flange corresponding to the side edge of the cover roll to be pivotally received in the reel. In the above heat dissipating device, the cover of the air guiding hood is movably connected to the housing, and the heat sink accommodated in the accommodating space of the air guiding hood is easily exposed, so that the heat sink can be disassembled. The invention will now be further described with reference to the specific embodiments with reference to the accompanying drawings. Embodiments Please refer to FIG. 1 to FIG. 3 , which illustrate a heat dissipation device 100 according to a first embodiment of the present invention. The heat sink 100 is mounted on a circuit board 90 for dissipating heat from a heat generating electronic component 80 on the circuit board 90. The heat generating electronic component 80 is secured to the circuit board 90 by a receptacle connector 82. The heat dissipation device 100 mainly includes a heat dissipation module 10, a fan 50, a bottom plate 60, and a back plate 70. The heat dissipation module 10 is received in the fan 50. The bottom plate 60 is fixed on the circuit board 90 to receive the fan. 5 0. The heat dissipation module 10 includes a heat sink 20, a heat conducting plate 30, and two heat pipes 40 mounted on the heat sink 20 and the heat conducting plate 30. The two heat pipes 40 are bent in an elliptical shape, and each includes a heat absorbing section 42 and a heat releasing section 44. The heat sink 20 is formed by a plurality of heat-dissipating fins 22 arranged in parallel with each other. A plurality of flow channels 220 extending in the longitudinal direction are formed between the fins 22, and two circular through holes 24 are formed on the side of the heat sink 20. The two through holes 24 are for receiving the heat releasing portion 44 of the heat pipe 40; the bottom portion of the heat sink 20 is provided with two semicircular grooves 26 parallel to the through holes 24, and the two grooves 26 penetrate the heat radiating fins 22 in the lateral direction. In a direction perpendicular to the 1312653 portion of the top of the heat sink 20, the four rectangular holes 28 penetrate the heat dissipation fins 22; the bottom end of the heat sink 2 is gradually curved upward in the direction in which the flow path 220 extends. The heat conducting plate 30 is located under the heat sink 20 and has a substantially rectangular shape. The top portion 32 of the heat conducting plate 3 is provided with two semicircular grooves 326 extending transversely through the heat conducting plate 3, and the two grooves 326 and the heat sink 20 The bottom groove 26 is correspondingly configured to receive the heat absorption section 42 of the heat pipe 4; the heat conduction plate 30 is provided with four through holes 328 corresponding to the rectangular holes 28 of the heat sink 2, at the four corners of the top 32 of the heat conduction plate 30. A threaded hole 322 is provided; when assembled, the heat pipe 40 and the heat conducting plate 30, the heat sink 2〇, and the top 32 of the heat conducting plate 30 and the bottom of the heat sink 20 are integrally formed by welding or bonding. A boss (not shown) extends downwardly from the bottom of the board 30 to contact the heat-generating electronic component 80 for absorbing heat on the heat-generating electronic component 80; and is disposed on each of the four corners of the socket connector 82 and the circuit board 90. The through holes 88, 98 correspond to the through holes 328 of the heat conducting plate 30 and the rectangular holes 28 of the heat sink 20. The fan 50 includes an impeller 52, a casing 53 and a cover plate 58. The impeller 52 is located in the casing 53 and pivotally connected to the side of the casing 53. The cover plate 58 is pivotally connected to the casing 53. The side adjacent to the impeller 52 is used to cover the top of the casing 53. Thus, the cover plate 58 and the casing 53 form an air hood; the bottom of the casing 53 is formed with a rectangular opening 532 corresponding to the heat conducting plate 30. 'The heat conducting plate 30 can be brought into contact with the heat-generating electronic component 80 through the opening 532 in the housing 53. The cover plate 58 includes a substantially rectangular body 580. The side edge of the body 580 pivotally connected to the housing 53 is bent to form a longitudinally extending reel 586 corresponding to the housing 53. The flange 536 formed by the side edge is pivotally connected; a side wall of the body 580 opposite to the roll 586 extends vertically downwardly from a side 1312653 wall 582. The side wall 582 is provided with two protrusions 585 at the side near the bottom. The protruding portion 585 is configured to be fastened to the two hooks 535 formed on the corresponding sides of the housing 53, so that the cover plate 58 is engaged with the housing 53. Thus, the housing 53 and the cover plate 58 are enclosed by an accommodating space 55. The accommodating space 55 is substantially rectangular for receiving the heat dissipation module 10, and the accommodating space 55-side is in communication with the impeller 52. One side of the housing 53 and the cover 58 enclose an opening 57 to communicate with the outside air. In the pivotal structure of the cover plate 58 and the housing 53, the cover plate 58 can be rotated and opened around the side of the housing 53 to expose the heat dissipation module 10 received in the accommodating space 55 to the outside, so as to facilitate the heat dissipation module. 10 perform assembly operations. An air inlet 537 is formed on the top of the corresponding impeller 52 of the housing 53 for the air to be absorbed by the impeller 52 and continuously blows airflow to the heat dissipation module 10 received in the accommodating space 55, and the airflow then flows through the heat dissipation fins. The 22 flow channels 220 exchange heat with the fins 22 and the surrounding air, and finally flow through the openings 57 to the outside air. The bottom plate 60 is a door-shaped frame that is open on one side. The frame is surrounded by three bodies 61. The bodies 61 are substantially rectangular, and the adjacent two bodies 61 are connected end to end and perpendicular to each other. The main body 61 extends vertically upwardly to form an inner wall 62 adjacent to the inner edge of the enclosed space. A rectangular boss 65 is formed at each of the four corners of the inner wall 62 for supporting the heat conducting plate 30. The boss 65 is provided with four The through hole 652 corresponds to the threaded hole 322 on the heat conducting plate 30. The four screws 655 pass through the through holes 652 and the threaded holes 322 from the bottom of the bottom plate 60 to connect the bottom plate 60 and the heat conducting plate 30. The bottom plate 60 is adjacent to the side of the impeller 52 of the fan 50, and the top of the body 61 extends upwardly from a plurality of sheets 66 arranged in parallel with each other. During assembly, the sheets 66 are received in the accommodating space 55 to further enlarge the heat dissipation area and the guiding airflow of the 10 1312653; the four corners 68 extend downward from the four corners of the frame of the bottom plate 60, and the bottom plate 60 is used by the bottom plate 60. The protrusions 68 are abutted on the circuit board 90. Each of the protrusions 68 is provided with a fastening hole 67. The circuit board 90 is provided with four through holes 97 corresponding to the fastening holes 67. The four fasteners 95 pass through the same. The through hole 97 and the fastening hole 67 are connected to connect the circuit board 90 and the bottom plate 60. The backplane 70 is located on the back surface of the circuit board 90 corresponding to the heat-generating electronic component 80. The backplane 70 includes a rectangular body 72. The body 72 is provided with a rectangular bump 77 for supporting and abutting the heat-emitting electronics in the center of the circuit board 90. The unit 80 has four cylindrical protrusions 75 extending from the four corners of the body 72. Each of the protrusions 75 is provided with a fastening hole 752, the fastening hole 752 and the through hole 88 of the socket connector 82, and the circuit board 90. The through holes 98 correspond to each other. The four fasteners 85 and the four fasteners 35 fix the heat dissipation module 10 to the circuit board 90 by the back plate 70. Each of the fasteners 85 includes a head 854 and a screw 852. Fastening holes 856. When assembled, the fasteners 85 pass through the through holes 88 of the socket connector 82, the through holes 98 of the circuit board 90, and are screwed into the fastening holes 752 of the back plate 70, and then the cover plate 58 is opened to operate the fasteners 35. The heat sink 100 is fixed by a rectangular hole 28 passing through the heat dissipation module, a through hole 328 of the heat conductive plate 30, and a fastening hole 856 screwed into the fastener 85. Referring to FIG. 4 to FIG. 6 , the heat dissipating device 200 of the second embodiment of the present invention is different from the heat dissipating device 100 of the first embodiment in that the cover plate 58 b of the heat dissipating device 200 is pivotally connected to the middle of the casing 53 b . A rectangular opening 530b is formed at a position corresponding to the heat dissipation module 10 at a top portion of the housing 53b. The opening 530b defines a recess 532b along a middle portion of the longitudinal direction. The recess 532b forms two convex shafts 535b along opposite ends of the lateral direction. A rectangular recess 534b is formed in the middle of an edge of the 530b opposite to the recess 532b. The cover 58b includes a rectangular body 580b similar in shape to the opening 53B. The body 580b forms a cylindrical projection in the middle of the edge. The portion 582b' is provided with a recessed hole at both ends of the protruding portion 582b (not shown). The body 580b is bent at an opposite edge from the protruding portion 582b to extend a card catch 584b. The cover plate 58b is received in the recess 532b of the housing 53b by its protruding portion 582b, and receives the protruding shaft 535b through the recessed holes at both ends of the protruding portion 582b, thereby achieving pivotal connection with the housing 53b, thereby borrowing By flipping the cover plate 58b, the heat dissipation module 10 in the heat sink 200 can be sufficiently exposed to the outside to facilitate the assembly operation of the heat dissipation module 10; and, when the cover plate 58b is turned to the horizontal position, the cover plate 58b is The hook 584b is snapped into the recess 534b of the housing 53b to close the top opening 53〇b of the housing 53b. Referring to FIG. 7 and FIG. 8 , the heat dissipating device 300 of the third embodiment of the present invention is different from the heat dissipating device 200 of the second embodiment in that the cover plate 58c of the heat dissipating device 300 is laterally buckled in the middle of the housing 53c. . A portion of the top portion of the housing 53c corresponding to the heat dissipation module 10 forms a rectangular opening 53c. The opening 530c extends through the top of the housing 53c. The opening 53 defines two guide rails 532c along the opposite edges of the longitudinal direction. A rectangular recess 534c is formed in the opening 530c adjacent to an edge adjacent to the guide rail 532c. Referring to FIG. 9, the cover plate 58c includes a rectangular body 580c similar in shape to the opening 530c. The main body 580c and the housing 53c The guide 532c is formed with two guide grooves 582c corresponding to the two edges. The two guide grooves 582c are for engaging with the guide 532c, so that the cover plate 58c is free to slide in the lateral direction on the top of the casing 53c. In addition, an end edge of the body 580c of the cover plate 58c and the guide groove 582c are bent downwardly to extend a flange 581c, and the shape of the flange 581c is similar to the shape of the corresponding end of the opening 530c of the casing 53c, 12 1312653. The hook 584c extends downward from the middle of the folded edge 581c for snapping into the recess 534c of the opening 530c, so that the cover 58 is slidably fastened to the position where the dome opening 530c of the housing 53 can be closed. , °
綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾^ 變化，皆應涵蓋於以下之申請專利範圍内。 少S 【圖式簡單說明】 圖1係本發明散熱裝置實施例一之立體組合圖。 圖2係本發明散熱裝置實施例一之立體分解圖。 圖3係圖2之組合圖，其中散熱裝置之導風罩處於 開狀態。 圖4係本發明散熱裝置實施例二之組合圖，其中導風 罩處於打開狀態。 圖5係本發明散熱裝置實施例二之組合圖，其中導風 罩與該散熱裝置分離。 圖6係本發明散熱裝置實施例二之組合圖。 圖7係本發明散熱裝置實施例三之組合圖。 圖8係本發明散熱裝置實施例三之組合圖，其中導風 單與該散熱裝置分離。 圖9係本發明散熱裝置實施例三中蓋板立體放大圖。 【主要元件符號說明】 20 散熱模組10 散熱器 13 1312653 散熱鰭片 22 流道 220 通孔 24,328,652 溝槽 26 88,97,98 矩形孔 28 導熱板 30 頂部 32 螺紋孔 322 凹槽 326 緊固件 35,85,95 敎管 ”、、ρϊ 40 吸熱段 42 放熱段 44 風扇 50 葉輪 52 殼體 53,53b,53c 開口 532, 530b,530c 凹槽 532b,534c 導執 532c 凹孔 534b 卡鉤 535, 584b,584c 凸轴 535b 凸緣 536 進風口 537 容置空間 55 開口 57 蓋板 58,58b,58c 本體 580,580b,580c 61,72 折邊 581c 凸出部 582b,585 側壁 582 導槽 582c 卷筒 586 底板 60 内壁 62 凸臺 65 螺釘 655 片體 66 緊固孔 67,752,856 凸柱 68,75 14 1312653 背板 70 凸塊 77 電子元件 80 插座連接器 82 螺桿 852 頭部 854 電路板 90 散熱裝置 100,200,300 15In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and those skilled in the art will be able to make modifications within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a first embodiment of a heat sink according to the present invention. 2 is an exploded perspective view of the first embodiment of the heat sink of the present invention. Figure 3 is a combination view of Figure 2 with the air hood of the heat sink in an open state. Figure 4 is a combination view of Embodiment 2 of the heat sink of the present invention, wherein the air deflector is in an open state. Figure 5 is a combination view of Embodiment 2 of the heat sink of the present invention, wherein the air deflector is separated from the heat sink. Figure 6 is a combination diagram of Embodiment 2 of the heat sink device of the present invention. Figure 7 is a combination diagram of Embodiment 3 of the heat sink of the present invention. Figure 8 is a combination diagram of Embodiment 3 of the heat sink of the present invention, wherein the air guide is separated from the heat sink. Figure 9 is a perspective enlarged view of the cover plate of the third embodiment of the heat sink of the present invention. [Main component symbol description] 20 Thermal module 10 Heat sink 13 1312653 Heat sink fin 22 Flow path 220 Through hole 24, 328, 652 Groove 26 88, 97, 98 Rectangular hole 28 Thermal plate 30 Top 32 Threaded hole 322 Groove 326 Fastener 35 , 85,95 敎管",,ρϊ 40 heat absorption section 42 heat release section 44 fan 50 impeller 52 housing 53, 53b, 53c opening 532, 530b, 530c groove 532b, 534c guide 532c recess 534b hook 535, 584b , 584c convex shaft 535b flange 536 air inlet 537 accommodating space 55 opening 57 cover plate 58, 58b, 58c body 580, 580b, 580c 61, 72 flange 581c projection 582b, 585 side wall 582 guide groove 582c reel 586 bottom plate 60 Inner wall 62 Boss 65 Screw 655 Plate 66 Fastening hole 67, 752, 856 Post 68, 75 14 1312653 Back plate 70 Bump 77 Electronics 80 Socket connector 82 Screw 852 Head 854 Circuit board 90 Heat sink 100, 200, 300 15