200903226 九、發明說明： 【發明所屬之技術領域】 種用於對電子 本發明涉及一種散熱裝置，尤其係指一 元件散熱之散熱裝置。 【先前技術】 隨著電子產業之迅速發展，如電腦中電子元件之運嘗 速度大幅度提高，其產生之熱量亦隨之劇增，如何將電: 凡件之熱量散發出去，以保證其正常運行，一直係業者必 需解決之問題。隨著近年來高頻圖像處理、無線 術不斷發展，包括顯卡、視頻圖像卡（VGA卡）在内之附加卡 上電子疋件之發熱量越來越大。例如圖像卡，一般包括一 早獨之處理器’稱作圖像處理器（GPU)，其發熱量亦相當 大，如不能有效散熱將會影響其正常運行。因此，通常: GPU之表面安裝—散熱裝置進行散熱。該散熱裝置一般包 ，與GPU接觸之散熱器及設於散熱器頂部之風扇，該散熱 斋包括一基座及設於該基座上之複數散熱片。風扇運轉時 其產生之氣流吹過散熱器之散熱片並與散熱片進行熱交 換，從而將散熱器從GPU吸收之熱量散發 '然，該散熱器 之底座往往係金屬實體與電子元件接觸，電子元件產生之 熱里k熱源中心向散熱裝置四周慢慢擴散，直接影響了整 個散熱裝置之散熱速度，同時，金屬實體之底座很大程度 上加大散熱器之質量。 因此，需要設計一種散熱裝置，該散熱裝置可以將電 200903226 量更加快速、均勻地分佈至整個散熱裝置。 本發明旨在提供 熱之散熱裝置。 種可快速、有效對電子元件 行散 敎：=二衣置，用以對一電路板上之電子元件進行背 …ά括-基座、排列在該基座上之 j :;一基;ir:::散熱…側之， -内封有：:質::板子::管頂部之均熱板’該均熱板為 μ習知技：相比，上述散熱裝置之均熱板為一高效導 :’、之平板形熱管且完全覆蓋於該電子元件頂部，故該電子 兀件產生之熱量能完全被該均熱板吸收並迅速均勻地分佈 :整個均熱板，在傳導到整個散熱片組上，最後通過該風 羽產生之氣流經過散熱片組内之氣流通道而快速將熱量帶 走，從而達到快速冷卻電子元件之效果。 【實施方式】 圖1至圖2揭示了本發明一實施例中之散熱裝置，該散 熱裝置用於對電路板上（圖未示）之電子元件（圖未示） 進行散熱。該電路板可以係顯卡、視頻圖像卡或主機板等， 其上安裝之電子元件可以係圖片處理晶片等高功率電子元 件，該等電子元件錢行時會㈣量熱量，需被及時 地冷卻以確保其正常運行。 忒散熱裝置包括—基座1〇、安裝於該基座1〇一端之一 7 200903226 風扇20、排列於該基座1〇上之一散熱片組2〇和罩設於該風 扇30及散熱片組2〇上之一蓋體4〇。 如圖3-5所示，上述基座10包括一基板n及嵌置在該基 板11内之一均熱板13。該基板n由導熱性能良好且密度較 小之金屬材料如鋁形成，其一端形成一大致呈圓形凹陷之 安裝部110，該安裝部110中間開設一供安裝風扇3〇之安裝 通口 1102，該通口 11〇2周圍開設有與螺釘1〇〇配合以安裝該 風扇30之二配合孔11〇4。該基座2〇中間偏向另一端處設置 一供該均熱板13嵌入之缺口 112，該缺口 112之大小形狀與 均熱板13相適配，該缺口 112邊緣之下半部分形成向缺口 112中心内凸伸之凸簷1120，且該凸簷1120在靠近該缺口 110之各個角落處向該缺口 112中心内凸伸之長度較其它之 長度長，以保證穩固地支撐該均熱板13。該基板n在靠近 該安裝部110之兩角落上設置有與基板丄丨長度方向平行之 複數散熱轉片114，該等散熱縛片114垂直於該基板u，且 它們之長度由該基板只兩側向中間遞減。該基板只在靠近 各邊、彖處均勾開设有從該基板丄丄上表面向下凹陷之複數階 孔11^ :亥等階孔116供固定件（圖未示）穿過而將該散熱 裝置女I在電路板上。請特別參閱圖4，該基板叫靠近各 邊彖處均勻開3又有從該基板i i下表面向上凹陷之複數固定 孔117，該等Μ孔117供螺桿件謂穿過並與該蓋體40螺 合，以將該蓋體40固定在該基座1〇上。特別參閱圖5，該基 板11底部在該缺口 112—角落附近向内凹陷形成—條形容 置。卩118，该容置部118沿該該缺口 112之對角線延伸。 8 200903226 上述均熱板13為一平板形熱管，其内封裝有工作介 質，故相對實體金屬板體來說具有導熱性能好及質量小之 k ”.’έ垓均熱板13大體呈矩形，其形狀大小與該基板η之 缺口 112相匹配，以容置於該缺口 112内。該均熱板13之上 表面為一平面，其底面甲間部分向下浮凸，而其底面靠近 各邊緣部分向上凹陷形成環繞該中間部分之凹陷部13〇，該 凹陷和〇之形狀與基板112之凸JU2G互補，正好承接在 該凸詹1120上使該均熱板13之上下表面分別與該基板狀 ^下表面在同一面上。該均熱板13之-個角上沿對角線向 條形封π部132 ’該封口部⑶在該均熱油容置 118内 之缺⑶2處時容置在該基板11底面之容置部 導上散熱片組2〇大致呈扇形，其包括由 形成^折邊跡該等折_ 等方式固定在該基板叫二反;:=過焊接输 等折邊220之寬戶從μ ‘、、土 、同形成之平面上。該 風扇3 〇之另一端逐漸'增大，2:::=風扇3 0 -端向遠離該 形成之空氣通道由散熱片22;::=:散熱片〜間 風扇30之另一端逐漸增大。該 羽30之一端向遠離該 長度較靠向兩側之散熱片22長：：：組20中間之散熱片22 該等散熱片22形成之氣流通道入=近該風扇3〇之-端在 处形成一圓弧形端面而 200903226 -包圍該風扇30,遠離該風扇3〇之另—端 由盆中鬥夕私批um, Ί "丨L "IL道出口處 ”日’之放熱片22向兩惻呈階梯狀遞減， 遞減程度大於向後側遞減 ”中向刖側之 、苦士， ^ ^ °豕政熱片組20之氣流通 迢之出口相對於其入口呈 、 、n、，丰 政狀故忐將從該入口進入氣 迢中之氣流通過該出口均勻地分佈到周圍環境卜 上述風扇30為-轴流式風扇，其通 標號）安裝在該基板丨丨之安裝部n〇上。 疋木（未 i述蓋體40由塑膠材料製成’其包括 頂板42邊緣垂直向下延伸之 反及攸該 ^ ,c J ^ 及頂板42之形狀和該 形狀相對應’其覆蓋除該基板u—端之散熱鰭片 二/;他部分。該頂板42之-端對應該風扇30處開設 广圓幵7氣Λ"'入口 420，以供該風扇3〇在運轉時將周圍之空 氣從中吸人。該頂板42垂直向τ延伸形成有複數螺筒422， 該等螺筒422間隔地分佈在該頂板42之周緣，並分別與該基 板11之固定孔117對應，以供螺桿件2〇〇穿過該固定孔117以 〔與該螺筒422螺合而將該蓋體4〇固定在該基座忉上。該側板 之门度14核頂板42之螺筒422之高度一致，略大於散熱片 、、且20之同度，其在遠離該氣流入口之一端之前側角落附近 形成有一氣流出口 440,以供該風扇3〇產生之氣流與該散熱 片組20進行熱交換後被從中排出。 請再次參考圖1及圖2，上述散熱裝置在組裝狀態時， 該散熱熱片組20之底面通過焊接或粘貼等方式固定在該基 座10上面，該風扇安裝在該基座10之安裝部11〇上，該蓋 肢4〇復蓋5亥散熱片組20及風扇30上面，並通過其螺筒422與 10 200903226 螺合而固定在該基座 穿過該基座10固定孔117之螺桿件2〇〇 10上。 上述散熱裝置在工作時，通過固定件穿過該基座此 階孔116固定到電路板上，該基座1〇均熱板13之底面可以斑 一個或多個電子元件接觸，可以在該均熱板13底面與電子 凡件頂面之間塗抹導熱膠以增強導熱效果，還可以在該散 熱裝置與電路板之間墊設絕緣膠片以起到絕緣及緩^乍 用由於σ亥均熱板11為一尚效導熱之板形埶管，故該+子 元件產生之熱量能被該均熱仙吸收並迅逮均勾地=在 =句熱板，在傳導到整個散熱片組2〇上，最後通過該風 ^產生之氣流經過散熱片組2〇内之氣流通道而快速將敎 =走，從而達到快速冷卻電子元件之效果。此外，該散 :片組20圍繞該風扇3〇呈放射狀，該等散熱片以間之氣 概通道由靠近該風扇30之一端向遠離該風扇3◦之另一端逐 :變寬，從而減小氣流在氣流通道中之空氣阻力，加快散 綜上料，本發明符合發明專利要件，爰依法提出專 ^請。惟’以上所述者僅為本發明之較佳實施例，舉凡 =本案技#之人士，在爰依本發明精神所作之等效修飾 2史化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之一實施例之立體組合圖。 圖2係圖1中散熱裝置之立體分解圖。 圖3係圖2中基座之立體組合圖。 11 200903226 圖4係圖2中均熱板之倒置視圖。 圖5係圖3中基座之倒置視圖。 【主要元件符號說明】 基座 10 基板 11 安裝部 110 通口 1102 配合孔 1104 缺口 112 凸簷 1120 散熱鰭片 114 階孔 116 固定子L 117 容置部 118 均熱板 13 凹陷咅P 130 封口部 132 散熱片組 20 散熱片 22 折邊 220 風扇 30 蓋體 40 頂板 42 氣流入口 420 螺同 422 側板 44 氣流出口 440 螺釘 100 螺桿件 200 12200903226 IX. Description of the Invention: [Technical Field] The invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat of a component. [Prior Art] With the rapid development of the electronics industry, such as the speed of the electronic components in the computer has greatly increased, the heat generated by it has also increased dramatically. How to heat up the heat of the pieces to ensure their normality? Operation, the problem that must be solved by the system. With the continuous development of high-frequency image processing and wireless technology in recent years, the heat generation of electronic components on additional cards including video cards and video image cards (VGA cards) is increasing. For example, an image card generally includes an early-stage processor, called an image processor (GPU), which generates a relatively large amount of heat. If it cannot be effectively dissipated, it will affect its normal operation. Therefore, usually: GPU surface mount - heat sink for heat dissipation. The heat sink generally includes a heat sink in contact with the GPU and a fan disposed on the top of the heat sink. The heat sink includes a base and a plurality of heat sinks disposed on the base. When the fan is running, the airflow generated by the fan blows through the heat sink of the heat sink and exchanges heat with the heat sink, thereby dissipating the heat absorbed by the heat sink from the GPU. The base of the heat sink is often in contact with the electronic component and the electronic component. The heat generated by the component k slowly diffuses around the heat sink, which directly affects the heat dissipation speed of the entire heat sink. At the same time, the base of the metal body greatly increases the quality of the heat sink. Therefore, there is a need to design a heat sink that can distribute the amount of electricity 200903226 more quickly and evenly throughout the heat sink. The present invention is directed to providing a heat sink. It can quickly and effectively disperse electronic components: = two clothes, used to carry back the electronic components on a circuit board, including the base, arranged on the base, j:; a base; ir :::heating...side, -the inner seal is::quality::board::the top of the tube is the hot plate' The soaking plate is the μ technology: compared to the heat sink of the above heat sink is an efficient Guide: ', the flat-shaped heat pipe and completely covers the top of the electronic component, so the heat generated by the electronic component can be completely absorbed by the soaking plate and quickly and evenly distributed: the entire heat-sinking plate is conducted to the entire heat sink In the group, the airflow generated by the wind feather finally passes the air passage in the heat sink group to quickly take away the heat, thereby achieving the effect of rapidly cooling the electronic components. [Embodiment] Figs. 1 to 2 disclose a heat dissipating device for dissipating heat from an electronic component (not shown) on a circuit board (not shown) according to an embodiment of the present invention. The circuit board can be a video card, a video image card or a motherboard, etc., and the electronic components mounted thereon can be high-power electronic components such as picture processing chips. When the electronic components are used, the amount of heat is required to be cooled in time. To ensure that it is working properly. The heat sink includes a base 1 , one of the ends of the base 1 , a 200903226 fan 20 , a heat sink unit 2 排列 arranged on the base 1 , and a cover 30 and a heat sink. One of the cover groups 2 has a cover body 4〇. As shown in FIGS. 3-5, the susceptor 10 includes a substrate n and a heat equalizing plate 13 embedded in the substrate 11. The substrate n is formed of a metal material having a good thermal conductivity and a low density, such as aluminum, and has a mounting portion 110 having a substantially circular recess at one end thereof, and a mounting port 1102 for mounting the fan 3 is disposed in the middle of the mounting portion 110. A plurality of fitting holes 11〇4 of the fan 30 are mounted around the opening 11〇2. A notch 112 is formed in the middle of the base 2 at the other end, and the notch 112 is shaped to fit the heat equalizing plate 13. The lower half of the edge of the notch 112 forms a notch 112. The protrusion 1120 protrudes from the center, and the length of the protrusion 1120 protruding into the center of the notch 112 near the corner of the notch 110 is longer than the other lengths to ensure the support of the heat equalizing plate 13 stably. The substrate n is disposed on two corners of the mounting portion 110 with a plurality of heat-dissipating fins 114 parallel to the longitudinal direction of the substrate, the heat-dissipating fins 114 are perpendicular to the substrate u, and the length thereof is only two by the substrate. Lateral reduction in the lateral direction. The substrate is only provided near the sides and the ridges, and is provided with a plurality of stepped holes 11^ which are recessed downward from the upper surface of the substrate, and the holes 11 are arranged for the fixing members (not shown) to pass through. The heat sink female I is on the circuit board. Referring to FIG. 4 in particular, the substrate is called a plurality of fixing holes 117 which are uniformly opened near the side edges 3 and are recessed upward from the lower surface of the substrate ii. The holes 117 are passed through the screw member and the cover body 40 is The screw is screwed to fix the cover 40 to the base 1 . Referring particularly to Figure 5, the bottom of the substrate 11 is recessed inwardly adjacent the corner of the gap 112 to form a strip-shaped receptacle. The accommodating portion 118 extends along a diagonal line of the notch 112. 8 200903226 The above-mentioned heat equalizing plate 13 is a flat-shaped heat pipe, which is packaged with a working medium, so that it has a good thermal conductivity and a small mass relative to the solid metal plate body. The crucible heat plate 13 is generally rectangular. The shape of the substrate is matched with the notch 112 of the substrate η to be received in the notch 112. The upper surface of the heat equalizing plate 13 is a flat surface, and the bottom portion of the bottom surface is downwardly convex, and the bottom surface thereof is close to each edge portion. The recessed portion 13A surrounding the intermediate portion is formed to be recessed upwardly, and the shape of the recess and the ridge is complementary to the convex JU2G of the substrate 112, and is received on the convex surface 1120 so that the upper surface of the heat equalizing plate 13 and the substrate are respectively formed. The lower surface is on the same side. The corner of the heat equalizing plate 13 is diagonally oriented toward the strip-shaped sealing portion π'. The sealing portion (3) is accommodated in the missing portion (3) 2 of the soaking oil reservoir 118. The receiving portion of the bottom surface of the substrate 11 is guided by the heat sink group 2, which is substantially fan-shaped, and is fixed on the substrate by the forming of the folded edge or the like. The wide household is from the plane formed by μ ', earth, and the same. The fan 3 The other end gradually 'increased, 2:::=fan 30 - the end is away from the formed air passage by the heat sink 22;::=: the heat sink to the other end of the fan 30 gradually increases. One end is long away from the heat sink 22 which is closer to the two sides of the length::: the heat sink 22 in the middle of the group 20; the air flow passage formed by the heat sink 22 is adjacent to the end of the fan 3 Curved end face and 200903226 - surrounded by the fan 30, away from the other side of the fan 3 由 由 由 由 私 私 私 quot quot quot quot quot quot quot & & & & & IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL It is stepped down, and the degree of decline is greater than that of the backward side. The middle of the squatting side, the ^ ^ ° 豕 热 热 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20气流 The airflow entering the air enthalpy from the inlet is evenly distributed to the surrounding environment through the outlet. The fan 30 is an axial flow fan, which is attached to the mounting portion n 该 of the substrate 。. (The cover 40 is not made of a plastic material, which includes the edge of the top plate 42 extending vertically downwards and the 攸, ^ J ^ and the shape of the top plate 42 corresponds to the shape 'which covers the heat sink fins 2 of the substrate u-end; the other part. The end of the top plate 42 corresponds to the fan 30 opening a wide circle Λ 7 gas Λ ' The inlet 420 is configured to allow the surrounding air to be sucked from the air when the fan 3 is in operation. The top plate 42 extends perpendicularly to the τ to form a plurality of barrels 422 which are spacedly distributed around the periphery of the top plate 42 and Corresponding to the fixing hole 117 of the substrate 11, respectively, the screw member 2 is passed through the fixing hole 117 to be screwed to the barrel 422 to fix the cover 4 to the base. The height of the screw 422 of the side panel 14 core top plate 42 is the same, slightly larger than the heat sink, and 20 degrees, and an air outlet 440 is formed near the front corner away from one end of the air flow inlet for the The airflow generated by the fan 3 is discharged from the heat sink group 20 after being exchanged. Referring to FIG. 1 and FIG. 2 again, when the heat dissipating device is in an assembled state, the bottom surface of the heat dissipating heat pack 20 is fixed on the base 10 by soldering or pasting, and the fan is mounted on the mounting portion of the base 10. 11〇, the cover limb 4 covers the 5H heat sink group 20 and the fan 30, and is screwed by the screw barrel 422 and 10200903226 to fix the screw through the base 10 fixing hole 117. Pieces 2〇〇10. The heat dissipating device is fixed to the circuit board through the fixing member through the base hole 116. The bottom surface of the base plate 1 and the heat receiving plate 13 may be contacted by one or more electronic components. A thermal conductive adhesive is applied between the bottom surface of the hot plate 13 and the top surface of the electronic component to enhance the heat conduction effect, and an insulating film may be placed between the heat dissipating device and the circuit board to provide insulation and ease of use. 11 is a heat-resistant plate-shaped manifold, so the heat generated by the + sub-component can be absorbed by the soaking heat and quickly caught in the hot plate, and transmitted to the entire heat sink group 2 Finally, the airflow generated by the wind passes through the airflow passage in the heat sink group 2〇 to quickly 敎=walk, thereby achieving the effect of rapidly cooling the electronic components. In addition, the scatter: the film group 20 is radially surrounding the fan 3〇, and the heat dissipation fins are widened by one end of the fan 30 away from the other end of the fan 30: widening, thereby reducing The air resistance of the airflow in the airflow passage accelerates the bulking of the material, and the invention complies with the patent requirements of the invention, and the special request is made according to law. However, the above description is only a preferred embodiment of the present invention, and the equivalent modification of the present invention in the spirit of the present invention should be included in the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of an embodiment of a heat sink according to the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1. Figure 3 is a perspective assembled view of the base of Figure 2. 11 200903226 Figure 4 is an inverted view of the soaking plate in Figure 2. Figure 5 is an inverted view of the base of Figure 3. [Main component symbol description] Base 10 Substrate 11 Mounting part 110 Port 1102 Matching hole 1104 Notch 112 Bulge 1120 Heat sink fin 114 Step hole 116 Fixer L 117 Housing 118 Heat soak plate 13 Sag 咅P 130 Sealing part 132 Heat sink set 20 Heat sink 22 Folding 220 Fan 30 Cover 40 Top plate 42 Air inlet 420 Splicing 422 Side plate 44 Air outlet 440 Screw 100 Screw 200 12