TWI657548B - Heat dissipation device for dissipating heat from heat-generating source - Google Patents

Abstract

A heat sink for dissipating heat from a heat source includes at least one fan element and a heat sink. The fan element has a fan and a frame, the fan being fixed to the frame such that the outer edge of the frame surrounds the fan. The heat sink is disposed on one side of the fan element. The heat sink includes a fin set and at least one flow guiding fin stacked on each other and the flow guiding fin is closer to the heat source than the fin set. The flow guiding fin comprises a body, at least one broken hole and at least one extending section. The hole is located on the body and runs through the body. The extension extends outwardly beyond the edge of the breach and has an angle between the extension and the body.

Description

Heat sink for dissipating heat from a heat source

The present invention relates to a heat sink, and more particularly to a heat sink mounted on a computer motherboard for dissipating heat from a heat source such as a CPU and peripheral components.

With the introduction of various electronic devices, the computing speed of the wafer has been continuously increased, and the power consumption accompanying it has also increased significantly. Therefore, it is necessary to provide a heat dissipation system for the wafer to improve its life and stability.

Most of the existing heat sink structure designs on the market can only solve the heat problem of the target wafer (such as the CPU), and cannot dissipate heat from the peripheral components of the target wafer (such as a voltage regulation module (VRM)); The components of the heat sink can only rely on the internal air circulation of the casing (such as the computer case) for air cooling. However, the complex part configuration inside the casing affects the air circulation efficiency, so that these peripheral components often lack direct airflow for forced air cooling. When these peripheral components are overheated, the performance of the target wafer is reduced, and the performance of the target wafer is suppressed.

The present invention provides a heat sink for dissipating heat from a heat source for enhancing the forced air cooling efficiency around the target wafer. In one or more embodiments, the heat sink includes at least one fan element and a heat sink. The fan element has a fan and a frame. The fan is fixed to the frame And make the outer edge of the frame surround the fan. The heat sink is disposed on one side of the fan element. The heat sink includes a fin set and at least one flow guiding fin, and the two are stacked and the flow guiding fin is closer to the heat source than the fin set. The flow guiding fin comprises a body, at least one broken hole and at least one extending section. The perforation is located on the body and extends through the body, and the extension extends outwardly from the edge of the hole. Moreover, the extension has an angle with the body.

In one or more embodiments, the bottom of the frame has an opening, and the hole and the extension are disposed on the side of the flow guiding fin adjacent to the opening.

In one or more embodiments, the number of the flow guiding fins is two or more, and the number of the broken holes and the extending segments on each of the guiding fins are two or more, and the broken holes are arranged side by side on the guiding fins. The extension sections are arranged side by side on the flow guiding fins.

In one or more embodiments, the heat sink further includes a baffle disposed at an edge of the flow guiding fin.

In one or more embodiments, the heat sink further includes a first spoiler. The first spoiler is disposed at the bottom of the frame and faces the extension.

In one or more embodiments, the heat sink further includes at least one second spoiler disposed on the extension.

In one or more embodiments, the second spoiler has a first locking hole, the extension has a second locking hole, and the heat sink further includes at least one locking member, and the locking member is locked into the first locking hole. And the second locking hole and the second spoiler is disposed on the extension.

In one or more embodiments, the heat sink further includes at least one soldering portion disposed between the second spoiler and the extension to connect the second spoiler and the extension.

In one or more embodiments, the first side of the flow guiding fin has a plurality of first buckle grooves, The two sides of the fin set have a plurality of second buckle grooves, and the frame of the fan element has a plurality of button holes. The heat dissipating device further includes a fastening component, the fastening component comprises a wearing part and two fastening parts connecting the two ends of the wearing part, the wearing part is disposed in the first fastening groove and the second fastening groove, and the fastening part is respectively buckled Connected to the buttonhole.

In one or more embodiments, the heat sink further includes a plurality of heat pipes that extend through the fin set and the flow guiding fins.

Therefore, when the heat dissipating device provided by one or more embodiments of the present invention is used as a heat dissipating system of the wafer when the heat dissipating device is disposed on the main board, since the bottom of the fan can generate a certain degree of negative pressure, the airflow can be from the fan. The opening of the frame is guided to the flow guiding fins. Therefore, the flow guiding fins are used as a diversion purpose to redirect the airflow to the main board to achieve the heat dissipation effect of the peripheral components. In addition, by the first spoiler disposed at the bottom of the frame, the airflow released from the opening can be guided to the guiding fins, and the airflow can be further guided to the motherboard to achieve peripheral components. Cooling.

100‧‧‧heating device

200‧‧‧ motherboard

21‧‧‧ wafer

22‧‧‧ peripheral components

30‧‧‧Fan components

31‧‧‧Fan

32‧‧‧Frame

32a‧‧‧Opening

32b‧‧‧ buttonhole

40‧‧‧heatsink

41‧‧‧Guide fins

411‧‧‧ Ontology

412‧‧‧ hole

413‧‧‧Extension

415‧‧‧ buckle groove

413a‧‧‧Keyhole

42‧‧‧Fin group

425‧‧‧ buckle groove

43‧‧‧heat pipe

44‧‧‧Base

45‧‧‧ deflector

50‧‧‧First spoiler

60‧‧‧Second spoiler

60a‧‧‧Keyhole

70‧‧‧Locker

71‧‧‧Weld Department

80‧‧‧fasteners

81‧‧‧ Department of Wear

82‧‧‧Deduction Department

1 is a schematic view showing the assembly of an exemplary embodiment of a heat sink according to the present invention.

Figure 2 is a partially exploded view of an exemplary embodiment of a heat sink of the present invention.

Figure 3 is a perspective view of a fan element of an exemplary embodiment of a heat sink of the present invention.

Figure 4 is a perspective view (I) of a flow guiding fin of an exemplary embodiment of the heat sink of the present invention.

Fig. 5 is a perspective view (2) of a flow guiding fin of an exemplary embodiment of the heat dissipating device of the present invention.

Fig. 6 is a perspective view (3) of a flow guiding fin of an exemplary embodiment of the heat dissipating device of the present invention.

Figure 7 is another partially exploded view of an exemplary embodiment of the heat sink of the present invention.

1 is a schematic view showing an assembly of an exemplary embodiment of a heat dissipating device of the present invention, FIG. 2 is a partially exploded view showing an exemplary embodiment of the heat dissipating device of the present invention, and FIG. 3 is an example of the heat dissipating device of the present invention. 3 is a perspective view of a fan element of an embodiment, and FIG. 4 is a perspective view (1) of a flow guiding fin of an exemplary embodiment of the heat sink of the present invention. As shown in FIGS. 1 to 4, the heat sink 100 is used for, but not limited to, mounting on the motherboard 200 to provide heat dissipation of the wafer 21 and the peripheral components 22 on the motherboard 200. The heat sink 100 includes at least one fan element 30 and a heat sink 40. As shown in FIG. 1 , in the present embodiment, the heat dissipation device 100 includes two oppositely disposed fan elements 30 , but is not limited thereto. In one or more other embodiments, the heat sink 100 can include only one fan element 30.

As shown in FIGS. 2 and 3, the fan member 30 has a fan 31 and a frame 32. The fan 31 is fixed to the frame 32 such that the outer edge of the frame 32 surrounds the fan 31. The heat sink 40 is disposed on one side of the fan element 30.

2 and FIG. 4, at least part of the heat sink 40 directly contacts the wafer 21, and the wafer 21 can be dissipated through contact heat conduction, and the fan element 30 can forcibly cool the heat sink 40.

The heat sink 40 includes at least one flow guiding fin 41 and a fin group 42. In particular, heat sink 40 includes a plurality of fin elements. Among the fin elements, the fin elements closest to the motherboard 200 are the aforementioned flow guiding fins 41, and the remaining fin elements constitute the fin group 42. That is to say, the flow guiding fins 41 are located at the outermost side of the plurality of fin elements, and the mounting direction of the plurality of fin elements is arranged such that the guiding fins 41 become the fin elements closest to the motherboard 200, and the fin sets 42 are located. On the flow guiding fin 41. The heat sink 40 may also include a plurality of flow guiding fins 41 juxtaposed on the same plane, and is not limited to the single flow guiding fins 41.

The guide fin 41 includes a body 411, a hole 412, and an extension 413. The hole 412 is located on the body 411, and the extension 413 extends to the edge of the hole 412, and the extension 413 has an angle with the body 411. In this example, the extension section 413 extends in the direction of the motherboard.

As shown in FIG. 1 , in this example, the flow guiding fins 41 have a plurality of side by side holes 412 and an extending portion 413 , but are not limited thereto. In other one or more embodiments, the flow guiding fin 41 may have only one broken hole 412 and one extended portion 413.

Therefore, when the heat dissipating device is disposed on the main board and serves as a heat dissipating system for the wafer, the guiding fins are used as a diversion source to redirect the airflow to the main board through the holes and the extension portion, thereby achieving the heat dissipation effect of the peripheral components. .

In one or more embodiments, the bottom of the frame 32 further has an opening 32a extending outwardly and on the same side as the opening 32a, and the breaking hole 412 and the extending portion 413 are disposed on the diversion The fin 41 is on the side close to the opening 32a. Since the bottom of the fan 31 can generate a certain degree of negative pressure, the air flow can be guided from the opening 32a of the frame 32 of the fan member 30 to the flow guiding fin 41. Therefore, the effect of heat dissipation of peripheral components is further enhanced.

In one or more embodiments, the heat sink 40 further includes a baffle 45 disposed at an edge of the flow guiding fin 41. Thereby, in addition to the extension portion 413 of the flow guiding fin 41, which can be used for guiding, the deflector 45 can also assist in guiding the flow to achieve heat dissipation.

In one or more embodiments, the angle between the extension 413 and the body 411 is between 5 and 85 degrees, preferably between 30 and 60 degrees. Referring to FIG. 4 , in the present embodiment, the angle between each extending portion 413 and its corresponding body 411 is substantially equal, but is not limited thereto. In other one or more embodiments, the extension 413 is adjacent to the opening 32a. The angle between the body 411 corresponding thereto is smaller than the angle between the extension 413 of the far-away hole 32a and its corresponding body 411. Thereby, the heat sink 100 can provide different flow fields to guide the airflow for heat dissipation.

Referring again to FIG. 2, at least a portion of the heat sink 40 is in direct contact with the wafer 21, in particular by providing a thermally conductive element for contacting the wafer 21 and connecting the fin set 42 and the flow guiding fins 41. In one or more embodiments, the heat sink 40 further includes a plurality of heat pipes 43 and a base 44 for use as the aforementioned heat conducting elements. Each heat pipe 43 extends through the fin set 42 and the body 411 of the flow guiding fin 41. The base 44 is used to contact the wafer 21, and one end of each heat pipe 43 extends from the base 44 and penetrates the fin set 42. Thereby, heat conduction can be achieved through the heat pipe 43, and the heat generated by the wafer 21 can be directly conducted to the fin group 42 and the flow guiding fins 41.

As shown in FIG. 3 , in one or more embodiments, the heat sink 100 further includes a first spoiler 50 disposed at the bottom of the frame 32 and facing the extension 413 . Thereby, the airflow released from the opening 32a can be further guided to the guiding fin 41 of the heat sink 40 through the first spoiler 50, so that the airflow can be further guided to the motherboard 200, and the peripheral component 22 is achieved. Forced air cooling. Moreover, in one or more embodiments, the angle between the first spoiler 50 and the bottom plane of the frame 32 is substantially equal to the angle between the extension 413 and the body 411. That is, the angle between the first spoiler 50 and the bottom plane of the frame 32 is between 5 and 85 degrees, preferably between 30 and 60 degrees.

Please refer to FIG. 5 and FIG. 6 , which are perspective views ( 2 ) and ( 3 ) of the flow guiding fins of an exemplary embodiment of the heat dissipation device of the present invention.

As shown in FIG. 5 and FIG. 6 , in one or more embodiments, the heat sink 100 further includes a second spoiler 60 disposed on the extension 413 . Specifically, it can be locked through The second spoiler 60 is disposed on the extension 413 in a manner such as FIG. 5) or welding (FIG. 6). As shown in FIG. 5, the second spoiler 60 and the extension section 413 respectively have a locking hole 60a, 413a and are locked by a locking member 70 (for example, a screw). As shown in FIG. 6 , the second spoiler 60 and the extension 413 can be welded to form the welded portion 71 , and the second spoiler 60 and the extended portion 413 are connected by the welded portion 71 , thereby The second spoiler 60 is disposed on the extension 413. Thereby, according to different product attributes and different construction methods, an appropriate material (for example, a stainless steel plate or a carbon fiber board) can be selected as the second spoiler 60 to further improve the structural strength of the heat sink 100.

Please refer to FIG. 7, which is another partial exploded view of an exemplary embodiment of the heat sink of the present invention.

Referring to FIG. 7 again, in one or more embodiments, the heat sink 40 is secured to the fan member 30 by a snap fit. Specifically, the heat dissipation device 100 includes a fastener 80. The two sides of the flow guiding fin 41 and the fin group 42 have buckle grooves 415 and 425, and the frame 32 of the fan member 30 has a buckle hole 32b. The fastener 80 has a penetrating portion 81 and a fastening portion 82 that connects the two ends of the piercing portion to form a U-shape. The insertion portion 71 is bored and received in the buckle grooves 415 and 425, and the fastening portion 82 is fastened to the buckle hole 32b. Thereby, the heat sink 40 can be fixed to the fan element 30 to each other.

Therefore, when the heat dissipating device provided by one or more embodiments of the present invention is used as a heat dissipating system of the wafer when the heat dissipating device is disposed on the main board, since the bottom of the fan can generate a certain degree of negative pressure, the airflow can be from the fan. The opening of the frame is guided to the flow guiding fins. Therefore, the flow guiding fins are used as a diversion purpose to redirect the airflow to the main board to achieve the heat dissipation effect of the peripheral components. In addition, by the first spoiler disposed at the bottom of the frame, the airflow released from the opening can be guided to the guiding fins, and the airflow can be further guided to the motherboard to achieve peripheral components. Cooling.

Claims (10)

A heat dissipating device for dissipating heat from a heat source, comprising: at least one fan component having a fan and a frame, the fan being fixed to the frame and surrounding the outer edge of the frame; and a heat sink On one side of the at least one fan element, the heat sink includes a fin set and at least one flow guiding fin, and the two are stacked and the flow guiding fin is closer to the heat source than the fin set, the guiding current The fin includes a body, at least one hole, and at least one extending hole, the at least one hole is located on the body and extends through the body, and the at least one extending portion extends outwardly to an edge of the at least one hole, and the at least one An extension between the extension and the body; wherein the extension of the at least one extension faces the heat source, such that the flow guide fin serves as a flow guiding source through the at least one hole and the at least one extension The airflow is redirected to the heat source. The heat dissipation device for dissipating heat from a heat source according to claim 1, wherein the bottom of the frame has an opening, and the at least one hole and the at least one extension are disposed on the flow guiding fin. One side of the opening. The heat dissipating device for dissipating heat from a heat generating source according to claim 1, wherein the number of the guiding fins is two or more, and the number of the broken holes and the extending portion on each of the guiding fins are respectively Two or more of the holes are arranged side by side in the flow guiding fins, and the extending sections are arranged side by side on the guiding fins. The heat dissipating device for dissipating heat from a heat generating source according to claim 1, wherein the heat sink further comprises a baffle disposed at an edge of the guiding fin. The heat dissipation device for dissipating heat from a heat source according to claim 1 further includes a first spoiler disposed at a bottom of the frame and facing the at least one extension. The heat sink for dissipating heat from a heat source according to claim 1, wherein the heat sink further comprises at least one second spoiler disposed on the at least one extension. The heat dissipating device for dissipating heat from a heat generating source according to claim 6, wherein the at least one second spoiler has a first locking hole, and the at least one extending portion has a second locking hole, and The heat sink further includes at least one locking member, and the at least one locking member locks the first locking hole and the second locking hole to set the at least one second spoiler to the at least one extending portion. The heat sink for dissipating heat from a heat source according to claim 6, wherein the heat sink further comprises at least one soldering portion disposed between the at least one second spoiler and the at least one extension The at least one second spoiler and the at least one extension. The heat dissipation device for dissipating heat from a heat source according to claim 1, wherein the two sides of the flow guiding fin have a plurality of first buckle grooves, and the two sides of the fin group have a plurality of second buckle grooves, The frame of the at least one fan component has a plurality of fastening holes, and the heat dissipation device further includes a fastening component, the fastening component includes a through portion and two fastening portions connected to the two ends of the through portion, the through portion is disposed through the frame The first fastening groove and the second fastening groove are respectively fastened to the fastening holes. The heat sink for dissipating heat from a heat source according to claim 1, wherein the heat sink further comprises a plurality of heat pipes, the heat pipes extending through the fin set and the flow guiding fins.