TW202005022A - Heat dissipation device for dissipating heat from heat-generating source - Google Patents

Abstract

A heat dissipation device for dissipating heat from a heat-generating source includes one or more fan element and a heat dissipation unit. The fan element has a fan and a frame. The fan is fixed on the frame such that an outer periphery of the frame surrounds the fan. The heat dissipation unit is on one side of the fan element. The heat dissipation unit includes a fin assembly and one or more flow-guiding fin. The fin assembly and the flow-guiding fin are stacked with each other, and the flow-guiding fin is closer to the heat-generating source than the fin assembly. The flow-guiding fin includes a main body, one or more crack, and one or more extension portion. The crack is on the main body and is defined through the main body. The extension portion is outwardly extending toward the periphery of the crack. An angle is between the extension portion and the main body.

Description

Radiator for radiating heat from heat source

The invention relates to a heat sink, especially a heat dissipation device which is installed on a computer motherboard and used for dissipating heat sources such as CPU and peripheral components.

With the introduction of various electronic devices, the computing speed of the chip has been continuously improved, and the accompanying power consumption has also increased significantly. Therefore, it is necessary to provide a heat dissipation system for the chip to improve its life and stability.

Most of the existing radiator structure designs on the market can only solve the heat problem of the target chip (such as CPU), and cannot dissipate heat from the peripheral components (such as voltage regulation module (VRM)) of the target chip; The components installed with the radiator can only rely on the air circulation inside the casing (such as the computer casing) for air cooling. However, the complicated parts configuration inside the chassis affects the air circulation efficiency, so that these peripheral components often lack direct air flow for forced air cooling. When these peripheral components are overheated, the operating performance will be reduced, and the performance of the target chip will be inhibited.

The invention provides a heat dissipation device for dissipating heat from a heat source, for enhancing the forced air cooling efficiency around the target wafer. In one or more embodiments, the heat dissipation device includes at least one fan element and a heat sink. The fan element has a fan and a frame. The fan is fixed to the frame so that the outer edge of the frame surrounds the fan. The radiator is arranged on one side of the fan element. The heat sink includes a fin group and at least one guide fin. The two are stacked and the guide fin is closer to the heat source than the fin group. The flow guide fin includes a body, at least one hole and at least one extension. The hole is located on the body and penetrates the body, and the extending section extends outward from the edge of the hole. In addition, there is an angle between the extension and the body.

In one or more embodiments, the bottom of the frame has an opening, and the hole and the extension are disposed on the side of the flow guide fin near the opening.

In one or more embodiments, the number of guide fins is more than two, and the number of holes and extensions on each guide fin is more than two, and the holes are arranged side by side on the guide fins In the middle, the extension sections are arranged side by side on the guide fins.

In one or more embodiments, the heat sink further includes a deflector, which is disposed at the edge of the deflector fin.

In one or more embodiments, the heat dissipation device further includes a first spoiler. The first spoiler is disposed at the bottom of the frame and faces the extension.

In one or more embodiments, the heat sink further includes at least one second spoiler, which is disposed on the extension section.

In one or more embodiments, the second spoiler has a first locking hole, the extension section has a second locking hole, and the radiator further includes at least one locking member, the locking member is locked into the first locking hole And the second keyhole to install the second spoiler on the extension section.

In one or more embodiments, the heat sink further includes at least one welded portion disposed between the second spoiler and the extension section to connect the second spoiler and the extension section.

In one or more embodiments, the two sides of the flow guide fin have a plurality of first buckle grooves, the two sides of the fin group have a plurality of second buckle grooves, and the frame of the fan element has a plurality of buckle holes. The heat dissipation device further includes a fastener. The fastener includes a penetrating portion and two buckling portions connected to the two ends of the penetrating portion. The penetrating portion is punctured in the first buckle groove and the second buckle groove, and the buckle portions are respectively buckled Connect to the buttonhole.

In one or more embodiments, the heat sink further includes a plurality of heat pipes, and the heat pipes penetrate the fin set and the flow guide fins.

In this way, through the heat dissipation device provided by one or more embodiments of the present invention, when the heat dissipation device is installed on the motherboard as the heat dissipation system of the chip, since the bottom of the fan can generate a certain degree of negative pressure, the airflow can flow from the fan The openings of the frame are guided to the guide fins. Therefore, the flow guide fins are used as flow guides to redirect the airflow to the motherboard to achieve the effect of heat dissipation of peripheral components. In addition, the first spoiler provided at the bottom of the frame can guide the airflow released from the opening to the guide fins, so that the airflow can be further guided to the motherboard to achieve peripheral components Heat dissipation.

Please refer to FIGS. 1 to 4, FIG. 1 is an assembly diagram of an exemplary embodiment of the heat sink of the present invention, FIG. 2 is a partially exploded view of an exemplary embodiment of the heat sink of the present invention, and FIG. 3 is an exemplary embodiment of the heat sink of the present invention A perspective view of the fan element of the embodiment. FIG. 4 is a perspective view (1) of the deflector fin of the embodiment of the heat sink of the present invention. As shown in FIGS. 1 to 4, the heat dissipation device 100 is used for, but not limited to, mounted on the motherboard 200 to provide the chip 21 and the peripheral elements 22 on the motherboard 200 to achieve the heat dissipation effect. The heat sink 100 includes at least one fan element 30 and a heat sink 40. As shown in FIG. 1, in this example, the heat dissipation device 100 includes two opposing fan elements 30, but it is not limited thereto. In one or more other embodiments, the heat dissipation device 100 may include only one fan element 30.

As shown in FIGS. 2 and 3, the fan element 30 has a fan 31 and a frame 32. The fan 31 is fixed to the frame 32 so that the outer edge of the frame 32 surrounds the fan 31. The radiator 40 is disposed on one side of the fan element 30.

Please continue to refer to FIGS. 2 and 4. At least a part of the heat sink 40 directly contacts the chip 21, and the heat can be dissipated through the contact heat conduction, and the fan element 30 can perform forced air cooling on the heat sink 40.

The heat sink 40 includes at least one guide fin 41 and a fin group 42. Specifically, the heat sink 40 includes a plurality of fin elements. Among these fin elements, the fin element closest to the main board 200 is the aforementioned guide fin 41, and the remaining fin elements constitute the fin group 42. In other words, the guide fin 41 is located at the outermost side of the plurality of fin elements, and the arrangement direction of the plurality of fin elements makes the guide fin 41 the fin element closest to the main board 200, and the fin group 42 is located On the guide fin 41. The heat sink 40 may also include a plurality of guide fins 41 juxtaposed on the same plane, and is not limited to a single guide fin 41.

The flow guide fin 41 includes a body 411, a hole 412, and an extension 413. The hole 412 is located on the body 411, the extension 413 extends at the edge of the hole 412, and there is an angle between the extension 413 and the body 411.

As shown in FIG. 1, in this example, the guide fin 41 has a plurality of side-by-side holes 412 and extensions 413, but it is not limited thereto. In one or more other embodiments, the flow guide fin 41 may have only one hole 412 and one extension 413.

In this way, when the heat dissipation device is installed on the motherboard as the heat dissipation system of the chip, the guide fins are used as guides to guide the airflow to the motherboard through the holes and the extensions, so as to achieve the effect of heat dissipation of peripheral components .

In one or more embodiments, the bottom of the frame 32 further has an opening 32a, the extending section 413 extends outward and is on the same side as the opening 32a, and the broken hole 412 and the extending section 413 are provided in the diversion The side of the fin 41 near the opening 32a. Since the bottom of the fan 31 can generate a certain degree of negative pressure, the airflow can be guided from the opening 32 a of the frame 32 of the fan element 30 to the flow guide fin 41. Therefore, the heat dissipation effect of peripheral components is further enhanced.

In one or more embodiments, the heat sink 40 further includes a deflector 45 disposed at the edge of the deflector fin 41. In this way, in addition to the extension portion 413 of the flow guiding fin 41 can be used for flow guiding, the flow guiding plate 45 can also assist the flow guiding and achieve heat dissipation.

In one or more embodiments, the angle between the extension 413 and the body 411 is between 5 degrees and 85 degrees, preferably between 30 degrees and 60 degrees. Please refer to FIG. 4. In this embodiment, the included angle between each extending portion 413 and its corresponding body 411 is approximately equal, but not limited to this. In one or more other embodiments, the angle between the extension 413 closer to the opening 32a and its corresponding body 411 is smaller than the angle between the extension 413 farther from the hole 32a and its corresponding body 411. In this way, the heat dissipation device 100 can provide different flow field forms to guide the air flow for heat dissipation.

Please refer to FIG. 2 again. At least a part of the heat sink 40 directly contacts the wafer 21. The specific method is to provide a heat conducting element for contacting the wafer 21 and to connect the fin group 42 and the guide fin 41. In one or more embodiments, the heat sink 40 further includes a plurality of heat pipes 43 and a base 44 to serve as the aforementioned heat conduction elements. Each heat pipe 43 penetrates the body 411 of the fin group 42 and the guide fin 41, the base 44 is used to contact the wafer 21, and one end of each heat pipe 43 extends from the base 44 and penetrates the fin group 42. Thereby, heat conduction can be achieved through the heat pipe 43, and the heat generated by the wafer 21 can be directly transmitted to the fin group 42 and the flow guide fin 41.

As shown in FIG. 3, in one or more embodiments, the heat dissipation device 100 further includes a first spoiler 50 disposed at the bottom of the frame 32 and facing the extension 413. In this way, the airflow released from the opening 32a can be guided to the guide fins 41 of the heat sink 40 through the first spoiler 50, so that the airflow can be further guided to the motherboard 200 to achieve the peripheral device 22 Forced air cooling. Furthermore, in one or more embodiments, the angle between the first spoiler 50 and the bottom plane of the frame 32 is substantially equal to the angle between the extension 413 and the body 411. That is to say, the angle between the first spoiler 50 and the bottom plane of the frame 32 is between 5 degrees and 85 degrees, preferably between 30 degrees and 60 degrees.

Please refer to FIGS. 5 and 6, which are perspective views (2) and (3) of the guide fins of an exemplary embodiment of the heat dissipation device of the present invention.

As shown in FIGS. 5 and 6, in one or more embodiments, the heat dissipation device 100 further includes a second spoiler 60 disposed on the extension 413. Specifically, the second spoiler 60 can be disposed on the extension 413 through locking (as shown in FIG. 5) or welding (as shown in FIG. 6 ). As shown in FIG. 5, the second spoiler 60 and the extension 413 respectively have a locking hole 60a, 413a, and are locked by a locking member 70 (such as a screw). As shown in FIG. 6 again, a welding portion 71 can be formed between the second spoiler 60 and the extension 413 by welding, and the second spoiler 60 and the extension 413 are connected by the welding portion 71, and then The second spoiler 60 is disposed on the extension 413. In this way, according to different product attributes and different construction methods, appropriate materials (such as stainless steel plates or carbon fiber plates, etc.) can be selected as the second spoiler 60 to further enhance the structural strength of the heat sink 100.

Please refer to FIG. 7, which is another exploded view of an exemplary embodiment of the heat dissipation device of the present invention.

Please refer to FIG. 7 again. In one or more embodiments, the heat sink 40 can be fixed to the fan element 30 by snap-fitting. Specifically, the heat dissipation device 100 includes a fastener 80, the guide fins 41 and the fin groups 42 have buckle grooves 415, 425 on both sides, and the frame 32 of the fan element 30 has a buckle hole 32b. The fastener 80 has a penetrating portion 81 and buckling portions 82 connected to both ends of the penetrating portion, and is generally U-shaped. The threading portion 71 is threaded and accommodated in the buckle slots 415 and 425, and the buckling portion 82 is buckled in the buckle hole 32b. Thereby, the radiator 40 and the fan element 30 can be fixed to each other.

In this way, through the heat dissipation device provided by one or more embodiments of the present invention, when the heat dissipation device is installed on the motherboard as the heat dissipation system of the chip, since the bottom of the fan can generate a certain degree of negative pressure, the airflow can flow from the fan The openings of the frame are guided to the guide fins. Therefore, the flow guide fins are used as flow guides to redirect the airflow to the motherboard to achieve the effect of heat dissipation of peripheral components. In addition, the first spoiler provided at the bottom of the frame can guide the airflow released from the opening to the guide fins, so that the airflow can be further guided to the motherboard to achieve peripheral components Heat dissipation.

100‧‧‧ Heat dissipation device 200‧‧‧Motherboard 21‧‧‧ Chip 22‧‧‧Peripheral component 30‧‧‧Fan component 31‧‧‧‧Fan 32‧‧‧Frame 32a‧‧‧Opening 32b‧‧‧ Hole 40‧‧‧Radiator 41‧‧‧Diversion fin 411‧‧‧Body 412‧‧‧Broken hole 413‧‧‧Extended section 415‧‧‧ Buckle groove 413a‧‧‧Key hole 42‧‧‧ Fin Group 425‧‧‧Groove 43‧‧‧ Heat pipe 44‧‧‧Base 45‧‧‧Baffle plate 50‧‧‧First spoiler 60‧‧‧Second spoiler 60a‧‧‧Key hole 70‧ ‧‧Firmware 71‧‧‧Welding part 80‧‧‧Fastener 81‧‧‧Putting part 82

FIG. 1 is an assembly diagram of an exemplary embodiment of the heat sink of the present invention. 2 is a partially exploded view of an exemplary embodiment of the heat sink of the present invention. 3 is a perspective view of a fan element of an embodiment of the heat sink of the present invention. FIG. 4 is a perspective view (1) of an exemplary flow guide fin of the heat dissipation device of the present invention. FIG. 5 is a perspective view (2) of a flow guide fin of an exemplary embodiment of the heat dissipation device of the present invention. FIG. 6 is a perspective view (3) of an exemplary flow guide fin of the heat dissipation device of the present invention. 7 is another partially exploded view of an exemplary embodiment of the heat sink of the present invention.

100‧‧‧radiating device

200‧‧‧Motherboard

21‧‧‧chip

22‧‧‧Peripheral components

30‧‧‧Fan element

40‧‧‧ radiator

Claims (10)

A heat dissipation device for dissipating heat from a heat source includes: at least one fan element, having a fan and a frame, the fan being fixed to the frame and making the outer edge of the frame surround the fan; and a radiator, provided On one side of the at least one fan element, the heat sink includes a fin set and at least one guide fin, the two are stacked and the guide fin is closer to the heat source than the fin set, the guide The fin includes a body, at least one hole and at least one extension section, the at least one hole is located on the body and penetrates the body, the at least one extension section extends outward from the edge of the at least one hole, and the at least There is an angle between an extension and the body. The heat dissipation device for dissipating heat from a heat source according to claim 1, wherein the bottom of the frame has an opening, and the at least one hole and the at least one extension are provided on the flow guide fin close to the Open the side of the hole. The heat dissipation device for dissipating heat from a heat source according to claim 1, wherein the number of the guide fins is more than two, and the number of the holes and the extensions on each of the guide fins are More than two, the broken holes are arranged side by side in the guide fin, and the extension sections are arranged side by side on the guide fin. The heat dissipation device for dissipating heat from a heat source according to claim 1, wherein the heat sink further includes a deflector plate, which is disposed at the edge of the deflector fin. The heat dissipation device for dissipating heat from a heat source according to claim 1, further comprising a first spoiler, the first spoiler is disposed at the bottom of the frame and faces the at least one extension. The heat dissipation device for dissipating heat from a heat source according to claim 1, wherein the heat sink further includes at least one second spoiler disposed on the at least one extension section. The heat dissipation device for dissipating heat from a heat source according to claim 6, wherein the at least one second spoiler has a first locking hole, and the at least one extension section has a second locking hole, and The heat sink further includes at least one locking member, the at least one locking member is locked into the first locking hole and the second locking hole, and the at least one second spoiler is disposed on the at least one extension section. The heat dissipation device for dissipating heat from a heat source according to claim 6, wherein the heat sink further includes at least one welding portion, which is disposed between the at least one second spoiler and the at least one extension The at least one second spoiler and the at least one extension. The heat dissipation device for dissipating heat from a heat source according to claim 1, wherein the two sides of the flow guide fin have a plurality of first buckle grooves, and the two sides of the fin group have a plurality of second buckle grooves, the The frame of at least one fan element has a plurality of buckle holes, the heat dissipation device further includes a buckle, the buckle includes a piercing portion and two buckling portions connected to the two ends of the piercing portion, the piercing portion is pierced through the The first buckle slots and the second buckle slots, the buckle portions are respectively buckled to the buckle holes. The heat dissipation device for dissipating heat from a heat source according to claim 1, wherein the heat sink further includes a plurality of heat pipes, the heat pipes penetrate the fin set and the flow guide fins.

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