201004548 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤其涉及一種用於 電子元件散熱之散熱裝置。 【先前技術】 電子元件如中央處理器等在運行過程中產生 大量熱量，為確保電子元件之正常運行，其產生之 熱里需及時地散發出去。通常’該電子元件上加裝 一散熱裝置以為其散熱。 習知技術之散熱裝置包括一金屬底板及自該 底板延伸之複數散熱鰭片。該底板貼置於發熱電子 元件而吸收該電子元件產生之熱量，進而將熱量傳 遞至鰭片而散發到周圍空間。然而隨著電子產業之 發展’電子元件之運行頻率和功能日益提升，其發 熱I也隨之增加，為滿足該電子元件之散熱需求， 上述政熱裝置通常加裝一風扇向上述鰭片提供強 對流氣流’從而提高該散熱裝置之散熱能力。然 而，電腦系統中需散熱之電子元件越來越多，而其 體積也越來越小，故上述散熱裝置需進一步改進以 滿足上述電子元件之散熱需求。 【發明内容】 有鑒於此，實有必要提供一種 散熱裝置。 …邙月平乂住之 —種散熱裝置，用於電子元件散熱，其包括— 6 201004548 散熱器，該敎熱器設有複數今 该散熱器氣流通道之—端。通道，-風屬位於 熱器相對兩例之調節件、一冬，還包括一固定於散 道另一端口之導流件以導上述散熱器氣流通 為其他電子元件散熱，該導、4由該散熱器之氣流 並相對於調節件具有多個：件固定於該調節件上 相對散熱器之高度。 同位置以調整導流件 與習知技術相比，上述 流通道之一端，而將流過鳍4件固定至散熱器氣 其他電子元件而為其散熱，纽之部分氣流導W向 流氣流得以充分利用， 上述風扇提供之強對 能趨勢下之散熱需求。 子系統小型化、強功 【實施方式】 凊參閱圖1，本發明 路板（圖未示）上之電子"展置用於對置於一電 散熱裝置包括一散熱器if、件圖未示）散熱。該 扇60固定至該散熱器1〇之風'風扇/〇、一將該風 與風扇固定件連接之二調節^屬固定件（圖未標）、 散熱器10 —側之導流件7〇。 5〇、及一安裝於該 請同時參閱圖2，上述批 11、置於嗲麻柘H v 熱器1()包括一底板 11及散熱韓片組13之三献管二3、連接底板 # ^ …、s 15及連接該底板u 並將該整個散熱器10固定在電路板上之二扣具 17。其中，風扇60固定於散熱鰭片組i 3之一側並 7 201004548 置於底板11上。 該底板11呈矩形板狀，三並排平行之凹槽110 沿底板11之頂部橫向延伸。該底板11底部向下延 伸一凸台（圖未標）以與該電子元件接觸，使得底 板 11之底部兩側設有二切口 ，以對應安裝扣具 17。該散熱鰭片組13包括複數堆疊之散熱鰭片 132。每一散熱鰭片132大致呈矩形且平行於底板 11。每一散熱鰭片1 3 2自兩相對側邊之兩側端各垂 直向下延伸二凸緣1 3 4以間隔相鄰之散熱鰭片1 3 2 相同之距離，並形成複數方向相同之氣流通道。每 一散熱鰭片132設有複數穿孔136，並於每一穿孔 136上圍設一環壁（圖未標）。每一熱管15包括 一吸熱段156及二自吸熱段156兩端垂直同向延伸 之放熱段158，該放熱段158相互平行。該熱管15 之吸熱段156焊接於該底板11之凹槽110中，其 放熱段158穿設散熱鰭片132之穿孔136並與環壁 焊接。每一扣具17包括一縱長之連接桿174及自 連接桿 174相對兩端傾斜向外延伸之二連接臂 178。二扣具17之連接桿174分別與底板11兩側 相連接。四螺釘（圖未標）分別穿過四連接臂178 之外端用以將散熱器1 0固定於電路板上。 請同時參閱圖 3，風扇固定件包括一對支架 30。每一支架30包括一面板32及從該面板32 — 邊緣垂直延伸之定位板3 4。該面板3 2之另一相對 8 201004548 邊緣中部挖去一塊以形成一呈“ c”形之缺口。該 面板3 2之上下端部分別設有一固定孔3 6及於每一 固定孔3 6上圍設一環壁（圖未標），以固定風扇 60。該二支架30分別固定至散熱鰭片組13之二邊 角，其中，二定位板34固定於上述散熱鰭片組13 左右兩側之凸緣134上，該面板32焊接固定於散 熱鰭片組1 3之前側並對應於散熱鰭片組1 3之氣流 通道。該二支架3 0之二面板 3 2相對，其間形成 對應氣流通道之通口 （圖未標），該風扇60藉由 螺釘（圖未標）固定至該二面板3 2上。 每一調節件50分別固定於每一支架30之固定 板34外表面上，用於調節該導流件70之高度。每 一調節件5 0包括一調節板5 2及自調節板5 2兩側 朝支架30之固定板34垂直延伸之支撐壁56。該 等支撐壁56固定在支架30之固定板34上並將調 節板5 2與固定板3 4隔開一定距離。每一調節板 52上之遠離風扇60之一側設有一豎槽521，靠近 風扇 60之一側自上而下間隔設置複數定位孔 5 23，中間設有複數橫槽522以分別連通每一定位 孔5 23與豎槽521。其中豎槽521與橫槽522之寬 度相同，而定位孔523之寬度大於橫槽522之寬度。 上述導流件70包括一導流板73及從該導流板 73之前邊緣兩端延伸之一對固定臂71。該導流板 73相對於上述風扇60而固定於上述散熱鰭片組13 9 201004548 之另外一側。该導流板73包括一嵌入部73 i及一 主體部732。該嵌入部731用於嵌入散熱鰭片132 之間起固定作用，其中該嵌入部731上相對兩側各 設有一切口 735以對應收容散熱鰭片132之凸緣 134。該嵌入部731與二固定臂71均平行於散熱鰭 片132’該主體部732相對於該固定臂71呈向下 傾斜設置。每-固定…前端部二 一連接柱716’該連接柱716之直徑小於調節件5〇 之豎槽521及橫槽522之寬度，因此該連接柱716 可以穿設在調節件50上並沿豎槽521及橫槽522 滑動。一彈簧78套設在連接柱716上並夾設於固 定臂71與調節件50之調節板52之間。該彈簧78 之直徑大於調節板52之定位孔523之寬度。該導 流件70還包括二卡掣件79，每一卡掣件79安裝 在調節件50及風扇固定件3〇之間並與每一連接柱 716連接。每一卡掣件79包括一凸體79〇及自凸 體790 —侧面垂直延伸之筒狀體796，該筒狀體 設有中心孔（圖未標）。該凸體79〇之直徑大於調 節板52之定位孔523之寬度。該筒狀體796之外 徑小於定位孔523之寬度且大於豎槽521及橫槽 522之i度，使仔清狀體796可以伸入定位孔523 中但不旎進入豎槽521及橫槽522。該筒狀體796 之内徑稍大於連接柱716之外徑，使得連接柱716 之外端可以穿過彈簧78及調節板52後收容於筒狀 201004548 體796中並與筒狀體796固定連接，連接方式可以 係焊接、過盈配合以及螺合等。 請參閱圖4和圖5，上述導流件70之二固定 臂71固定至上述散熱鰭片組13之相對兩侧之調節 件50上，其中已經與固定臂71連接之卡掣件79 之筒狀體796藉由彈箐78之作用伸入至調節板52 之定位孔523中。由於筒狀體796外徑大於橫槽 522之寬度從而不能滑入橫槽522中，因此導流件 70之二固定臂71固定於調節板52預設定之位置 上。該導流板73之定位片731嵌卡於該鰭片組130 之之間，從而該導流板73之嵌入散熱鰭片132之 間，而主體部7 3 2對應該鰭片組13之氣流通道而 斜向下固定於該鰭片組13 —側。 使用時，上述散熱器10之底板11貼合發熱電 子元件而吸收該電子元件產生之熱，該底板11上 之部分熱量直接傳遞至散熱鰭片組13，部分熱量 由熱管15傳遞至散熱鰭片組13。風扇60對應該 散熱鰭片組13之氣流通道向該鰭片組1 3提供強對 流氣流，藉由氣流通道後之部分氣流直接散發至周 圍空間，而對應上述導流件70導流板73之部分氣 流在導流板73之主體部732導引下吹向周圍之其 他電子元件而為其散熱。 請一併參閱圖6和圖7，當周圍之其他電子元 件之分佈發生改變需要改變系統之氣流流場時，分 11 201004548 別將散熱鰭片組1 3兩側之固定臂7 1向散熱鰭片組 13按壓，使得卡掣件79之筒狀體796退出調節板 52之定位孔523，而彈簀78受壓，連接柱716進 入定位孔523。推動導流件70使連接柱716沿著 橫槽522及豎槽521滑動，同時導流板73之定位 片731從二散熱鰭片132之間退出。當導流件70 達到所需高度之位置時，拉動導流件70使連接柱 716延橫槽522進入新調整之定位孔523 ;然後撤 去對固定臂71之按壓力，藉由彈簧18之伸張將固 定臂71遠離調節板52，使得連接柱716退出定位 孔 523，而卡掣件 79之筒狀體 796進入定位孔 5 23，從而使得調節件70固定在新之位置上，將藉 由鰭片組13之部分氣流導引向其他電子元件而為 其散熱。 與習知技術相比，上述導流板73將藉由散熱 鰭片組13之部分氣流導引向其他電子元件而為其 散熱，使上述風扇60提供之強對流氣流得以充分 利用，滿足電子系統小型化、強功能趨勢下之散熱 需求。進一步地，藉由導流件70之連接柱716與 筒狀體796之不同直徑，使得導流件70可以相對 調節件50滑動、定位，實現對導流件70高度之調 整，有效地改變氣流之流場，以適應不同之散熱環 境。 綜上所述，本發明符合發明專利要件，爰依法 12 201004548 提出專利申請。惟，以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，在麦依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體、％裝圖。 圖2係本發明散熱裝置之分解圖。 圖3係圖2之風扇固定件、調節件芬道4从 丨干及導流件之 裝配分解圖。 圖4係圖1散熱裝置之侧視圖。201004548 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat of an electronic component. [Prior Art] Electronic components such as a central processing unit generate a large amount of heat during operation, and in order to ensure the normal operation of the electronic components, the heat generated therein needs to be released in time. Usually, a heat sink is attached to the electronic component to dissipate heat therefrom. The heat sink of the prior art includes a metal backplane and a plurality of heat sink fins extending from the bottom plate. The bottom plate is placed on the heat-generating electronic component to absorb the heat generated by the electronic component, thereby transferring heat to the fins and radiating to the surrounding space. However, with the development of the electronics industry, the operating frequency and function of electronic components are increasing, and the heat generation I is also increasing. In order to meet the heat dissipation requirements of the electronic components, the above-mentioned political heating device usually adds a fan to provide strong force to the fins. The convection airflow 'increased the heat dissipation capability of the heat sink. However, there are more and more electronic components in the computer system that need to dissipate heat, and the volume thereof is getting smaller and smaller, so the above heat sink needs to be further improved to meet the heat dissipation requirements of the above electronic components. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink. ... 邙 乂 — — — — — — — — — — — — — — — — — — — — — — — — — — — 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热The passage, the wind is located in the two parts of the heat exchanger, one winter, and includes a flow guide fixed to the other port of the diffuser to guide the radiator airflow to dissipate heat for other electronic components. The airflow of the heat sink has a plurality of airflows relative to the adjusting member: the height of the component is fixed to the adjusting component relative to the heat sink. In the same position, the flow guiding member is fixed at one end of the flow channel, and the flow through the fin 4 is fixed to the heat sink gas and other electronic components to dissipate heat therefrom, and part of the air flow is guided to the flow airflow. Make full use of the above-mentioned fans to provide a strong demand for heat dissipation under the trend. Miniaturization and strong work of the subsystem [Embodiment] Referring to Figure 1, the electronic "display on the road board (not shown) of the present invention is used for placing an electric heat sink including a heat sink if, Show) heat dissipation. The fan 60 is fixed to the windshield of the radiator 1 fan/〇, a second adjusting member (not shown) connecting the wind and the fan fixing member, and a deflecting member 7 on the side of the radiator 10. . 5〇, and one installed at the same time please refer to Figure 2, the above batch 11, placed in the ramie H v heater 1 () includes a bottom plate 11 and a cooling Korean group 13 three of the three 2, the connection floor # ^ ..., s 15 and two fasteners 17 that connect the bottom plate u and fix the entire heat sink 10 to the circuit board. The fan 60 is fixed to one side of the heat dissipation fin group i 3 and 7 201004548 is placed on the bottom plate 11 . The bottom plate 11 has a rectangular plate shape, and the three parallel rows of grooves 110 extend laterally along the top of the bottom plate 11. The bottom of the bottom plate 11 extends downwardly from a boss (not shown) to be in contact with the electronic component, so that two sides of the bottom of the bottom plate 11 are provided with two slits to correspondingly mount the fastener 17. The heat dissipation fin group 13 includes a plurality of stacked heat dissipation fins 132. Each of the heat dissipation fins 132 is substantially rectangular and parallel to the bottom plate 11. Each of the heat dissipating fins 133 extends vertically downward from the opposite ends of the two opposite sides of the two flanges 134 to the same distance from the adjacent fins 1 3 2 and forms a plurality of airflows of the same direction. aisle. Each of the heat dissipation fins 132 is provided with a plurality of through holes 136, and a ring wall (not labeled) is disposed on each of the through holes 136. Each of the heat pipes 15 includes a heat absorbing section 156 and two heat releasing sections 158 extending perpendicularly from opposite ends of the heat absorbing section 156. The heat radiating sections 158 are parallel to each other. The heat absorbing section 156 of the heat pipe 15 is welded to the groove 110 of the bottom plate 11, and the heat releasing section 158 passes through the through hole 136 of the heat radiating fin 132 and is welded to the ring wall. Each of the fasteners 17 includes a longitudinal connecting rod 174 and two connecting arms 178 extending obliquely outward from opposite ends of the connecting rod 174. The connecting rods 174 of the two clips 17 are respectively connected to both sides of the bottom plate 11. Four screws (not shown) pass through the outer ends of the four connecting arms 178 to fix the heat sink 10 to the circuit board. Referring also to Figure 3, the fan mount includes a pair of brackets 30. Each bracket 30 includes a panel 32 and a locating plate 34 extending perpendicularly from the edge of the panel 32. The other side of the panel 3 2 is offset by a piece in the middle of the edge of the 201004548 to form a "c" shaped notch. The lower end of the panel 3 2 is respectively provided with a fixing hole 36 and a ring wall (not labeled) is disposed on each of the fixing holes 36 to fix the fan 60. The two brackets 30 are respectively fixed to the two corners of the heat dissipation fin group 13 , wherein the two positioning plates 34 are fixed on the flanges 134 of the left and right sides of the heat dissipation fin group 13 , and the panel 32 is soldered and fixed to the heat dissipation fin group. The front side of 1 3 corresponds to the air flow passage of the heat dissipation fin group 13. The two brackets 30 of the two brackets 32 are opposite each other, and a through port (not shown) corresponding to the air flow passage is formed therebetween, and the fan 60 is fixed to the second panel 32 by screws (not shown). Each adjusting member 50 is respectively fixed to the outer surface of the fixing plate 34 of each bracket 30 for adjusting the height of the guiding member 70. Each of the adjusting members 50 includes an adjusting plate 52 and a supporting wall 56 extending from the adjusting plate 5 on both sides of the adjusting plate 5 to the fixing plate 34 of the bracket 30. The support walls 56 are fixed to the fixing plate 34 of the bracket 30 and spaced apart from the fixing plate 34 by a certain distance. A vertical slot 521 is defined on one side of the adjusting plate 52 away from the fan 60, and a plurality of positioning holes 523 are disposed at a distance from one side of the fan 60, and a plurality of horizontal slots 522 are defined in the middle to respectively connect each positioning. Hole 5 23 and vertical groove 521. The width of the vertical groove 521 and the horizontal groove 522 are the same, and the width of the positioning hole 523 is larger than the width of the horizontal groove 522. The flow guiding member 70 includes a deflector 73 and a pair of fixed arms 71 extending from both ends of the front edge of the deflector 73. The deflector 73 is fixed to the other side of the heat radiating fin group 13 9 201004548 with respect to the fan 60. The deflector 73 includes an embedded portion 73 i and a body portion 732. The embedding portion 731 is configured to be embedded between the heat dissipating fins 132. The embedding portion 731 is provided with a plurality of ports 735 on opposite sides of the embedding portion 731 to correspond to the flanges 134 of the heat dissipating fins 132. The embedded portion 731 and the two fixed arms 71 are both parallel to the heat dissipation fins 132'. The body portion 732 is disposed to be inclined downward with respect to the fixed arm 71. Each of the front end portions of the connecting post 716' has a smaller diameter than the vertical slot 521 and the lateral slot 522 of the adjusting member 5, so that the connecting post 716 can be passed through the adjusting member 50 and vertically The groove 521 and the lateral groove 522 slide. A spring 78 is sleeved on the connecting post 716 and is interposed between the fixing arm 71 and the adjusting plate 52 of the adjusting member 50. The diameter of the spring 78 is greater than the width of the positioning hole 523 of the adjustment plate 52. The flow guide 70 further includes two latching members 79, each of which is mounted between the adjusting member 50 and the fan fixing member 3A and connected to each of the connecting posts 716. Each of the latch members 79 includes a convex body 79 and a cylindrical body 796 extending perpendicularly from the convex body 790. The cylindrical body is provided with a central hole (not shown). The diameter of the convex body 79 is larger than the width of the positioning hole 523 of the regulating plate 52. The outer diameter of the cylindrical body 796 is smaller than the width of the positioning hole 523 and greater than the i-degree of the vertical groove 521 and the horizontal groove 522, so that the abundance 796 can protrude into the positioning hole 523 but does not enter the vertical groove 521 and the transverse groove. 522. The inner diameter of the cylindrical body 796 is slightly larger than the outer diameter of the connecting post 716, so that the outer end of the connecting post 716 can pass through the spring 78 and the adjusting plate 52 and be received in the cylindrical 201004548 body 796 and fixedly connected with the cylindrical body 796. The connection method can be welding, interference fit, and screwing. Referring to FIG. 4 and FIG. 5, the two fixing arms 71 of the above-mentioned flow guiding member 70 are fixed to the adjusting members 50 on opposite sides of the above-mentioned heat dissipating fin group 13, and the cartridges 79 of the clamping member 79 that have been connected to the fixing arms 71 are attached. The body 796 projects into the positioning hole 523 of the adjustment plate 52 by the action of the magazine 78. Since the outer diameter of the cylindrical body 796 is larger than the width of the lateral groove 522 so as not to slide into the lateral groove 522, the two fixed arms 71 of the flow guiding member 70 are fixed to the predetermined position of the regulating plate 52. The positioning piece 731 of the baffle 73 is embedded between the fin sets 130 such that the baffle 73 is embedded between the heat dissipating fins 132, and the main body portion 723 corresponds to the airflow of the fin set 13. The channel is fixed obliquely downward to the side of the fin group 13 . In use, the bottom plate 11 of the heat sink 10 is attached to the heat-generating electronic component to absorb the heat generated by the electronic component, and part of the heat on the bottom plate 11 is directly transmitted to the heat-dissipating fin group 13, and part of the heat is transferred from the heat pipe 15 to the heat-dissipating fin Group 13. The airflow channel of the fan 60 corresponding to the heat dissipation fin group 13 provides a strong convective airflow to the fin group 13. The airflow after the airflow channel is directly transmitted to the surrounding space, and corresponds to the deflector 73 of the flow guiding member 70. A portion of the airflow is directed toward the surrounding electronic components by the body portion 732 of the baffle 73 to dissipate heat therefrom. Please refer to Figure 6 and Figure 7. When the distribution of other electronic components around it needs to change the flow field of the system, point 11 201004548 Do not fix the fixed arms 7 1 on both sides of the fin assembly 1 to the heat sink fins. The sheet set 13 is pressed such that the cylindrical body 796 of the latching member 79 is withdrawn from the positioning hole 523 of the adjusting plate 52, and the magazine 78 is pressed, and the connecting post 716 enters the positioning hole 523. The flow guiding member 70 is pushed to slide the connecting post 716 along the lateral groove 522 and the vertical groove 521, and the positioning piece 731 of the deflector 73 is withdrawn from between the two heat radiating fins 132. When the flow guiding member 70 reaches the desired height position, the flow guiding member 70 is pulled to extend the connecting post 716 into the newly adjusted positioning hole 523; then the pressing force on the fixed arm 71 is removed, and the spring 18 is extended. The fixing arm 71 is moved away from the adjusting plate 52, so that the connecting post 716 is withdrawn from the positioning hole 523, and the cylindrical body 796 of the latching member 79 enters the positioning hole 523, so that the adjusting member 70 is fixed at a new position, which will be finned. Part of the airflow of the slice 13 directs heat to other electronic components. Compared with the prior art, the baffle 73 guides a portion of the airflow of the heat dissipation fin group 13 to other electronic components for heat dissipation, so that the strong convection airflow provided by the fan 60 can be fully utilized to satisfy the electronic system. The need for heat dissipation under the trend of miniaturization and strong functions. Further, by the different diameters of the connecting post 716 of the deflector 70 and the cylindrical body 796, the deflector 70 can be slid and positioned relative to the adjusting member 50, thereby adjusting the height of the deflector 70, effectively changing the airflow. The flow field to adapt to different heat dissipation environments. In summary, the present invention complies with the requirements of the invention patent, and filed a patent application according to law 12 201004548. However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and those skilled in the art will be able to devise equivalent modifications or variations in the spirit of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a heat dissipation device of the present invention. Figure 2 is an exploded view of the heat sink of the present invention. Fig. 3 is an exploded view showing the assembly of the fan fixing member and the adjusting member 4 from the drying and guiding members. Figure 4 is a side view of the heat sink of Figure 1.
圖5係圖4散熱裝置之局部俯視圖，其中導济 件置於調節件之定位孔中。 L 圖6係圖4散熱裝置之局部俯视圖，其中導流 件置於調節件之豎槽中。 ^ 圖7係圖1散熱裝置之側視圖，龙士, 务中導流件位 於調節後之位置。 【主要元件符號說明】 10 110 132 136 15 6 17 11 13 134 15 158 散熱鰭片奴 凸緣 熱管 放熱段 連接桿 散熱器 凹槽 散熱鰭片 穿孔 吸熱段 扣具 13 174 201004548 連接臂 178 面板 32 固定子L 36 調節板 52 橫槽 522 支撐壁 56 導流件 70 連接柱 716 嵌入部 731 切口 735 卡掣件 79 筒狀體 796 支架 30 定位板 34 調節件 50 豎槽 521 定位孔 523 風扇 60 固定臂 71 導流板 73 主體部 732 彈簧 78 凸體 790 14Fig. 5 is a partial plan view of the heat sink of Fig. 4, wherein the guide member is placed in the positioning hole of the adjusting member. Figure 6 is a partial plan view of the heat sink of Figure 4 with the flow guides placed in the vertical slots of the adjustment member. ^ Figure 7 is a side view of the heat sink of Figure 1. The dragon deflector is in the adjusted position. [Main component symbol description] 10 110 132 136 15 6 17 11 13 134 15 158 Heat sink fins Flange heat pipe heat release section Connecting rod Radiator groove Heat sink fin perforated heat sink clip 13 174 201004548 Connecting arm 178 Panel 32 fixing Sub L 36 Adjustment plate 52 Transverse groove 522 Support wall 56 Flow guide 70 Connection post 716 Embedding portion 731 Notch 735 Clamping member 79 Cylindrical body 796 Bracket 30 Positioning plate 34 Adjustment member 50 Vertical groove 521 Positioning hole 523 Fan 60 Fixed arm 71 deflector 73 body portion 732 spring 78 convex body 790 14