CN101466240B - Radiating device - Google Patents
Radiating device Download PDFInfo
- Publication number
- CN101466240B CN101466240B CN2007102031926A CN200710203192A CN101466240B CN 101466240 B CN101466240 B CN 101466240B CN 2007102031926 A CN2007102031926 A CN 2007102031926A CN 200710203192 A CN200710203192 A CN 200710203192A CN 101466240 B CN101466240 B CN 101466240B
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- China
- Prior art keywords
- heat
- wind scooper
- radiating fin
- heat abstractor
- fixed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The present invention relates to a heat radiator used for heat dissipation of electronic components, comprising a heat-conducting plate which is adhibited with the electronic components, a plurality of radiating fins, and a heat pipe used for connecting the heat-conducting plate and the radiating fins, wherein, a plurality of air channels are formed among the radiating fins. The heat radiator further comprises a wind scooper. The wind scooper comprises a top plate and two baffles, wherein, the two baffles are connected with the top plate; the top plate is fixed at the top part of the radiating fins; the baffles surround the two ends of the radiating fins; two fans are fixed on the wind scooper and arranged at the two sides of the radiating fins and at the inlet and the outlet of the air channels. A mounting part is extended out from on both sides of each baffle of the wind scooper. And the fans are fixed on the mounting parts. By adopting the structure that the wind scooper surrounds the radiating fins and the two fans, the convection intensity of the air in the gas channel of the radiating fins is enhanced and the heat dissipation efficiency of the heat radiator is improved.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is used to electronic component to dispel the heat.
Background technology
When moving, can produce a large amount of heats such as computer cpu, north bridge chips, the contour power electronic element of video card,, will directly cause temperature sharply to rise, and badly influence the normal operation of electronic component if these heats can not be left effectively.For this reason, need heat abstractor to come these electronic components are dispelled the heat.
Traditional heat abstractor generally includes a base, a groups of fins, a heat pipe and connects base and this groups of fins, reaches a fan that is fixed in groups of fins one side.The heat that electronic component produces at first is passed to base, is absorbed by this heat pipe bottom then; To its end, the heat of heat pipe end dispels the heat to surrounding air via groups of fins the phase change of this heat pipe by working fluid in it again with heat transferred.Fan can improve the rate of heat exchange of fin, thereby improves radiating efficiency.
In the above-mentioned heat abstractor, the air-flow that fan blows flows along the interval between the fin, promptly leaves this groups of fins in the extremely short time, and the cold air utilance is lower, thereby makes radiating efficiency lower; And above-mentioned heat abstractor can only set up in fin one side and put this fan because the fixing of fan needs complicated structure to set up, cause groups of fins opposite side air current flow a little less than, cause entire heat dissipation device radiation efficient to reduce.
Summary of the invention
In view of this, be necessary to provide a kind of wind scooper and the wind-guiding ability is strong, radiating efficiency is high heat abstractor of having.
A kind of heat abstractor, be used for an electronic element radiating, comprise a heat-conducting plate that is sticked with described electronic component, the heat pipe of some radiating fins and connection heat-conducting plate and radiating fin, form some air ducts between the described radiating fin, described heat abstractor further comprises a wind scooper, described wind scooper comprises that a top board and two connects the baffle plate of top board, described top board is fixed on the radiating fin top, described baffle plate surrounds the two ends of radiating fin, two fans are fixed on the wind scooper and place described radiating fin both sides and be positioned at the import and export of described air duct, each baffle plate dual-side of described wind scooper is extended with installation portion, and described two fans are fixed on these installation portions.
In the above-mentioned heat abstractor, be used in wind scooper and enclose radiating fin and double fans structure, strengthened the convection intensity of air in the air duct of radiating fin widely, improved the radiating efficiency of heat abstractor.
The invention will be further described below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 is the constitutional diagram of heat abstractor of the present invention.
Fig. 2 is the part exploded view of Fig. 1.
Fig. 3 is the exploded view of the radiator combination of heat abstractor among Fig. 2.
Fig. 4 is the wind scooper of heat abstractor among Fig. 2 and the exploded view of fan.
Embodiment
Please see figures.1.and.2 simultaneously, be the heat abstractor of first embodiment of the invention, this heat abstractor is installed on a circuit board (figure does not show) and goes up the heat that produces in order to the electronic component (figure does not show) that distributes on the circuit board.This heat abstractor comprises radiator combination 10, is assembled in two fans 30 that this radiator makes up the wind scooper 20 on 10 and is installed on these wind scooper 20 relative both sides.
See also Fig. 3, this radiator combination 10 comprises a heat-conducting plate 12, a radiating fin group 14, in order to connect heat-conducting plate 12 and three heat pipes 16 of the parallel arranged of radiating fin group 14 and the fixed head 18 that is fixed in radiating fin group 14 tops, wherein:
The roughly rectangular plate body of this heat-conducting plate 12, its bottom is provided with the three parallel grooves of being separated by 124.Two installing racks 13 are fixed in the opposite end of the bottom of heat-conducting plate 12 by screw 133, and each installing rack 13 opposite end has protruded out lug 132.Heat-conducting plate 12 is connected with circuit board by four securing members (figure does not show) that pass lug 132, and keeps closely contacting with electronic component.
Each heat pipe 16 takes the shape of the letter U endothermic section 160 that comprises a level and the two parallel heat units 162 that extend straight up at 160 two ends from the endothermic section is set.This endothermic section 160 is contained in the groove 124 of heat-conducting plate 12, and the bottom surface coplane of its bottom surface and heat-conducting plate 12 forms smooth bottom surface to be attached on the electronic component end face with the bottom with heat-conducting plate 12, absorbs the heat from electronic component.This two heat unit 162 runs through radiating fin group 14, and this radiating fin group 14 is placed on the heat unit 162 of heat pipe 16.
This radiating fin group 14 by some radiating fins that are parallel to each other 140 from top to bottom stacked arrangement form, each radiating fin 140 is little wavy, whole and heat-conducting plate 12 almost parallels.Both sides are provided with three side by side through holes 142, the heat unit 162 of these through holes 142 in order to accommodate heat pipe 16 respectively on each radiating fin 140.It is long-pending with heat unit 162 contact surfaces to increase radiating fin 140 that each radiating fin 140 is provided with ring wall 146 from these through hole 142 edges extensions, and make the certain at interval distance of adjacent radiating fin 140 with formation air duct (figure is mark).Each radiating fin 140 middle part is provided with the four-way hole 144 of distributed rectangular, and these through holes 144 are located between the through hole 142.The through hole 144 of the radiating fin 140 of multilayer can be formed screwed hole, screws togather for screw 19.
Fixed head 18 rectangular tabular settings, its four corner is respectively equipped with a through hole 180, and the through hole 144 of these through hole 180 corresponding radiating fins 140 wears for screw 19 fixed head 18 is fixed on radiating fin group 14 tops.These fixed head 18 middle parts are provided with two screws 185, with fixing wind scooper 20.
See also Fig. 4, wind scooper 20 is inverted U, comprises that a top board 22 reaches from vertically extending two baffle plates 24 in these top board 22 two ends.The width of this top board 22 and baffle plate 24 equates with the width of radiating fin group 14.These top board 22 middle parts are provided with two through holes 220, and this two through hole 220 is corresponding to the screw 185 of said fixing plate 18.Described each baffle plate 24 relative both sides respectively form an installation portion 26 that is used to install fan 30, and each installation portion 26 is provided with a pair of installing hole 260 that is used for fixing fan 30.
The setting that roughly is square of the profile of each fan 30, it comprises front and back two flat boards 32,34 that have opening, wherein the flat board 32 of a fan 30 is installed and is closely attached on two installation portions 26 of wind scooper 20 homonymies, and the flat board 34 of another fan 30 is installed on two installation portions 26 of wind scooper 20 opposite sides.
When heat abstractor is assembled, at first radiating fin group 14 wears on the heat unit 162 that is welded on heat pipe 16, adjacent radiating fin 140 forms air duct, and heat-conducting plate 12 makes the endothermic section 160 of heat pipe 16 be contained in the groove 124 of heat-conducting plate 12 with endothermic section 160 welding of heat pipe 16; Described installing rack 13, radiating fin group 14 top mounting plates 18 are fixed in two ends, heat-conducting plate 12 bottom.Radiator combination 10 is fixed on the circuit board by described securing member and closely contacts with electronic component then.Following the fan 30 that with wind scooper 20, has been installed on wind scooper 20 both sides is installed in the radiator combination 10 in the lump from top to bottom, make the baffle plate 24 of wind scooper 20 surround the two ends of radiating fin group 14, the import and export that two fans 30 place the both sides of radiating fin group 14 respectively and place air duct.The through hole 220 that passes the top board 22 of wind scooper 20 with second-hand stubborn screw 50 is screwed on the fixed head 18 at last, the installation of entire heat dissipation device.
During electronic component work, the heat of its generation is passed on the radiating fin group 14 by heat-conducting plate 12, heat pipe 16, the part heat is distributed in the air of air duct by radiating fin group 14 again; Because turning to of two fans 30 is identical, the fan 30 of radiating fin group 14 1 sides is blown into the fan 30 of the hot-air sucking-off in radiating fin group 14 air ducts, opposite side in the air duct of radiating fin group 14 with cold air, increases the convective exchange of hot cold air.Because two baffle plates 24 of wind scooper 20 surround radiating fin group 14 both sides, the cold air that fan is sent into can not overflow to both sides in the air duct of radiating fin group 14, has improved the utilance of cold air; And double fan 30 uses simultaneously, has strengthened the convection intensity of air widely, has improved radiating efficiency; At last,, only need manually back out screw 50 in the time of dismounting and promptly wind scooper 20 can be extracted out with fan 30, need not to dismantle fan 30 because fan 30 can be installed on the wind scooper 20 in advance, convenient and swift.
Claims (9)
1. heat abstractor, be used for an electronic element radiating, comprise a heat-conducting plate that is sticked with described electronic component, the heat pipe of some radiating fins and connection heat-conducting plate and radiating fin, form some air ducts between the described radiating fin, it is characterized in that: described heat abstractor further comprises a wind scooper, described wind scooper comprises that a top board and two connects the baffle plate of top board, described top board is fixed on the radiating fin top, described baffle plate surrounds the two ends of radiating fin, two fans are fixed on the wind scooper and place described radiating fin both sides and be positioned at the import and export of described air duct, each baffle plate dual-side of described wind scooper is extended with installation portion, and described two fans are fixed on these installation portions.
2. heat abstractor as claimed in claim 1 is characterized in that: a fixed head is fixed at described radiating fin top, and the top board of described wind scooper is fixed on this fixed head.
3. heat abstractor as claimed in claim 2 is characterized in that: described each radiating fin middle part is provided with through hole, and the through hole of these radiating fins forms screwed hole and screws togather with fixing described fixed head for screw.
4. heat abstractor as claimed in claim 3 is characterized in that: the top board of described wind scooper is provided with two through holes, and second-hand stubborn screw passes this top board and fixed head screws togather.
5. heat abstractor as claimed in claim 1 is characterized in that: described wind scooper takes the shape of the letter U.
6. heat abstractor as claimed in claim 1 is characterized in that: described fan turns to identical.
7. heat abstractor as claimed in claim 1 is characterized in that: described heat pipe comprises that an endothermic section and two connects the heat release section of endothermic section, and described heat-conducting plate bottom is provided with groove to accommodate the endothermic section of heat pipe.
8. heat abstractor as claimed in claim 7 is characterized in that: the bottom surface of the endothermic section of described heat pipe and heat-conducting plate bottom surface coplane.
9. heat abstractor as claimed in claim 8 is characterized in that: the setting that takes the shape of the letter U of described heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007102031926A CN101466240B (en) | 2007-12-18 | 2007-12-18 | Radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007102031926A CN101466240B (en) | 2007-12-18 | 2007-12-18 | Radiating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101466240A CN101466240A (en) | 2009-06-24 |
| CN101466240B true CN101466240B (en) | 2011-11-09 |
Family
ID=40806521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007102031926A Expired - Fee Related CN101466240B (en) | 2007-12-18 | 2007-12-18 | Radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101466240B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339106A (en) * | 2010-07-20 | 2012-02-01 | 鸿富锦精密工业（深圳）有限公司 | Fan fixing device |
| CN104760763B (en) * | 2015-03-20 | 2017-09-26 | 孙建群 | A kind of refrigerating box |
| CN106159743A (en) * | 2016-07-15 | 2016-11-23 | 国网山东省电力公司济南市历城区供电公司 | A kind of transformer station cooling system |
| CN106558562A (en) * | 2016-11-21 | 2017-04-05 | 武汉精立电子技术有限公司 | A kind of high power load metal-oxide-semiconductor heat abstractor |
| CN107577305A (en) * | 2017-06-14 | 2018-01-12 | 威海职业学院 | A kind of computer housing ventilation heat abstractor |
| CN109768400A (en) * | 2017-11-09 | 2019-05-17 | 富士康(昆山)电脑接插件有限公司 | Electric coupler component |
| CN109360816A (en) * | 2018-12-06 | 2019-02-19 | 深圳市超频三科技股份有限公司 | A kind of radiator |
| CN109407806B (en) * | 2018-12-06 | 2024-03-29 | 深圳市超频三科技股份有限公司 | Radiator |
| CN116360554A (en) * | 2021-12-28 | 2023-06-30 | 全亿大科技（佛山）有限公司 | Radiator and radiator manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2507141Y (en) * | 2001-10-12 | 2002-08-21 | 宝陆科技有限公司 | Heat radiator |
| CN2603516Y (en) * | 2003-01-24 | 2004-02-11 | 北方工业大学 | Heat-tube heat-sink for CPU of desk computer |
| CN1917194A (en) * | 2005-08-18 | 2007-02-21 | 富准精密工业(深圳)有限公司 | Heat sink |
-
2007
- 2007-12-18 CN CN2007102031926A patent/CN101466240B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2507141Y (en) * | 2001-10-12 | 2002-08-21 | 宝陆科技有限公司 | Heat radiator |
| CN2603516Y (en) * | 2003-01-24 | 2004-02-11 | 北方工业大学 | Heat-tube heat-sink for CPU of desk computer |
| CN1917194A (en) * | 2005-08-18 | 2007-02-21 | 富准精密工业(深圳)有限公司 | Heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101466240A (en) | 2009-06-24 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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Granted publication date: 20111109 Termination date: 20131218 |