CN101677503B - Heat radiating device - Google Patents
Heat radiating device Download PDFInfo
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- CN101677503B CN101677503B CN2008102119999A CN200810211999A CN101677503B CN 101677503 B CN101677503 B CN 101677503B CN 2008102119999 A CN2008102119999 A CN 2008102119999A CN 200810211999 A CN200810211999 A CN 200810211999A CN 101677503 B CN101677503 B CN 101677503B
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- radiator
- heat
- kuppe
- heat abstractor
- baffler
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Abstract
The invention relates to a heat radiating device, in particular to a heat radiating device comprising a heat radiator, a heat radiating fan and a first air guide sleeve, wherein the heat radiator comprises a base and a plurality of heat radiating fins which are joined together and arranged on the base; an air flow passage is defined between every two adjacent heat radiating fins; the heat radiating fan is arranged on the rear side of the heat radiator and used for providing heat radiating air flows for the heat radiator, so that the air flows can flow through the air flow passages from the rear side of the heat radiator and are blown out from the front side of the heat radiator; the first air guide sleeve is arranged on the left or right side of the heat radiator, positioned in front of the heat radiating fan and used for guiding out part of the heat radiating air flows provided by the heat radiating fan through one side of the heat radiator; and thus, the direction of part of the heat radiating air flows can be changed so as to radiate heat of the heating electronic elements, storages or the like on the periphery of the central processing unit.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly relate to a kind of flow-guiding structure that changes the heat abstractor of the radiating airflow flow direction.
Background technology
Like Fig. 1 and shown in Figure 2, known heat abstractor 1 comprises a radiator 11, a fixed frame 12, a radiator fan 13 and a kuppe 14.The pedestal 111 of radiator 11 is locked on the motherboard 21 through locked mechanism 112 and is connected to central processing unit 22 end faces; So that central processing unit 22 is dispelled the heat; Radiator 11 comprises the many heat pipes 113 that are assembled on the pedestal 111; And multi-disc is mutually superimposed and be arranged at the radiating fin 114 on the heat pipe 113, and heat pipe 113 is in order to conducting to the heat on the pedestal 111 at radiating fin 114 places, and dispels the heat by radiating fin 114.Radiator fan 13 is arranged in the fixed frame 12 and is assembled in the pedestal 111 of radiator 11 through fixed frame 12, in order to provide radiator 11 radiating airflows.
When radiator fan 13 running, air-flow can get into via the air intake 115 of radiator 11 rear sides in the airflow path 116 that radiating fins 114 defined, and discharges via the outlet air end 117 of radiator 11 front sides, uses cooling heat pipe 113 and radiating fin 114.In addition, by being arranged on fixed frame 12 front sides and being positioned at kuppe 14 design of radiating fin 114 belows, the radiating airflow that can guide radiator fan 13 flows downward, and the heating electronic building brick of using being located at central processing unit 22 front sides 23 dispels the heat.Yet; The kuppe 14 of this kind heat abstractor 1 can only dispel the heat to the heating electronic building brick 23 of central processing unit 22 front sides; And heat abstractor 1 is no extraly to design other the air outlet and the structure of air-out angle again, so the high heat problem that is produced during heating electronic building brick (figure does not show) work that can't solve heat abstractor 1 and arranged on left and right sides.
As shown in Figure 3; Radiator 31 end faces of another known heat abstractor 3 are provided with a radiator fan 32; The pedestal 311 of radiator 31 is provided with the spaced in the form of a ring radiating fin 312 of multi-disc, and by this, the direction that the heat transmission gas that 32 pairs of radiators 31 of radiator fan are provided fails to be convened for lack of a quorum shown in arrow flows; And discharge via the outside of radiating fin 312; Yet this kind heat abstractor 3 can't collect in specific direction or special angle with the radiating airflow of discharging, so can't be effectively other heating electronic building brick be dispelled the heat.
Summary of the invention
Main purpose of the present invention is to provide a kind of heat abstractor that can be simultaneously the heating electronic building brick of central processing unit and periphery thereof be dispelled the heat.
The object of the invention and solve its technical problem and adopt following technological means to realize according to the disclosed heat abstractor of the present invention, comprises a radiator, a radiator fan and one first kuppe.
Radiator comprises a pedestal; And multi-disc engages one another and is located at the radiating fin on the pedestal; Define an airflow path between the per two adjacent radiating fins; Radiator fan is arranged at the radiator rear side, in order to the radiator heat-dissipation air-flow to be provided, it can be blown out by the radiator backside flow through each airflow path and by the radiator front side; First kuppe be arranged at the radiator left and right side wherein a side and be positioned at radiator fan the place ahead, derive outward by radiator one side direction in order to the part radiating airflow that radiator fan is provided.
The object of the invention and solve its technical problem and can also adopt following technological means further to realize.
Aforesaid heat abstractor, first kuppe comprise that one is vertical and first baffler of diagonally extending and outwardly forward, by this, can the part radiating airflow be directed to the outside.
Aforesaid heat abstractor, first kuppe comprise that also multi-disc by the first baffler lateral surface, second baffler of diagonally extending down, by this, can be directed to outer side-lower place with the part radiating airflow.
Aforesaid heat abstractor, also comprise one be arranged at the radiator left and right side wherein opposite side and be positioned at the baffle plate in radiator fan the place ahead, in order to the part radiating airflow is outwards derived by the radiator opposite side.
Aforesaid heat abstractor; Radiator also comprises the heat-conducting piece that is connected on the pedestal and supplies said radiating fin to install; Heat abstractor also comprise one be arranged at radiating fin below second kuppe; The front end place of second kuppe is provided with the 3rd baffler of diagonally extending and down forward, by this, can the part radiating airflow be directed to place, below, front side.
Aforesaid heat abstractor; Also comprise one be connected to the radiator rear side positioning framework; The radiator fan and first kuppe are connected to respectively on the positioning framework, and positioning framework comprises that two lay respectively at the draw-in groove of upper and lower two opposite sides, and first kuppe comprises that one is connected in the clamping plate between two draw-in grooves.
Heat abstractor of the present invention; Configuration by first, second kuppe and baffle plate; Can change the flow direction of the part radiating airflow that radiator fan provides; By this, heat abstractor also can dispel the heat to the heating electronic building brick of central processing unit periphery and memory etc. except can dispelling the heat to central processing unit.
Description of drawings
Fig. 1 is the front view of known heat abstractor;
Fig. 2 is the right side view of known heat abstractor;
Fig. 3 is the stereogram of another kind of known heat abstractor;
Fig. 4 is that a preferred embodiment of heat abstractor of the present invention is assembled in the stereogram on the circuit board;
Fig. 5 is the three-dimensional exploded view of a preferred embodiment of heat abstractor of the present invention;
Fig. 6 is that a preferred embodiment of heat abstractor of the present invention is assembled in the vertical view on the circuit board, explains that radiating airflow can dispel the heat to memory and heating electronic building brick via the guiding of first kuppe and baffle plate;
Fig. 7 is that a preferred embodiment of heat abstractor of the present invention is assembled in the front view on the circuit board, explains that radiating airflow can be electric with assembly radiating to memory and heating via the guiding of first kuppe and baffle plate;
Fig. 8 is that a preferred embodiment of heat abstractor of the present invention is assembled in the right side view on the circuit board, explains that radiating airflow can be via the guiding of second kuppe to the heat radiation of heating electronic building brick; And
Fig. 9 is that a preferred embodiment of heat abstractor of the present invention is assembled in the left side view on the circuit board, explains that radiating airflow can be via the guiding of second kuppe to the heat radiation of heating electronic building brick.
The primary clustering symbol description:
(known) 511 ... Pedestal
1,3 ... Heat abstractor 512 ... Heat-conducting piece
11,31 ... Radiator 513 ... Radiating fin
111,311 ... Pedestal 514 ... Contact site
112 ... Locked mechanism 515 ... Heat pipe
113 ... Heat pipe 516 ... Pressure section
114,312 ... Radiating fin 517 ... Locked mechanism
115 ... Air intake 518 ... Airflow path
116 ... Airflow path 519 ... Screw
117 ... Outlet air end 520 ... Air intake
12 ... Fixed frame 521 ... Outlet air end
13,32 ... Radiator fan 53 ... Positioning framework
14 ... Kuppe 531 ... First lug
21 ... Motherboard 532 ... Second lug
22 ... Central processing unit 533 ... Location hole
23 ... Heating electronic building brick 534 ... Perforation
(the present invention) 535 ... Screw
4 ... Motherboard 536 ... Projection
41 ... Central processing unit 537 ... Grab
42 ... Memory 538 ... Draw-in groove
43,44 ... Heating electronic building brick 54 ... Radiator fan
5 ... Heat abstractor 541 ... Deckle board
51 ... Radiator 542 ... Location hole
55 ... First kuppe 56 ... Second kuppe
551 ... Clamping plate 561 ... Opening
552 ... First baffler 562 ... The 3rd baffler
553 ... Top board I, II ... Arrow
554 ... The second baffler III, IV ... Arrow
Embodiment
About aforementioned and other technology contents, characteristics and effect of the present invention, in the detailed description of following cooperation, can clearly appear with reference to a preferred embodiment of accompanying drawing.Explanation through embodiment; Should be to reach technological means that predetermined purpose takes and effect to obtain one more deeply and concrete understanding to the present invention; Yet appended accompanying drawing only provides the usefulness of reference and explanation, is not to be used for the present invention is limited.
Before the present invention is described in detail, be noted that in following description similarly assembly is to represent with identical numbering.
Like Fig. 4 and shown in Figure 5; It is a preferred embodiment of heat abstractor of the present invention; This heat abstractor 5 is installed on the motherboard 4; Heating electronic building brick in order to central processing unit on the motherboard 4 41 and periphery thereof dispels the heat, and heat abstractor 5 comprises a radiator 51, and locatees framework 53, a radiator fan 54, and one first kuppe 55.
Like Fig. 5, Fig. 6, Fig. 7 and shown in Figure 8, a side that in following explanation, will belong to the radiator 51 of three-dimensional exploded view shown in Figure 5 is called the place ahead, and a side at radiator fan 53 places is called the rear.Radiator 51 comprises a pedestal 511, a heat-conducting piece 512; And multi-disc radiating fin 513; Pedestal 511, heat-conducting piece 512 and radiating fin 513 all are made by the good material of thermal conductivity, like materials such as copper or aluminium, heat-conducting piece 512 have one in order to motherboard 4 on the contact site 514 of central processing unit 41 butts; And many heat pipes 515 that protrude out up by contact site 514; Pedestal 511 middle convex with one in order to press on the pressure section 516 on the heat pipe 515, and pedestal 511 can be locked on the motherboard 4 through locked mechanism 517, make that the contact site 514 of heat-conducting piece 512 can be closely sturdy in central processing unit 41 end faces.Said radiating fin 513 is superimposed together mutually up and down and is connected on the heat pipe 515 of heat-conducting piece 512, defines an airflow path 518 along the fore-and-aft direction circulation between the per two adjacent radiating fins 513.
Positioning framework 53 comprises that one is convexly set in first lug 531 of end face; And two be convexly set in the bottom surface second lug 532; First lug 531 is provided with a through hole 533; Each second lug 532 be provided with one with the corresponding perforation 534 in screw 519 positions of pedestal 511 rear sides; Be sheathed on a heat pipe 515 of radiator 51 by the through hole 533 of first lug 531, and perforation 534 and screw lock that screw 535 passes second lug 532 be in the screw 519 of pedestal 511, make positioning framework 53 be able to winding and be fixed in radiator 51 rear sides.Radiator fan 54 is one in order to the tube-axial fan of radiator 51 radiating airflows to be provided; Radiator fan 54 comprises a deckle board 541; And a plurality of be located on the deckle board 541 and with the projection 536 position corresponding positioning hole 542 of positioning framework 53; Projection 536 by positioning framework 53 is arranged in location hole 542, and grab 537 clips of positioning framework 53 and arranged on left and right sides make radiator fan 54 be fastened on the positioning framework 53 in the deckle board 541 of radiator fan 54.
In addition; Heat abstractor 5 also comprise one be arranged at radiating fin 513 bottoms second kuppe 56; And one be arranged at second kuppe, 56 left side baffle plate 57; Second kuppe 56 have one be formed at rear end opening 561, and one be positioned at front end place the 3rd baffler 562 of diagonally extending and down forward, by the configuration of second kuppe 56; Can the part radiating airflow that radiator fan 54 is provided be guided to pedestal 511 the place aheads of radiator 51, and the configuration of baffle plate 57 can be guided to the part radiating airflow that radiator fan 54 is provided the left side of radiator 51.
Like Fig. 6, Fig. 7, Fig. 8 and shown in Figure 9; The heat that is produced during central processing unit 41 work can conduct to heat pipe 515 via the contact site 514 of heat-conducting piece 512; And conduct to radiating fin 513 to dispel the heat via heat pipe 515, simultaneously, radiator fan 54 can provide radiating airflow to the radiator 51 that flows like arrow I direction; Most heat transmission gas fails to be convened for lack of a quorum and flows in the airflow path 518 via the air intake of radiating fin 513 rear sides 520; Then through airflow path 518 after discharge by the outlet air end 521 of radiating fin 513 front sides, by this, can cool off heat pipe 515 and radiating fin 513 and effectively the heat of central processing unit 41 is derived.
Because first, second kuppe 55,56 and baffle plate 57 all are arranged at radiator fan 54 the place aheads and are positioned on the flow path of radiating airflow; Therefore; The heat transmission gas of part fails to be convened for lack of a quorum and flows out towards radiator 51 lower rights along arrow II direction via first, second baffler 552,554 guidings of first kuppe 55; By this, can dispel the heat to the memory 42 that is arranged on the motherboard 4 and be positioned at central processing unit 41 right sides.Again, the heat transmission gas of the part left along arrow III direction towards radiator 51 that fails to be convened for lack of a quorum via the guiding of baffle plate 57 flows out, and by this, can dispel the heat to the heating electronic building brick 43 that is arranged on the motherboard 4 and be positioned at central processing unit 41 left sides.Moreover; The heat transmission gas of part fails to be convened for lack of a quorum and is flowed in second kuppe 56 by the opening of second kuppe 56 561; And flow out at place, below, the front side via the guiding of the 3rd baffler 562 along arrow IV direction towards radiator 51; By this, can dispel the heat to the heating electronic building brick 44 that is arranged on the motherboard 4 and be positioned at central processing unit 41 front sides.Configuration by first, second kuppe 55,56 and baffle plate 57; Can change the flow direction of the part radiating airflow that radiator fan 54 provided; By this; Heat abstractor 5 also can dispel the heat to the heating electronic building brick 43,44 of central processing unit 41 periphery and memory 42 etc. except can dispelling the heat to central processing unit 41.
What need explanation is; When practical application; Heat abstractor 5 also can adopt two groups of first kuppes 55 that are positioned at radiating fin 513 and arranged on left and right sides respectively simultaneously; Or adopting two groups of baffle plates 57 that are positioned at second kuppe, 56 and arranged on left and right sides respectively simultaneously, the demand of visual reality and do different change designs respectively is not that one group design is exceeded with disclosed first kuppe 55 and baffle plate 57 in the present embodiment.Moreover; Second baffler 554 of first kuppe 55 also can be designed to be articulated on first baffler 552; By this; Can adjust the angle of second baffler 554 along with the position difference of memory 42 or heating electronic building brick, to change the flow direction of the radiating airflow of being discharged by first kuppe 55.
Conclude above-mentioned; The heat abstractor 5 of present embodiment by the configuration of first, second kuppe 55,56 and baffle plate 57, can change the flow direction of the part radiating airflow that radiator fan 54 provided; By this; Heat abstractor 5 also can dispel the heat to the heating electronic building brick 43,44 of central processing unit 41 periphery and memory 42 etc., so can reach the purpose of institute of the present invention demand really except can dispelling the heat to central processing unit 41.
The above-described content of thought; Be merely preferred embodiment of the present invention; Can not limit the scope that the present invention implements with this, promptly every simple equivalent variations and modification of doing according to claims scope of the present invention and invention description all still belongs in the scope that patent of the present invention contains.Arbitrary embodiment of the present invention in addition or claims scope are not to reach the disclosed whole purposes of the present invention or advantage or characteristics.In addition, summary part and title only are the usefulness that is used for assisting the patent document retrieval, are not to be used for limiting interest field of the present invention.
Claims (9)
1. heat abstractor comprises:
One radiator comprises a pedestal, and multi-disc engages one another and be located at the radiating fin on the said pedestal, defines an airflow path between the per two adjacent radiating fins;
One radiator fan is arranged at said radiator rear side, in order to said radiator heat-dissipation air-flow to be provided, it can be blown out by said radiator backside flow through each said airflow path and by said radiator front side;
One first kuppe, be arranged at said radiator left and right side wherein a side and be positioned at said radiator fan the place ahead, derive outward by said radiator one side direction in order to the part radiating airflow that said radiator fan is provided; And
One be arranged at said radiator left and right side wherein opposite side and be positioned at the baffle plate in said radiator fan the place ahead, in order to the part radiating airflow is outwards derived by said radiator opposite side.
2. heat abstractor according to claim 1, wherein, said first kuppe comprises that one is vertical and first baffler of diagonally extending and outwardly forward.
3. heat abstractor according to claim 2, wherein, said first kuppe comprises that also multi-disc is by the said first baffler lateral surface second baffler of diagonally extending down.
4. heat abstractor according to claim 1; Wherein, Said radiator also comprises the heat-conducting piece that is connected on the said pedestal and supplies said radiating fin to install; Said heat abstractor comprises that also one is arranged at second kuppe of said radiating fin below, and the front end place of said second kuppe is provided with the 3rd baffler of diagonally extending and down forward.
5. heat abstractor according to claim 1 comprises that also one is connected to the positioning framework of said radiator rear side, and said radiator fan and said first kuppe are connected to respectively on the said positioning framework.
6. heat abstractor according to claim 5, wherein, said positioning framework comprises that two lay respectively at the draw-in groove of upper and lower two opposite sides, said first kuppe comprises that one is connected in the clamping plate between said two draw-in grooves.
7. heat abstractor according to claim 3; Wherein, Said radiator also comprises the heat-conducting piece that is connected on the said pedestal and supplies said radiating fin to install; Said heat abstractor comprises that also one is arranged at second kuppe of said radiating fin below, and the front end place of said second kuppe is provided with the 3rd baffler of diagonally extending and down forward.
8. heat abstractor according to claim 3 comprises that also one is connected to the positioning framework of said radiator rear side, and said radiator fan and said first kuppe are connected to respectively on the said positioning framework.
9. heat abstractor according to claim 8, wherein, said positioning framework comprises that two lay respectively at the draw-in groove of upper and lower two opposite sides, said first kuppe comprises that one is connected in the clamping plate between said two draw-in grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102119999A CN101677503B (en) | 2008-09-17 | 2008-09-17 | Heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102119999A CN101677503B (en) | 2008-09-17 | 2008-09-17 | Heat radiating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101677503A CN101677503A (en) | 2010-03-24 |
| CN101677503B true CN101677503B (en) | 2012-01-11 |
Family
ID=42029857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102119999A Expired - Fee Related CN101677503B (en) | 2008-09-17 | 2008-09-17 | Heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101677503B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102202487A (en) * | 2010-03-26 | 2011-09-28 | 鸿富锦精密工业（深圳）有限公司 | Heat abstractor |
| CN117355123B (en) * | 2023-12-04 | 2024-03-08 | 佛山聚科通盛电子有限公司 | Radiator of photovoltaic inverter and photovoltaic inverter |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1959590A (en) * | 2005-11-02 | 2007-05-09 | 富准精密工业(深圳)有限公司 | Heat sink |
-
2008
- 2008-09-17 CN CN2008102119999A patent/CN101677503B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1959590A (en) * | 2005-11-02 | 2007-05-09 | 富准精密工业(深圳)有限公司 | Heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101677503A (en) | 2010-03-24 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120111 |