CN101896054A - heat sink - Google Patents

heat sink Download PDF

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Publication number
CN101896054A
CN101896054A CN2009103025118A CN200910302511A CN101896054A CN 101896054 A CN101896054 A CN 101896054A CN 2009103025118 A CN2009103025118 A CN 2009103025118A CN 200910302511 A CN200910302511 A CN 200910302511A CN 101896054 A CN101896054 A CN 101896054A
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Prior art keywords
bottom plate
heat sink
fan
fan frame
heat
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CN2009103025118A
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聂伟成
杨红成
曹磊
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to CN2009103025118A priority Critical patent/CN101896054A/en
Priority to US12/507,781 priority patent/US20100294463A1/en
Publication of CN101896054A publication Critical patent/CN101896054A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置，用于对安装于电路板上的发热电子元件散热，包括一散热器及一离心风扇，所述散热器包括一底板及形成于底板上的若干散热片，所述离心风扇包括一扇框及安装于扇框上的扇叶，所述扇框罩设并安装于散热器的底板上，扇框与底板共同形成供气流流通的一腔室，所述扇框设有一进风口，所述散热器的散热片对应离心风扇的出风口形成若干气流通道。本发明中扇框与散热器的底板共同形成供气流流通的腔室，与传统的离心风扇相比省去了与扇框结合的盖板，降低制造成本。

A heat dissipation device for dissipating heat from heating electronic components mounted on a circuit board, comprising a heat sink and a centrifugal fan, the heat sink includes a bottom plate and a plurality of cooling fins formed on the bottom plate, the centrifugal fan includes A fan frame and fan blades installed on the fan frame, the fan frame is covered and installed on the bottom plate of the radiator, the fan frame and the bottom plate together form a chamber for air flow, and the fan frame is provided with an air inlet , the cooling fins of the radiator form several airflow channels corresponding to the air outlets of the centrifugal fan. In the present invention, the fan frame and the bottom plate of the radiator jointly form a chamber for air flow, and compared with the traditional centrifugal fan, the cover plate combined with the fan frame is omitted, thereby reducing the manufacturing cost.

Description

散热装置 heat sink

技术领域technical field

本发明涉及一种散热装置，特别是一种具有一离心风扇的散热装置。The invention relates to a cooling device, in particular to a cooling device with a centrifugal fan.

背景技术Background technique

随着中央处理器(CPU)等电子元件功率的不断提高，散热问题越来越受到人们的重视，在笔记本电脑中更是如此。With the continuous improvement of the power of electronic components such as central processing unit (CPU), the problem of heat dissipation is more and more paid attention to by people, especially in notebook computers.

通常业界在电路板上安装散热器，用以对设置在电路板上的发热电子元件散热。散热器通常包括一底座及设置于底座上的若干散热片，为加强散热效果常将一离心式风扇设置在底座上并位于散热片一侧，以便将电路板周围的冷空气吹向散热片。然而，由于发热电子元件贴设于散热片底部，散热片底部与周围空气的热交换效果不明显，整个散热器的散热效率有待提高。尤其对于一显卡上发热电子元件散热时，由于显卡所处空间狭窄，风扇所能吸入的风量较少，大量加热气流集中在散热片底部不易排出的情况更为突出。因此，需要提供一种不仅能快速对散热片底部散热，又能在有限的空间内增加散热面积的散热装置。Generally, the industry installs a heat sink on the circuit board to dissipate heat from the heat-generating electronic components disposed on the circuit board. The heat sink usually includes a base and a plurality of cooling fins arranged on the base. In order to enhance the heat dissipation effect, a centrifugal fan is often arranged on the base and located on one side of the cooling fins, so as to blow the cold air around the circuit board to the cooling fins. However, since the heating electronic components are attached to the bottom of the heat sink, the heat exchange effect between the bottom of the heat sink and the surrounding air is not obvious, and the heat dissipation efficiency of the whole radiator needs to be improved. Especially when heat-generating electronic components on a graphics card dissipate heat, because the space where the graphics card is located is narrow, the air volume that the fan can inhale is less, and the situation that a large amount of heated air is concentrated at the bottom of the heat sink and is difficult to discharge is more prominent. Therefore, it is necessary to provide a heat dissipation device that can not only quickly dissipate heat from the bottom of the heat sink, but also increase the heat dissipation area in a limited space.

发明内容Contents of the invention

有鉴于此，有必要提供一种具有一离心风扇的散热装置，该离心风扇与散热器底板结合以利于导流。In view of this, it is necessary to provide a heat dissipation device with a centrifugal fan, which is combined with the bottom plate of the radiator to facilitate air conduction.

一种散热装置，用于对安装于电路板上的发热电子元件散热，包括一散热器及一离心风扇，所述散热器包括一底板及形成于底板上的若干散热片，所述离心风扇包括一扇框及安装于扇框上的扇叶，所述扇框罩设并安装于散热器的底板上，扇框与底板共同形成供气流流通的一腔室，所述扇框设有一进风口，所述散热器的散热片对应离心风扇的出风口形成若干气流通道。A heat dissipation device is used to dissipate heat from heat-generating electronic components mounted on a circuit board, comprising a heat sink and a centrifugal fan, the heat sink includes a bottom plate and a plurality of cooling fins formed on the bottom plate, and the centrifugal fan includes A fan frame and fan blades installed on the fan frame, the fan frame is covered and installed on the bottom plate of the radiator, the fan frame and the bottom plate together form a chamber for air flow, and the fan frame is provided with an air inlet , the cooling fins of the radiator form several airflow channels corresponding to the air outlets of the centrifugal fan.

本发明中扇框与散热器的底板共同形成供气流流通的腔室，与传统的离心风扇相比省去了与扇框结合的盖板，降低制造成本。In the present invention, the fan frame and the bottom plate of the radiator jointly form a chamber for air circulation, and compared with the traditional centrifugal fan, the cover plate combined with the fan frame is omitted, thereby reducing the manufacturing cost.

下面参照附图，结合具体的实施方式对本发明作进一步的描述。The present invention will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.

附图说明Description of drawings

图1是本发明散热装置的立体分解图。Fig. 1 is a three-dimensional exploded view of the heat sink of the present invention.

图2是图1的部分组装图。FIG. 2 is a partially assembled view of FIG. 1 .

图3是图1中气流方向示意图。Fig. 3 is a schematic diagram of the airflow direction in Fig. 1 .

具体实施方式Detailed ways

请参阅图1和图2，本发明散热装置用于对安装于电路板(图未示)，尤其用于对如显卡上的发热电子元件(图未示)散热，该散热装置包括一散热器10及安装于散热器10上的一离心风扇20。该散热器10底部直接与发热电子元件贴设，以吸收发热电子元件热量。为引导离心风扇20出风口气流，设置一导流板30于离心风扇20的出风口。Please refer to Fig. 1 and Fig. 2, the heat dissipation device of the present invention is used for being installed on the circuit board (not shown in the figure), especially for dissipating heat to the heat-generating electronic components (not shown in the figure) on the graphics card, the heat dissipation device includes a radiator 10 and a centrifugal fan 20 installed on the radiator 10. The bottom of the heat sink 10 is directly attached to the heating electronic components to absorb the heat of the heating electronic components. In order to guide the airflow at the air outlet of the centrifugal fan 20 , a deflector 30 is arranged at the air outlet of the centrifugal fan 20 .

散热器10大致呈扁平状，包括一大致呈长条状的底板12及由底板12顶表面向上延伸出的若干散热片14。底板12大致分为三部分，第一部分位于底板12中部呈半圆形，一半圆形的第一进风口120开设于第一部分的中央处，底板12的底表面对应于第一进风口120处直接与发热电子元件贴设。第一部分向前延伸出一呈矩形的第二部分，所述散热片14由底板12的第二部分一体垂直向上延伸而成。第一部分向后延伸出呈矩形的第三部分，为增加散热面积可在第三部分加设若干散热鳍片(图未示)，底板12的具体形状是根据发热电子元件所在的位置决定的，故其三部分可以依据具体情况改变。三个固定柱16均匀分布在底板12的顶表面，位于第一部分的前端及第三部分的中间，所述固定柱16垂直于底板12，每一固定柱16设有固定孔160。底板12的第二部分的前端相对于底板12倾斜设置，即底板12位于前端的底表面142向下倾斜，以增加离心风扇20的出风口面积，并利于气流向下流动，吹向位于电路板上的其他发热电子元件。每一散热片14的顶部内凹形成一弧形边缘，所有弧形边缘于散热片14顶部形成与导流板30配合的一凹槽140。散热片14的长度沿底板12相对二侧边逐渐减小，以与离心风扇20的外形相适配，利于将离心风扇20安装在底板12上。The heat sink 10 is substantially flat and includes a substantially elongated bottom plate 12 and a plurality of cooling fins 14 extending upward from the top surface of the bottom plate 12 . The bottom plate 12 is roughly divided into three parts. The first part is located in the middle of the bottom plate 12 and is semicircular. The semicircular first air inlet 120 is opened in the center of the first part. Attached to the heating electronic components. A rectangular second part extends forward from the first part, and the heat sink 14 is integrally formed by vertically extending upward from the second part of the bottom plate 12 . The first part extends backwards into a rectangular third part. In order to increase the heat dissipation area, some heat dissipation fins (not shown) can be added to the third part. The specific shape of the bottom plate 12 is determined according to the position of the heating electronic components. Therefore, the three parts can be changed according to the specific situation. Three fixing columns 16 are evenly distributed on the top surface of the base plate 12 , located at the front end of the first part and the middle of the third part. The fixing columns 16 are perpendicular to the base plate 12 , and each fixing column 16 is provided with a fixing hole 160 . The front end of the second part of the base plate 12 is inclined relative to the base plate 12, that is, the bottom surface 142 of the base plate 12 at the front end is inclined downwards, so as to increase the area of the air outlet of the centrifugal fan 20, and facilitate the downward flow of airflow, blowing to the circuit board located on the circuit board. other heat-generating electronic components on the The top of each cooling fin 14 is recessed to form an arc-shaped edge, and all the arc-shaped edges form a groove 140 on the top of the cooling fin 14 to cooperate with the deflector 30 . The length of the cooling fins 14 gradually decreases along two opposite sides of the base plate 12 to match the shape of the centrifugal fan 20 , which facilitates installing the centrifugal fan 20 on the base plate 12 .

离心风扇20包括一扇框22与安装于扇框22顶部内侧面的扇叶24。扇框22包括一面板220及沿面板220垂直向下延伸的侧壁222，所述面板220的形状对应于散热器10底板12的第一部分，面板220对应于散热器10底板12的第一进风口120设有第二进风口2200。扇框22的侧壁222对应于底板12的固定柱16处，水平向外延伸出三个定位部224，每一定位部224设有一孔口2240，螺钉90穿过定位部224的孔口2240并螺锁于底板12的固定柱16的固定孔160内，将离心风扇20固定在散热器10的底板12的顶表面。The centrifugal fan 20 includes a fan frame 22 and fan blades 24 installed on the top inner side of the fan frame 22 . The fan frame 22 includes a panel 220 and a side wall 222 extending vertically downward along the panel 220. The shape of the panel 220 corresponds to the first part of the bottom plate 12 of the radiator 10, and the panel 220 corresponds to the first part of the bottom plate 12 of the radiator 10. The air outlet 120 is provided with a second air inlet 2200 . The side wall 222 of the fan frame 22 corresponds to the fixed column 16 of the bottom plate 12, and three positioning parts 224 extend horizontally outward, each positioning part 224 is provided with a hole 2240, and the screw 90 passes through the hole 2240 of the positioning part 224 And screwed in the fixing hole 160 of the fixing column 16 of the bottom plate 12 , the centrifugal fan 20 is fixed on the top surface of the bottom plate 12 of the radiator 10 .

导流板30与离心风扇20并排设置，并直接盖设于散热片14顶部，以引导离心风扇20出风口的气流进入散热片14形成的气流通道后，沿底板12第二部分倾斜端部向下吹出，吹向电路板上的其他发热电子元件。导流板30包括一本体32及由本体32一侧朝下倾斜设置的斜面34，所述斜面34凹设于散热片14的凹槽140内。The deflector 30 and the centrifugal fan 20 are arranged side by side, and are directly covered on the top of the cooling fin 14, so as to guide the airflow at the air outlet of the centrifugal fan 20 into the airflow channel formed by the cooling fin 14, and then move along the inclined end of the second part of the bottom plate 12. Blow down and blow to other heat-generating electronic components on the circuit board. The deflector 30 includes a main body 32 and an inclined surface 34 inclined downward from one side of the main body 32 . The inclined surface 34 is recessed in the groove 140 of the heat sink 14 .

请参阅图3，工作时，外界空气在离心风扇20引导下，同时由底板12的第一进风口120及离心风扇20的第二进风口2200吸入扇框22与底板12共同形成的腔室内，气流在扇叶24的作用下，吹向位于底板12一侧的散热片14，最后经散热片14的气流通道吹出。Please refer to FIG. 3 , during operation, the outside air is guided by the centrifugal fan 20, and is sucked into the cavity formed by the fan frame 22 and the bottom plate 12 by the first air inlet 120 of the bottom plate 12 and the second air inlet 2200 of the centrifugal fan 20 at the same time. Under the action of the fan blades 24 , the airflow blows towards the heat sink 14 located on one side of the bottom plate 12 , and finally blows out through the airflow channel of the heat sink 14 .

本发明中离心风扇20的扇框22直接与散热器10的底板12配合形成供气流通过的通道，省去传统离心式风扇中与扇框22结合的盖板，节省制造成本；底板12加设第一进风口120，利于引导气流吹向底板12底表面，直接吹向贴设于底板12底表面的发热电子元件，加快散热。In the present invention, the fan frame 22 of the centrifugal fan 20 directly cooperates with the bottom plate 12 of the radiator 10 to form a passage for air flow, which saves the manufacturing cost by eliminating the cover plate combined with the fan frame 22 in the traditional centrifugal fan; The first air inlet 120 is beneficial to guide the airflow to blow to the bottom surface of the bottom plate 12 and directly blow to the heating electronic components attached to the bottom surface of the bottom plate 12 to accelerate heat dissipation.

Claims (10)

1.一种散热装置，用于对安装于电路板上的发热电子元件散热，包括一散热器及一离心风扇，所述散热器包括一底板及形成于底板上的若干散热片，所述离心风扇包括一扇框及安装于扇框上的扇叶，其特征在于：所述扇框罩设并安装于散热器的底板上，扇框与底板共同形成供气流流通的一腔室，所述扇框设有一进风口，所述散热器的散热片对应离心风扇的出风口形成若干气流通道。1. A heat dissipation device, which is used to dissipate heat to heat-generating electronic components mounted on a circuit board, comprising a heat sink and a centrifugal fan, the heat sink includes a base plate and some cooling fins formed on the base plate, the centrifugal fan The fan includes a fan frame and fan blades installed on the fan frame, and is characterized in that: the fan frame is covered and installed on the bottom plate of the radiator, and the fan frame and the bottom plate together form a chamber for air flow. The fan frame is provided with an air inlet, and the cooling fins of the radiator form a plurality of airflow channels corresponding to the air outlet of the centrifugal fan. 2.如权利要求1所述的散热装置，其特征在于：所述散热器的底板设有另一进风口，所述发热电子元件对应底板的另一进风口。2 . The heat dissipation device according to claim 1 , wherein the bottom plate of the heat sink is provided with another air inlet, and the heating electronic component corresponds to the other air inlet of the bottom plate. 3 . 3.如权利要求2所述的散热装置，其特征在于：所述散热器底板的另一进风口对应扇框的进风口设置。3. The heat dissipation device according to claim 2, wherein the other air inlet of the radiator bottom plate is set corresponding to the air inlet of the fan frame. 4.如权利要求1所述的散热装置，其特征在于：所述散热器底板位于散热片的一端倾斜设置。4 . The heat dissipation device according to claim 1 , wherein the bottom plate of the heat sink is arranged obliquely at one end of the heat sink. 5 . 5.如权利要求4所述的散热装置，其特征在于：所述散热器的散热片长度沿散热器相对二侧边逐渐减小。5. The heat dissipation device according to claim 4, wherein the length of the fins of the heat sink gradually decreases along two opposite sides of the heat sink. 6.如权利要求1所述的散热装置，其特征在于：所述散热器的底板上设有固定离心风扇扇框的固定柱。6 . The heat dissipation device according to claim 1 , wherein a fixing column for fixing the fan frame of the centrifugal fan is arranged on the bottom plate of the heat sink. 7 . 7.如权利要求6所述的散热装置，其特征在于：所述离心风扇扇框对应底板上的固定柱设有定位部，螺钉穿过定位部并螺锁在底板的固定柱内将离心风扇固定在底板上。7. The cooling device according to claim 6, wherein the fan frame of the centrifugal fan is provided with a positioning portion corresponding to the fixing column on the bottom plate, and the screw passes through the positioning portion and is screwed into the fixing column of the bottom plate to secure the centrifugal fan. fixed on the bottom plate. 8.如权利要求1所述的散热装置，其特征在于：还包括与离心风扇的扇框并排设置并盖设于散热器的散热片顶部的一导流板。8 . The heat dissipation device according to claim 1 , further comprising a deflector arranged side by side with the fan frame of the centrifugal fan and covering the top of the heat sink of the heat sink. 9.如权利要求8所述的散热装置，其特征在于：所述散热器的散热片的顶部凹设一凹槽，所述导流板设置于凹槽内。9 . The heat dissipation device according to claim 8 , wherein a groove is recessed at the top of the heat sink of the heat sink, and the deflector is disposed in the groove. 10 . 10.如权利要求9所述的散热装置，其特征在于：所述散热器的底板包括位于中央处的第一部分及由第一部分向外延伸出的第二部分，所述离心风扇与散热片分别设于底板的第一部分与第二部分，所述发热电子元件对应于底板的第一部分。10. The heat dissipation device according to claim 9, characterized in that: the bottom plate of the heat sink comprises a first part located in the center and a second part extending outward from the first part, the centrifugal fan and the heat sink are respectively The heating electronic element is arranged on the first part and the second part of the bottom plate corresponding to the first part of the bottom plate.
CN2009103025118A 2009-05-21 2009-05-21 heat sink Pending CN101896054A (en)

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CN2009103025118A CN101896054A (en) 2009-05-21 2009-05-21 heat sink
US12/507,781 US20100294463A1 (en) 2009-05-21 2009-07-22 Heat dissipation device having a fan thereon

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