CN101896054A - Radiating device - Google Patents

Radiating device Download PDF

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Publication number
CN101896054A
CN101896054A CN2009103025118A CN200910302511A CN101896054A CN 101896054 A CN101896054 A CN 101896054A CN 2009103025118 A CN2009103025118 A CN 2009103025118A CN 200910302511 A CN200910302511 A CN 200910302511A CN 101896054 A CN101896054 A CN 101896054A
Authority
CN
China
Prior art keywords
base plate
radiator
fan
centrifugal fan
heat abstractor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009103025118A
Other languages
Chinese (zh)
Inventor
聂伟成
杨红成
曹磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN2009103025118A priority Critical patent/CN101896054A/en
Priority to US12/507,781 priority patent/US20100294463A1/en
Publication of CN101896054A publication Critical patent/CN101896054A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a radiating device which is used for radiating heat to a heating electronic component installed on a circuit board. The radiating device comprises a radiator and a centrifugal fan, wherein the radiator comprises a bottom plate and a plurality of radiating fins formed on the bottom plate; the centrifugal fan comprises a fan frame and fan blades installed on the fan frame; the fan frame covers on the bottom plate of the radiator; the fan frame and the bottom plate together form a chamber for air to flow; the fan frame is provided with an air inlet; and the radiating fins of the radiator form a plurality of air channels corresponding to an air outlet of the centrifugal fan. In the invention, because the fan frame and the bottom plate of the radiator together form the chamber for air to flow, compared with the traditional centrifugal fan, a cover plate combined with the fan frame is omitted, thereby reducing the manufacturing cost.

Description

Heat abstractor
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor with a centrifugal fan.
Background technology
Along with improving constantly of central processing unit electronic component power such as (CPU), heat dissipation problem more and more is subject to people's attention, and is all the more so in notebook computer.
Usually industry is installed radiator on circuit board, in order to the heat-generating electronic elements that is arranged on the circuit board is dispelled the heat.Radiator generally includes a base and is arranged at some fin on the base, often is arranged on a centrifugal fan on the base and is positioned at fin one side for strengthening radiating effect, so that the cold air around the circuit board is blowed to fin.Yet because heat-generating electronic elements is attached at the fin bottom, the fin bottom is not obvious with the heat exchange effect of surrounding air, and the radiating efficiency of entire radiator has much room for improvement.When especially dispelling the heat for heat-generating electronic elements on the video card, because video card narrow space of living in, the air quantity that fan can suck is less, and the situation that a large amount of heating air flow concentrate on the difficult discharge in fin bottom is more outstanding.Therefore, need provide a kind of and can not only can in limited space, increase the heat abstractor of area of dissipation again fast to the heat radiation of fin bottom.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor with a centrifugal fan, this centrifugal fan combines with base plate of radiator and is beneficial to water conservancy diversion.
A kind of heat abstractor, be used for being installed on the heat-generating electronic elements heat radiation on the circuit board, comprise a radiator and a centrifugal fan, described radiator comprises a base plate and is formed at some fin on the base plate, described centrifugal fan comprises a fan frame and is installed on the flabellum of fanning on the frame, described fan mask is established and is installed on the base plate of radiator, fan frame and base plate form a chamber of air feed stream circulation jointly, described fan frame is provided with an air inlet, and the air outlet of the corresponding centrifugal fan of the fin of described radiator forms some gas channels.
The base plate of middle fan frame of the present invention and radiator forms the chamber of air feed stream circulation jointly, compares with traditional centrifugal fan and has saved the cover plate that combines with the fan frame, reduces manufacturing cost.
With reference to the accompanying drawings, the invention will be further described in conjunction with concrete execution mode.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.
Fig. 2 is the part assembly drawing of Fig. 1.
Fig. 3 is an airflow direction schematic diagram among Fig. 1.
Embodiment
See also Fig. 1 and Fig. 2, heat abstractor of the present invention is used for being installed on circuit board (figure does not show), be particularly useful for as the heat-generating electronic elements on the video card (figure do not show) heat radiation, this heat abstractor comprises a radiator 10 and is installed on a centrifugal fan 20 on the radiator 10.These radiator 10 bottoms directly are sticked with heat-generating electronic elements, with absorption heat-generating electronic elements heat.For guiding centrifugal fan 20 air outlet air-flows, a baffler 30 is set in the air outlet of centrifugal fan 20.
Radiator 10 roughly is flat, comprises that one roughly is the base plate 12 of strip and the some fin 14 that extended upward by base plate 12 top surfaces.Base plate 12 roughly is divided into three parts, and first is positioned at base plate 12 middle part semicirculars in shape, and first air inlet 120 of a semicircle is opened in the centre of first, the basal surface of base plate 12 corresponding to first air inlet, 120 places directly and heat-generating electronic elements be sticked.First extends a rectangular second portion forward, and described fin 14 is extended vertically upward by the second portion one of base plate 12 and forms.First extends back rectangular third part, can add some radiating fins (figure does not show) in third part for increasing area of dissipation, the concrete shape of base plate 12 is according to the determining positions at heat-generating electronic elements place, so its three part can change according to concrete condition.Three fixed legs 16 are evenly distributed on the top surface of base plate 12, are positioned at the front end of first and the centre of third part, and described fixed leg 16 is perpendicular to base plate 12, and each fixed leg 16 is provided with fixing hole 160.The front end of the second portion of base plate 12 is obliquely installed with respect to base plate 12, it is downward-sloping to be that base plate 12 is positioned at the basal surface 142 of front end, increasing the air outlet area of centrifugal fan 20, and be beneficial to air-flow and flow downward, blow to other heat-generating electronic elements that are positioned on the circuit board.The top indent of each fin 14 forms a curved edge, and all curved edges form a groove 140 that cooperates with baffler 30 in fin 14 tops.The length of fin 14 reduces gradually along base plate 12 relative dual side-edges, with suitable with the profile of centrifugal fan 20, be beneficial to centrifugal fan 20 is installed on the base plate 12.
Centrifugal fan 20 comprises a fan frame 22 and the flabellum 24 that is installed on fan frame 22 inside top faces.Fan frame 22 comprises a panel 220 and the sidewall 222 that extends vertically downward along panel 220, the shape of described panel 220 is corresponding to the first of radiator 10 base plates 12, and panel 220 is provided with second air inlet 2200 corresponding to first air inlet 120 of radiator 10 base plates 12.The sidewall 222 of fan frame 22 is corresponding to fixed leg 16 places of base plate 12, level extends outward three location divisions 224, each location division 224 is provided with an aperture 2240, screw 90 passes the aperture 2240 of location division 224 and screw lock in the fixing hole 160 of the fixed leg 16 of base plate 12, centrifugal fan 20 is fixed on the top surface of the base plate 12 of radiator 10.
Baffler 30 is arranged side by side with centrifugal fan 20, and directly be covered on fin 14 tops, enter the gas channel of fin 14 formation with the air-flow that guides centrifugal fan 20 air outlets after, blow out downwards, blow to other heat-generating electronic elements on the circuit board along base plate 12 second portion inclined end portion.Baffler 30 comprises a body 32 and the inclined-plane 34 that is obliquely installed by body 32 1 sides down, and described inclined-plane 34 is arranged with in the groove 140 of fin 14.
See also Fig. 3, during work, outside air is under centrifugal fan 20 guiding, suck in fan frame 22 and the base plate 12 common chambers that form by first air inlet 120 of base plate 12 and second air inlet 2200 of centrifugal fan 20 simultaneously, air-flow is under the effect of flabellum 24, blow to the fin 14 that is positioned at base plate 12 1 sides, after the gas channel of fin 14 blow out.
The fan frame 22 of centrifugal fan 20 directly cooperates the passage that formation air feed stream passes through among the present invention with the base plate 12 of radiator 10, saves the cover plate that combines with fan frame 22 in the conventional centrifugal fan, saves manufacturing cost; Base plate 12 adds first air inlet 120, is beneficial to steering current and blows to base plate 12 basal surfaces, directly blows to the heat-generating electronic elements that is attached at base plate 12 basal surfaces, accelerates heat radiation.

Claims (10)

1. heat abstractor, be used for being installed on the heat-generating electronic elements heat radiation on the circuit board, comprise a radiator and a centrifugal fan, described radiator comprises a base plate and is formed at some fin on the base plate, described centrifugal fan comprises a fan frame and is installed on the flabellum of fanning on the frame, it is characterized in that: described fan mask is established and is installed on the base plate of radiator, fan frame and base plate form a chamber of air feed stream circulation jointly, described fan frame is provided with an air inlet, and the air outlet of the corresponding centrifugal fan of the fin of described radiator forms some gas channels.
2. heat abstractor as claimed in claim 1 is characterized in that: the base plate of described radiator is provided with another air inlet, another air inlet of the corresponding base plate of described heat-generating electronic elements.
3. heat abstractor as claimed in claim 2 is characterized in that: the air inlet setting of the corresponding fan of another air inlet frame of described base plate of radiator.
4. heat abstractor as claimed in claim 1 is characterized in that: the end that described base plate of radiator is positioned at fin is obliquely installed.
5. heat abstractor as claimed in claim 4 is characterized in that: the fin length of described radiator reduces gradually along the relative dual side-edge of radiator.
6. heat abstractor as claimed in claim 1 is characterized in that: the base plate of described radiator is provided with the fixedly fixed leg of centrifugal fan fan frame.
7. heat abstractor as claimed in claim 6 is characterized in that: the fixed leg on the corresponding base plate of described centrifugal fan fan frame is provided with the location division, and screw passes the location division and screw lock is fixed on centrifugal fan on the base plate in the fixed leg of base plate.
8. heat abstractor as claimed in claim 1 is characterized in that: also comprise a baffler that is arranged side by side and is covered on the fin top of radiator with the fan frame of centrifugal fan.
9. heat abstractor as claimed in claim 8 is characterized in that: the top of the fin of described radiator is arranged with a groove, and described baffler is arranged in the groove.
10. heat abstractor as claimed in claim 9, it is characterized in that: the base plate of described radiator comprises first that is positioned at centre and the second portion that is extended outward by first, described centrifugal fan and fin are located at the first and the second portion of base plate respectively, and described heat-generating electronic elements is corresponding to the first of base plate.
CN2009103025118A 2009-05-21 2009-05-21 Radiating device Pending CN101896054A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009103025118A CN101896054A (en) 2009-05-21 2009-05-21 Radiating device
US12/507,781 US20100294463A1 (en) 2009-05-21 2009-07-22 Heat dissipation device having a fan thereon

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009103025118A CN101896054A (en) 2009-05-21 2009-05-21 Radiating device

Publications (1)

Publication Number Publication Date
CN101896054A true CN101896054A (en) 2010-11-24

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Application Number Title Priority Date Filing Date
CN2009103025118A Pending CN101896054A (en) 2009-05-21 2009-05-21 Radiating device

Country Status (2)

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US (1) US20100294463A1 (en)
CN (1) CN101896054A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102588346A (en) * 2011-01-10 2012-07-18 鸿富锦精密工业（深圳）有限公司 Air-guiding device and radiating module provided with air-guiding device
CN103853251A (en) * 2012-12-04 2014-06-11 鸿富锦精密工业（深圳）有限公司 Electronic device assembly
CN105208841A (en) * 2015-11-11 2015-12-30 林炳彩 Circuit board device assembly with shock absorption function
CN104114008B (en) * 2013-04-17 2017-03-01 建准电机工业股份有限公司 Heat dissipation module and flow guide structure thereof
CN108291726A (en) * 2015-11-24 2018-07-17 三菱电机株式会社 Air conditioner
CN111665910A (en) * 2020-07-06 2020-09-15 惠州市五荣五金电子有限公司 Computer radiator

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TW201221780A (en) * 2010-11-19 2012-06-01 Inventec Corp Heat dissipating device
TW201229729A (en) * 2011-01-06 2012-07-16 Hon Hai Prec Ind Co Ltd Diversion divice and cooling module having the diversion device
SG10201609616TA (en) 2016-09-06 2018-04-27 Apple Inc Electronic device with cooling fan
CN112577235A (en) * 2017-03-08 2021-03-30 青岛海尔特种电冰柜有限公司 Horizontal air-cooled refrigerator
US10285303B2 (en) * 2017-07-14 2019-05-07 Apple Inc. Electronic device with integrated passive and active cooling
US10757809B1 (en) * 2017-11-13 2020-08-25 Telephonics Corporation Air-cooled heat exchanger and thermal arrangement for stacked electronics
US11249523B2 (en) * 2020-05-06 2022-02-15 Quanta Computer Inc. Adjustable air baffle for directing air flow in a computer system

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Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US5867365A (en) * 1997-06-10 1999-02-02 Chiou; Ming Chin CPU heat sink assembly
CN1909772A (en) * 2005-08-05 2007-02-07 富准精密工业(深圳)有限公司 Heat radiation model set

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102588346A (en) * 2011-01-10 2012-07-18 鸿富锦精密工业（深圳）有限公司 Air-guiding device and radiating module provided with air-guiding device
CN103853251A (en) * 2012-12-04 2014-06-11 鸿富锦精密工业（深圳）有限公司 Electronic device assembly
CN104114008B (en) * 2013-04-17 2017-03-01 建准电机工业股份有限公司 Heat dissipation module and flow guide structure thereof
CN105208841A (en) * 2015-11-11 2015-12-30 林炳彩 Circuit board device assembly with shock absorption function
CN108291726A (en) * 2015-11-24 2018-07-17 三菱电机株式会社 Air conditioner
CN111665910A (en) * 2020-07-06 2020-09-15 惠州市五荣五金电子有限公司 Computer radiator

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