TW201416822A - Heat dissipation apparatus assembly - Google Patents

Heat dissipation apparatus assembly Download PDF

Info

Publication number
TW201416822A
TW201416822A TW101138177A TW101138177A TW201416822A TW 201416822 A TW201416822 A TW 201416822A TW 101138177 A TW101138177 A TW 101138177A TW 101138177 A TW101138177 A TW 101138177A TW 201416822 A TW201416822 A TW 201416822A
Authority
TW
Taiwan
Prior art keywords
air outlet
fins
heat
air inlet
heat sink
Prior art date
Application number
TW101138177A
Other languages
Chinese (zh)
Inventor
Shun-Siang Tu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW101138177A priority Critical patent/TW201416822A/en
Priority to US13/915,793 priority patent/US20140102670A1/en
Publication of TW201416822A publication Critical patent/TW201416822A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation apparatus includes a plurality of parallel fins. A first air inlet is formed at one side of the plurality of parallel fins. A first air outlet is formed at another side of the plurality of parallel fins. An opening is diagonally defined on each of the plurality of parallel fins. An air deflecting slice horizontally extended from a side edge of each of the openings. The air deflecting slices are connected to each two adjacent parallel fins to form an air deflecting panel. A second air outlet is formed at a bottom of the plurality of parallel fins. Airflow from the first air inlet passes through the plurality of parallel fins and is blown out the apparatus via the first air outlet. Airflow from the first air inlet passes through the plurality of parallel fins and is blown out the apparatus via the second air outlet guiding by the air deflecting panel.

Description

散熱裝置組合Heat sink combination

本發明涉及一種散熱裝置組合，尤指一種具有多個出風方向之散熱裝置組合。The invention relates to a heat sink assembly, in particular to a heat sink assembly having a plurality of air outlet directions.

隨著中央處理器等電子元件之輸出功率和工作頻率之不斷提高，其相應產生之熱量亦明顯增多，若不及時排除其產生之熱量，將導致熱量累積引起溫度升高，而嚴重影響電子元件之正常運行。為此，業界通常於該等發熱電子元件表面安裝一散熱器進行輔助散熱，同時於散熱器上加裝一風扇，以加強散熱效果。習知之散熱器只能從單一之出風方向將升溫後之風流排出，散熱效率不高。As the output power and operating frequency of electronic components such as central processing units continue to increase, the corresponding heat generated is also significantly increased. If the heat generated by the central processing unit is not removed in time, the heat accumulation will cause the temperature to rise, which will seriously affect the electronic components. Normal operation. To this end, the industry usually installs a heat sink on the surface of the heat-generating electronic components to assist heat dissipation, and a fan is added to the heat sink to enhance the heat dissipation effect. The conventional radiator can only discharge the warmed air flow from a single air outlet direction, and the heat dissipation efficiency is not high.

鑒於以上內容，有必要提供一種具有多個出風方向之散熱裝置組合。In view of the above, it is necessary to provide a heat sink assembly having a plurality of air outlet directions.

一種散熱裝置，包括一底板、一平行於該底板之頂板、及複數平行設置於該底板和頂板之間之散熱片，該底板和頂板之間於複數散熱片之一側形成一第一進風口，該底板和頂板之間於複數散熱片之另一側形成一第一出風口，每一散熱片上斜向開設一開口，每一開口之上邊緣水平延伸出一擋風片，該擋風片連接於相鄰之兩散熱片之間，複數散熱片之間之擋風片形成一斜向之擋風壁，該底板之一側於複數散熱片之底部形成一第二出風口，來自於該第一進風口之一部分風流經過複數散熱片後自該第一出風口流出，來自於該第一進風口之另一部分風流經過複數散熱片後被該擋風壁導向該第二出風口。A heat dissipating device includes a bottom plate, a top plate parallel to the bottom plate, and a plurality of fins disposed in parallel between the bottom plate and the top plate, and a first air inlet is formed on one side of the plurality of fins between the bottom plate and the top plate A first air outlet is formed on the other side of the plurality of heat sinks, and an opening is obliquely opened on each of the heat sinks. A windshield extends horizontally from the upper edge of each of the openings. Connected between two adjacent fins, the windshield between the plurality of fins forms an oblique windshield wall, one side of the bottom plate forms a second air outlet at the bottom of the plurality of fins, from the A part of the first air inlet passes through the plurality of fins and then flows out from the first air outlet. The other part of the wind from the first air inlet passes through the plurality of fins and is guided by the windshield to the second air outlet.

一種散熱裝置組合，包括一熱源、一散熱器、一連接該熱源和散熱器之熱管、及一安裝於該散熱器上之風扇，該散熱器包括複數平行設置之散熱片，複數散熱片之一側形成一第一進風口，複數散熱片之另一側形成一第一出風口，每一散熱片上斜向開設一開口，每一開口之上邊緣水平延伸出一擋風片，該擋風片連接於相鄰之兩散熱片之間，複數散熱片之間之擋風片形成一斜向之擋風壁，複數散熱片之底部形成一第二出風口，來自於該第一進風口之一部分風流經過複數散熱片後自該第一出風口流出，來自於該第一進風口之另一部分風流經過複數散熱片後被該擋風壁導向該第二出風口。A heat sink assembly includes a heat source, a heat sink, a heat pipe connected to the heat source and the heat sink, and a fan mounted on the heat sink, the heat sink including a plurality of heat sinks disposed in parallel, one of the plurality of heat sinks A first air inlet is formed on the side, and a first air outlet is formed on the other side of the plurality of heat sinks, and an opening is obliquely opened on each of the heat sinks, and a wind shield is horizontally extended from an upper edge of each opening, the wind shield Connected between two adjacent fins, the windshield between the plurality of fins forms an oblique windshield wall, and the bottom of the plurality of fins forms a second air outlet from a part of the first air inlet The wind flow flows from the first air outlet after passing through the plurality of heat sinks, and another portion of the wind flow from the first air inlet passes through the plurality of heat sinks and is guided by the windshield wall to the second air outlet.

相較於習知技術，上述散熱裝置組合可將來自於該第一進風口之一部分風流經過複數散熱片後自該第一出風口流出，來自於該第一進風口之另一部分風流經過複數散熱片後被該擋風壁導向該第二出風口，提高了散熱效率。Compared with the prior art, the heat dissipating device combination may flow a part of the airflow from the first air inlet through the plurality of fins, and then flow out from the first air outlet, and another part of the airflow from the first air inlet passes through the plurality of heat dissipation. After the sheet is guided by the windshield wall to the second air outlet, the heat dissipation efficiency is improved.

請一併參閱圖1至圖3，於本發明一較佳實施方式中，一散熱裝置組合包括一熱源10、一散熱器20、一連接該熱源10和散熱器20之熱管30、及一安裝於該散熱器20上之風扇40。Referring to FIG. 1 to FIG. 3, in a preferred embodiment of the present invention, a heat sink assembly includes a heat source 10, a heat sink 20, a heat pipe 30 connecting the heat source 10 and the heat sink 20, and an installation. A fan 40 on the heat sink 20.

該散熱器20包括一底板21、一平行於該底板21之頂板22、及複數平行設置於該底板21和頂板22之間之散熱片23。該底板21和頂板22之間於複數散熱片23之一側形成一第一進風口24。該底板21和頂板22之間於複數散熱片23之另一側形成一第一出風口25。每一散熱片23上斜向開設一開口231。每一開口231之上邊緣水平延伸出一擋風片232。該擋風片232連接於相鄰之兩散熱片23之間。複數散熱片23之間之擋風片232形成一斜向之擋風壁233。該底板21之一側於複數散熱片23之底部形成一第二出風口26。其中，該開口231呈矩形，複數散熱片23於該第一出風口25位置處呈一弧形面。該擋風片232於豎直方向上之尺寸等於相鄰兩散熱片23之間之間距。The heat sink 20 includes a bottom plate 21, a top plate 22 parallel to the bottom plate 21, and a plurality of fins 23 disposed in parallel between the bottom plate 21 and the top plate 22. A first air inlet 24 is formed on one side of the plurality of fins 23 between the bottom plate 21 and the top plate 22. A first air outlet 25 is formed on the other side of the plurality of fins 23 between the bottom plate 21 and the top plate 22. An opening 231 is obliquely opened in each of the fins 23. A windshield 232 extends horizontally from the upper edge of each opening 231. The windshield 232 is connected between the adjacent two fins 23. The windshield 232 between the plurality of fins 23 forms an oblique windshield wall 233. One of the bottom plates 21 forms a second air outlet 26 at the bottom of the plurality of fins 23. The opening 231 has a rectangular shape, and the plurality of fins 23 have an arcuate surface at the position of the first air outlet 25. The dimension of the windshield 232 in the vertical direction is equal to the distance between the adjacent two fins 23.

該風扇40包括一殼體41和一安裝於該殼體41內可旋轉之葉輪42。該殼體41上開設一第二進風口43和一第三出風口44。該第二進風口43形成之進風通道與該風扇40之轉軸同向，該第三出風口44形成之出風通道與該風扇40之轉軸垂直。The fan 40 includes a housing 41 and an impeller 42 that is rotatable within the housing 41. A second air inlet 43 and a third air outlet 44 are defined in the housing 41. The air inlet passage formed by the second air inlet 43 is in the same direction as the rotation shaft of the fan 40, and the air outlet passage formed by the third air outlet 44 is perpendicular to the rotation axis of the fan 40.

請參閱圖4，安裝時，將該熱管30之一端安裝於該熱源10之底部，將該熱管30之另一端安裝於該散熱器20之底板21上。然後將該風扇40之第三出風口44正對該散熱器20之第一進風口24。Referring to FIG. 4, one end of the heat pipe 30 is mounted on the bottom of the heat source 10, and the other end of the heat pipe 30 is mounted on the bottom plate 21 of the heat sink 20. The third air outlet 44 of the fan 40 is then directed to the first air inlet 24 of the heat sink 20.

工作時，該熱源10產生之熱量經由該熱管30傳導至該散熱器20。來自該風扇40外部之氣流自該第二進風口43沿一第一方向流進該風扇40。該風扇40產生之氣流沿一第二方向流出該第三出風口44並進入該第一進風口24。來自於該第一進風口24之一部分風流經過複數散熱片23後自該第一出風口25流出，來自於該第一進風口24之另一部分風流經過複數散熱片23後被該擋風壁233導向該第二出風口26。來自於該風扇40外部之較低溫度之氣流被源源不斷之吹向該散熱器20，較低溫度之氣流在吸收了該散熱器20上之熱量後可經由該第一出風口25和該第二出風口26流出，提高了該散熱器20之散熱效率。In operation, heat generated by the heat source 10 is conducted to the heat sink 20 via the heat pipe 30. Airflow from the outside of the fan 40 flows into the fan 40 from the second air inlet 43 in a first direction. The airflow generated by the fan 40 flows out of the third air outlet 44 in a second direction and enters the first air inlet 24. A portion of the airflow from the first air inlet 24 passes through the plurality of fins 23 and then flows out from the first air outlet 25, and another portion of the airflow from the first air inlet 24 passes through the plurality of fins 23 and is blocked by the windshield wall 233. The second air outlet 26 is guided. The lower temperature airflow from the outside of the fan 40 is continuously blown toward the heat sink 20, and the lower temperature airflow can absorb the heat on the heat sink 20 through the first air outlet 25 and the first The two air outlets 26 flow out, which improves the heat dissipation efficiency of the heat sink 20.

該散熱裝置組合可將來自於該第一進風口24之一部分風流經過複數散熱片23後自該第一出風口25流出，來自於該第一進風口24之另一部分風流經過複數散熱片23後被該擋風壁233導向該第二出風口26，提高了散熱效率。The heat sink assembly can flow a portion of the airflow from the first air inlet 24 through the plurality of fins 23 and then from the first air outlet 25, and another portion of the airflow from the first air inlet 24 passes through the plurality of fins 23 The windshield 233 is guided to the second air outlet 26 to improve heat dissipation efficiency.

綜上所述，本發明係合乎發明專利申請條件，爰依法提出專利申請。惟，以上所述僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士其所爰依本案之創作精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention is in accordance with the conditions of the invention patent application, and the patent application is filed according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art to the spirit of the present invention should be included in the following claims.

10．．．熱源10. . . Heat source

20．．．散熱器20. . . heat sink

21．．．底板twenty one. . . Bottom plate

22．．．頂板twenty two. . . roof

23．．．散熱片twenty three. . . heat sink

231．．．開口231. . . Opening

232．．．擋風片232. . . Windshield

233．．．擋風壁233. . . Windshield

24．．．第一進風口twenty four. . . First air inlet

25．．．第一出風口25. . . First air outlet

26．．．第二出風口26. . . Second outlet

30．．．熱管30. . . Heat pipe

40．．．風扇40. . . fan

41．．．殼體41. . . case

42．．．葉輪42. . . impeller

43．．．第二進風口43. . . Second air inlet

44．．．第三出風口44. . . Third air outlet

圖1係本發明散熱裝置組合一較佳實施例之一分解圖，該散熱裝置組合包括一散熱器。1 is an exploded view of a preferred embodiment of a heat sink assembly of the present invention, the heat sink assembly including a heat sink.

圖2係圖1之散熱器之一立體圖。Figure 2 is a perspective view of a heat sink of Figure 1.

圖3係圖2沿III-III方向之剖視圖。Figure 3 is a cross-sectional view of Figure 2 taken along the line III-III.

圖4係圖1之一立體組裝圖。Figure 4 is a perspective assembled view of Figure 1.

10．．．熱源10. . . Heat source

20．．．散熱器20. . . heat sink

30．．．熱管30. . . Heat pipe

40．．．風扇40. . . fan

41．．．殼體41. . . case

42．．．葉輪42. . . impeller

43．．．第二進風口43. . . Second air inlet

44．．．第三出風口44. . . Third air outlet

Claims (8)

一種散熱裝置，包括一底板、一平行於該底板之頂板、及複數平行設置於該底板和頂板之間之散熱片，該底板和頂板之間於複數散熱片之一側形成一第一進風口，該底板和頂板之間於複數散熱片之另一側形成一第一出風口，每一散熱片上斜向開設一開口，每一開口之上邊緣水平延伸出一擋風片，該擋風片連接於相鄰之兩散熱片之間，複數散熱片之間之擋風片形成一斜向之擋風壁，該底板之一側於複數散熱片之底部形成一第二出風口，來自於該第一進風口之一部分風流經過複數散熱片後自該第一出風口流出，來自於該第一進風口之另一部分風流經過複數散熱片後被該擋風壁導向該第二出風口。A heat dissipating device includes a bottom plate, a top plate parallel to the bottom plate, and a plurality of fins disposed in parallel between the bottom plate and the top plate, and a first air inlet is formed on one side of the plurality of fins between the bottom plate and the top plate A first air outlet is formed on the other side of the plurality of heat sinks, and an opening is obliquely opened on each of the heat sinks. A windshield extends horizontally from the upper edge of each of the openings. Connected between two adjacent fins, the windshield between the plurality of fins forms an oblique windshield wall, one side of the bottom plate forms a second air outlet at the bottom of the plurality of fins, from the A part of the first air inlet passes through the plurality of fins and then flows out from the first air outlet. The other part of the wind from the first air inlet passes through the plurality of fins and is guided by the windshield to the second air outlet. 如申請專利範圍第1項所述之散熱裝置，其中該擋風片於豎直方向上之尺寸等於相鄰兩散熱片之間之間距。The heat dissipating device of claim 1, wherein the wind deflector has a dimension in a vertical direction equal to a distance between adjacent fins. 如申請專利範圍第1項所述之散熱裝置，其中該開口呈矩形，複數散熱片於該第一出風口位置處呈一弧形面。The heat dissipating device of claim 1, wherein the opening has a rectangular shape, and the plurality of fins have an arcuate surface at the position of the first air outlet. 一種散熱裝置組合，包括一熱源、一散熱器、一連接該熱源和散熱器之熱管、及一安裝於該散熱器上之風扇，該散熱器包括複數平行設置之散熱片，複數散熱片之一側形成一第一進風口，複數散熱片之另一側形成一第一出風口，其中每一散熱片上斜向開設一開口，每一開口之上邊緣水平延伸出一擋風片，該擋風片連接於相鄰之兩散熱片之間，複數散熱片之間之擋風片形成一斜向之擋風壁，複數散熱片之底部形成一第二出風口，來自於該第一進風口之一部分風流經過複數散熱片後自該第一出風口流出，來自於該第一進風口之另一部分風流經過複數散熱片後被該擋風壁導向該第二出風口。A heat sink assembly includes a heat source, a heat sink, a heat pipe connected to the heat source and the heat sink, and a fan mounted on the heat sink, the heat sink including a plurality of heat sinks disposed in parallel, one of the plurality of heat sinks A first air inlet is formed on the side, and a first air outlet is formed on the other side of the plurality of heat sinks, wherein each of the heat sinks has an opening obliquely, and a wind shield extends horizontally from the upper edge of each opening, the wind shield The sheet is connected between the adjacent two fins, and the windshield between the plurality of fins forms an oblique windshield wall, and the bottom of the plurality of fins forms a second air outlet from the first air inlet A part of the wind flow flows out from the first air outlet after passing through the plurality of heat sinks, and another part of the wind flow from the first air inlet passes through the plurality of heat sinks and is guided by the windshield wall to the second air outlet. 如申請專利範圍第4項所述之散熱裝置組合，其中該擋風片於豎直方向上之尺寸等於相鄰兩散熱片之間之間距。The heat sink assembly of claim 4, wherein the windshield has a dimension in a vertical direction equal to a distance between adjacent fins. 如申請專利範圍第4項所述之散熱裝置組合，其中該開口呈矩形，複數散熱片於該第一出風口位置處呈一弧形面。The heat sink assembly of claim 4, wherein the opening has a rectangular shape, and the plurality of heat sinks have an arcuate surface at the first air outlet position. 如申請專利範圍第4項所述之散熱裝置組合，其中該風扇包括一第二進風口和一第三出風口，來自該風扇外部之氣流自該第二進風口沿一第一方向流進該風扇，該風扇產生之氣流沿一第二方向流出該第三出風口，該第三出風口和該第一進風口相連通。The heat sink assembly of claim 4, wherein the fan comprises a second air inlet and a third air outlet, and the airflow from the outside of the fan flows into the first direction from the second air inlet. a fan, the airflow generated by the fan flows out of the third air outlet in a second direction, and the third air outlet is in communication with the first air inlet. 如申請專利範圍第7項所述之散熱裝置組合，其中該第一方向垂直於該第二方向。The heat sink assembly of claim 7, wherein the first direction is perpendicular to the second direction.
TW101138177A 2012-10-17 2012-10-17 Heat dissipation apparatus assembly TW201416822A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101138177A TW201416822A (en) 2012-10-17 2012-10-17 Heat dissipation apparatus assembly
US13/915,793 US20140102670A1 (en) 2012-10-17 2013-06-12 Heat dissipating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101138177A TW201416822A (en) 2012-10-17 2012-10-17 Heat dissipation apparatus assembly

Publications (1)

Publication Number Publication Date
TW201416822A true TW201416822A (en) 2014-05-01

Family

ID=50474321

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101138177A TW201416822A (en) 2012-10-17 2012-10-17 Heat dissipation apparatus assembly

Country Status (2)

Country Link
US (1) US20140102670A1 (en)
TW (1) TW201416822A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016004839A (en) * 2014-06-13 2016-01-12 日本電産株式会社 Heat module
US10379583B2 (en) 2017-04-19 2019-08-13 Facebook Technologies, Llc System for discharging heat out of head-mounted display based on hybrid fan and heat pipe
USD825498S1 (en) * 2017-07-17 2018-08-14 Oculus Vr, Llc Heat sink assembly
TWI691830B (en) * 2018-12-05 2020-04-21 宏碁股份有限公司 Heat dissipation module

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050039890A1 (en) * 2003-08-08 2005-02-24 Lee Hsieh Kun Heat dissipating device and method of making it
TWM244512U (en) * 2003-09-19 2004-09-21 Hon Hai Prec Ind Co Ltd Heat pipe type radiator
TW200528966A (en) * 2004-02-27 2005-09-01 Quanta Comp Inc Heat-dissipating module and structure thereof
CN100493317C (en) * 2005-10-21 2009-05-27 富准精密工业(深圳)有限公司 Radiator
US20070267172A1 (en) * 2006-05-16 2007-11-22 Foxconn Technology Co., Ltd. Heat dissipation apparatus
US20080017350A1 (en) * 2006-07-21 2008-01-24 Foxconn Technology Co., Ltd. Heat sink
US7568518B2 (en) * 2006-07-21 2009-08-04 Furui Precise Component (Kunshan) Co., Ltd. Heat sink
CN101193529B (en) * 2006-11-24 2010-11-10 富准精密工业(深圳)有限公司 Heat radiator
US20080135215A1 (en) * 2006-12-06 2008-06-12 Foxconn Technology Co., Ltd. Heat dissipation device
TW200905457A (en) * 2007-07-30 2009-02-01 Inventec Corp Heat-dissipating module
CN101370371B (en) * 2007-08-17 2011-06-08 富准精密工业(深圳)有限公司 Heat radiation model set and radiator used for the same
CN101676569A (en) * 2008-09-19 2010-03-24 富准精密工业(深圳)有限公司 Heat sink and centrifugal fan applied by same
CN102083296A (en) * 2009-11-27 2011-06-01 鸿富锦精密工业（深圳）有限公司 Heat radiating device

Also Published As

Publication number Publication date
US20140102670A1 (en) 2014-04-17

Similar Documents

Publication Publication Date Title
TWI463939B (en) Electronic device
TWI513400B (en) Heat dissipation device
TWI526624B (en) Electronic device and heat dissipation module and centrifugal blower thereof
TWI537481B (en) Centrifugal fan
CN101832280A (en) Heat-dissipating device, centrifugal fan thereof and electronic device using same
CN101896054A (en) Radiating device
TW201443345A (en) Electronic device and air duct of the same
TW201408179A (en) Airflow guiding member and electronic device having the same
TWM472230U (en) Cooling device of interface card
TW201416822A (en) Heat dissipation apparatus assembly
TW201305794A (en) Electronic device
WO2016086855A2 (en) Electronic terminal device
TWI510896B (en) Heat dissipation device
JP4735214B2 (en) Air conditioner outdoor unit
TW201528908A (en) Computer case
TW201538063A (en) Electronic device and cooling fan thereof
TW201418581A (en) Cooling fan and cooling device with cooling fan
TWI461607B (en) Air-extracting type heat dissipating apparatus
TW201325418A (en) Electronic device
TW201309918A (en) Heat dissipation apparatus
CN103104555B (en) Centrifugal fan
TWI465009B (en) Heat dissipation device and centrifugal fan thereof
TWI564699B (en) Heat sink assembly and graphics card module
TW201524332A (en) Heat sink assembly
TW201440623A (en) Heat dispersion apparatus