USD825498S1 - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
USD825498S1
USD825498S1 US29/610,923 US201729610923F USD825498S US D825498 S1 USD825498 S1 US D825498S1 US 201729610923 F US201729610923 F US 201729610923F US D825498 S USD825498 S US D825498S
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US
United States
Prior art keywords
heat sink
sink assembly
assembly
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/610,923
Inventor
Boyd Drew Allin
Jeffrey Taylor Stellman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meta Platforms Technologies LLC
Original Assignee
Oculus VR Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oculus VR Inc filed Critical Oculus VR Inc
Priority to US29/610,923 priority Critical patent/USD825498S1/en
Assigned to OCULUS VR, LLC reassignment OCULUS VR, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: STELLMAN, Jeffrey Taylor, ALLIN, BOYD DREW
Application granted granted Critical
Publication of USD825498S1 publication Critical patent/USD825498S1/en
Assigned to FACEBOOK TECHNOLOGIES, LLC reassignment FACEBOOK TECHNOLOGIES, LLC CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: OCULUS VR, LLC
Assigned to META PLATFORMS TECHNOLOGIES, LLC reassignment META PLATFORMS TECHNOLOGIES, LLC CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: FACEBOOK TECHNOLOGIES, LLC
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a heat sink assembly, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink assembly, as shown and described.
US29/610,923 2017-07-17 2017-07-17 Heat sink assembly Active USD825498S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/610,923 USD825498S1 (en) 2017-07-17 2017-07-17 Heat sink assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/610,923 USD825498S1 (en) 2017-07-17 2017-07-17 Heat sink assembly

Publications (1)

Publication Number Publication Date
USD825498S1 true USD825498S1 (en) 2018-08-14

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ID=63079429

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/610,923 Active USD825498S1 (en) 2017-07-17 2017-07-17 Heat sink assembly

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US (1) USD825498S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180164042A1 (en) * 2016-12-08 2018-06-14 Microsoft Technology Licensing, Llc Lost wax cast vapor chamber device
USD917402S1 (en) * 2017-08-22 2021-04-27 Foxconn Interconnect Technology Limited Protective cap

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080105410A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation apparatus
US7589972B2 (en) * 2007-05-26 2009-09-15 Hon Hai Precision Ind. Co., Ltd. Electrical connector with clip mechanism
USD609198S1 (en) * 2009-03-19 2010-02-02 Xigmatek Co., Ltd. Back plate for a heat sink
US7965512B2 (en) * 2009-02-03 2011-06-21 Quanta Computer Inc. Heat-dissipation module and electronic device using the same
US20110186269A1 (en) * 2010-02-04 2011-08-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module
US20130070419A1 (en) * 2011-09-21 2013-03-21 Hon Hai Precision Industry Co., Ltd. Electronic device with heat dissipating module
US20130070418A1 (en) * 2011-09-21 2013-03-21 Foxconn Technology Co., Ltd. Heat dissipation module
US20130077242A1 (en) * 2011-09-23 2013-03-28 Inventec Corporation Fan structure and electronic device applied with the same
US20130077251A1 (en) * 2011-09-27 2013-03-28 Hon Hai Precision Industry Co., Ltd. Heat sink mounting device
US20140102670A1 (en) * 2012-10-17 2014-04-17 Hon Hai Precision Industry Co., Ltd. Heat dissipating apparatus
US20140182818A1 (en) * 2012-12-29 2014-07-03 Hon Hai Precision Industry Co., Ltd. Heat sink
USD708592S1 (en) * 2012-10-20 2014-07-08 Apple Inc. Thermal device
US20140290908A1 (en) * 2013-04-02 2014-10-02 Quanta Computer, Inc. Heat dissipation module
US20150192369A1 (en) * 2013-02-11 2015-07-09 Google Inc. Variable thickness heat pipe
US20150330716A1 (en) * 2014-05-18 2015-11-19 Asia Vital Components Co., Ltd. Base plate fixing structure for a heat dissipating module
US20160131442A1 (en) * 2014-11-11 2016-05-12 Tsung-Hsien Huang Heat sink and mounting bracket arrangement
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080105410A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation apparatus
US7589972B2 (en) * 2007-05-26 2009-09-15 Hon Hai Precision Ind. Co., Ltd. Electrical connector with clip mechanism
US7965512B2 (en) * 2009-02-03 2011-06-21 Quanta Computer Inc. Heat-dissipation module and electronic device using the same
USD609198S1 (en) * 2009-03-19 2010-02-02 Xigmatek Co., Ltd. Back plate for a heat sink
US20110186269A1 (en) * 2010-02-04 2011-08-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module
US20130070419A1 (en) * 2011-09-21 2013-03-21 Hon Hai Precision Industry Co., Ltd. Electronic device with heat dissipating module
US20130070418A1 (en) * 2011-09-21 2013-03-21 Foxconn Technology Co., Ltd. Heat dissipation module
US20130077242A1 (en) * 2011-09-23 2013-03-28 Inventec Corporation Fan structure and electronic device applied with the same
US20130077251A1 (en) * 2011-09-27 2013-03-28 Hon Hai Precision Industry Co., Ltd. Heat sink mounting device
US20140102670A1 (en) * 2012-10-17 2014-04-17 Hon Hai Precision Industry Co., Ltd. Heat dissipating apparatus
USD708592S1 (en) * 2012-10-20 2014-07-08 Apple Inc. Thermal device
US20140182818A1 (en) * 2012-12-29 2014-07-03 Hon Hai Precision Industry Co., Ltd. Heat sink
US20150192369A1 (en) * 2013-02-11 2015-07-09 Google Inc. Variable thickness heat pipe
US20140290908A1 (en) * 2013-04-02 2014-10-02 Quanta Computer, Inc. Heat dissipation module
US20150330716A1 (en) * 2014-05-18 2015-11-19 Asia Vital Components Co., Ltd. Base plate fixing structure for a heat dissipating module
US20160131442A1 (en) * 2014-11-11 2016-05-12 Tsung-Hsien Huang Heat sink and mounting bracket arrangement
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
eBay, "HP EliteBook 11.6″ 2170p Genuine Laptop CPU Cooling Heatsink 693307-001 GLP*", Accessed Jun. 4, 2018. (https://www.ebay.com/itm/HP-EliteBook-11-6-2170p-Genuine-Laptop-CPU-Cooling-Heatsink-693307-001-GLP/282691921487). *
eBay, "New Genuine Toshiba CPU Heatsink C670 C675 C675D Series", first sold on Jul. 1, 2017. (https://www.ebay.com/itm/H000026370-13N0-Y3A0W02-NEW-GENUINE-TOSHIBA-CPU-HEATSINK-C670-C675-C675D-SERIES/142315100462). *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180164042A1 (en) * 2016-12-08 2018-06-14 Microsoft Technology Licensing, Llc Lost wax cast vapor chamber device
US10451356B2 (en) * 2016-12-08 2019-10-22 Microsoft Technology Licensing, Llc Lost wax cast vapor chamber device
USD917402S1 (en) * 2017-08-22 2021-04-27 Foxconn Interconnect Technology Limited Protective cap

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