USD825498S1 - Heat sink assembly - Google Patents
Heat sink assembly Download PDFInfo
- Publication number
- USD825498S1 USD825498S1 US29/610,923 US201729610923F USD825498S US D825498 S1 USD825498 S1 US D825498S1 US 201729610923 F US201729610923 F US 201729610923F US D825498 S USD825498 S US D825498S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- sink assembly
- assembly
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
Claims (1)
- The ornamental design for a heat sink assembly, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/610,923 USD825498S1 (en) | 2017-07-17 | 2017-07-17 | Heat sink assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/610,923 USD825498S1 (en) | 2017-07-17 | 2017-07-17 | Heat sink assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
USD825498S1 true USD825498S1 (en) | 2018-08-14 |
Family
ID=63079429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/610,923 Active USD825498S1 (en) | 2017-07-17 | 2017-07-17 | Heat sink assembly |
Country Status (1)
Country | Link |
---|---|
US (1) | USD825498S1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180164042A1 (en) * | 2016-12-08 | 2018-06-14 | Microsoft Technology Licensing, Llc | Lost wax cast vapor chamber device |
USD917402S1 (en) * | 2017-08-22 | 2021-04-27 | Foxconn Interconnect Technology Limited | Protective cap |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080105410A1 (en) * | 2006-11-03 | 2008-05-08 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
US7589972B2 (en) * | 2007-05-26 | 2009-09-15 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector with clip mechanism |
USD609198S1 (en) * | 2009-03-19 | 2010-02-02 | Xigmatek Co., Ltd. | Back plate for a heat sink |
US7965512B2 (en) * | 2009-02-03 | 2011-06-21 | Quanta Computer Inc. | Heat-dissipation module and electronic device using the same |
US20110186269A1 (en) * | 2010-02-04 | 2011-08-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module |
US20130070419A1 (en) * | 2011-09-21 | 2013-03-21 | Hon Hai Precision Industry Co., Ltd. | Electronic device with heat dissipating module |
US20130070418A1 (en) * | 2011-09-21 | 2013-03-21 | Foxconn Technology Co., Ltd. | Heat dissipation module |
US20130077242A1 (en) * | 2011-09-23 | 2013-03-28 | Inventec Corporation | Fan structure and electronic device applied with the same |
US20130077251A1 (en) * | 2011-09-27 | 2013-03-28 | Hon Hai Precision Industry Co., Ltd. | Heat sink mounting device |
US20140102670A1 (en) * | 2012-10-17 | 2014-04-17 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating apparatus |
US20140182818A1 (en) * | 2012-12-29 | 2014-07-03 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
USD708592S1 (en) * | 2012-10-20 | 2014-07-08 | Apple Inc. | Thermal device |
US20140290908A1 (en) * | 2013-04-02 | 2014-10-02 | Quanta Computer, Inc. | Heat dissipation module |
US20150192369A1 (en) * | 2013-02-11 | 2015-07-09 | Google Inc. | Variable thickness heat pipe |
US20150330716A1 (en) * | 2014-05-18 | 2015-11-19 | Asia Vital Components Co., Ltd. | Base plate fixing structure for a heat dissipating module |
US20160131442A1 (en) * | 2014-11-11 | 2016-05-12 | Tsung-Hsien Huang | Heat sink and mounting bracket arrangement |
USD785578S1 (en) * | 2016-03-22 | 2017-05-02 | Asm Ip Holding B.V. | Substrate supporting arm for semiconductor manufacturing apparatus |
-
2017
- 2017-07-17 US US29/610,923 patent/USD825498S1/en active Active
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080105410A1 (en) * | 2006-11-03 | 2008-05-08 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
US7589972B2 (en) * | 2007-05-26 | 2009-09-15 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector with clip mechanism |
US7965512B2 (en) * | 2009-02-03 | 2011-06-21 | Quanta Computer Inc. | Heat-dissipation module and electronic device using the same |
USD609198S1 (en) * | 2009-03-19 | 2010-02-02 | Xigmatek Co., Ltd. | Back plate for a heat sink |
US20110186269A1 (en) * | 2010-02-04 | 2011-08-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module |
US20130070419A1 (en) * | 2011-09-21 | 2013-03-21 | Hon Hai Precision Industry Co., Ltd. | Electronic device with heat dissipating module |
US20130070418A1 (en) * | 2011-09-21 | 2013-03-21 | Foxconn Technology Co., Ltd. | Heat dissipation module |
US20130077242A1 (en) * | 2011-09-23 | 2013-03-28 | Inventec Corporation | Fan structure and electronic device applied with the same |
US20130077251A1 (en) * | 2011-09-27 | 2013-03-28 | Hon Hai Precision Industry Co., Ltd. | Heat sink mounting device |
US20140102670A1 (en) * | 2012-10-17 | 2014-04-17 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating apparatus |
USD708592S1 (en) * | 2012-10-20 | 2014-07-08 | Apple Inc. | Thermal device |
US20140182818A1 (en) * | 2012-12-29 | 2014-07-03 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
US20150192369A1 (en) * | 2013-02-11 | 2015-07-09 | Google Inc. | Variable thickness heat pipe |
US20140290908A1 (en) * | 2013-04-02 | 2014-10-02 | Quanta Computer, Inc. | Heat dissipation module |
US20150330716A1 (en) * | 2014-05-18 | 2015-11-19 | Asia Vital Components Co., Ltd. | Base plate fixing structure for a heat dissipating module |
US20160131442A1 (en) * | 2014-11-11 | 2016-05-12 | Tsung-Hsien Huang | Heat sink and mounting bracket arrangement |
USD785578S1 (en) * | 2016-03-22 | 2017-05-02 | Asm Ip Holding B.V. | Substrate supporting arm for semiconductor manufacturing apparatus |
Non-Patent Citations (2)
Title |
---|
eBay, "HP EliteBook 11.6″ 2170p Genuine Laptop CPU Cooling Heatsink 693307-001 GLP*", Accessed Jun. 4, 2018. (https://www.ebay.com/itm/HP-EliteBook-11-6-2170p-Genuine-Laptop-CPU-Cooling-Heatsink-693307-001-GLP/282691921487). * |
eBay, "New Genuine Toshiba CPU Heatsink C670 C675 C675D Series", first sold on Jul. 1, 2017. (https://www.ebay.com/itm/H000026370-13N0-Y3A0W02-NEW-GENUINE-TOSHIBA-CPU-HEATSINK-C670-C675-C675D-SERIES/142315100462). * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180164042A1 (en) * | 2016-12-08 | 2018-06-14 | Microsoft Technology Licensing, Llc | Lost wax cast vapor chamber device |
US10451356B2 (en) * | 2016-12-08 | 2019-10-22 | Microsoft Technology Licensing, Llc | Lost wax cast vapor chamber device |
USD917402S1 (en) * | 2017-08-22 | 2021-04-27 | Foxconn Interconnect Technology Limited | Protective cap |
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