US20140102670A1 - Heat dissipating apparatus - Google Patents

Heat dissipating apparatus Download PDF

Info

Publication number
US20140102670A1
US20140102670A1 US13/915,793 US201313915793A US2014102670A1 US 20140102670 A1 US20140102670 A1 US 20140102670A1 US 201313915793 A US201313915793 A US 201313915793A US 2014102670 A1 US2014102670 A1 US 2014102670A1
Authority
US
United States
Prior art keywords
air
fins
air outlet
heat sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/915,793
Inventor
Shun-Siang Tu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TU, SHUN-SIANG
Publication of US20140102670A1 publication Critical patent/US20140102670A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to heat dissipating apparatuses, more particularly to a heat dissipating apparatus for CPU.
  • Heat dissipating apparatus performs the critical function of removing heat from a computer system.
  • a fan is provided to dissipate heat from an electronic component, such as a CPU. Air is directed out of the computer system by the fan, for dissipating heat generated by the CPU.
  • the air outlet on the computer is the element which will decrease heat dissipating efficiency of the computer system, when the air flows out of the computer. Therefore, there is room for improvement within the art.
  • FIG. 1 is an isometric, exploded view of a heat dissipating apparatus in accordance with an embodiment.
  • FIG. 2 is an isometric view of a heat sink of the heat dissipating apparatus of FIG. 1 .
  • FIG. 3 is a cross-sectional view of the heat dissipating apparatus of FIG. 2 , taken along a line III-III.
  • FIG. 4 is an assembled view of the heat dissipating apparatus of FIG. 1 .
  • FIGS. 1 and 2 illustrate a heat dissipating apparatus in accordance with an embodiment for dissipating heat generated by an electronic component 10 , such as a CPU.
  • the heat dissipating apparatus comprises a heat sink 20 , a heat pipe 30 , and a fan 40 .
  • the heat pipe 30 is connected to the heat sink 20 and the electronic component 10
  • the fan 40 is attached to the heat sink 20 .
  • the heat sink 20 comprises a bottom panel 21 , a top panel 22 substantially parallel to the bottom panel 21 , and a plurality of fins 23 located between the bottom panel 21 an the top panel 22 .
  • each of the plurality of fins 23 is substantially perpendicular to the bottom panel 21 .
  • An air intake 24 is defined between the bottom panel 21 and the top panel 22 .
  • An opening 231 is defined in each of the plurality of fins 23 and slanted relative to the bottom panel 21 .
  • An air guiding piece 232 substantially perpendicular to each of the plurality of fins 23 , extends from a top edge of the opening 231 .
  • the plurality of air guiding pieces 232 on the plurality of fins 23 together define an air guiding wall 233 .
  • the air guiding wall 233 is slanted towards the bottom panel 21 .
  • a first air outlet 25 opposite to the air intake 24 , is defined in a first side of the plurality of fins 23 .
  • a second air outlet 26 is defined in the bottom panel 21 , and located in a second side of the plurality of fins 23 , that is substantially perpendicular to the first side the plurality of fins 23 .
  • the opening 231 is substantially rectangular.
  • a distal end of each of the plurality of fins 23 located on the first air outlet 25 , is substantially arcuate.
  • a width of the air guiding piece 232 is substantially equal to a distance between every two adjacent fins of the plurality of fins 23 , so that the air guiding piece 232 can cover the gap between every two adjacent fins.
  • the fan 40 comprises an enclosure 41 and a impeller 42 located in the enclosure 41 .
  • the impeller 42 spins about an axis on the center of the enclosure 41 .
  • the enclosure 41 defines a fan air intake 43 and a fan air outlet 44 .
  • An air intake passage way defined by the fan air intake 43 is substantially perpendicular to an air outlet passage way defined by the fan air outlet 44 .
  • FIG. 4 shows that, in assembly, a first end of the heat pipe 30 is secured to the bottom portion of the electronic component 10 , and a second end of the heat pipe 30 is secured to the bottom panel 21 by means such as by soldering.
  • the heat generated by the electronic component 10 is transferred to the heat sink 20 .
  • Air from the outside of the fan 40 flows into the enclosure 41 via the fan air intake 43 , and out of the enclosure 41 via the fan air outlet 44 . Then, the air flows into the heat sink 20 via the air intake 24 . A first part of the air flows out of the heat sink 20 via the first air outlet 25 .
  • the air guiding wall 233 guides a second part of the air to flow out of the heat sink 20 via the second air outlet 26 .

Abstract

A heat dissipating apparatus includes a heat-generating electronic component, a heat pipe, a heat sink. The heat sink includes a bottom panel, a top panel, and a plurality of fins. An air intake is defined between the bottom panel and the top panel. The plurality of fins defines a first air outlet and a second air outlet. An air guiding wall extends through the plurality of fins. The air intake, the air guiding wall, and the first air outlet together define a first air passage for air extending through the heat sink, and the air intake, the air guiding wall, and the second air outlet together define a second air passage for air extending through the heat sink. The invention further provides an assembly with the heat dissipating apparatus.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to heat dissipating apparatuses, more particularly to a heat dissipating apparatus for CPU.
  • 2. Description of Related Art
  • Heat dissipating apparatus performs the critical function of removing heat from a computer system. For example, a fan is provided to dissipate heat from an electronic component, such as a CPU. Air is directed out of the computer system by the fan, for dissipating heat generated by the CPU. Usually, the air outlet on the computer is the element which will decrease heat dissipating efficiency of the computer system, when the air flows out of the computer. Therefore, there is room for improvement within the art.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an isometric, exploded view of a heat dissipating apparatus in accordance with an embodiment.
  • FIG. 2 is an isometric view of a heat sink of the heat dissipating apparatus of FIG. 1.
  • FIG. 3 is a cross-sectional view of the heat dissipating apparatus of FIG. 2, taken along a line III-III.
  • FIG. 4 is an assembled view of the heat dissipating apparatus of FIG. 1.
    •  DETAILED DESCRIPTION
  • The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
  • FIGS. 1 and 2 illustrate a heat dissipating apparatus in accordance with an embodiment for dissipating heat generated by an electronic component 10, such as a CPU. The heat dissipating apparatus comprises a heat sink 20, a heat pipe 30, and a fan 40. The heat pipe 30 is connected to the heat sink 20 and the electronic component 10, and the fan 40 is attached to the heat sink 20.
  • The heat sink 20 comprises a bottom panel 21, a top panel 22 substantially parallel to the bottom panel 21, and a plurality of fins 23 located between the bottom panel 21 an the top panel 22. In one embodiment, each of the plurality of fins 23 is substantially perpendicular to the bottom panel 21. An air intake 24 is defined between the bottom panel 21 and the top panel 22. An opening 231 is defined in each of the plurality of fins 23 and slanted relative to the bottom panel 21. An air guiding piece 232, substantially perpendicular to each of the plurality of fins 23, extends from a top edge of the opening 231. The plurality of air guiding pieces 232 on the plurality of fins 23 together define an air guiding wall 233. The air guiding wall 233 is slanted towards the bottom panel 21. A first air outlet 25, opposite to the air intake 24, is defined in a first side of the plurality of fins 23. A second air outlet 26 is defined in the bottom panel 21, and located in a second side of the plurality of fins 23, that is substantially perpendicular to the first side the plurality of fins 23. In one embodiment, the opening 231 is substantially rectangular. A distal end of each of the plurality of fins 23, located on the first air outlet 25, is substantially arcuate. A width of the air guiding piece 232 is substantially equal to a distance between every two adjacent fins of the plurality of fins 23, so that the air guiding piece 232 can cover the gap between every two adjacent fins.
  • The fan 40 comprises an enclosure 41 and a impeller 42 located in the enclosure 41. The impeller 42 spins about an axis on the center of the enclosure 41. The enclosure 41 defines a fan air intake 43 and a fan air outlet 44. An air intake passage way defined by the fan air intake 43 is substantially perpendicular to an air outlet passage way defined by the fan air outlet 44.
  • FIG. 4 shows that, in assembly, a first end of the heat pipe 30 is secured to the bottom portion of the electronic component 10, and a second end of the heat pipe 30 is secured to the bottom panel 21 by means such as by soldering.
  • In use, the heat generated by the electronic component 10 is transferred to the heat sink 20. Air from the outside of the fan 40 flows into the enclosure 41 via the fan air intake 43, and out of the enclosure 41 via the fan air outlet 44. Then, the air flows into the heat sink 20 via the air intake 24. A first part of the air flows out of the heat sink 20 via the first air outlet 25. The air guiding wall 233 guides a second part of the air to flow out of the heat sink 20 via the second air outlet 26. Thus, the heat generated from the electronic component 10 can be effectively removed.
  • It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (13)

What is claimed is:
1. A heat dissipating apparatus comprising:
a heat pipe; a first end of the heat pipe connected to an electronic component; and
a heat sink connected to a second end of the heat pipe; the heat sink comprises a bottom panel, a top panel, and a plurality of fins located between the bottom panel and the top panel; an air intake defined between the bottom panel and the top panel; the plurality of fins defining a first air outlet and a second air outlet that is substantially perpendicular to the first air outlet; the first air outlet is opposite to the air intake; and an air guiding wall extending through the plurality of fins;
wherein the air intake, the air guiding wall, and the first air outlet together defines a first air passage for air flowing through the heat sink; and the air intake, the air guiding wall, and the second air outlet together defines a second air passage for air flowing through the heat sink.
2. The heat dissipating apparatus of claim 1, wherein an air guiding piece perpendicularly extends from each of the plurality of fins, and the air guiding wall is defined by the air guiding piece of each of the plurality of fins.
3. The heat dissipating apparatus of claim 2, wherein the air guiding piece is slanted relative to the bottom panel.
4. The heat dissipating apparatus of claim 2, wherein each of the plurality of fins defines an opening, and the air guiding piece extends from an edge of the opening.
5. The heat dissipating apparatus of claim 2, wherein a width of the air guiding piece is substantially equal to a distance between every two adjacent fins of the plurality of fins.
6. The heat dissipating apparatus of claim 1, wherein a distal end of each of the plurality of fins is substantially arcuate.
7. An assembly comprising:
an electronic component;
a heat sink comprising a bottom panel, a top panel, and a plurality of fins located between the bottom panel and the top panel; an air intake defined between the bottom panel and the top panel; the plurality of fins defining a first air outlet and a second air outlet substantially perpendicular to the first air outlet; the first air outlet opposite to the air intake; an air guiding wall extending through the plurality of fins;
a heat pipe connected to the electronic component and the heat sink; and
a fan, attached to the heat sink, comprising a fan air intake and a fan air outlet;
wherein air outside of the fan flows into the fan via the fan air intake, through the fan air outlet and into the heat sink via the air intake, a first part of the air flows out of the heat sink via the first air outlet, and a second part of the air flows out of the heat sink via the second air outlet by the air guiding wall.
8. The assembly of claim 7, wherein an air guiding piece perpendicularly extends from each of the plurality of fins, and the air guiding wall is defined by the air guiding piece of each of the plurality of fins.
9. The assembly of claim 8, wherein the air guiding piece is slanted relative to the bottom panel.
10. The assembly of claim 8, wherein each of the plurality of fins defines an opening, and the air guiding piece extends from an edge of the opening.
11. The assembly of claim 8, wherein a width of the air guiding piece is substantially equal to a distance between every adjacent two of the plurality of fins.
12. The assembly of claim 7, wherein a distal end of each of the plurality of fins is substantially arcuate.
13. The assembly of claim 7, wherein the electronic component is a CPU.
US13/915,793 2012-10-17 2013-06-12 Heat dissipating apparatus Abandoned US20140102670A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101138177A TW201416822A (en) 2012-10-17 2012-10-17 Heat dissipation apparatus assembly
TW101138177 2012-10-17

Publications (1)

Publication Number Publication Date
US20140102670A1 true US20140102670A1 (en) 2014-04-17

Family

ID=50474321

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/915,793 Abandoned US20140102670A1 (en) 2012-10-17 2013-06-12 Heat dissipating apparatus

Country Status (2)

Country Link
US (1) US20140102670A1 (en)
TW (1) TW201416822A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150362258A1 (en) * 2014-06-13 2015-12-17 Nidec Corporation Heat module
USD825498S1 (en) * 2017-07-17 2018-08-14 Oculus Vr, Llc Heat sink assembly
US10379583B2 (en) 2017-04-19 2019-08-13 Facebook Technologies, Llc System for discharging heat out of head-mounted display based on hybrid fan and heat pipe
US10928869B2 (en) * 2018-12-05 2021-02-23 Acer Incorporated Heat dissipation module

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050039890A1 (en) * 2003-08-08 2005-02-24 Lee Hsieh Kun Heat dissipating device and method of making it
US20050190538A1 (en) * 2004-02-27 2005-09-01 Quanta Computer Inc. Heat-dissipating module and structure thereof
US20070089869A1 (en) * 2005-10-21 2007-04-26 Foxconn Technology Co., Ltd. Heat sink
US7243708B2 (en) * 2003-09-19 2007-07-17 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Radiator with streamline airflow guiding structure
US20070267172A1 (en) * 2006-05-16 2007-11-22 Foxconn Technology Co., Ltd. Heat dissipation apparatus
US20080017350A1 (en) * 2006-07-21 2008-01-24 Foxconn Technology Co., Ltd. Heat sink
US20080121372A1 (en) * 2006-11-24 2008-05-29 Foxconn Technology Co., Ltd. Heat dissipation device
US20080135215A1 (en) * 2006-12-06 2008-06-12 Foxconn Technology Co., Ltd. Heat dissipation device
US20090034196A1 (en) * 2007-07-30 2009-02-05 Inventec Corporation Heat-dissipating module
US20090046428A1 (en) * 2007-08-17 2009-02-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module and fin assembly thereof
US7568518B2 (en) * 2006-07-21 2009-08-04 Furui Precise Component (Kunshan) Co., Ltd. Heat sink
US20100071875A1 (en) * 2008-09-19 2010-03-25 Furui Precise Component (Kunshan) Co., Ltd. Heat dissipation device and centrifugal fan thereof
US20110127012A1 (en) * 2009-11-27 2011-06-02 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd . Heat dissipation device

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050039890A1 (en) * 2003-08-08 2005-02-24 Lee Hsieh Kun Heat dissipating device and method of making it
US7243708B2 (en) * 2003-09-19 2007-07-17 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Radiator with streamline airflow guiding structure
US20050190538A1 (en) * 2004-02-27 2005-09-01 Quanta Computer Inc. Heat-dissipating module and structure thereof
US20070089869A1 (en) * 2005-10-21 2007-04-26 Foxconn Technology Co., Ltd. Heat sink
US20070267172A1 (en) * 2006-05-16 2007-11-22 Foxconn Technology Co., Ltd. Heat dissipation apparatus
US7568518B2 (en) * 2006-07-21 2009-08-04 Furui Precise Component (Kunshan) Co., Ltd. Heat sink
US20080017350A1 (en) * 2006-07-21 2008-01-24 Foxconn Technology Co., Ltd. Heat sink
US20080121372A1 (en) * 2006-11-24 2008-05-29 Foxconn Technology Co., Ltd. Heat dissipation device
US20080135215A1 (en) * 2006-12-06 2008-06-12 Foxconn Technology Co., Ltd. Heat dissipation device
US20090034196A1 (en) * 2007-07-30 2009-02-05 Inventec Corporation Heat-dissipating module
US20090046428A1 (en) * 2007-08-17 2009-02-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module and fin assembly thereof
US20100071875A1 (en) * 2008-09-19 2010-03-25 Furui Precise Component (Kunshan) Co., Ltd. Heat dissipation device and centrifugal fan thereof
US20110127012A1 (en) * 2009-11-27 2011-06-02 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd . Heat dissipation device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150362258A1 (en) * 2014-06-13 2015-12-17 Nidec Corporation Heat module
US9909813B2 (en) * 2014-06-13 2018-03-06 Nidec Corporation Heat module
US10379583B2 (en) 2017-04-19 2019-08-13 Facebook Technologies, Llc System for discharging heat out of head-mounted display based on hybrid fan and heat pipe
US10656690B2 (en) 2017-04-19 2020-05-19 Facebook Technologies, Llc System for discharging heat out of head-mounted display based on hybrid fan and heat pipe
US11029730B2 (en) 2017-04-19 2021-06-08 Facebook Technologies, Llc System for discharging heat out of head-mounted display based on hybrid fan
US11435784B2 (en) 2017-04-19 2022-09-06 Meta Platforms Technologies, Llc System for discharging heat out of head-mounted display
USD825498S1 (en) * 2017-07-17 2018-08-14 Oculus Vr, Llc Heat sink assembly
US10928869B2 (en) * 2018-12-05 2021-02-23 Acer Incorporated Heat dissipation module

Also Published As

Publication number Publication date
TW201416822A (en) 2014-05-01

Similar Documents

Publication Publication Date Title
US8514574B2 (en) Heat dissipating apparatus
US8395892B2 (en) Air duct and computer system with the air duct
US20120327589A1 (en) Computer system with airflow guiding duct
US8749975B2 (en) Computer system with airflow guiding duct
US8462497B2 (en) Computer system
US8564948B2 (en) Electronic device
US8335082B2 (en) Heat dissipating apparatus
US9206813B2 (en) Centrifugal fan
US20110292580A1 (en) Airflow duct
US8659894B2 (en) Computer system with heat dissipation apparatus
US8737070B2 (en) Heat dissipation system
US20140160671A1 (en) Motherboard cooling system
US20140102670A1 (en) Heat dissipating apparatus
US8737060B2 (en) Computer system with airflow guiding duct
US9155222B2 (en) Electronic device
US20130155611A1 (en) Electronic device having dust cleaning apparatus
US20120120595A1 (en) Computer system with airflow guiding duct
US8120909B2 (en) Computer system with airflow guiding duct
US20140218864A1 (en) Electronic device with cooling assembly
US20120289142A1 (en) Heat dissipation assembly for electronic device
US20120044641A1 (en) Electronic device
US8941986B2 (en) Computer system
US8804329B2 (en) Computer system including a heat dissipating apparatus
US8587942B2 (en) Heat dissipating apparatus and electronic device with heat dissipating apparatus
US20130014920A1 (en) Heat sink assembly

Legal Events

Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TU, SHUN-SIANG;REEL/FRAME:030594/0294

Effective date: 20130610

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION