US20150330716A1 - Base plate fixing structure for a heat dissipating module - Google Patents

Base plate fixing structure for a heat dissipating module Download PDF

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Publication number
US20150330716A1
US20150330716A1 US14/280,618 US201414280618A US2015330716A1 US 20150330716 A1 US20150330716 A1 US 20150330716A1 US 201414280618 A US201414280618 A US 201414280618A US 2015330716 A1 US2015330716 A1 US 2015330716A1
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United States
Prior art keywords
base plate
groove
fixing
heat dissipating
heat pipe
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Abandoned
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US14/280,618
Inventor
Xiang Chen
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Asia Vital Components Co Ltd
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Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to US14/280,618 priority Critical patent/US20150330716A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, XIANG
Publication of US20150330716A1 publication Critical patent/US20150330716A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/08—Fastening; Joining by clamping or clipping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Heat dissipating devices and heat dissipating modules generally comprise varying combinations of a plurality of identical or diverse heat dissipating components.
  • These heat dissipating components may be heat pipes, heat sinks, heat dissipating base plates, and so on. They are generally assembled and fixed by soldering. But when soldering aluminum heat dissipating components, some preliminary procedures are required before carrying out a special soldering process. Not only is the manufacturing process complicated and the manufacturing cost increased, but harmful substances are also produced and pollute the environment.
  • a base plate fixing structure for a heat dissipating module which comprises a base plate and a plurality of fixing components.
  • a through groove At a center of the base plate is disposed a through groove.
  • a holding and engaging part extending and protruding inwards.
  • On two sides of the through groove are respectively disposed two or more than two corresponding fixing holes.
  • On two ends of the through groove are respectively disposed a containing rod arching upwards.
  • the plurality of fixing components includes a horizontal section and vertical sections extending downwards from two ends of the horizontal section.
  • the holding and engaging part disposed at a bottom edge of the through groove of the base plate is an arc extending inwards.
  • the vertical sections of the fixing components are slightly bigger than the hole size of the fixing holes on the base plate, so that when pressed into the fixing holes the vertical sections are tightly snapped fit to the fixing holes.
  • the vertical sections of the fixing components may also be configured as bending upwards to form a V shape from bottom ends to produce appropriate flexibility, so that after passing through the fixing holes the vertical sections are tightly snapped fit to the fixing holes.
  • the horizontal section of the fixing components may be configured as containing arcs bending downwards near the vertical sections to produce appropriate flexibility and facilitate pressing down of the heat pipe for fixing.
  • the fixing structure for a heat dissipating module of the present invention facilitates assembly of a heat dissipating module at a reduced cost. It also reduces the thickness and weight of a heat dissipating module with improved quality.
  • FIG. 1 is a pictorial drawing of a conventional heat dissipating module
  • FIG. 2 is a pictorial break-down drawing of a base plate and a heat pipe of the present invention
  • FIG. 3 is a pictorial drawing of a base plate and a heat pipe of the present invention.
  • FIG. 4 is a pictorial drawing of a heat dissipating module of the present invention.
  • FIG. 5 is a view of the present invention during assembly
  • FIG. 8 is a view of a third preferred embodiment of the present invention during assembly.
  • FIG. 9 is a view of a fourth preferred embodiment of the present invention during assembly.
  • FIGS. 2 and 3 along with FIGS. 4 , 5 , and 6 , showing respectively a pictorial break-down drawing of a base plate and a heat pipe of the present invention, a pictorial drawing of a base plate and a heat pipe of the present invention, a pictorial drawing of a heat dissipating module of the present invention, a view of the present invention during assembly, and a cross-sectional view of the present invention after assembly.
  • the present invention includes a base plate 4 , heat dissipating fins 5 , a heat pipe 6 connected to the base plate 4 and the heat dissipating fins 5 , and fixing components 7 for fixing the heat pipe 6 .
  • the plurality of fixing components 7 each includes a horizontal section 71 and vertical sections 72 extending downwards from two ends of the horizontal section 71 .
  • the vertical sections 72 of the fixing components 7 are slightly bigger than the hole size of the fixing holes 42 of the base plate 4 for having the vertical sections 72 tightly snapped fit to the fixing holes 42 .
  • one end of the heat pipe 6 is run through the through groove 41 of the base plate 4 with the containing rod 43 above and the holding and engaging part 411 below limiting its position.
  • the fixing components 7 are joined to the fixing holes 42 through their vertical sections 72 .
  • the horizontal sections 71 of the fixing components 7 are used to press the heat pipe 6 so that the heat pipe 6 is tightly fixed to the base plate 4 .
  • the fore-going combination facilitates the assembly of a base plate 4 for a heat dissipating module at a reduced assembly cost.
  • FIGS. 5 and 6 along with FIG. 3 .
  • the heat pipe 6 is run through the through groove 41 of the base plate 4 .
  • a holding and engaging part 411 configured as an arc extending and protruding inwards.
  • the holding and engaging part 411 holds a bottom edge of one end of the heat pipe 6 , and the position of the upper edge of the heat pipe 6 is limited by the containing rod 43 to prevent the heat pipe 6 from coming off.
  • the vertical sections 72 of the fixing components 7 are snapped fit to the fixing holes 42 on the base plate 4 .
  • the horizontal sections 71 of the fixing components 7 are pressed to tightly snap fit the heat pipe 6 to the base plate 4 .
  • FIGS. 7 and 8 showing views of a second and a third embodiment of the present invention during assembly.
  • the vertical sections 72 of the fixing components 7 of the present invention may also be configured as bending upwards to form a V shape from bottom ends to produce appropriate flexibility, so that after passing through the fixing holes 42 the vertical sections 72 are tightly snapped fit to the fixing holes 42 .
  • the present invention Compared with the assembly of a conventional heat dissipating module, the present invention has at least the following advantages:

Abstract

A base plate fixing structure for a heat dissipating module includes a base plate and a plurality of fixing components. At a center of the base plate is disposed a through groove. At a bottom edge of the through groove is disposed a holding and engaging part extending and protruding inwards. On two sides of the through groove are respectively disposed two or more than two corresponding fixing holes. On two ends of the through groove are respectively disposed a containing rod arching upwards. The plurality of fixing components each includes a horizontal section and vertical sections extending downwards from two ends of the horizontal section. During assembly, one end of the heat pipe is run through the through groove of the base plate with the containing rod and the holding and engaging part limiting its position. The fixing components are joined to the fixing holes through their vertical sections. The horizontal sections are used to press the heat pipe so that the heat pipe is tightly fixed to the base plate. The fore-going combination facilitates the assembly of a heat dissipating module at a reduced assembly cost.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a base plate fixing structure for a heat dissipating module, particularly to a base plate fixing structure for a heat dissipating module which facilitates the assembly of a base plate and a heat pipe for a heat dissipating module at a reduced assembly cost.
  • 2. Description of Related Art
  • Existing CPUs in laptops usually generate a huge amount of heat energy in working states, which causes the temperature of electronic components to rise. Without adequate heat dissipation, those electronic components will overheat, which may destabilize their operation and may even cause the entire electronic device to stop working or crash. As the working speed of all kinds of electronic components is constantly improved, the amount of heat energy generated in working states also increases greatly and may burn down the CPU completely. Therefore, heat dissipating devices for all kinds of chips have become a major issue nowadays.
  • Current heat dissipating devices and heat dissipating modules generally comprise varying combinations of a plurality of identical or diverse heat dissipating components. These heat dissipating components may be heat pipes, heat sinks, heat dissipating base plates, and so on. They are generally assembled and fixed by soldering. But when soldering aluminum heat dissipating components, some preliminary procedures are required before carrying out a special soldering process. Not only is the manufacturing process complicated and the manufacturing cost increased, but harmful substances are also produced and pollute the environment.
  • As FIG. 1 shows, a heat pipe is connected to a heat dissipating plate and heat dissipating fins. A CPU is fixed to a bottom edge of the heat dissipating plate. The heat energy generated by the CPU is conducted by the heat pipe and dissipated through the heat dissipating fins. In a conventional process of manufacturing a heat dissipating module, the heat pipe is assembled using tin soldering. In the process, the material is first plated with nickel and then soldered with tin solder when being assembled. But this conventional process of assembly has the following drawbacks:
  • 1. The material cost of nickel-plating and tin soldering is high. They will also generate harmful substances and pollute the environment.
  • 2. It is less effective in conducting heat.
  • In view of this, after laborious research and experiments, the applicant has devised a fixing structure for a heat dissipating module which facilitates the assembly of a heat dissipating module at a reduced assembly cost.
    • SUMMARY OF THE INVENTION
  • It is an object of the present invention to provide a base plate fixing structure for a heat dissipating module which facilitates the assembly of a heat dissipating module by doing without the process of soldering and reduces the assembly cost.
  • It is another object of the present invention to provide a base plate fixing structure for a heat dissipating module which comprises a base plate and a plurality of fixing components. At a center of the base plate is disposed a through groove. At a bottom edge of the through groove is disposed a holding and engaging part extending and protruding inwards. On two sides of the through groove are respectively disposed two or more than two corresponding fixing holes. On two ends of the through groove are respectively disposed a containing rod arching upwards. The plurality of fixing components includes a horizontal section and vertical sections extending downwards from two ends of the horizontal section. During assembly, one end of the heat pipe is run through the through groove of the base plate with the containing rod and the holding and engaging part limiting its position. The fixing components are joined to the fixing holes through their vertical sections. The horizontal sections are used to press the heat pipe so that the heat pipe is tightly fixed to the base plate. The fore-going combination facilitates the assembly of a heat dissipating module at a reduced assembly cost.
  • Further, the holding and engaging part disposed at a bottom edge of the through groove of the base plate is an arc extending inwards. Further, the vertical sections of the fixing components are slightly bigger than the hole size of the fixing holes on the base plate, so that when pressed into the fixing holes the vertical sections are tightly snapped fit to the fixing holes. Further, the vertical sections of the fixing components may also be configured as bending upwards to form a V shape from bottom ends to produce appropriate flexibility, so that after passing through the fixing holes the vertical sections are tightly snapped fit to the fixing holes. Further, the horizontal section of the fixing components may be configured as containing arcs bending downwards near the vertical sections to produce appropriate flexibility and facilitate pressing down of the heat pipe for fixing.
  • The fixing structure for a heat dissipating module of the present invention facilitates assembly of a heat dissipating module at a reduced cost. It also reduces the thickness and weight of a heat dissipating module with improved quality.
    • BRIEF DESCRIPTION OF THE INVENTION
  • FIG. 1 is a pictorial drawing of a conventional heat dissipating module;
  • FIG. 2 is a pictorial break-down drawing of a base plate and a heat pipe of the present invention;
  • FIG. 3 is a pictorial drawing of a base plate and a heat pipe of the present invention;
  • FIG. 4 is a pictorial drawing of a heat dissipating module of the present invention;
  • FIG. 5 is a view of the present invention during assembly;
  • FIG. 6 is a cross-sectional view of the present invention after assembly.
  • FIG. 7 is a view of a second preferred embodiment of the present invention during assembly.
  • FIG. 8 is a view of a third preferred embodiment of the present invention during assembly.
  • FIG. 9 is a view of a fourth preferred embodiment of the present invention during assembly.
  • FIG. 10 is a view of a fifth preferred embodiment of the present invention during assembly.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Please refer to FIGS. 2 and 3, along with FIGS. 4, 5, and 6, showing respectively a pictorial break-down drawing of a base plate and a heat pipe of the present invention, a pictorial drawing of a base plate and a heat pipe of the present invention, a pictorial drawing of a heat dissipating module of the present invention, a view of the present invention during assembly, and a cross-sectional view of the present invention after assembly. As the figures show, the present invention includes a base plate 4, heat dissipating fins 5, a heat pipe 6 connected to the base plate 4 and the heat dissipating fins 5, and fixing components 7 for fixing the heat pipe 6. At a center of the base plate 4 is disposed a through groove 41. At a bottom edge of the through groove 41 is disposed a holding and engaging part 411 extending and protruding inwards. On two sides of the through groove 41 are respectively disposed two or more than two corresponding fixing holes 42 (two fixing holes 42 are respectively disposed on two sides of the through groove 41 in this preferred embodiment). On two ends of the through groove 41 are respectively disposed a containing rod 43 arching upwards. The plurality of fixing components 7 each includes a horizontal section 71 and vertical sections 72 extending downwards from two ends of the horizontal section 71. The vertical sections 72 of the fixing components 7 are slightly bigger than the hole size of the fixing holes 42 of the base plate 4 for having the vertical sections 72 tightly snapped fit to the fixing holes 42.
  • During assembly, one end of the heat pipe 6 is run through the through groove 41 of the base plate 4 with the containing rod 43 above and the holding and engaging part 411 below limiting its position. The fixing components 7 are joined to the fixing holes 42 through their vertical sections 72. The horizontal sections 71 of the fixing components 7 are used to press the heat pipe 6 so that the heat pipe 6 is tightly fixed to the base plate 4. The fore-going combination facilitates the assembly of a base plate 4 for a heat dissipating module at a reduced assembly cost.
  • Please refer to FIGS. 5 and 6, along with FIG. 3. As the figures show, during assembly, the heat pipe 6 is run through the through groove 41 of the base plate 4. On a bottom edge of the through groove 41 is disposed a holding and engaging part 411 configured as an arc extending and protruding inwards. When the heat pipe 6 is run through the through groove 41, the holding and engaging part 411 holds a bottom edge of one end of the heat pipe 6, and the position of the upper edge of the heat pipe 6 is limited by the containing rod 43 to prevent the heat pipe 6 from coming off. Further, the vertical sections 72 of the fixing components 7 are snapped fit to the fixing holes 42 on the base plate 4. The horizontal sections 71 of the fixing components 7 are pressed to tightly snap fit the heat pipe 6 to the base plate 4.
  • Please refer to FIGS. 7 and 8, showing views of a second and a third embodiment of the present invention during assembly. As the figures show, the vertical sections 72 of the fixing components 7 of the present invention may also be configured as bending upwards to form a V shape from bottom ends to produce appropriate flexibility, so that after passing through the fixing holes 42 the vertical sections 72 are tightly snapped fit to the fixing holes 42.
  • Please refer to FIGS. 9 and 10, showing views of a fourth and a fifth embodiment of the present invention during assembly. As the figures show, the horizontal sections 71 of the fixing components 7 may be configured as containing arcs bending downwards near the vertical sections 72 to produce appropriate flexibility, so that after passing through the fixing holes 42 the vertical sections 72 are tightly snapped fit to the fixing holes 42 and press the heat pipe 6 down by means of the downward bending arcs.
  • Compared with the assembly of a conventional heat dissipating module, the present invention has at least the following advantages:
  • 1. No nickel-plating and tin soldering are needed to assemble the present invention, which reduces its material cost and is eco-friendly.
  • 2. It is more efficient in conducting heat.
  • 3. Its production cost is reduced.
  • The fore-going preferred embodiments of the present invention are illustrated of the present invention rather than limiting of the present invention. It is intended to cover various modifications and changes included within the spirit and scope of the appended claims, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structures.
  • In view of the foregoing considerations, the present invention relates to a fixing structure for a heat dissipating module comprising a base plate with a through groove and fixing holes, and fixing components for fixing. It facilitates the assembly of a base plate and a heat pipe of a heat dissipating module at a reduced assembly cost and is also eco-friendly.

Claims (4)

What is claimed is:
1. A fixing structure for a heat dissipating module, comprising:
a base plate, at a center of the base plate is disposed a through groove, at a bottom edge of the through groove is disposed a holding and engaging part extending and protruding inwards, on two sides of the through groove are respectively disposed two or more than two corresponding fixing holes, and on two ends of the through groove are respectively disposed a containing rod arching upwards;
a plurality of fixing components, each comprising a horizontal section and vertical sections extending downwards from two ends of the horizontal section;
a heat pipe, one end of the heat pipe is disposed inside the through groove;
wherein during assembly, one end of the heat pipe is run through the through groove of the base plate with the containing rod above and the holding and engaging part below limiting its position, the fixing components are joined to the fixing holes through their vertical sections, the horizontal sections are used to press the heat pipe, and the heat pipe is tightly fixed to the base plate through the fixing components.
2. The base plate fixing structure for a heat dissipating module of claim 1, wherein the holding and engaging part disposed at a bottom edge of the through groove of the base plate is configured as an arc extending and protruding inwards.
3. The base plate fixing structure for a heat dissipating module of claim 1, wherein the vertical sections of the fixing component are slightly bigger than the hole size of the fixing holes of the base plate, so that when pressed into the fixing holes the vertical sections are tightly snapped fit to the fixing holes.
4. The base plate fixing structure for a heat dissipating module of claim 1, wherein the vertical sections of the fixing component may also be configured as bending upwards to form a V shape from bottom ends to produce appropriate flexibility.
US14/280,618 2014-05-18 2014-05-18 Base plate fixing structure for a heat dissipating module Abandoned US20150330716A1 (en)

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USD825498S1 (en) * 2017-07-17 2018-08-14 Oculus Vr, Llc Heat sink assembly
US10379583B2 (en) 2017-04-19 2019-08-13 Facebook Technologies, Llc System for discharging heat out of head-mounted display based on hybrid fan and heat pipe
US11425842B2 (en) * 2020-09-14 2022-08-23 Hewlett Packard Enterprise Development Lp Thermal design of an access point
US20220369512A1 (en) * 2021-05-12 2022-11-17 Lenovo (Singapore) Pte. Ltd. Electronic apparatus, cooling device, and method for manufacturing cooling device

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