TWI513400B - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- TWI513400B TWI513400B TW100131184A TW100131184A TWI513400B TW I513400 B TWI513400 B TW I513400B TW 100131184 A TW100131184 A TW 100131184A TW 100131184 A TW100131184 A TW 100131184A TW I513400 B TWI513400 B TW I513400B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat dissipation
- adjacent
- heat sink
- distance
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
本發明涉及一種散熱裝置，特別涉及一種適用於發熱電子元件的散熱裝置。 The invention relates to a heat dissipating device, in particular to a heat dissipating device suitable for heating electronic components.
隨著電子產業的飛速發展，電子元件(如中央處理器)運行速度的不斷提升，運行時產生大量的熱量，使其本身及系統溫度升高，繼而影響其系統的穩定性。為確保電子元件能正常運行，通常在其上安裝一散熱裝置，排出其所產生的熱量。 With the rapid development of the electronics industry, electronic components (such as central processing units) continue to increase in speed, generate a large amount of heat during operation, and increase the temperature of the system itself, which in turn affects the stability of the system. In order to ensure the normal operation of the electronic components, a heat sink is usually mounted thereon to discharge the heat generated by the components.
習知的散熱裝置通常包括一散熱器，並於該散熱器的一側設置一散熱風扇，通過該散熱風扇由外界吸入氣流並吹向散熱器以將其熱量帶走。然而，散熱風扇由外界吸入的氣流中往往會帶有大量的粉塵，且由於散熱風扇吹出的冷卻氣流的強度不等，而散熱器的散熱片間等間距設置，從而使粉塵集中於由冷卻氣流強的區域開始被散熱風扇吹向散熱器，導致散熱器於靠近散熱風扇的一側被粉塵堆積而影響其散熱性能。 Conventional heat sinks generally include a heat sink, and a heat dissipating fan is disposed on one side of the heat sink, through which the airflow is drawn from the outside and blown toward the heat sink to carry away the heat. However, the airflow from the outside of the cooling fan tends to carry a large amount of dust, and the intensity of the cooling airflow blown by the cooling fan is not equal, and the fins of the radiator are equally spaced, so that the dust is concentrated by the cooling airflow. The strong area begins to be blown toward the heat sink by the cooling fan, causing the heat sink to be deposited on the side close to the cooling fan to affect its heat dissipation performance.
有鑒於此，有必要提供一種可防止粉塵堆積的散熱裝置。 In view of this, it is necessary to provide a heat sink that prevents dust from accumulating.
一種散熱裝置，包括散熱器及設於該散熱器一側的散熱風扇，該散熱風扇對應散熱器具有一出風口，該散熱風扇於出風口處具有至少一強風區及弱風區，所述散熱器包括對應所述強風區的第一 散熱鰭片組及對應所述弱風區的第二散熱鰭片組，所述第一散熱鰭片組由複數第一散熱片排列而成，每相鄰的兩第一散熱片間形成第一氣流通道，所述第二散熱鰭片組由複數第二散熱片排列而成，每相鄰的兩第二散熱片間形成第二氣流通道，每相鄰兩第一散熱片之間的距離大於每相鄰兩第二散熱片之間的距離。 A heat dissipating device includes a heat sink and a heat dissipating fan disposed on a side of the heat sink. The heat dissipating fan has an air outlet corresponding to the heat sink, and the heat dissipating fan has at least one strong wind zone and a weak wind zone at the air outlet, the radiator Including the first corresponding to the strong wind zone a heat dissipation fin group and a second heat dissipation fin group corresponding to the weak wind region, wherein the first heat dissipation fin group is formed by a plurality of first heat dissipation fins, and each of the two adjacent first heat dissipation fins forms a first An air flow channel, the second heat dissipation fin group is formed by a plurality of second heat dissipation fins, and a second air flow channel is formed between each adjacent two second heat dissipation fins, and a distance between each adjacent two first heat dissipation fins is greater than The distance between each adjacent two second fins.
與習知技術相比，該散熱裝置中的第一散熱鰭片組及第二散熱鰭片組分別與強風區級弱風區對應，且每相鄰兩第一散熱片之間的距離大於每相鄰兩第二散熱片之間的距離，從而使散熱風扇由外界吸入的氣流中所帶有的粉塵由第一氣流通道的一側進入到散熱器內，再通過第一氣流通道的導引由第一氣流通道的另一側吹出，進而防止粉塵於散熱器上的堆積而影響散熱性能。 Compared with the prior art, the first heat dissipation fin group and the second heat dissipation fin group in the heat dissipation device respectively correspond to the strong wind zone level weak wind zone, and the distance between each adjacent two first heat sinks is greater than each The distance between the adjacent two second fins, so that the dust carried in the airflow sucked by the external fan from the outside enters into the radiator from one side of the first airflow passage, and then passes through the guiding of the first airflow passage It is blown out from the other side of the first air flow passage, thereby preventing the accumulation of dust on the heat sink and affecting the heat dissipation performance.
100‧‧‧散熱裝置 100‧‧‧heating device
10‧‧‧第一吸熱板 10‧‧‧First heat absorbing plate
20‧‧‧第二吸熱板 20‧‧‧second heat absorbing plate
30‧‧‧散熱器 30‧‧‧ radiator
31‧‧‧凹槽 31‧‧‧ Groove
32‧‧‧入風面 32‧‧‧Into the wind
33‧‧‧出風面 33‧‧‧Out of the wind
40‧‧‧第一散熱鰭片組 40‧‧‧First heat sink fin set
42‧‧‧第一散熱片 42‧‧‧First heat sink
43‧‧‧第一氣流通道 43‧‧‧First airflow channel
44‧‧‧第三散熱片 44‧‧‧ Third heat sink
50‧‧‧第二散熱鰭片組 50‧‧‧Second heat sink fin set
52‧‧‧第二散熱片 52‧‧‧second heat sink
53‧‧‧第二氣流通道 53‧‧‧Second airflow channel
60‧‧‧第一熱管 60‧‧‧First heat pipe
70‧‧‧第二熱管 70‧‧‧second heat pipe
80‧‧‧散熱風扇 80‧‧‧ cooling fan
81‧‧‧底座 81‧‧‧Base
82‧‧‧葉輪 82‧‧‧ Impeller
83‧‧‧蓋板 83‧‧‧ cover
84‧‧‧底板 84‧‧‧floor
85‧‧‧側壁 85‧‧‧ side wall
86‧‧‧入風口 86‧‧‧Air inlet
87‧‧‧出風口 87‧‧‧air outlet
88‧‧‧舌部 88‧‧ ‧Tongue
89‧‧‧強風區 89‧‧‧Strong wind zone
90‧‧‧弱風區 90‧‧‧ weak wind zone
420、440、520‧‧‧本體 420, 440, 520‧‧‧ ontology
422、442、522‧‧‧折邊 422, 442, 522‧ ‧ hem
423、523‧‧‧第一折邊 423, 523‧‧‧ first hem
425、525‧‧‧第二折邊 425, 525‧‧‧ second hem
圖1為本發明散熱裝置的一實施例的立體組裝圖。 1 is an assembled, isometric view of an embodiment of a heat sink of the present invention.
圖2為圖1所示散熱裝置的另一角度的立體分解圖。 2 is an exploded perspective view of another angle of the heat sink shown in FIG. 1.
圖3為圖2所示散熱裝置的散熱器的部分分解圖。 3 is a partially exploded view of the heat sink of the heat sink shown in FIG. 2.
圖4為圖1所示散熱裝置去除吸熱板及熱管後的流場示意圖。 4 is a schematic view of a flow field after the heat sink of FIG. 1 removes the heat absorbing plate and the heat pipe.
如圖1及圖2所示，該散熱裝置100包括第一吸熱板10、第二吸熱板20、散熱器30、連接於第一吸熱板10與散熱器30之間的第一熱管60、連接於第二吸熱板20與散熱器30之間的第二熱管70及設於該散熱器30一側的散熱風扇80。 As shown in FIG. 1 and FIG. 2, the heat sink 100 includes a first heat absorbing plate 10, a second heat absorbing plate 20, a heat sink 30, a first heat pipe 60 connected between the first heat absorbing plate 10 and the heat sink 30, and a connection. The second heat pipe 70 between the second heat absorbing plate 20 and the heat sink 30 and the heat radiating fan 80 provided on the heat sink 30 side.
所述第一吸熱板10及第二吸熱板20均由銅等導熱性能良好的金屬製成，其下表面分別用於與一電子元件連接以吸收該電子元件所 產生的熱量。 The first heat absorbing plate 10 and the second heat absorbing plate 20 are made of a metal having good thermal conductivity such as copper, and the lower surface thereof is respectively connected to an electronic component to absorb the electronic component. The heat generated.
所述第一熱管60的一端及第二熱管70的一端分別與第一吸熱板10及第二吸熱板20連接，另一端與散熱器30連接，以將不同的電子元件所產生的熱量傳導至散熱器30上，再通過該散熱器30向外散發。 One end of the first heat pipe 60 and one end of the second heat pipe 70 are respectively connected to the first heat absorbing plate 10 and the second heat absorbing plate 20, and the other end is connected to the heat sink 30 to conduct heat generated by different electronic components to The heat sink 30 is then radiated outward through the heat sink 30.
該散熱器30大致為方塊狀，其頂端設有一凹槽31，以用於收容第一熱管60及第二熱管70。該散熱器30靠近散熱風扇80的一側面為入風面32，遠離該散熱風扇80的一側為出風面33。該散熱器30包括並排設置的兩個第一散熱鰭片組40及一第二散熱鰭片組50，且兩第一散熱鰭片組40分別位於第二散熱鰭片組50的相對兩側端。 The heat sink 30 has a substantially square shape, and a top end of the heat sink 30 is provided with a recess 31 for receiving the first heat pipe 60 and the second heat pipe 70. One side of the heat sink 30 adjacent to the heat dissipation fan 80 is an air inlet surface 32, and the side away from the heat dissipation fan 80 is an air outlet surface 33. The heat sink 30 includes two first heat dissipation fin sets 40 and a second heat dissipation fin set 50 , and the two first heat dissipation fin sets 40 are respectively located at opposite sides of the second heat dissipation fin set 50 . .
請同時參閱圖3，每一第一散熱鰭片組40由複數第一散熱片42排列而成，每相鄰的兩第一散熱片42間形成一第一氣流通道43。每一第一散熱片42包括一本體420及由本體420的相對兩側彎折延伸形成的折邊422。每一折邊422包括靠近入風面32的第一折邊423及靠近出風面33的第二折邊425。所述第一折邊423的寬度大於第二折邊425的寬度，本實施例中第一折邊423的寬度為第二折邊425的寬度的2倍。每一第一散熱鰭片組40還包括複數第三散熱片44。各第三散熱片44與第一散熱片42交替設置，且分別位於各第一氣流通道43內於靠近出風面33的一端而未延伸至入風面32。本實施例中，各第三散熱片44分別位於第一氣流通道43於靠近出風面33一端的正中間，從而使每相鄰兩第一散熱片42之間的距離為每一第一散熱片42與其相鄰的第三散熱片44之間的距離的2倍。每一第三散熱片44包括一本體440及由本體440的相對兩側彎折延伸形成的折邊442。該本體440由出風面33向入風面32延伸的長度 與第二折邊425對應的本體420的長度相同，所述第三散熱片44的折邊442的長度及寬度分別與第一散熱片42的第二折邊425的長度及寬度相同。 Referring to FIG. 3 , each of the first heat dissipation fin sets 40 is formed by a plurality of first heat dissipation fins 42 , and a first air flow passage 43 is formed between each adjacent two first heat dissipation fins 42 . Each of the first fins 42 includes a body 420 and a flange 422 formed by bending and extending from opposite sides of the body 420. Each of the flanges 422 includes a first flange 423 adjacent to the wind inlet surface 32 and a second flange 425 adjacent the wind outlet surface 33. The width of the first flange 423 is greater than the width of the second flange 425. In this embodiment, the width of the first flange 423 is twice the width of the second flange 425. Each of the first fins 40 further includes a plurality of third fins 44. Each of the third fins 44 and the first fins 42 are alternately disposed, and are respectively located at one end of each of the first airflow passages 43 near the windward surface 33 and do not extend to the wind inlet surface 32. In this embodiment, each of the third heat dissipation fins 44 is located in the middle of the first air flow passage 43 near the end of the air outlet surface 33, so that the distance between each adjacent two first heat sinks 42 is the first heat dissipation. The distance between the sheet 42 and its adjacent third fin 44 is twice. Each of the third fins 44 includes a body 440 and a flange 442 formed by bending and extending from opposite sides of the body 440. The length of the body 440 extending from the windward surface 33 toward the windward surface 32 The length of the body 420 corresponding to the second flange 425 is the same, and the length and width of the flange 442 of the third heat sink 44 are the same as the length and width of the second flange 425 of the first heat sink 42 respectively.
該第二散熱鰭片組50由複數第二散熱片52排列而成，每相鄰的兩第二散熱片52間形成一第二氣流通道53。本實施例中，該散熱器30的最外側還分別設有一第二散熱片52，具體實施時，亦可於散熱器30的最外側不設置第二散熱片52。每一第二散熱片52的結構與第一散熱片42的結構大體相同，其包括一本體520及由本體520的相對兩側延伸形成的折邊522，所述折邊522包括第一折邊523及第二折邊525。每一第二散熱片52的結構與第一散熱片42的結構不同之處在於：第二散熱片52的第二折邊525的寬度與第一折邊523的寬度相同，且均小於第一散熱片42的第一折邊423的寬度，從而使每相鄰兩第一散熱片42之間的距離大於每相鄰兩第二散熱片52之間的距離。本實施例中，每一第二散熱片52的第一折邊523及第二折邊525的寬度均與第一散熱片42的第二折邊425的寬度相同，從而使每相鄰兩第二散熱片52之間的距離與每一第一散熱片42與其相鄰的第三散熱片44之間的距離相等。 The second heat dissipation fin group 50 is formed by a plurality of second heat dissipation fins 52, and a second air flow passage 53 is formed between each adjacent two second heat dissipation fins 52. In this embodiment, a second heat sink 52 is further disposed on the outermost side of the heat sink 30. In the specific implementation, the second heat sink 52 may not be disposed on the outermost side of the heat sink 30. Each of the second heat sinks 52 has substantially the same structure as the first heat sink 42 and includes a body 520 and a flange 522 extending from opposite sides of the body 520. The flange 522 includes a first flange. 523 and second hem 525. The structure of each second heat sink 52 is different from that of the first heat sink 42 in that the width of the second flange 525 of the second heat sink 52 is the same as the width of the first flange 523, and is smaller than the first one. The width of the first flange 423 of the heat sink 42 is such that the distance between each adjacent two first fins 42 is greater than the distance between each adjacent two second fins 52. In this embodiment, the widths of the first flange 523 and the second flange 525 of each second heat sink 52 are the same as the width of the second flange 425 of the first heat sink 42 so that each adjacent two The distance between the two fins 52 is equal to the distance between each of the first fins 42 and the third fin 44 adjacent thereto.
組裝散熱器30時，各第一散熱片42、第二散熱片52及第三散熱片44通過折邊422、522、442與其相鄰的本體420、520、440相抵靠，並通過折邊422、522、442上設有相互配合的卡扣結構(圖未示)而固定連接。所述第一散熱片42的第一折邊423及第二散熱片52的第一折邊523的頂端形成該凹槽31的表面。 When the heat sink 30 is assembled, the first heat sink 42, the second heat sink 52, and the third heat sink 44 abut against the adjacent bodies 420, 520, 440 by the flanges 422, 522, 442, and pass through the flange 422. 522, 442 are provided with a matching snap structure (not shown) and fixedly connected. The first flange 423 of the first heat sink 42 and the top end of the first flange 523 of the second heat sink 52 form a surface of the groove 31.
該散熱風扇80為一離心風扇，其包括一底座81及收容於該底座81內的一葉輪82及蓋設於該底座81上的一蓋板83。該底座81包括一 底板84及由底板周緣向上延伸形成的一側壁85，該底板84及蓋板83上分別設有一入風口86，所述側壁85為一渦形壁，其對應散熱器30的一側開設一出風口87。該側壁85上還設有一向內突出的舌部88。請同時參閱圖4，使用時，所述葉輪82旋轉帶動外界氣流由入風口86進入後由出風口87吹出，該吹出的氣流於出風口87處的兩側分別形成一強風區89，於出風口87的中間形成一弱風區90，由於所述兩個第一散熱鰭片組40分別與各強風區89相對應，第二散熱鰭片組50與弱風區90對應，且每相鄰兩第一散熱片42之間的距離大於每相鄰兩第二散熱片52之間的距離，從而使散熱風扇80由外界吸入的氣流中所帶有的粉塵由第一氣流通道43的入風面32進入到第一氣流通道43內，再通過第一氣流通道43的導引由其出風面33吹出，進而防止粉塵於散熱器30上的堆積而影響散熱性能。另外，由於每相鄰兩第二散熱片52之間的距離與每一第一散熱片42與其相鄰的第三散熱片44之間的距離相等，即散熱器30於出風面33的一側仍保持習知散熱器的散熱片間的標準間距，從而防止外界的雜物由散熱器30的出風面33進入到散熱器30內而影響散熱裝置的性能。 The cooling fan 80 is a centrifugal fan, and includes a base 81 and an impeller 82 received in the base 81 and a cover 83 disposed on the base 81. The base 81 includes a a bottom plate 84 and a side wall 85 extending upward from the periphery of the bottom plate. The bottom plate 84 and the cover plate 83 are respectively provided with an air inlet 86. The side wall 85 is a scroll wall, and a side wall corresponding to the heat sink 30 is opened. Tuyere 87. The side wall 85 is also provided with an inwardly projecting tongue 88. Referring to FIG. 4 at the same time, in use, the impeller 82 rotates to drive the external airflow to enter the air inlet 86, and then is blown out by the air outlet 87. The blown airflow forms a strong wind zone 89 on both sides of the air outlet 87, respectively. A weak wind zone 90 is formed in the middle of the air outlet 87. Since the two first heat dissipation fin sets 40 respectively correspond to the strong wind zones 89, the second heat radiation fin group 50 corresponds to the weak wind zone 90, and each adjacent The distance between the two first fins 42 is greater than the distance between each adjacent two second fins 52, so that the dust carried in the airflow sucked by the external fan 80 from the outside is ventilated by the first airflow passage 43. The surface 32 enters the first air flow passage 43 and is guided by the first air flow passage 43 to be blown out by the air outlet surface 33, thereby preventing the accumulation of dust on the heat sink 30 and affecting the heat dissipation performance. In addition, since the distance between each adjacent two second heat sinks 52 is equal to the distance between each of the first heat sinks 42 and the third heat sink 44 adjacent thereto, that is, one of the heat sinks 30 on the wind surface 33 The side still maintains the standard spacing between the heat sinks of the conventional heat sink, thereby preventing external debris from entering the heat sink 30 from the air outlet surface 33 of the heat sink 30 and affecting the performance of the heat sink.
具體實施時，該散熱器30及散熱風扇80的結構不限於本實施例的情況，如散熱風扇80上可以不設有舌部88，從而散熱風扇80只有一個強風區89，即強風區89及弱風區90分別位於散熱風扇80於出風口87處的相對兩側，同時，散熱器30的結構亦對應的改變，即只包含一個第一散熱鰭片組40對應該強風區89設置，弱風區90對應設有第二散熱鰭片組50。所述第一散熱鰭片組40的結構亦不限於本實施例的情況，其亦可為每相鄰兩第一散熱片42之間的距離大於每相鄰兩第二散熱片52之間的距離，且每一第一散熱片42與 其相鄰的第三散熱片44之間的距離不大於每相鄰兩第二散熱片52之間的距離的其他結構。 In the specific implementation, the structure of the heat sink 30 and the heat dissipation fan 80 is not limited to the case of the embodiment. For example, the heat dissipation fan 80 may not have the tongue 88, so that the heat dissipation fan 80 has only one strong wind zone 89, that is, the strong wind zone 89 and The weak wind zones 90 are respectively located on opposite sides of the air-dissipating fan 80 at the air outlet 87. At the same time, the structure of the heat sink 30 is correspondingly changed, that is, only one first heat-dissipating fin group 40 is disposed corresponding to the strong wind zone 89, which is weak. The wind zone 90 is correspondingly provided with a second heat sink fin set 50. The structure of the first heat dissipation fin group 40 is not limited to the case of the embodiment, and the distance between each adjacent two first heat sinks 42 may be greater than between each adjacent two second heat sinks 52. Distance, and each first heat sink 42 The other structure in which the distance between the adjacent third fins 44 is not greater than the distance between each adjacent two second fins 52.
可以理解的是，對於本領域的普通技術人員來說，可以根據本發明的技術構思做出其他各種像應的改變與變形，而所有這些改變與變形都應屬於本發明權利要求的保護範圍。 It is to be understood that those skilled in the art can make various changes and modifications of the various embodiments in accordance with the present invention, and all such changes and modifications are intended to fall within the scope of the appended claims.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
40‧‧‧第一散熱鰭片組 40‧‧‧First heat sink fin set
50‧‧‧第二散熱鰭片組 50‧‧‧Second heat sink fin set
82‧‧‧葉輪 82‧‧‧ Impeller
87‧‧‧出風口 87‧‧‧air outlet
89‧‧‧強風區 89‧‧‧Strong wind zone
90‧‧‧弱風區 90‧‧‧ weak wind zone
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102508151A CN102958325A (en) | 2011-08-29 | 2011-08-29 | Radiating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201311128A TW201311128A (en) | 2013-03-01 |
| TWI513400B true TWI513400B (en) | 2015-12-11 |
Family
ID=47741948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100131184A TWI513400B (en) | 2011-08-29 | 2011-08-31 | Heat dissipation device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20130048256A1 (en) |
| CN (1) | CN102958325A (en) |
| TW (1) | TWI513400B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102958324B (en) * | 2011-08-29 | 2015-03-25 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| JP6277608B2 (en) * | 2013-06-21 | 2018-02-14 | 株式会社リコー | Cooling structure, image projection device, electronic equipment |
| CN104349639A (en) * | 2013-07-24 | 2015-02-11 | 酷码科技股份有限公司 | Heat dissipation module |
| US9261924B2 (en) * | 2013-09-05 | 2016-02-16 | Dell Inc. | Heat pipe assemblies |
| JP2016009003A (en) * | 2014-06-23 | 2016-01-18 | 株式会社リコー | Cooling device, image projector, and electronic apparatus |
| TWI568342B (en) * | 2014-06-27 | 2017-01-21 | 台達電子工業股份有限公司 | Heat dissipating fin assembly |
| TWI594688B (en) * | 2014-11-14 | 2017-08-01 | 廣達電腦股份有限公司 | Heat dissipating module |
| CN107153451A (en) * | 2016-03-02 | 2017-09-12 | 昆山新力精密五金有限公司 | Semi-open fan-shaped groups of fins |
| CN108804845B (en) * | 2018-06-20 | 2020-03-31 | 西安交通大学 | Heat dissipation device cooling channel generation type design method based on non-grid Galerkin method |
| CN208445912U (en) * | 2018-07-02 | 2019-01-29 | 深圳市大疆创新科技有限公司 | Radiating subassembly and remote controler |
| CN110389642A (en) * | 2019-08-27 | 2019-10-29 | 广东虹勤通讯技术有限公司 | Radiator fan, radiator and electronic equipment for electronic equipment |
| CN110475466B (en) * | 2019-09-23 | 2021-04-13 | 阳光电源股份有限公司 | Air-cooled radiator and electrical equipment |
| TWM588906U (en) * | 2019-09-26 | 2020-01-01 | 藍天電腦股份有限公司 | Laptop computer dustproof device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI300692B (en) * | 2006-08-04 | 2008-09-01 | Foxconn Tech Co Ltd | Heat dissipation apparatus |
| TWI327692B (en) * | 2007-07-13 | 2010-07-21 | Foxconn Tech Co Ltd | Heat dissipation apparatus and heat dissipating fin thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
| CN100530616C (en) * | 2005-09-23 | 2009-08-19 | 富准精密工业(深圳)有限公司 | Radiating module |
| CN100464279C (en) * | 2005-11-17 | 2009-02-25 | 富准精密工业(深圳)有限公司 | Heat sink |
| TW200905457A (en) * | 2007-07-30 | 2009-02-01 | Inventec Corp | Heat-dissipating module |
| CN101370370B (en) * | 2007-08-17 | 2011-11-09 | 富准精密工业(深圳)有限公司 | Heat radiation module |
-
2011
- 2011-08-29 CN CN2011102508151A patent/CN102958325A/en active Pending
- 2011-08-31 TW TW100131184A patent/TWI513400B/en not_active IP Right Cessation
- 2011-12-23 US US13/335,965 patent/US20130048256A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI300692B (en) * | 2006-08-04 | 2008-09-01 | Foxconn Tech Co Ltd | Heat dissipation apparatus |
| TWI327692B (en) * | 2007-07-13 | 2010-07-21 | Foxconn Tech Co Ltd | Heat dissipation apparatus and heat dissipating fin thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130048256A1 (en) | 2013-02-28 |
| CN102958325A (en) | 2013-03-06 |
| TW201311128A (en) | 2013-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI513400B (en) | Heat dissipation device | |
| TWI463939B (en) | Electronic device | |
| US8023265B2 (en) | Heat dissipation device and centrifugal fan thereof | |
| US7986521B2 (en) | Heat dissipation device and computer using same | |
| US8011423B2 (en) | Heat sink with a centrifugal fan having vertically layered fins | |
| TWI535989B (en) | Heat dissipation device and electronic device having the same | |
| TW201834535A (en) | Electronic equipment with heat-dissipating function and water-cooled radiator assembly thereof | |
| TWI573519B (en) | Portable electronic apparatus and thermal module tehreof | |
| US9313918B2 (en) | Cooling device for electronic machine | |
| TWI510896B (en) | Heat dissipation device | |
| TW201144990A (en) | Heat dissipation device and centrifugal fan thereof | |
| CN102279639A (en) | Radiating device and centrifugal fan thereof | |
| JP5556288B2 (en) | Heat dissipation unit and electronic device using the same | |
| US20110042043A1 (en) | Heat dissipation module | |
| TW201416822A (en) | Heat dissipation apparatus assembly | |
| TWI464323B (en) | Fan | |
| TWM460321U (en) | Fan impeller, centrifugal axial fan, heat dissipating device and display card module | |
| CN101287348B (en) | Heat sink assembly | |
| TWI501719B (en) | Heat dissipation device | |
| TWI465009B (en) | Heat dissipation device and centrifugal fan thereof | |
| TW201124691A (en) | Heat dissipation device | |
| US20130014921A1 (en) | Air flow guiding structure | |
| TWI468912B (en) | Heat dissipating device | |
| TWI495425B (en) | Cooling module and air-guiding structure thereof | |
| TWI636723B (en) | Electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |