CN201387577Y - Heat-dissipating device of notebook computer - Google Patents
Heat-dissipating device of notebook computer Download PDFInfo
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- CN201387577Y CN201387577Y CN200920006861U CN200920006861U CN201387577Y CN 201387577 Y CN201387577 Y CN 201387577Y CN 200920006861 U CN200920006861 U CN 200920006861U CN 200920006861 U CN200920006861 U CN 200920006861U CN 201387577 Y CN201387577 Y CN 201387577Y
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- base plate
- heat
- notebook computer
- fins
- cover body
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Abstract
The utility model relates to a heat-dissipating device of a notebook computer, which is applied to the heat dissipation of a heat source in the notebook computer, and comprises a cover body, a bottom plate, a heat-insulating layer and at least one fan, wherein the cover body and the bottom plate form a heat-dissipating channel together, and a plurality of fins and protruding columns are integrally arranged on the bottom plate; the bottom plate is positioned above the heating source, and the fans are arranged above the bottom plate so as to allow the heat to be discharged quickly from the inside. The heat-dissipating area between the bottom plate and the heating source is increased through the fins and protruding columns so as to improve the heat-dissipating efficiency of the whole body and achieve the effects of quick heat dissipation and low cost.
Description
Technical field
The utility model relates to a kind of heat abstractor of notebook computer, relates in particular to a kind of pyrotoxin top that is applied to notebook computer, with the heat abstractor of the notebook computer that promotes radiating effect.
Background technology
Because the rise of electronics and IT products, make the popularity rate straight line of notebook computer (NOTEBOOK) rise, again owing to the instruction cycle of consumer for notebook computer, radiating effect and volume lightly wait the lifting that requires, make the radiating effect of the notebook computer particular importance that more seems, the pyrotoxin of general notebook computer is mainly chipset, and chipset comprises such as central processing unit (CPU), north bridge chipset, South Bridge chip group etc., the hot gas how effective aforementioned pyrotoxin of loss is produced is the important key that promotes total quality to promote the heat radiation quality of notebook computer.
Commonly use the heat abstractor of common notebook computer at present, mainly be provided with the assembly of two solid copper heat pipes, on this heat pipe, then be respectively equipped with several metal stators as conduction heat and heat absorption; This stator is in order to produce the pyrotoxin (for example being chipset) of heat on the involutory circuit board, an end of heat pipe then is welded with a plurality of fins, and in a side of this fin fan is set, and the opening of fan can be brushed facing to fin; Therefore, reach the fin of end in addition via heat pipe when heat that chipset produces after, can brush by the fan of a side and heat is discharged outside in notebook computer.
Another kind is commonly used heat abstractor, include the assembly of two solid copper heat pipes as conduction heat and heat absorption, establish a bigger microscler stator but on this heat pipe, then change, this stator is provided with guide groove and inserts for heat pipe, straight forming has several projections on this stator simultaneously, one end of heat pipe then is welded with a plurality of fins of two groups respectively, and be provided with fan in a side of this stator, this fan has two openings respectively, brushing, and reach radiating effect towards two groups of fins.
Above-mentioned two shortcoming of commonly using heat abstractor is:
With many solid heat pipes made of copper is radiator structure, makes cost too high.
Transmit heat with solid heat pipe made of copper, heat can't be transmitted fast, cause radiating rate to reduce.
This solid heat pipe made of copper causes heat to hoard in inside easily and can't discharge, and makes solid heat pipe hot soak condition made of copper, and heat can't be discharged projection smoothly.
Copper heat pipe must be arranged in pairs or groups because of it and is located at the fan of side, so only can be L shaped structure, will take the bigger space that is provided with.
Summary of the invention
A purpose of the present utility model is to provide a kind of heat abstractor that promotes radiating effect and reduce the notebook computer of manufacturing cost.
For achieving the above object, the utility model provides a kind of heat abstractor of notebook computer, includes:
One cover body, its inside has an accommodation space;
One base plate has should pyrotoxin and a plurality of projections that are provided with and a plurality of fins of being located at a plurality of projection one sides, and this base plate is relatively arranged on the top of this pyrotoxin, and involution makes the common formation of cover body and base plate one heat dissipation channel in the below of this cover body relatively;
One thermofin is located at this base plate top, and is provided with open-work with respect to described a plurality of fins and described a plurality of projection;
At least one fan is located at the top of base plate, and be positioned at this heat dissipation channel for air-guiding by this heat dissipation channel.
Compared to known techniques, the beneficial effects of the utility model are, form a heat dissipation channel with cover body and base plate, and this base plate is provided with a plurality of fins and projection, with the increase area of dissipation, and at least one fan is set on base plate, the heat that pyrotoxin is produced can follow heat dissipation channel to discharge smoothly, the design of the copper heat pipe of commonly using with replacement, so the technical program can quick heat radiating and reduce cost.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the utility model one embodiment;
Fig. 2 is the top plan view of the utility model one embodiment;
Fig. 3 is the side cutaway view of the utility model one embodiment;
Side cutaway view when Fig. 4 is located at the inboard for fan of the present utility model;
Fig. 5 is the top plan view of another embodiment of the utility model.
Description of reference numerals:
The 10-cover body; The 11-heat dissipation channel; The 20-base plate; The 21-fin; The long fin of 210-; The 211-short fin; The 212-short fin; The 213-short fin; The 214-short fin; The 22-projection; The 30-thermofin; The 31-open-work; The 40-fan; The 50-circuit board; The 51-chipset.
Embodiment
The accompanying drawing of now only arranging in pairs or groups in the following instructions describes content of the present utility model in detail.
Please referring to Fig. 1, Fig. 2, shown in Figure 3, the heat abstractor of the utility model one embodiment is applied to the pyrotoxin in the notebook computer, includes a cover body 10, and is located at the thermofin 30 of base plate 20 tops and is located at least one fan 40 on this base plate 20 with respect to the base plate 20, of this cover body 10.It should be noted that present embodiment is that example is done explanation to be applied to the pyrotoxin such as chipset is dispelled the heat, but not limited thereto, also can be used for dispelling the heat such as random access memory or other pyrotoxins.
This cover body 10 has a downward opening accommodation space, and in the present embodiment, this cover body 10 is the elongated cover body.But, also can be the cover body of other shapes in other embodiments not as limit.
These base plate 20 relative involutions make this cover body 10 and base plate 20 common formation one heat dissipation channels 11 in the below of this cover body 10, and this base plate 20 has fin 21 and projection 22; This base plate 20 is respectively equipped with a plurality of projections 22 in the position with respect to the chipset on the circuit board 50 51; Between the both sides of base plate 20 and a plurality of projection 22, be provided with fin 21 in addition, described a plurality of fin 21 includes a plurality of long fins 210 and a plurality of short fin 211,212,213, described a plurality of long fin 210 is located at the both sides of base plate 20, discharge to make the higher heat of temperature guide from both sides, and can be through other projection 22; In addition, a plurality of short fins 211,212,213 are located at 22 of each projections and least significant end, with the heat of direct absorption chipset 51 central authorities, again heat are directed to heat dissipation channel 11 and are discharged to the external world.
It should be noted, in other embodiments, the height of being located at a plurality of fins 21 on the base plate 20 is except can be equal height, also can be fin 21 that should chipset 51 top center is lower than fin 21 that should chipset 51 tops two sides, perhaps fin 21 that should chipset 51 top center is higher than fin 21 that should chipset 51 tops two sides.In other words, described a plurality of fin 21 comprises a plurality of fins 21 that are positioned at these base plate 20 2 sides and a plurality of fins 21 that are positioned at these base plate 20 central authorities, and it is provided with quantity with highly not limited thereto, and this can be those skilled in the art's understanding and is implemented in view of the above.
Moreover the pyrotoxin in the present embodiment is for example a plurality of chipsets 51 (showing three chipsets 51 in graphic), but be illustrative only at this, is not in order to limit the utility model.
In the present embodiment, described a plurality of fin 21 and projection 22 one are located at base plate 20, described a plurality of fin 21 is linear array, 22 of described a plurality of projections are rectangular arrangement, and can be turbulence columns, but not limited thereto, as long as this base plate 20 has a plurality of projections 22 of should pyrotoxin (chipset 51) and being provided with and a plurality of fins 21 of being located at a plurality of projection 22 1 sides; Simultaneously, and this cover body 10 and base plate 20 can be relative aluminium cover with aluminium sheet or be relative aluminum_alloy cover and cover body and the base plate of aluminium alloy plate or other light weights and cost-effective (COST-EFFECTIVE).
One thermofin 30 covers in the top of base plate 20, and is being provided with open-work 31 with respect to described a plurality of fins 21 and described these a plurality of projection 22 parts.In the present embodiment, this thermofin 30 can be the made thermofin of high thermal resistance material (low heat conduction coefficient), the equivalent rete of polyimide layer, sial fibrage or other high thermal resistance low heat conduction coefficients for example, the heat of base plate 20 belows can be directly conducted in the heat dissipation channel 11 between cover body 10 and the base plate 20 by described a plurality of fins 21 and described a plurality of projection 22, and can avoid the heat reverse conduction to base plate 20, with thorough loss heat.
Please referring to shown in Figure 4, in order to reduce the computing machine whole height, also fan 40 directly can be located at a side of described a plurality of projection 22, and expose outside this heat dissipation channel 11, fan 40 directly is blown into heat in the heat dissipation channel 11, discharges fast the heat between described a plurality of fins 21 and the described a plurality of projection 22 is directly blown to heat dissipation channel 11.
Please referring to shown in Figure 5, this cover body 10 and base plate 20 also can be relative bending type cover body and bending type base plate, and the bending place on this base plate 20 can further be provided with a plurality of short fins 214 to increase the shunting effect of hot gas, to promote radiating effect.And a fan (not shown) also can be set up again in this bending place, make this heat dissipation channel 11 two ends, one heat absorption fan and a radiator fan is set respectively, and the heat of being drawn with the fan that will absorb heat is delivered to by heat dissipation channel 11 behind the radiator fan of holding in addition and is discharged outside to fast and swimmingly; In other words, this fan 40 can directly be faced pyrotoxin, and locates also can be provided with fan away from this pyrotoxin, simultaneously, can utilize fan with the heat sucking-off, also can utilize fan to suck cold air to this heat dissipation channel 11, and fan quantity is set and the position is not limited to described in the present embodiment.
Therefore, the utility model will have following advantage when implementing:
1. the utility model increases the area of dissipation of heat abstractor and chipset with a plurality of fins and a plurality of projection, and the design of collocation heat dissipation channel makes whole heat energy, discharges fast from inside to outside, and the design of the copper heat pipe of commonly using with replacement is with the lifting radiating effect.
2. base plate of the present utility model is provided with thermofin, and be formed with open-work with respect to fin and projection place, the heat of floor below can be directly conducted in the heat dissipation channel between cover body and base plate by fin and projection, and thermal source not again reverse conduction to base plate, make heat can direct into heat dissipation channel and discharge fast fully, to promote radiating efficiency.
3. cover body of the present utility model and base plate are aluminium cover and aluminium sheet or aluminum_alloy cover and aluminium alloy plate, and not only weight can reduce manufacturing cost more again.
Above embodiment only is preferred embodiment of the present utility model, and it is illustrative for the utility model, and nonrestrictive.Those skilled in the art carries out conversion, modification even equivalence to it under the situation that does not exceed the utility model spirit and scope, these changes all can fall into claim protection domain of the present utility model.
Claims (10)
1. the heat abstractor of a notebook computer is characterized in that, this heat abstractor includes:
One cover body, its inside has an accommodation space;
One base plate, has the interior pyrotoxin of corresponding notebook computer and a plurality of projections that are provided with and a plurality of fins of being located at described a plurality of projection one side, this base plate is relatively arranged on the top of this pyrotoxin, and involution makes the common formation of cover body and base plate one heat dissipation channel in the below of this cover body relatively;
One thermofin is located at this base plate top, and is provided with open-work with respect to described a plurality of fins and described a plurality of projection;
At least one fan is located at the top of base plate, and be positioned at this heat dissipation channel for air-guiding by this heat dissipation channel.
2. the heat abstractor of notebook computer as claimed in claim 1 is characterized in that, this cover body and base plate are respectively corresponding elongated cover body and elongated base plate.
3. the heat abstractor of notebook computer as claimed in claim 1 is characterized in that, this cover body and base plate are respectively corresponding bending type cover body and bending type base plate.
4. the heat abstractor of notebook computer as claimed in claim 1 is characterized in that, cover body and base plate are respectively and are aluminium cover and aluminium sheet.
5. the heat abstractor of notebook computer as claimed in claim 1 is characterized in that, described a plurality of fins and described a plurality of projection are integrally formed at this base plate.
6. the heat abstractor of notebook computer as claimed in claim 1 is characterized in that, described a plurality of fins include the long fin of being located at these base plate both sides and are located at short fin between described a plurality of projection.
7. the heat abstractor of notebook computer as claimed in claim 1 is characterized in that, described fan is located at described a plurality of projections top.
8. the heat abstractor of notebook computer as claimed in claim 1 is characterized in that, described fan is located at a side of described a plurality of projections and is exposed outside this heat dissipation channel.
9. the heat abstractor of notebook computer as claimed in claim 1 is characterized in that, two fans are set, and each fan is located at two relative ends of this heat dissipation channel respectively.
10. the heat abstractor of notebook computer as claimed in claim 1, it is characterized in that, described a plurality of fin comprises a plurality of fins that are positioned at these base plate two sides and a plurality of fins that are positioned at these base plate central authorities, and a plurality of fins that are positioned at these base plate two sides are higher than a plurality of fins that are positioned at these base plate central authorities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920006861U CN201387577Y (en) | 2009-03-25 | 2009-03-25 | Heat-dissipating device of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920006861U CN201387577Y (en) | 2009-03-25 | 2009-03-25 | Heat-dissipating device of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201387577Y true CN201387577Y (en) | 2010-01-20 |
Family
ID=41580114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920006861U Expired - Fee Related CN201387577Y (en) | 2009-03-25 | 2009-03-25 | Heat-dissipating device of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201387577Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470219A (en) * | 2015-12-05 | 2016-04-06 | 重庆元创自动化设备有限公司 | Protection-type heat dissipation device |
| CN109275309A (en) * | 2017-07-18 | 2019-01-25 | 技嘉科技股份有限公司 | Radiating module and motherboard component comprising it |
| CN114708795A (en) * | 2022-03-25 | 2022-07-05 | 杭州海康威视数字技术股份有限公司 | Screen display device |
-
2009
- 2009-03-25 CN CN200920006861U patent/CN201387577Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470219A (en) * | 2015-12-05 | 2016-04-06 | 重庆元创自动化设备有限公司 | Protection-type heat dissipation device |
| CN109275309A (en) * | 2017-07-18 | 2019-01-25 | 技嘉科技股份有限公司 | Radiating module and motherboard component comprising it |
| CN109275309B (en) * | 2017-07-18 | 2020-09-08 | 技嘉科技股份有限公司 | Heat dissipation module and host board assembly comprising same |
| CN114708795A (en) * | 2022-03-25 | 2022-07-05 | 杭州海康威视数字技术股份有限公司 | Screen display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100120 Termination date: 20120325 |