CN109275309B

CN109275309B - Heat dissipation module and host board assembly comprising same

Info

Publication number: CN109275309B
Application number: CN201710586562.2A
Authority: CN
Inventors: 林伟贤
Original assignee: Giga Byte Technology Co Ltd
Current assignee: Giga Byte Technology Co Ltd
Priority date: 2017-07-18
Filing date: 2017-07-18
Publication date: 2020-09-08
Anticipated expiration: 2037-07-18
Also published as: CN109275309A

Abstract

A heat dissipation module and a motherboard assembly comprising the same are provided, wherein the motherboard assembly comprises a circuit board, an expansion card and a heat dissipation module. The circuit board comprises a substrate and an electric connector, and the electric connector is arranged on the substrate. The expansion card is connected with the electric connector. The heat dissipation module comprises a heat dissipation sheet, a mask and a fan. The heat sink is in thermal contact with the expansion card. The shade is overlapped on the heat sink, and the shade and the heat sink form a heat dissipation chamber together. The mask has a first through hole and a second through hole corresponding to each other. The fan is arranged on the shade and is positioned in the heat dissipation chamber. The invention can improve the heat dissipation efficiency of the heat dissipation module to the expansion card, thereby maintaining the working efficiency of the expansion card and prolonging the service life of the expansion card.

Description

Heat dissipation module and host board assembly comprising same

Technical Field

The present invention relates to a heat dissipation module and a motherboard assembly including the same, and more particularly, to a heat dissipation module capable of blocking waste heat and a motherboard assembly including the same.

Background

As the technology in the electronic field is continuously evolving, the performance of electronic devices is also continuously increasing. The m.2 connector specification is a new generation of interface standard developed in recent years, which adopts a more flexible specification, allows a wider variety of module specifications to be connected, and can be matched with a higher-order interface. For example, it is applicable to channels such as Serial Advanced Technology Attachment (SATA) and Mini Peripheral component interconnect Express (MiniPCIe). Therefore, the device has better convenience and higher efficiency in use. In addition, as the technology of related products is more mature and the price is more and more popular, the expansion device adopting the m.2 connector specification is more and more popular in recent years.

Generally, the performance of the electronic device is improved, and the amount of heat generated is increased. This heat can build up on the electronic components and cause the temperature of the components themselves to increase. Failure to effectively reduce the temperature of the electronic component can lead to component failure and damage, which can reduce the useful life of the electronic component. Therefore, in these high performance electronic components, which are prone to generate a large amount of heat energy, a heat dissipation device such as a heat sink is usually disposed to dissipate the heat. However, the waste heat generated by the heat dissipation device dissipating heat from the electronic components also affects the surrounding electronic components. For example, the heat sink may diffuse the waste heat around the display adapter when dissipating heat, so that the adjacent expansion devices such as the m.2 solid state disk may be affected by the waste heat to reduce the heat dissipation efficiency, and further affect the working efficiency of the expansion device, and increase the probability of damage to the expansion device. Therefore, how to provide a heat dissipation device that can effectively block the waste heat of the peripheral electronic components and can remove the heat of the expansion device itself is one of the problems that the research and development personnel should solve.

Disclosure of Invention

The invention provides a heat dissipation module and a mainboard assembly comprising the same, so as to solve the problem that the expansion device in the prior art is influenced by the waste heat of peripheral electronic elements to reduce the heat dissipation efficiency and the working efficiency of the expansion device.

The motherboard assembly disclosed by the embodiment of the invention comprises a circuit board, an expansion card and a heat dissipation module. The circuit board comprises a substrate and an electric connector, and the electric connector is arranged on the substrate. The expansion card is connected with the electric connector. The heat dissipation module comprises a heat dissipation sheet, a mask and a fan. The heat sink is in thermal contact with the expansion card. The shield is overlapped on the radiating fin, and the shield and the radiating fin together form a radiating cavity. The shield has a corresponding first through hole and a corresponding second through hole. The fan is arranged on the shade and is positioned in the heat dissipation chamber.

The invention relates to a motherboard assembly, wherein the circuit board further comprises a stud and a screw, the stud is arranged on the substrate and keeps a distance with the electric connector, the shade, the heat sink and the expansion card are all provided with an opening corresponding to the stud, and the screw penetrates through the opening and is locked on the stud.

The invention provides a motherboard assembly, wherein the shade is provided with a first side surface far away from the electric connector and a second side surface close to the electric connector, the first through hole is positioned on the first side surface, and the second through hole is positioned on the second side surface.

The host board assembly of the invention, wherein the shade has a first side surface far away from the electric connector, and the first through hole and the second through hole are both positioned on the first side surface.

The host board assembly of the invention is characterized in that the shade is provided with a first side surface far away from the electric connector and a second side surface close to the electric connector, and the distance between the fan and the first side surface is smaller than that between the fan and the second side surface.

The invention relates to a motherboard assembly, wherein the heat sink comprises a board body and a plurality of protruding structures, and the protruding structures are positioned on one side of the board body, which is far away from the expansion card.

The host board assembly of the invention, wherein, the heat-dissipating module further includes a heat-dissipating glue, the heat-dissipating glue locates between the expansion card and the heat sink.

The motherboard assembly of the invention, wherein, the expansion card is an expansion device suitable for M.2 connector specification.

The motherboard assembly of the invention is characterized in that the expansion card is an expansion device suitable for a mini-shortcut peripheral interconnection standard channel. The heat dissipation module disclosed in another embodiment of the present invention is suitable for being installed on an expansion card. The expansion card is connected with an electric connector of a circuit board. The heat dissipation module comprises a heat dissipation sheet, a mask and a fan. The heat sink is used for thermally contacting the expansion card. The shade is overlapped on the heat sink, and the shade and the heat sink form a heat dissipation chamber together. The mask has a first through hole and a second through hole corresponding to each other. The fan is arranged on the shade and is positioned in the heat dissipation chamber.

The invention has the beneficial effects that:

according to the heat dissipation module and the host board assembly comprising the same disclosed by the embodiment, the heat dissipation module is arranged on the expansion card through the shade, so that the waste heat of peripheral electronic elements can be blocked; in addition, the proper position of the shield is provided with a through hole to avoid the diffusion path of the waste heat of the peripheral electronic elements, and the arrangement of the fan is matched to strengthen the air convection between the heat dissipation chamber and the external space. Therefore, the heat dissipation efficiency of the heat dissipation module to the expansion card can be improved, the working efficiency of the expansion card is further maintained, and the service life of the expansion card is prolonged.

Drawings

Fig. 1 is a perspective view of a motherboard assembly according to a first embodiment of the invention.

Fig. 2 is an exploded schematic view of the motherboard assembly of fig. 1.

Fig. 3 is a side cross-sectional view of the motherboard assembly of fig. 1.

Fig. 4 is a side sectional view of a motherboard assembly according to a second embodiment of the invention.

Wherein, the reference numbers:

1. 1a Main Board Assembly

10 circuit board

110 substrate

130 electric connector

131 connecting surface

133 slot

150 stud

170 screw

30 expansion card

31 semicircular opening

50 heat radiation module

510 Heat sink

511 board body

513 protruding structure

515 first opening hole

530 Heat dissipation glue

550. 550a shade

551. 551a heat dissipation chamber

552 extension plate

553. 553a first side

555. 555a second side surface

556a third through hole

557. 557a first via

558. 558a second through hole

559 second opening

560 shim

570. 570a fan

D1 first distance

D2 second distance

Detailed Description

The following examples further illustrate aspects of the invention in detail, but are not intended to limit the scope of the invention in any way.

Please refer to fig. 1 to 3. Fig. 1 is a perspective view of a motherboard assembly according to a first embodiment of the invention. Fig. 2 is an exploded schematic view of the motherboard assembly of fig. 1. Fig. 3 is a side cross-sectional view of the motherboard assembly of fig. 1.

The motherboard assembly 1 of the present embodiment includes a circuit board 10, an expansion card 30 and a heat dissipation module 50.

The circuit board 10 includes a substrate 110, an electrical connector 130, a stud 150 and a screw 170. The electrical connector 130 and the stud 150 are disposed on the substrate 110, and a distance is kept between the electrical connector 130 and the stud 150. In the present embodiment, the expansion card 30 and the heat dissipation module 50 can be fixed to the stud 150 by screws 170.

The electrical connector 130 has a connecting surface 131 and a slot 133, the connecting surface 131 faces the direction of the stud 150, and the slot 133 is opened on the connecting surface 131.

The expansion card 30 is inserted into the slot 133 of the electrical connector 130, and one end of the expansion card 30 away from the electrical connector 130 has a semicircular opening 31. The screw 170 can be inserted through the semicircular opening 31 and locked to the stud 150, thereby fixing the expansion card 30.

In the embodiment, the electrical connector 130 is an m.2 socket connector, and the expansion card 30 is an m.2 solid-state hard disk device adapted to the m.2 connector specification and a Mini Peripheral Component Interconnect Express (minipci) channel, but the invention is not limited thereto. In other embodiments, the electrical connector may be, for example, a standard mSATA (mini Serial advanced technology attachment) connector; the expansion card may be, for example, an m.2 expansion device or an mSATA expansion device that is adapted to a Serial Advanced Technology Attachment (SATA) or Universal Serial Bus (USB) channel.

The heat dissipation module 50 includes a heat sink 510, a heat dissipation adhesive 530, a mask 550, and a fan 570.

The heat sink 510 is disposed on the expansion card 30, and the heat dissipation adhesive 530 is disposed between the expansion card 30 and the heat sink 510. Further, the heat sink 510 thermally contacts the expansion card 30 through the heat dissipation paste 530. The heat sink 510 includes a board body 511 and a plurality of protruding structures 513, wherein the protruding structures 513 are located on a side of the board body 511 away from the expansion card 30. Therefore, the protruding structure 513 can increase the contact area between the heat sink 510 and the air, so that the flowing air can take away more heat from the heat sink 510, thereby achieving a better heat dissipation effect. In addition, the heat sink 510 further has a first opening 515 corresponding to the stud 150, and the screw 170 can pass through the first opening 515 and be fastened to the stud 150 to fix the heat sink 510.

In the embodiment, the heat dissipation module 50 includes a heat dissipation adhesive 530, but the invention is not limited thereto. In other embodiments, the heat dissipation module may not include a heat dissipation adhesive, and the heat dissipation plate directly contacts the expansion card. In addition, in the embodiment, the heat sink 510 includes a plurality of protruding structures 513 as an example, but the invention is not limited thereto. In other embodiments, the heat sink may not include the protruding structure.

The mask 550 is stacked on the heat sink 510, and the mask 550 and the heat sink 510 together form a heat dissipation chamber 551. The mask 550 has a first side 553 away from the electrical connector 130 and a second side 555 near the electrical connector 130, and the mask 550 has a plurality of first through holes 557 and a second through hole 558. The first through holes 557 of the shroud 550 are located at the first side 553, and the second through holes 558 are located at the second side 555. The heat dissipation chamber 551 communicates with the external space through the first through holes 557 and the second through holes 558, so that the air inside and outside the mask 550 can flow through each other. Generally, the electronic components (not shown) around the expansion card 30 are disposed on the left and right sides of the expansion card 30, so that the first through hole 557 and the second through hole 558 are respectively disposed on the front and rear side surfaces (i.e., the first side surface 553 and the second side surface 555) of the mask 550 to prevent the waste heat of the peripheral electronic components from directly flowing to the through holes and entering the heat dissipation chamber 551; therefore, the mask 550 can effectively block waste heat of the peripheral electronic components, and can achieve ventilation and heat dissipation through the first through holes 557 and the second through holes 558 on the first side surface 553 and the second side surface 555. In addition, the mask 550 further includes an extension plate 552 and a second opening 559. The extending plate 552 is adjacent to the first side 553 and extends along a normal to the first side 553 in a direction away from the electrical connector 130. The second opening 559 is disposed at a position of the extending plate 552 corresponding to the stud 150, and the screw 170 can pass through the second opening 559 and be fastened to the stud 150 to fix the mask 550.

In the embodiment, the material of the mask 550 is plastic, but the invention is not limited thereto. In other embodiments, the mask may be made of other materials with low thermal conductivity.

The fan 570 is disposed on the mask 550 and located in the heat dissipation chamber 551, and a first distance D1 between the fan 570 and the first side 553 is smaller than a second distance D2 between the fan 570 and the second side 555. In addition, a plurality of spacers 560 may be disposed between the fan 570 and the mask 550 to maintain a distance between the fan 570 and the mask 550 for air to flow into the fan 570. As shown in fig. 3, in the present embodiment, the connecting surface 131 of the electrical connector 130 covers a portion of the second through hole 558, so that an area of the second through hole 558 through which the airflow can pass is smaller than an area of the first through hole 557 through which the airflow can pass. Therefore, the fan 570 is disposed adjacent to the first side 553 of the mask 550, so that the flow rate of the air entering the heat dissipation chamber 551 through the first through holes 557 is increased, thereby achieving a better heat dissipation effect.

In the embodiment, the fan 570 is disposed at the position of the mask 550 close to the first side 553 for example, but the invention is not limited thereto. In other embodiments, the position of the fan disposed in the mask may be adjusted according to actual requirements.

In addition, in the embodiment, the air enters the heat dissipation chamber 551 from the first side 553 of the mask 550 and flows out from the second side 555 to form an air flow path, but the invention is not limited thereto. In other embodiments, air may enter and exit the mask on the same side.

Referring to fig. 4, a side cross-sectional view of a motherboard assembly according to a second embodiment of the invention is shown. The main board assembly 1a of the present embodiment is similar to the main board assembly 1 of the first embodiment, except that the fan 570a of the present embodiment is disposed adjacent to the first side 553a of the mask 550a, and the first through hole 557a and the second through hole 558a are disposed on the first side 553a of the mask 550 a. The first through hole 557a and the second through hole 558a are air inlet holes and air outlet holes, respectively. In addition, the mask 550a further has a third through hole 556a, and the third through hole 556a is located on the second side 555a of the mask 550 a. Thus, when the fan 570a operates, air enters the heat dissipation chamber 551a from the first through hole 557a and flows out from the second through hole 558a to form an air flow path; in addition, air can also enter or exit the mask 550a through the third through hole 556a to form another air flow path, so that waste heat can be dissipated and exhausted out of the mask 550a to meet the heat dissipation requirements of different types.

In the embodiment, the mask 550a has the third through hole 556a on the second side 555a as an example, but the invention is not limited thereto. In other embodiments, the second side of the mask may not have through holes, and only the first side may have through holes for air circulation.

According to the heat dissipation module and the host board assembly comprising the same, the heat dissipation module is arranged on the expansion card in a shielding manner, so that waste heat of peripheral electronic elements can be blocked; in addition, because the electronic components around the expansion card are generally arranged at the left side and the right side of the expansion card, the through holes are arranged at the front side and the rear side of the shade to avoid the diffusion path of the waste heat of the peripheral electronic components, and the arrangement of the fan is matched to strengthen the air convection between the heat dissipation chamber and the external space; moreover, the contact area between the radiating fin and the air can be increased through the convex structure on the radiating fin, so that the flowing air can take away more heat on the radiating fin. Therefore, the heat dissipation efficiency of the heat dissipation module to the expansion card can be improved, the working efficiency of the expansion card is further maintained, and the service life of the expansion card is prolonged.

In addition, the convenience of assembling and disassembling the expansion card can be improved by the characteristic that the fan is arranged on the shade and the characteristic that the expansion card, the radiating fin and the shade can be fixedly locked on the stud through the same screw.

The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A motherboard assembly, comprising:

a circuit board, including a substrate and an electrical connector, the electrical connector being disposed on the substrate;

an expansion card connected to the electric connector; and

a heat dissipation module, comprising:

a heat sink in thermal contact with the expansion card;

the shielding cover is stacked on the radiating fin, forms a radiating cavity together with the radiating fin and is provided with a first through hole and a second through hole which correspond to each other; and

a fan, which is arranged in the shade and is positioned in the heat dissipation chamber;

the mask is provided with a first side surface far away from the electric connector and a second side surface close to the electric connector, the first through hole is positioned on the first side surface, and the second through hole is positioned on the second side surface;

the electronic elements around the expansion card are arranged on the left side and the right side of the expansion card, and the first side face and the second side face are the front side face and the rear side face of the shade.

2. The assembly as claimed in claim 1, wherein the circuit board further includes a stud disposed on the substrate and spaced apart from the electrical connector, the mask, the heat sink and the expansion card each having an opening corresponding to the stud, and a screw passing through the opening and fastened to the stud.

3. The motherboard assembly as recited in claim 1 wherein the shield has a first side remote from the electrical connector and a second side proximate to the electrical connector, the fan being spaced from the first side less than the fan is spaced from the second side.

4. The motherboard assembly as recited in claim 1 wherein the heat sink comprises a board body and a plurality of protruding structures, the protruding structures being located on a side of the board body away from the expansion card.

5. The motherboard assembly as recited in claim 1 wherein the heat sink module further comprises a heat sink adhesive, the heat sink adhesive being disposed between the expansion card and the heat sink.

6. The motherboard assembly as recited in claim 1 wherein the expansion card is an expansion device adapted to the m.2 connector specification.

7. The motherboard assembly as recited in claim 1 wherein the expansion card is an expansion device adapted to mini peripheral component interconnect express channels.

8. A heat dissipation module is suitable for being arranged on an expansion card, and the expansion card is connected with an electric connector of a circuit board, and is characterized by comprising:

a heat sink for thermally contacting the expansion card;