TW201826259A - Server and solid-state storage device thereof - Google Patents

Abstract

A solid-state storage device is provided. The solid-state storage device includes a housing, a first circuit board and a plurality of first memory chips. The housing includes a first outer surface and a plurality of first heat-dissipation posts. The first heat-dissipation posts are formed on the first outer surface. The first heat-dissipation posts define a first outer flow path and a second outer flow path. The first outer flow path is perpendicular to the second outer flow path. The first circuit board is disposed in the housing. The first memory chip is disposed on the first circuit board.

Description

   Server and solid-state storage device thereof   

The present invention relates to a solid-state storage device, and more particularly, to a solid-state storage device with a heat dissipation function.

In the conventional technology, a plurality of solid-state storage devices are inserted into a server to provide an access function. A cooling fin structure is formed on the surface of the casing of the solid-state storage devices. The heat dissipation fin structure is elongated and extends in the same direction. When the traveling direction of the ambient air flow is the same as the extending direction of the heat dissipation fins, a heat dissipation effect can be provided. However, when the design of the server is changed and the insertion direction of the solid-state storage device is changed, the traveling direction of the ambient air flow will be different from the extending direction of the heat dissipation fin, and the heat dissipation effect will be deteriorated accordingly.

The invention provides a solid-state storage device for solving the problems of the conventional technology. The solid-state storage device includes a casing, a first circuit board, and a plurality of first memory chips. The housing includes a first outer surface and a plurality of first heat radiation protrusions. The first heat radiation protrusions are formed on the first outer surface, wherein the first heat radiation protrusions define a first outer airflow channel and a first heat radiation protrusion. Two external airflow channels, the first external airflow channel is perpendicular to the second external airflow channel. The first circuit board is disposed in the casing. The first memory chip is disposed on the first circuit board.

In an embodiment, the solid-state storage device further includes a main control unit disposed on the first circuit board, the main control unit faces the first outer surface, and the main control unit is conductive. Means to thermally connect the first outer surface.

In one embodiment, the first heat dissipation convex pillars are cylindrical or square pillars.

In one embodiment, the first heat dissipation protrusions are arranged in a matrix manner.

In one embodiment, each first heat dissipation post includes a top surface and a side surface, and a leading angle is formed between the top surface and the side surface.

In an embodiment, the housing further includes a first side surface and a second side surface, the first side surface is opposite to the second side surface, and the first side surface and the second side surface are perpendicular to the second side surface. On the first outer surface, at least one first convection hole is formed on the first side surface, and at least one second convection hole is formed on the second side surface.

In one embodiment, the solid-state storage device further includes a second circuit board disposed in the housing and coupled to the first circuit board, wherein a gap is formed on the first circuit board and the second circuit. Between the plates, the first convection hole and the second convection hole correspond to a gap.

In an embodiment, the first circuit board includes a first connector and a second connector. The second circuit board is connected to the first circuit board through the first connector and the second connector. A connector and the second connector define an internal airflow channel, and the internal airflow channel corresponds to the first convection hole and the second convection hole.

In an embodiment, the solid-state storage device further includes a flexible connection board, the first circuit board includes a first edge, the second circuit board includes a second edge, and the flexible connection board is connected to the first edge and the The second edge, the extending direction of the first edge and the second edge are perpendicular to the first side surface and the second side surface.

In one embodiment, the present invention further provides a server including a server case, a fan, a motherboard, and a plurality of solid-state storage devices. The server housing includes an air inlet and an air outlet. The motherboard includes multiple ports. A solid-state storage device is connected to the ports, wherein each solid-state storage device includes a casing, a first circuit board, and a plurality of first memory chips. The housing includes a first outer surface and a plurality of first heat radiation protrusions. The first heat radiation protrusions are formed on the first outer surface, wherein the first heat radiation protrusions define a first outer airflow channel and a first heat radiation protrusion. Two external airflow channels, the first external airflow channel is perpendicular to the second external airflow channel, wherein an airflow enters the air inlet, is driven by the fan, passes through the first external airflow channel, and leaves the airflow through the air outlet. Server housing. The first circuit board is disposed in the casing. The first memory chip is disposed on the first circuit board.

Applying the solid-state storage device according to the embodiment of the present invention, since the first heat dissipating pillars define a first external airflow channel and a second external airflow channel that are perpendicular to each other, under different server designs, the traveling direction of ambient airflow will be Parallel to the extending direction of the first external airflow channel, or parallel to the extending direction of the second external airflow channel. Therefore, under different server designs, the solid-state storage device according to the embodiment of the present invention can still provide a good heat dissipation effect.

SSD‧‧‧Solid State Storage Device

S‧‧‧Server

1‧‧‧ the first circuit board

11‧‧‧The first memory chip

12‧‧‧Master Control Unit

13‧‧‧ first edge

141‧‧‧first connector

142‧‧‧Second connector

143‧‧‧Inner air flow channel

2‧‧‧ second circuit board

23‧‧‧ second edge

3‧‧‧ shell

31‧‧‧ the first part

311‧‧‧first outer surface

312‧‧‧The first thermal projection

313‧‧‧First external airflow channel

314‧‧‧second external airflow channel

315‧‧‧Top

316‧‧‧ side

317‧‧‧lead angle

32‧‧‧ The second part

33‧‧‧First side surface

331‧‧‧First convection hole

34‧‧‧ second side surface

341‧‧‧Second Convection Hole

4‧‧‧ flexible connection board

G‧‧‧ Clearance

H‧‧‧Server housing

F‧‧‧Fan

M‧‧‧ Motherboard

I‧‧‧air inlet

O‧‧‧outlet

FIG. 1A is a perspective view showing a solid-state storage device according to an embodiment of the present invention.

FIG. 1B is an exploded view showing a solid-state storage device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a solid-state storage device according to another embodiment of the present invention.

FIG. 3 shows a detailed structure of a first heat dissipation post according to an embodiment of the present invention.

FIG. 4 shows the internal structure of a solid-state storage device according to another embodiment of the present invention.

FIG. 5 shows a server according to an embodiment of the present invention.

1A and 1B, a solid state storage device SSD according to an embodiment of the present invention is shown. The SSD includes a casing 3, a first circuit board 1, and a plurality of first memory chips 11. The casing 3 includes a first component 31 and a second component 32. The first component 31 includes a first outer surface 311 and a plurality of first heat dissipating protrusions 312. The first heat dissipating protrusions 312 are formed on the first outer surface 311, wherein the first heat dissipating protrusions 312 are defined A first external airflow channel 313 and a second external airflow channel 314 are perpendicular to the second external airflow channel 314. The first circuit board 1 is disposed in the casing 3. The first memory chip 11 is disposed on the first circuit board 1.

Applying the solid state storage device SSD according to the embodiment of the present invention, since the first heat dissipation protrusions 312 define a first external airflow channel 313 and a second external airflow channel 314 perpendicular to each other, the ambient airflow is different under different server designs. The travelling direction of the parallel airflow path will be parallel to the extending direction of the first external airflow path 313 or parallel to the extending direction of the second external airflow path 314. Therefore, under different server designs, the solid-state storage device SSD in the embodiments of the present invention can still provide good heat dissipation effects.

1A and 1B, in an embodiment, the solid-state storage device SSD further includes a main control unit 12 disposed on the first circuit board 1, and the main control unit 12 faces the first An outer surface 311, the main control unit 12 is thermally connected to the first outer surface 311 of the first component 31 in a conductive manner. In one embodiment, a thermally conductive adhesive or a thermally conductive pad may be sandwiched between the main control unit 12 and the inner surface of the first component 31. Alternatively, the main control unit 12 may directly contact the inner surface of the first component 31. Since the heat generated by the main control unit 12 is high, the first outer surface 311 is thermally connected in a conductive manner to improve the heat dissipation effect.

In the embodiment shown in FIGS. 1A and 1B, the first heat dissipation protrusions 312 are cylindrical. However, the above disclosure does not limit the present invention. In different embodiments, referring to FIG. 2, the first heat dissipation protrusions 312 may also be square pillars, or other shapes of heat dissipation structures. Referring to FIGS. 1A and 1B, in an embodiment, the first heat dissipation protrusions are arranged in a matrix manner, thereby defining the first external airflow channel 313 perpendicular to the second external airflow channel 314.

In one embodiment, each of the first heat dissipation protrusions 312 includes a top surface 315 and a side surface 316. The top surface 315 and the side surface 316 have a guide angle 317. The function of the guide angle 317 is to prevent the user from scraping hurt. In another embodiment, the lead angle 317 may be replaced with a rounded corner.

In the above embodiment, the first heat dissipation protrusions 312 are formed only on the first outer surface 311. However, the above disclosure does not limit the present invention. For example, in an embodiment, the housing 3 may also include a second outer surface and a plurality of second heat dissipation posts, the second heat dissipation posts are formed on the second outer surface, and the second outer surface is opposite On the first outer surface.

Referring again to FIGS. 1A and 1B, in an embodiment, the housing 3 further includes a first side surface 33 and a second side surface 34. The first side surface 33 is opposite to the second side surface 34. The one side surface 33 and the second side surface 34 are both perpendicular to the first outer surface 311. At least one first convection hole 331 is formed in the first side surface 33, and at least one second convection hole 341 is formed in the second side surface 34. The design of the first convection hole 331 and the second convection hole 341 can take out the heat inside the solid state storage device SSD in a convection manner, and improve the heat dissipation effect.

Referring again to FIGS. 1A and 1B, in an embodiment, the solid state storage device SSD further includes a second circuit board 2 disposed in the casing 3 and coupled to the first circuit board 1, wherein a gap G is formed between the first circuit board 1 and the second circuit board 2, and the first convection hole 331 and the second convection hole 341 correspond to the gap G. The design of the gap G can further enhance the effect of convection heat dissipation.

Referring again to FIGS. 1A and 1B, in this embodiment, the solid state storage device SSD further includes a flexible connection board 4, the first circuit board 1 includes a first edge 13, and the second circuit board 2 includes a second Edge 23, the flexible connecting plate 4 connects the first edge 13 and the second edge 23, and the extending direction of the first edge 13 and the second edge 23 is perpendicular to the first side surface 33 and the second side surface 34 .

In another embodiment, the first circuit board 1 and the second circuit board 2 are not electrically connected by a flexible connection board, but are connected by a connector. Referring to FIG. 3, the first circuit board 1 includes a first connector 141 and a second connector 142. The second circuit board 2 is connected to the first circuit board through the first connector 141 and the second connector 142. The circuit board 1, the first connector 141 and the second connector 142 define an internal airflow channel 143, and the internal airflow channel 143 corresponds to the first convection hole 331 and the second convection hole 341.

In the foregoing embodiment, the positions of the first convection hole 331 and the second convection hole 341 can be changed as needed to conform to the flow direction of the ambient airflow and provide a good heat dissipation effect. The above disclosure does not limit the present invention.

With reference to FIGS. 1A and 5, in one embodiment, the present invention further provides a server S, which includes a server case H, a fan F, a motherboard M, and a plurality of solid-state storage devices SSD. The server housing H includes an air inlet I and an air outlet O. The motherboard M includes a plurality of ports. The solid-state storage device SSD is connected to these ports, wherein an airflow A enters the air inlet I, is driven by the fan F, passes through the first external airflow channel 313, and leaves the server housing through the air outlet O . In this embodiment, the solid-state storage device SSD is installed in the server S in a vertical insertion manner.

Although the present invention has been disclosed as above with specific preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can still make some changes and decorations without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application.

Claims (10)

    A solid-state storage device includes a housing including a first outer surface and a plurality of first heat-dissipating protrusions. The first heat-dissipating protrusions are formed on the first outer surface, and the first heat-dissipating protrusions are defined. A first external airflow channel and a second external airflow channel, the first external airflow channel is perpendicular to the second external airflow channel; a first circuit board disposed in the housing; and a plurality of first memory chips, It is disposed on the first circuit board.         The solid-state storage device according to item 1 of the scope of patent application, further comprising a main control unit disposed on the first circuit board, the main control unit facing the first outer surface, and the main control unit The unit is thermally connected to the first outer surface in a conductive manner.         The solid-state storage device according to item 1 of the scope of patent application, wherein the first heat-dissipating convex pillars are cylindrical or square pillars.         The solid-state storage device according to item 1 of the scope of the patent application, wherein the first heat dissipation protrusions are arranged in a matrix manner.         The solid-state storage device according to item 1 of the scope of patent application, wherein each of the first heat-dissipating protrusions includes a top surface and a side surface, and a leading angle is formed between the top surface and the side surface.         The solid-state storage device according to item 1 of the patent application scope, wherein the housing further includes a first side surface and a second side surface, the first side surface is opposite to the second side surface and the first side surface And the second side surface is perpendicular to the first outer surface, at least one first convection hole is formed on the first side surface, and at least one second convection hole is formed on the second side surface.         The solid-state storage device according to item 6 of the patent application scope, further comprising a second circuit board disposed in the casing and coupled to the first circuit board, wherein a gap is formed on the first circuit board And between the second circuit board, the first convection hole and the second convection hole correspond to a gap.         The solid-state storage device according to item 6 of the patent application, wherein the first circuit board includes a first connector and a second connector, and the second circuit board passes through the first connector and the second connection. And the first connector and the second connector define an internal airflow channel, and the internal airflow channel corresponds to the first convection hole and the second convection hole.         The solid-state storage device according to item 6 of the patent application scope, further comprising a flexible connection board, the first circuit board includes a first edge, the second circuit board includes a second edge, and the flexible connection board is connected to the The first edge and the second edge, and the extending directions of the first edge and the second edge are perpendicular to the first side surface and the second side surface.         A server includes: a server housing including an air inlet and an air outlet; a fan; a main board including a plurality of connection ports; and a plurality of solid-state storage devices connected to the connection ports, respectively. The solid-state storage device includes: a housing including a first outer surface and a plurality of first heat-dissipating protrusions, the first heat-dissipating protrusions are formed on the first outer surface, wherein the first heat-dissipating protrusions define a first An external airflow channel and a second external airflow channel, the first external airflow channel is perpendicular to the second external airflow channel, wherein an airflow enters the air inlet, is driven by the fan, and passes through the first external airflow channel, And leaving the server casing through the air outlet; a first circuit board disposed in the casing; and a plurality of first memory chips disposed on the first circuit board.