TWM564318U - Electronic apparatus with heat-dissipating structure - Google Patents

Abstract

An electronic device with a heat dissipation structure includes a base, a heat dissipation housing and a rear side panel. The pedestal comprises a plurality of connection ports and a plurality of electronic components provided with a substrate, an electrical connection substrate. The heat dissipation housing is provided with a base, and the heat dissipation housing comprises a top plate, two side plates connected to the top plate, and a retaining hole formed between the top plate and the two side plates. The top plate is provided with a plurality of first heat dissipation fins, and each of the side plates is respectively provided with a plurality of second heat dissipation fins. The rear side panel is mounted to the base corresponding to the connecting port, and the rear side panel includes a shielding plate for shielding the positioning hole. Thereby, the heat dissipation case can effectively avoid the connection ports and reduce the overall thickness of the electronic device to achieve the purpose of thinning.

Description

Electronic device with heat dissipation structure

The present invention relates to an electronic device, and more particularly to an electronic device having a heat dissipation structure that achieves ultra-thin structure.

With the advancement of electronic technology, personal computers such as mini/thin/industrial comptures, etc., do not affect the functions and performances that can be provided due to the small size and thin end. In order to cope with the huge system workload of the above-mentioned personal computers, the heat generated by the internal electronic components in the operation process will continue to rise, so the heat dissipation problem has become an important consideration for the design of the personal computer casing. Question. In addition, in order to solve the problem of heat dissipation, the existing industry generally uses a fan or designs more heat dissipation fins on the casing to achieve the purpose of heat dissipation. However, such a design and structure will increase the overall volume, which is disadvantageous for the thinning of the product. Therefore, how to design the computer to have both heat dissipation and light and thin structure is an important issue that the industry needs to face.

One of the objects of the present invention is to provide an electronic device having a heat dissipation structure in which the heat dissipation casing can effectively avoid the connection ports and reduce the overall thickness of the electronic device to achieve a thinner thickness.

To achieve the above objective, the present invention provides an electronic device having a heat dissipation structure including a base, a heat dissipation case and a rear side panel. The pedestal comprises a plurality of connection ports and a plurality of electronic components provided with a substrate, an electrical connection substrate. The heat dissipation housing is provided with a base, and the heat dissipation housing comprises a top plate, two side plates connected to the top plate, and a retaining hole formed between the top plate and the two side plates. The top plate is provided with a plurality of first heat sink fins Each of the side plates is provided with a plurality of second heat dissipation fins. The rear side panel is mounted to the base corresponding to the connecting port, and the rear side panel includes a shielding plate for shielding the positioning hole.

In one embodiment, the substrate further extends horizontally outwardly from each of the side panels, and each of the wings is provided with a plurality of positioning holes for being fixed to another device.

The present invention also has the following effects: the first heat dissipation holes correspondingly disposed in the lateral direction, and the second heat dissipation holes, the third heat dissipation holes and the connection opening openings correspondingly disposed in the longitudinal direction, the heat dissipation airflow is transmitted through the lateral direction or The holes in the longitudinal direction accelerate the heat out of the electronic device to achieve rapid heat dissipation.

1‧‧‧Electronic device

11‧‧‧Base

111‧‧‧Substrate

112‧‧‧Links

113‧‧‧Electronic components

114‧‧‧Operator panel

115‧‧‧second vent

116‧‧‧First area

117‧‧‧Second area

118‧‧‧ wing

119‧‧‧Positioning holes

12‧‧‧Heat case

121‧‧‧ top board

122‧‧‧ side panels

123‧‧‧Replacement hole

124‧‧‧First heat sink fin

125‧‧‧Second heat sink fins

126‧‧‧First vent

127‧‧‧ outer surface

128‧‧‧ inner surface

13‧‧‧Back side panel

131‧‧‧shading board

132‧‧‧Connecting opening

133‧‧‧Folding board

134‧‧‧ Abutment plate

135‧‧‧ third cooling hole

2‧‧‧Storage device

3‧‧‧ transverse direction

4‧‧‧ longitudinal direction

FIG. 1 is an exploded view of the electronic device with the heat dissipation structure of the present invention.

FIG. 2 is another exploded perspective view of the electronic device with the heat dissipation structure of the present invention.

FIG. 3 is a perspective view of the electronic device with the heat dissipation structure of the present invention.

FIG. 4 is another perspective view of the electronic device with the heat dissipation structure of the present invention.

FIG. 5 is a cross-sectional view showing the electronic device with the heat dissipation structure of the present invention.

Figure 6 is a partial enlarged view of Figure 5.

FIG. 7 is another angled cross-sectional view showing the electronic device with the heat dissipation structure of the present invention.

The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.

Referring to FIG. 1 to FIG. 4 , the present invention provides an electronic device 1 having a heat dissipation structure, including a base 11 , a heat dissipation housing 12 and a rear side panel 13 . The electronic device 1 referred to herein is preferably an industrial computer. However, in other different embodiments, the electronic device 1 can also be applied to a desktop computer, a personal computer, or a thin computer in other fields.

The susceptor 11 includes a plurality of ports 112 and a plurality of electronic components 113 that are provided with a substrate 111 and electrically connected to the substrate 111. The electronic component 113 shown in FIGS. 1 and 2 is, for example, a multiplex processor, a memory card, an expansion card, or the like. After the heat sink casing 12 is covered with the base 11, the fixing member is screwed to the base 11 by a fixing member such as a screw.

The heat dissipation housing 12 includes a top plate 121, two side plates 122 connecting the top plate 121, and a receiving hole 123 formed between the top plate 121 and the two side plates 122. The top plate 121 is provided with a plurality of first heat dissipation fins 124, and each of the side plates 122 is respectively provided with a plurality of second heat dissipation fins 125. Referring to FIG. 5 and FIG. 6 together, the top plate 121 and each side plate 122 are preferably made of a heat dissipating material such as copper, aluminum or an alloy thereof.

Each of the side plates 122 is further provided with a plurality of first heat dissipation holes 126 respectively formed between the two second heat dissipation fins 125 spaced apart from each other. In particular, the first heat dissipation holes 126 of the two side plates 122 are disposed symmetrically with each other, and each of the first heat dissipation holes 126 has a rectangular shape, for example, a fan (not shown) disposed outside the electronic device 1 to dissipate heat flow (not Marked) The electronic device 1 can be discharged in a lateral direction 3 to enhance the heat dissipation effect.

The rear side panel 13 is attached to the base 11 corresponding to the plurality of ports 112, and the rear side panel 13 includes a shielding plate 131 for shielding the position holes 123. The upper surface of the shielding plate 131 is flush with the outer surface 127 of the heat dissipation housing 12. Therefore, the heat dissipation casing 12 of the present embodiment can effectively avoid the connection ports 112, and the overall thickness of the electronic device 1 can be greatly reduced to achieve a thinning effect. In other words, the relief hole of the heat dissipation case 12 123 just avoiding the position of each connection port 112, not only does not increase the overall thickness of the electronic device 1, but also effectively achieves the purpose of ultra-thinning of the electronic device 1.

In addition, the base 11 further extends an operation panel 114 correspondingly to the rear side panel 13. The operation panel 114 further defines a plurality of second heat dissipation holes 115 and associated switches and sockets (not labeled). The rear side panel 13 defines a plurality of connection ports 132 corresponding to the respective ports 112, and the connection ports 132 are disposed corresponding to the second heat dissipation holes 115. Referring to FIG. 7 together, the rear side panel 13 further has a bent plate 133 connecting the shielding plate 131 and an abutting plate 134 connecting the bent plate 133. The bending plate 133 is further provided with a plurality of third heat dissipation holes 135 for abutting the heat dissipation housing 12 so that the heat dissipation housing 12 can be conveniently corresponding to the abutting plate 134 for assembly on the base 11. Therefore, the design of the abutment plate 134 of the rear side panel 13 allows the user to assemble the base 11 correctly and quickly.

As shown in FIG. 1 , FIG. 2 and FIG. 5 , the susceptor 11 further includes a first region 116 and a second region 117 . The substrate 111 is disposed in the first region 116, and the second region 117 is mounted with a storage device 2. The top plate 121 also has an outer surface 127 and an inner surface 128. The inner surface 128 corresponds to the position of the first region 116 as a plane, and the outer surface 127 is also planar corresponding to the second region. In other words, the position of the outer surface 127 corresponding to the first region 116 is the first heat dissipation fins 124 , and the inner surface 128 corresponding to the second region 124 is also the first heat dissipation fins 124 .

It should be emphasized here that the inner surface 128 of the top plate 121 is a flat surface, and the corresponding contact is located on the top surface of the electronic component 113 of the first region 116 to passively transfer the heat generated by the operation of the electronic component 113 to each The first heat sink fin 124 is on. It can be seen that the electronic component 113 described herein is preferably a multiplexer processor or the like, and the heat of the electronic component 113 can be quickly transmitted to the first heat dissipation fins through the direct contact of the heat dissipation housing 12. At 124, heat is further conducted to the outside of the heat sink casing 12.

Furthermore, as shown in FIG. 7 , since each of the third heat dissipation holes 135 is further disposed corresponding to each of the second heat dissipation holes 115 of the operation panel 114 , the present invention can also be made through, for example, a fan (not shown) provided outside the electronic device 1 . The heat dissipation airflow (not shown) passes through the third heat dissipation hole 135, the gap between the first heat dissipation fins 124 and the second heat dissipation hole 115, or the second heat dissipation hole 115, respectively. The gap between the heat dissipation fins 124 and the third heat dissipation hole 135 actively discharge heat out of the electronic device 1 to increase heat dissipation efficiency.

Each of the side plates 122 further extends horizontally outwardly from a plurality of wings 118, and each of the wings 118 is provided with a plurality of positioning holes 119 for fixing to another device (not shown). Therefore, the present invention transmits the heat dissipation airflow by the first heat dissipation holes 126 correspondingly disposed in the lateral direction 3 and the second heat dissipation holes 115, the third heat dissipation holes 135 and the connection opening openings 132 correspondingly disposed in the longitudinal direction 4. The holes in the transverse direction 3 or the longitudinal direction 4 accelerate the heat to be actively discharged outside the electronic device 1 to achieve rapid heat dissipation.

In summary, the embodiments disclosed herein are to be considered as illustrative of the present invention and are not intended to limit the present invention. The scope of this creation is defined by the scope of the appended patent application and covers its legal equivalents and is not limited to the foregoing description.

Claims (12)

An electronic device having a heat dissipation structure, comprising: a base, a substrate, a plurality of connection ports electrically connected to the substrate, and a plurality of electronic components; a heat dissipation case covering the base, the heat dissipation case comprising a top plate a plurality of second heat dissipation fins, wherein the top plate is provided with a plurality of first heat dissipation fins, and each of the side plates is respectively provided with a plurality of second heat dissipation fins; A rear side panel is mounted to the base corresponding to the connecting panel, and the rear side panel includes a shielding panel for shielding the retaining hole. The electronic device with a heat dissipation structure according to claim 1, wherein each of the side plates further defines a plurality of first heat dissipation holes, each of the first heat dissipation holes being formed between the second heat dissipation fins spaced apart from each other . The electronic device with a heat dissipation structure according to claim 2, wherein the first heat dissipation holes of the two side plates are symmetrically disposed with each other, and each of the first heat dissipation holes has a rectangular shape. The electronic device with a heat dissipation structure according to claim 1, wherein the pedestal corresponding to the rear side panel further extends an operation panel, and the operation panel is provided with a plurality of second heat dissipation holes. The electronic device with a heat dissipation structure according to claim 4, wherein the rear side panel is provided with a plurality of connection ports corresponding to the connection ports, and each of the connection port openings is disposed corresponding to each of the second heat dissipation holes. The electronic device with a heat dissipation structure according to claim 1, wherein the rear side panel further has a bent plate connecting the shielding plate and an abutting plate connecting the bent plate. The electronic device with a heat dissipation structure according to claim 6, wherein the bending plate is provided with a plurality of third heat dissipation holes, and the abutting plate is used for positioning the heat dissipation housing. The electronic device with a heat dissipation structure according to claim 7, wherein the base further comprises an operation panel having a plurality of second heat dissipation holes, each of the third heat dissipation holes corresponding to each of the second heat dissipation holes of the operation panel Settings. The electronic device with a heat dissipation structure according to claim 1, wherein the base comprises a first area and a second area, the substrate is disposed in the first area, and the second area is mounted with a storage device. The electronic device with a heat dissipation structure according to claim 9, wherein the top plate further has an outer surface and an inner surface, wherein the inner surface corresponds to a position of the first area, and the outer surface corresponds to the second area. flat. The electronic device with a heat dissipation structure according to claim 10, wherein the outer surface corresponds to the first region and is the first heat dissipation fin, and the inner surface corresponds to the second region, and each of the first heat dissipation fins is sheet. The electronic device with a heat dissipation structure according to claim 1, wherein the substrate further extends outwardly from each of the side plates, and each of the wings is provided with a plurality of positioning holes.