KR100313310B1 - Portable computer with the dissipating apparatus of electronic system - Google Patents

Abstract

PURPOSE: A portable computer having a heat radiating device of an electronic system is provided to radiate a heat being generated in an electronic circuit effectively in an electronic system. CONSTITUTION: A bottom housing(20) includes a bottom surface and side surfaces. A top housing(22) is combined with the upper surface of the bottom housing(20), forms an inner space of a system, and includes a penetration hole the upper surface. A keyboard(16) is combined with the top housing(22), and the bottom surface is exposed to the inner space through the penetration hole. A circuit board is combined with the bottom surface of the bottom housing(20). A semiconductor device is mounted on the circuit board and generates a heat in an operating process. One surface of a mounting plate(50) is contacted and mounted to one surface of the semiconductor device directly. A first heat sink(32) is connected to the mounting plate(50), and one surface is contacted and mounted to the bottom surface of the keyboard(16). A fan(36) is mounted adjacent to one side of the bottom housing(20), combined with one side of the mounting plate(50), and forms an airflow in an internal space. The second heat sink is combined on the mounting plate(50) and includes a plurality of fins for guiding an airflow. A heat pipe includes at least one elbow and transmits a heat to the first heat sink(32) and the second heat sink on the mounting plate(50). The first air vent(24) is formed at a side surface of the fan(36). The second air vent(26) is formed at a side surface of the second heat sink.

Description

PORTABLE COMPUTER WITH THE DISSIPATING APPARATUS OF ELECTRONIC SYSTEM}

The present invention relates to a portable computer provided with a heat dissipation device of an electronic system, and more particularly to a portable computer provided with a heat dissipation device of an electronic system for dissipating heat generated from components constituting the electronic system.

In most commercially available computers, heat dissipation devices are used. These heat sinks are mainly used to dissipate heat generated by the central processing unit (CPU). Most of the devices for heat dissipation are configured in the form of a heat sink.

For example, the heat sink is a block or plate made of a material having excellent thermal conductivity such as aluminum or aluminum alloy. Fins are formed on the top of the block or plate. These blocks or plates are attached to, and in contact with, the top of the CPU as a heat transfer medium. If heat is generated while the CPU is operating, then it is conducted to the heat sink and then removed by ambient convection. The drawback of this type of heat sink is its low heat removal efficiency.

In order to increase the efficiency of removing heat, it is proposed to add a fan to the heat sink. This fan allows forced convection through the fins of the heat sink. Thus, the heat removal efficiency of the computer CPU is increased. The problem associated with using a fan is the space problem for installing this fan. This problem is particularly acute in minimizing portable computers, such as notebook computers. The notebook computers have very limited internal space for accommodating such one fan.

Accordingly, in response to the trend of miniaturization of electronic systems, there is a demand for a heat dissipation device capable of efficiently dissipating heat generated from components constituting an electronic circuit of the electronic system. In particular, an efficient heat dissipation device is essential in an electronic system that is getting smaller in size while increasing heat generated by a CPU, such as a portable computer.

The present invention has been made to solve such a conventional problem, and an object thereof is to provide a portable computer provided with a heat dissipation device of a new type of electronic system capable of efficiently dissipating heat generated from an electronic circuit in an electronic system. Another object of the present invention is to provide a portable computer provided with a heat dissipation device of a new type of electronic system capable of efficiently dissipating heat generated from a CPU in a limited internal space of a portable computer such as a notebook computer.

1 is a perspective view of a portable computer provided with a heat dissipation device of an electronic system according to an embodiment of the present invention;

2 is a block diagram showing a configuration of a heat radiation device according to an embodiment of the present invention;

Figure 3 is an exploded perspective view showing the main body before the heat dissipation device is installed according to an embodiment of the present invention;

4 is a perspective view showing the main body portion after the heat dissipation device is coupled;

FIG. 5 is a side view showing a partial relationship between a heat dissipating device and a heat generating part according to an embodiment of the present invention with a partial cross section of the housing of the main body in FIG. 4; FIG.

Figure 6 is a perspective view showing the back of the heat dissipation device according to an embodiment of the present invention;

7 is an exploded perspective view of the heat dissipation member.

* Explanation of symbols for the main parts of the drawings

10: portable computer 12: main body

14 display panel unit 16 keyboard assembly

18: display assembly 20: bottom housing

22 top housing 24 first air vent

26: 2nd air vent 28: 3rd air vent

30: heat dissipation device 32: first heat sink

34: heat pipe 36: fan

50: mounting plate 54: sub mounting plate

56,56 ': Radial Channel 60: Second Heat Sink

60a, 60b: Pin 70: Motherboard

72: CPU 74: thermal pad

According to a feature of the present invention for achieving the above object, the heat dissipation device of the electronic system for dissipating heat generated in the semiconductor device of the system is installed on one side of the semiconductor device A mounting plate in contact with and coupled to the mounting plate; A first heat sink connected to the mounting plate and in contact with and coupled to one inner surface of the system; A fan installed adjacent to one side of the housing, coupled to one side of the mounting plate, and configured to form an air flow in the housing; And a heat pipe connecting the mounting plate and the first heat sink to transfer heat generated from the semiconductor device to the first heat sink.

In the present invention as described above, a second heat sink in which a plurality of fins are formed on the mounting plate coupled to the fan is added. The heat pipe has at least one elbow. The first heat sink is flat type and has a first side that is in contact with and coupled to an inner side of the system and a second side opposite to the first side, wherein the heat pipe is Combined.

According to another aspect of the present invention for achieving the above object, a bottom housing having a bottom surface and sides; A top housing coupled to an upper portion of the bottom housing to form an internal space of the system and having a through hole formed on an upper surface thereof; A keyboard coupled to the top housing, the bottom surface of the keyboard being exposed to the internal space through the through hole; A circuit board coupled to the bottom surface of the bottom housing; A semiconductor device installed on the circuit board and generating heat during operation; A mounting plate having one surface in contact with and coupled to one surface of the semiconductor device; A first heat sink connected to the mounting plate and having one surface in contact with and coupled to the bottom surface of the keyboard; A fan installed close to one side of the bottom housing, coupled to one side of the mounting plate, and configured to form an air flow in the inner space; A second heat sink coupled to the mounting plate to which the fan is coupled, the second heat sink having a plurality of fins across the air stream; And a heat pipe connecting the mounting plate, the first heat sink, and the second heat sink to transfer heat generated from the semiconductor device to the first heat sink and the second heat sink.

In the present invention, the second heat sink is installed to be close to one side, the fan is installed to be close to the other side, and the fan is close to the side of the inner space adjacent to the corner where the two sides meet. A first air vent is formed, and a second air vent is formed at a side surface of the second heat sink to form a flow of air from the second air vent to the first air vent.

In this invention, a third air vent is formed on the bottom surface of the housing in which the second heat sink is located. The semiconductor device includes a central processing unit (CPU).

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, FIGS. 1 to 8, and like reference numerals denote like elements for performing the same function.

1 shows a portable computer 10 equipped with a heat dissipation device for an electronic system according to an embodiment of the present invention. The portable computer 10 illustrates a representative notebook computer, and may be understood as other types of portable computers, such as a laptop computer and a palmtop computer.

The general portable computer 10 includes a main body 12 and a display panel unit 14. The main body portion 12 and the display panel portion 14 have a coupling relationship through some hinge structure. Through this coupling relationship, the display panel unit 14 is folded on the upper surface of the main body unit 12. The upper surface of the main body 12 is provided with a keyboard assembly 16 for controlling data input and system. In addition, the display panel unit 14 is provided with a display assembly 18. Thus, the display panel unit 14 also serves as a cover of the portable computer 10. The main body 12 has a bottom housing 20 and a top housing 22. The bottom housing 20 has a bottom surface and side surfaces. The top housing 22 is coupled to the upper portion of the bottom housing 20. The inner space of the main body 12 is formed by the coupling of the top housing 22 and the bottom housing 20. This interior space is typically equipped with a motherboard and a number of electronic card assemblies. This motherboard and the plurality of electronic card assemblies have a number of electrical devices. In addition, a power supply and disk drive assemblies may be installed in the internal space. In addition, a keyboard assembly 16 is installed on the top surface of the top housing 22. The keyboard assembly 16 is installed such that its bottom surface is exposed to the internal space through a through hole formed in the top surface of the top housing 22. The keyboard assembly 16 is connected to an electronic circuit installed in the internal space through the through hole. The size of the through hole may be formed differently according to the type of product. As will be described later, a portable computer according to an embodiment of the present invention has a structure in which a first heat sink is coupled to a bottom surface of the keyboard.

2 is a block diagram showing the configuration of a heat radiation device according to an embodiment of the present invention.

2, a heat dissipation device 30 according to an embodiment of the present invention may include a first heat sink 32, a heat pipe 34, a fan 36, and a mounting method. It can be seen that the plate (mounting plate) 50, and the second heat sink (60). It can be seen that the mounting plate 50 is coupled to the CPU 72. In the exemplary embodiment of the present invention, the component coupled to the mounting plate 50 is illustrated as the CPU 72, but the CPU 72 may be recognized by replacing other semiconductor devices. These semiconductor devices are components that generate heat, such as the CPU 72. In addition, a component coupled to the mounting plate 50 may be coupled to one or more components, and one or more mounting plates 50 may be installed.

As such, the concept of the present invention is to use two or more heat sinks, fans, and heat pipes of various types in configuring a heat dissipation device of an electronic system. In this case, the heat pipes connect the heat sinks, and the fan is coupled to one end of the heat sink to form a flow of air. Those skilled in the art will readily understand that the mounting plate 50 applied in the embodiment of the present invention also serves as a heat sink.

The first heat sink 32 may be formed in a flat type, and may be formed in a size and a shape permitted by an internal space of the electronic system. This is to increase the heat radiation efficiency through a large area. In addition, the first heat sink 32 may be in contact with and coupled to one inner surface of the electronic system. As will be described later, in the embodiment of the present invention, the first heat sink 32 is brought into contact with and coupled to the bottom surface of the keyboard assembly. In general, heat sinks are composed of anodized aluminum. The second heat sink 60 has a plurality of fins. These fins serve to widen the surface area of the second heat sink 60. The second heat sink 60 is installed to be in contact with the fan 36. At this time, the pins are installed to be perpendicular to the fan 36. This is to allow the flow of air formed by the fan 36 to flow between the fins. This maximizes the heat radiation efficiency of the second heat sink 60.

The heat pipe 34 is configured to connect the mounting plate 50 with the first and second heat sinks 32, 60. The heat pipe 34 has an elbow so as to extend in various forms. The heat pipe 34 having such a configuration allows heat to be efficiently transferred from the mounting plate 50 to the first and second heat sinks 32.

3 to 5 are diagrams showing an embodiment of the present invention for applying a heat dissipation device to a portable computer.

The heat dissipation device 30 is installed in the inner space formed by the bottom housing 20 and the top housing 22. In this internal space, a motherboard 70 and a plurality of electronic card assemblies are installed. In addition, the power supply and the disk drive assemblies may be installed in the internal space. In the embodiment of the present invention, the heat dissipation device 30 is installed on the top of the motherboard 70 or the electronic assembly cards. On the upper surface of the motherboard 70 and the electronic assembly card, a plurality of semiconductor devices are installed. For example, the plurality of semiconductor devices are installed on the motherboard 70 and electronic assembly cards by surface mount technology. There is also a semiconductor device in which a separate socket is mounted on the motherboard 70 and installed in the socket. The heat dissipation device 30 of the present invention relates to a semiconductor device in which heat is generated during operation such as the CPU 72 among the semiconductor devices.

In the present embodiment, the bottom surface of the mounting plate 50 in the heat dissipation device 30 is coupled to the top surface of the CPU 72. In this case, a thermal pad 74 may be inserted between the mounting plate 50 and the CPU 72 to improve contact and conductivity. The first heat sink 32 is formed in a plate shape. The top surface of the first heat sink 32 is coupled to the bottom surface of the keyboard assembly 16. The first heat sink 32 is connected to the mounting plate 50. In addition, the first heat sink 32 is connected to the mounting plate 50 by a heat pipe 34. The heat pipe 34 is coupled to the top surface of the mounting plate 50 and coupled to the rear surface of the first heat sink 32. The fan 36 is coupled to one end of the mounting plate 50. In addition, a second heat sink 60 is installed on the mounting plate 50 to which the fan 36 is coupled. The second heat sink 60 is composed of a plurality of fins. A plurality of fins constituting the second heat sink 60 are installed to be perpendicular to the air flow formed by the fan 36 to increase the heat dissipation effect.

In the present embodiment, the second heat sink 60 is installed to be close to the front surface of the bottom housing 20, and the fan 36 is installed to be close to the right surface. In addition, a first air vent 26 is formed on the right side of the fan 36 to which the fan 36 is close, and a second air vent 24 is formed on the front side of the second heat sink 60 to the side of the fan 36. . This configuration forms a flow of air from the second air vent 24 to the first air vent 26. This configuration allows air to be sucked in from the front surface of the bottom housing 20 where the user is located and allows air to be exhausted to the side where the user is not located. Thus, a comfortable environment can be provided to the user of the portable computer. In addition, a third air vent 28 is added to the bottom surface of the bottom housing 20 in which the second heat sink 60 is positioned so that air flow by the fan 36 is efficiently performed. .

Thus, the heat dissipation device according to the embodiment of the present invention can be very usefully applied to an electronic system having a very small internal space such as a portable computer. For example, a mounting plate and a first heat sink coupled to a heat generating semiconductor device, such as a CPU, may be formed in a plate shape to be efficiently positioned in a narrow internal space. The second heat sink is composed of fins and corresponds to the air flow formed from the fan. In addition, since the second heat sink and the fan, which are relatively taller than the first heat sink and the mounting plate, are positioned on the side of the housing, the internal space can be efficiently used.

6 is a perspective view illustrating a rear surface of the heat dissipation device according to the embodiment of the present invention, and FIG. 7 is an exploded perspective view of the heat dissipation member.

6 and 7, the heat dissipation device 30 according to the embodiment of the present invention is a combination of the first heat sink 32, the mounting plate 50, the second heat sink 60, and the fan 36. It can be seen that it is made by. The mounting plate 50 is coupled to a semiconductor device that generates heat, such as a CPU, on the bottom as described above. One end of the mounting plate 50 is coupled to the first heat sink 32 by screws 42. Of course, the method of coupling the mounting plate 50 and the first heat sink 32 may use another method such as soldering. This mounting plate 50 may be coupled by screws to the housing of the electronic system. The portion 58 to which the screw is coupled is formed at a suitable position in the mounting plate 50. This is a method for efficiently using the internal space of the system. On the other hand, the fan 36 is coupled to one surface of the mounting plate 50 by screws 44. The second heat sink 60 is coupled to a portion at which the fan 36 is coupled. The second heat sink 60 is composed of a plurality of fins 60a and 60b. These pins 60a, 60b are coupled on the mounting plate 50 so as to be perpendicular to the air flow formed by the fan 36.

Meanwhile, the mounting plate 50 and the first and second heat sinks 32 and 60 are connected by heat pipes 34. A radial channel 56 is formed on an upper surface of the mounting plate 50. The lower surface of the mounting plate 50 has been described above that a semiconductor device that generates heat, such as a CPU, is coupled. The radial channel 56 extends to a surface to which the second heat sink 60 is coupled. The heat pipe 34 is coupled to the top surface of the mounting plate 54 by a sub mounting plate 54. The heat pipe 34 is formed of elbows at the first heat sink 32. The elbow allows the shape of the first heat sink 32 to be installed differently from the mounting direction of the mounting plate 50. For example, in this embodiment, the mounting plate 50 and the first heat sink 32 are vertically coupled. The heat pipe 34 is joined by a sheet metal 40 when it is joined on the first heat sink 32. The thin plate 40 may be bonded to the first heat sink 32 by soldering or brazing.

Thus, it can be expected that the configuration of the heat dissipation device shown in the embodiment of the present invention can be used in various forms. After all, an important meaning of the present invention is to make efficient use of the heat sinks and the fan connected by the heat pipe in a narrow space, and to maximize the heat dissipation effect.

Applying the present invention as described above can perform efficient heat dissipation using convection and conduction in the electronic system. In particular, since the heat dissipation is performed in the entire part of the system, it is possible to maintain a uniform distribution of the overall temperature in the system. In addition, since the heat dissipation device of the present invention does not need to be installed in close proximity to the fan or connected in series, the heat dissipation device can be relatively freely positioned in the heat generating component in the motherboard or card assemblies installed inside the system. Can be. For example, a narrow space can be efficiently used in an electronic system with a narrow internal space such as a portable computer. In addition, since the heat dissipation device is composed of one assembly, there is an advantage that the assembly and disassembly of the system can be easily performed.

Claims (3)

A bottom housing having a bottom surface and side surfaces; A top housing coupled to an upper portion of the bottom housing to form an internal space of the system and having a through hole formed on an upper surface thereof; A keyboard coupled to the top housing, the bottom surface of the keyboard being exposed to the internal space through the through hole; A circuit board coupled to the bottom surface of the bottom housing; A semiconductor device installed on the circuit board and generating heat during operation; A mounting plate on one surface of which is in direct contact with and coupled to one surface of the semiconductor device; A first heat sink connected to the mounting plate and having one surface in contact with and coupled to the bottom surface of the keyboard; A fan installed close to one side of the bottom housing, coupled to one side of the mounting plate, and configured to form an air flow in the inner space; A second heat sink coupled to the mounting plate to which the fan is coupled, the second heat sink having a plurality of fins to which the fan is coupled to cross the air flow; A heat pipe having at least one elbow, the heat pipe transferring the heat on both sides of the first heat sink and the second heat sink on the mounting plate; The second heat sink is installed to be close to one side, the fan is installed to be close to the other side, and the first space is disposed on the inner space near the corner where two sides of the bottom housing meet. An air vent is formed, and a second air vent is formed on a side surface of the second heat sink to form an air flow from the second air vent to the first air vent. A portable computer with a heat dissipation device for an electronic system. The method of claim 1, And a third air vent formed on a bottom surface of the housing in which the second heat sink is located. The method of claim 1, And the semiconductor device comprises a central processing unit (CPU).