TWI636723B - Electronic apparatus - Google Patents

Abstract

An electronic device includes a housing, a fan module, and a heat sink fin set. The outer casing includes an upper cover and at least one side wall. The side wall abuts the upper cover and has a first opening and a second opening. The fan module is disposed in the outer casing. The fan module has at least one air inlet and an air outlet. The heat dissipation fin group is disposed in the outer casing and is located between the first opening and the air outlet of the fan module. The outer casing, the heat dissipation fin set and the fan module form an air inlet path between the second opening and the air inlet. The air inlet path passes through at least a space between the upper cover of the outer casing and the heat dissipation fin set.

Description

Electronic device

The invention relates to a heat dissipation module in an electronic device, in particular to a heat dissipation module in a portable electronic device.

In general, electronic devices, such as notebooks, personal computers, etc., in the normal operation, the heat generated by diverging computing components or other components, through the provision of thermal modules, such as heat sink fins, fan modules Etc., thereby avoiding heat accumulation in the electronic device, causing the temperature inside the electronic device to rise, affecting the operation of the computing device, and in severe cases, even destroying or stopping the components in the computing device. However, in order to prevent dust from directly entering the computing component or other components in the electronic device and accumulating thereon, the heat dissipation efficiency of the computing component or other components is worse, and the electronic device mostly calculates the computing component, other components, and the heat dissipation module. Wrap in the outer casing. It is true that the outer casing avoids the accumulation of dust, but at the same time it also hinders the heat generated by the heat dissipation module from generating heat. In this way, in addition to reducing the heat dissipation efficiency of the heat dissipation module, the heat radiated by the heat dissipation module may turn to heat the outer casing and remain on the outer casing, continuously affecting the temperature inside the electronic device, and may further affect the electronic device. The normal operation of the computing components and other components within. It can be seen that the above existing architecture obviously has inconveniences and defects, and needs to be further improved. In order to solve the above problems, the relevant fields have not exhausted their efforts to seek solutions, but the methods that have not been applied for a long time have been developed. Therefore, how to effectively solve the above problems is one of the current important research and development topics, and it has become an urgent target for improvement in related fields.

One aspect of the present invention relates to a heat dissipation module in a portable electronic device, which uses an additional opening to communicate with the air inlet, so that there is more space between the heat dissipation fin group and the outer casing to accommodate air, which can reduce Or avoid excessive heat transfer between the heat sink fin set and the outer casing. Simultaneously, the cold air entering the outer casing from the opening is guided into the fan module, and between the heat dissipation fin group and the outer casing of the electronic device, the heat dissipation fin group and the outer casing are further guided by the heat dissipation fin group. The heated air enters the air inlet of the fan module according to the guidance of the air inlet path, avoids excessive accumulation of air heated by the heat dissipation fin group, and transfers heat energy to the outer casing, and increases the airflow entering the fan module. In this way, the heat dissipation module of the electronic device can be reduced or avoided, because the heat dissipation fin assembly is heated by the heat dissipation module, and the heat dissipation efficiency of the heat dissipation module is reduced or the normal operation of the electronic device is affected.

The invention provides an electronic device comprising a housing, a fan module and a heat dissipation fin set. The outer casing includes an upper cover and at least one side wall. The side wall abuts the upper cover and has a first opening and a second opening. The fan module is disposed in the outer casing. The fan module has at least one air inlet and an air outlet. The heat dissipation fin group is disposed in the outer casing and is located between the first opening and the air outlet of the fan module. The outer casing, the heat dissipation fin set and the fan module form an air inlet path between the second opening and the air inlet. The air inlet path passes through at least a space between the upper cover of the outer casing and the heat dissipation fin set.

In one or more embodiments of the present invention, the first opening and the second opening are respectively located on two sides of a plane where the air inlet is located, and the second opening is closer to the upper cover than the first opening.

In one or more embodiments of the present invention, the second opening is located between the first opening and the upper cover.

In one or more embodiments of the present invention, the heat dissipation fin set includes a plurality of heat dissipation fins. The heat dissipation fins have extension portions 162a, respectively. The extension portion 162a is adjacent to the upper cover. The extension portions 162a of the heat dissipation fin group collectively form a surface that blocks the heat dissipation fins from directly communicating with the second opening in the outer casing. The heat dissipation fin group is away from one end of the fan module and extends away from the upper cover.

In one or more embodiments of the present invention, the first opening and the second opening are juxtaposed to the side wall in a direction substantially parallel to the upper cover.

In one or more embodiments of the present invention, the outer casing includes a plurality of side walls, and the first opening and the second opening are respectively located at two adjacent ones of the side walls.

In one or more embodiments of the present invention, the electronic device further includes a baffle. The deflector is disposed between the heat dissipation fin set and the second opening. The deflector, the outer casing, and the outer surface of the finned fin set together form an air inlet path.

In one or more embodiments of the present invention, the baffle plate extends in a direction substantially perpendicular to the upper cover.

In one or more embodiments of the present invention, the baffle plate includes at least one flow guiding branch extending between the heat dissipation fin set and the outer casing.

In one or more embodiments of the present invention, the side of the diversion branch adjacent to the fan module is parallel to the side of the heat dissipation fin set adjacent to the fan module. The heat sink fin set has a first length in a direction substantially parallel to the side wall, and the flow guiding branch has a second length, the second length being at least one third greater than the first length.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and components are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

When a component is called "on", it can mean that the component is directly on other components, or that other components exist in both. Conversely, when a component is called "directly on" another component, it cannot have other components in between. As used herein, the term "and/or" encompasses any combination of one or more of the listed associated items.

1 is a perspective perspective view of an electronic device 100 in accordance with various embodiments of the present invention. 2 is a side cross-sectional view of a portion of the electronic device 100 in the outer casing 120, the fan module 140, and the heat dissipation fin set 160 according to various embodiments of the present invention. As shown in FIGS. 1 and 2 , the electronic device 100 includes a housing 120 , a fan module 140 , and a heat dissipation fin set 160 . The outer casing 120 can include an upper cover 122 and at least one side wall 124. The side wall 124 abuts the upper cover 122 and surrounds the upper cover 122. The side wall 124 has a first opening 126a and a second opening 126b. The fan module 140 is disposed in the outer casing 120. Referring to FIG. 2, the fan module 140 has at least one air inlet 142 and an air outlet 144. In various embodiments, the air inlet 142 may be located on a side of the fan module 140 near the upper cover 122, but is not limited thereto. In some embodiments, the air inlet 142 may also be located on a side of the fan module 140 away from the upper cover 122. The heat dissipation fin set 160 is disposed in the outer casing 120 and located between the first opening 126a and the air outlet 144 of the fan module 140. In various embodiments, the heat dissipation fin set 160 is in close contact with the air outlet 144 of the fan module 140 and communicates with the air outlet 144 and the first opening 126a. The outer casing 120, the heat dissipation fin set 160 and the fan module 140 form an air inlet path between the second opening 126b and the air inlet 142. The air inlet path passes through at least a space between the upper cover 122 of the outer casing 120 and the heat dissipation fin set 160.

The air entering the outer casing 120 from the second opening 126b can be guided along the air inlet path to limit the pressure difference between the peripheral structure (such as the upper cover 122, the heat dissipation fin set 160 and the fan module 140) and the fan module 140. In the case of the air inlet 142 of the fan module 140. Therefore, the electronic device 100 enters between the upper cover 122 and the heat dissipation fin set 160 by introducing more external cold air, so that there is more space between the heat dissipation fin set 160 and the upper cover 122 of the outer casing 120 to accommodate air, which can reduce Or avoiding the distance between the heat dissipation fin set 160 and the outer casing 120 being too close, and generating excessive heat energy from the heat dissipation fin set 160 to the outer casing 120. Simultaneously, the cold air entering the outer casing 120 from the second opening 126b can be guided into the fan module 140, and between the heat dissipation fin set 160 and the outer casing 120, the heat dissipation fin set 160 and the outer casing 120 can be further The air heated by the heat dissipation fin group 160 is guided into the air inlet 142 of the fan module 140 according to the air flow of the air inlet path, so as to avoid excessive accumulation of air heated by the heat dissipation fin group 160 and transfer heat energy to the outer casing 120. And the airflow entering the fan module 140 is increased. In this way, the heat dissipation module of the electronic device 100, such as the fan module 140 and the heat dissipation fin set 160, can be reduced or avoided, and the heat dissipation module of the electronic device 100 is heated by the heat dissipation fin group 160. The heat dissipation efficiency is reduced. Or, reducing or avoiding the accumulation of heat in the outer casing 120 causes the temperature in the electronic device 100 to rise, thereby affecting the normal operation of the electronic device 100.

In addition, since the second opening 126b is disposed on the side wall 124 together with the first opening 126a, in the normal use, when the upper cover 122 faces upward, the first opening 126a and the second opening 126b are less likely to be affected by gravity. Falling dust or other foreign matter enters. In this way, the first opening 126a or the second opening 126b can be reduced or prevented from being accumulated due to dust or foreign matter, and the airflow flowing from the first opening 126a or the second opening 126b and the normal operation of the heat dissipation module are affected. .

It should be noted that the structures between the first opening 126a, the second opening 126b, and the second opening 126b to the air inlet 142 shown in FIG. 1 and FIG. 2 are only examples, and are not intended to limit the present invention. In various embodiments, the side wall 124 can include a plurality of first openings 126a and a plurality of second openings 126b. In various embodiments, other elements may be disposed between the second opening 126b and the air inlet 142, such as, for example, a baffle or the like. It should be understood that those skilled in the art, in light of the actual needs, may make a modest modification or substitution without departing from the spirit and scope of the disclosure, as long as outside air can enter the outer casing 120 from the second opening 126b, and In the process of flowing to the fan module 140, it may pass between the outer casing 120 and the heat dissipation fin set 160. Or even after the outside air enters the outer casing 120 from the second opening 126b, in the path away from the first opening 126a, the heat dissipation fin set 160 is passed twice to increase the heat exchange between the air and the heat dissipation fin set 160. The effective path is long and the heat exchange rate between the air and the fin group 160 is increased.

Referring to FIG. 2, in various embodiments, the first opening 126a and the second opening 126b are respectively located on two sides of a plane where the air inlet 142 is located, and the second opening 126b is closer to the upper cover 122 than the first opening 126a. Since the air is heated by the heat dissipation fin group 160, the air density thereof becomes small, and it is easy to rise to the space between the upper cover 122 and the heat dissipation fin group 160. Therefore, the electronic device 100 increases the space between the upper cover 122 and the heat dissipation fin set 160, and the second opening 126b is disposed above the first opening 126a. Referring also to FIG. 1 , in various embodiments, the second opening 126 b can be located between the first opening 126 a and the upper cover 122 . That is, the second opening 126b is disposed in a space between the first opening 126a and the upper cover 122. In this way, the air can flow more directly into the heat dissipation fin set 160, and the space utilization of the outer casing 120 is increased and the manufacturing process of the outer casing 120 is simplified.

FIG. 3 is a perspective view of a heat dissipation fin set 160 of an electronic device 100 according to various embodiments of the present invention. As shown in FIG. 3, in various embodiments, the heat sink fin set 160 can include a plurality of heat sink fins 162. The heat dissipation fins 162 have extension portions 162a, respectively. The extension portion 162a is adjacent to the upper cover 122. The extensions 162a of the heat dissipation fin set 160 may collectively form a surface 164. The surface 164 of the heat dissipation fin set 160 can at least partially block the heat sink fin set 160 from directly communicating with the second opening 126b in the outer casing 120. That is, the second opening 126b needs to pass through the path of the air inlet path and the fan module 140 to communicate with the heat dissipation fin group 160 to avoid the air heated by the heat dissipation fin group 160, directly entering the heat dissipation fin group 160 and The space between the upper covers 122 of the outer casing 120 blocks cold air from entering the second opening 126b, and may increase heat exchange between the outer casing 120 and the air heated by the heat dissipation fin set 160, increasing the temperature of the outer casing 120. In one embodiment, the heat dissipation fin set 160 is away from one end of the air outlet 144 of the fan module 140 and can extend away from the upper cover 122 .

The surface 164 of the heat dissipation fin set 160 blocks the heat dissipation fin set 160 from directly communicating with the second opening 126b in the outer casing 120, and at the same time, the end of the heat dissipation fin set 160 away from the air outlet 144 of the fan module 140 faces away from the upper cover. The direction of the 122 or the second opening 126b extends, so that the airflow can be guided away from the air outlet 144 and heated, and then guided, and guided away from the second opening 126b. The reduced or avoided air is circulated to the outside of the second opening 126b after being discharged, and is again sucked into the outer casing 120, so that the proportion of the electronic device 100 sucking in the cold air is lowered, so that the heat dissipation efficiency of the electronic device 100 is lowered.

4 is a top perspective view of an electronic device 300 in accordance with another embodiment of the present invention. As shown in FIG. 4, in various embodiments, the outer casing 120 may include a plurality of side walls 124, and the first opening 126a and the second opening 126b are respectively located at two adjacent sides of the side wall 124. In this way, the intake air path can be prevented from being too long, and at the same time, the airflow is prevented from exiting from the air outlet 144 and entering the heat dissipation fin group 160, and then discharged toward the second opening 126b, and is again sucked into the outer casing 120. The electronic device 300 can draw more cold air from the outside, and the heat dissipation efficiency of the electronic device 300 is increased.

In various embodiments, the electronic device 300 can further include a baffle 180. The deflector 180 is disposed between the heat dissipation fin set 160 and the second opening 126b. The outer surfaces of the deflector 180, the outer casing 120, and the fins 160 together form an air inlet path. By providing the deflector 180, the air entering the outer casing 120 through the second opening 126b can be more efficiently guided to the space between the heat dissipation fin set 160 and the outer casing 120, and then enter the air inlet 142. In addition, the deflector 180 can reduce or avoid the large wind cut flow field and the noise generated by the wind cut flow field after the airflow enters the outer casing 120.

In various embodiments, the baffle 180 can include at least one flow guiding branch 180a extending between the heat sink fin set 160 and the outer casing 120. In various embodiments, the flow guiding branch 180a can extend over a side of the heat sink fin set 160 that is adjacent the upper cover 120 of the outer casing 120. In other various embodiments, the flow guiding branch 180a can extend between the two sides of the heat dissipation fin set 160 and the space sandwiched by the outer casing 120.

In various embodiments, the baffle 180 extends in a direction that is substantially perpendicular to the upper cover 122. Alternatively, in other various embodiments, the baffle 180 may extend in a direction parallel to the upper cover 122, but is not limited thereto. It should be understood that the baffle 180 and the diversion branch 180a described herein are merely examples, and those skilled in the art can make appropriate modifications or do not deviate from the spirit and scope of the disclosure. Alternatively, as long as the outside air can enter the outer casing 120 from the second opening 126b and is guided by the deflector 180 and the diversion branch 180a, it is more efficiently passed between the outer casing 120 and the heat dissipation fin set 160. The air inlet 142 of the fan module 140 can be accessed.

FIG. 5 is a top perspective view of an electronic device 400 according to another embodiment of the present invention. FIG. 6 is a perspective view of the heat dissipation fin set 160, the deflector 180, and the flow guiding branch 180a of the electronic device 400 according to another embodiment of the present invention. As shown in FIG. 5 , in various embodiments, the first opening 126 a and the second opening 126 b are juxtaposed to the side wall 124 in a direction substantially parallel to the upper cover 122 . In various embodiments, the electronic device 400 can include a baffle 180. Similarly, in various embodiments, the baffle 180 is disposed between the heat dissipation fin set 160 and the second opening 126b. In various embodiments, the baffle 180 can include at least one flow guiding branch 180a extending between the heat sink fin set 160 and the outer casing 120 (as shown in FIG. 6).

In one embodiment, the side of the flow guiding branch 180a adjacent to the fan module 140 is parallel to the side of the heat dissipation fin set 160 near the fan module 140 to reduce the wind cut flow field and the accompanying wind cut flow place. The noise. In various embodiments, the heat sink fin set 160 has a first length d1 in a direction substantially parallel to an edge of the air outlet 144, and the flow guiding branch 180a has a second length d2 in a direction of the first length d1. In various embodiments, the second length d2 is at least greater than one third of the first length d1, with a preferred air flow field guiding effect. In various embodiments, the second length d2 is less than two-thirds of the first length d1 and has a preferred air flow field guiding effect. In various embodiments, the flow guiding branch 180a can shield at least a portion of the space between the outer casing 120 and the heat dissipation fin set 160. However, the flow guiding branch 180a does not completely shield the housing 120 from the heat sink fin set 160 or directly contact the housing 120 and the heat sink fin set 160. In this way, a better combination can be achieved between guiding the air and maintaining the cross-sectional area of the air inlet path. At the same time, the heat radiated by the heat dissipation fin group 160 can be prevented from being conducted to the outer casing 120 through the flow guiding branch 180a.

It should be noted that the direction and extension length of the flow guiding branch 180a described herein are merely examples, and are not intended to limit the present invention. It should be understood that those skilled in the art, in light of the actual needs, may make a modest modification or substitution without departing from the spirit and scope of the disclosure, as long as outside air can enter the outer casing 120 from the second opening 126b, and Guided by the deflector 180 and the flow guiding branch 180a, the air inlet 142 of the fan module 140 can be accessed only after passing between the outer casing 120 and the heat dissipation fin set 160.

In summary, the present invention provides an electronic device including a housing, a fan module, and a heat dissipation fin set. The outer casing includes an upper cover and at least one side wall. The side wall abuts the upper cover and has a first opening and a second opening. The fan module is disposed in the outer casing. The fan module has at least one air inlet and an air outlet. The heat dissipation fin group is disposed in the outer casing and is located between the first opening and the air outlet of the fan module. The outer casing, the heat dissipation fin set and the fan module form an air inlet path between the second opening and the air inlet. The air inlet path passes through at least a space between the upper cover of the outer casing and the heat dissipation fin set. By providing the second opening, the cold air from the outside can enter the heat-dissipating fin group and the outer casing from the second opening, and flow into the fan module as the pressure difference between the air inlet path and the fan module is guided. tuyere. In this way, the heat exchange between the heat dissipation fin group and the outer casing can be reduced or reduced, thereby reducing the temperature of the outer casing near the heat dissipation fin group, so that the heat dissipation module of the electronic device can achieve better heat dissipation efficiency.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧Electronic devices

120‧‧‧Shell

122‧‧‧Upper cover

124‧‧‧ Side wall

126a‧‧‧first opening

126b‧‧‧ second opening

140‧‧‧Fan module

142‧‧‧ air inlet

144‧‧‧air outlet

160‧‧‧Fixed fin set

162‧‧‧heat fins

162a‧‧‧Extension

164‧‧‧ surface

180‧‧‧ deflector

180a‧‧‧ diversion branch

300‧‧‧Electronic devices

400‧‧‧Electronic devices

D1‧‧‧first length

D2‧‧‧second length

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. 2 is a side cross-sectional view of an electronic device in accordance with various embodiments of the present invention. FIG. 3 is a perspective view of a heat dissipation fin set of an electronic device according to various embodiments of the present invention. 4 is a top perspective view of an electronic device according to another embodiment of the present invention. FIG. 5 is a top perspective view of an electronic device according to still another embodiment of the present invention. 6 is a perspective view of a heat sink fin set, a baffle, and a flow guiding branch of an electronic device according to still another embodiment of the present invention.

Claims (8)

An electronic device comprising: an outer casing comprising: an upper cover; and at least one side wall adjacent to the upper cover, the side wall having a first opening and a second opening, wherein the first opening and the second opening are substantially a fan module is disposed in the outer wall, and a fan module is disposed in the outer casing. The fan module has at least one air inlet and an air outlet; a heat dissipation fin set is disposed in the outer casing, and Between the first opening and the air outlet of the fan module; and a baffle disposed between the heat dissipation fin set and the second opening; wherein the outer casing, the heat dissipation fin set and the The fan module forms an air inlet path between the second opening and the air inlet, and the air inlet path passes through at least a space between the upper cover and the heat dissipation fin set of the outer casing, the air deflector, the outer casing, and An outer surface of the heat sink fin group collectively forms the air inlet path. The electronic device of claim 1, wherein the first opening and the second opening are respectively located on two sides of a plane where the air inlet is located, and the second opening is closer to the upper cover than the first opening. The electronic device of claim 2, wherein the second opening is located between the first opening and the upper cover. The electronic device of claim 2, wherein the heat dissipation fin set comprises a plurality of heat dissipation fins, each of the heat dissipation fins having an extension portion 162a adjacent to the upper cover, the heat dissipation fin group The extension portion 162a collectively forms a surface that blocks the heat dissipation fin group from directly communicating with the second opening in the outer casing, and the heat dissipation fin group is away from an end of the fan module and extends away from the upper cover. The electronic device of claim 1, wherein the outer casing comprises a plurality of the side walls, and the first opening and the second opening are respectively located adjacent to the side walls. The electronic device of claim 1, wherein the baffle extends in a direction substantially perpendicular to the upper cover. The electronic device of claim 1, wherein the baffle comprises at least one flow guiding branch extending between the heat dissipation fin set and the outer casing. The electronic device of claim 7, wherein a side of the flow guiding branch adjacent to the fan module is parallel to a side of the heat dissipation fin group adjacent to the fan module, and the heat dissipation fin group is substantially A direction parallel to an edge of the air outlet has a first length, the flow guiding branch having a second length along the direction of the first length, the second length being at least greater than one third of the first length.