M295425 八、新型說明： 【新型所屬之技術領域】 本創作「電腦機殼散熱構造」，旨在於提供一種應用於小型電腦的散熱 構造。 【先前技術】M295425 VIII. New Description: [New Technology Field] The creation of "Computer Case Heat Dissipation Structure" aims to provide a heat dissipation structure for small computers. [Prior Art]
現今的桌上型電腦的發展，有一部份往標準尺寸的規格發展，另一部 份則往小型的規袼發展（例如準系統、BOOK SIZE PC)，二者之間各有其優 缺點’其中之小型電腦’具有體積小，不健間以及便於攜帶的優點，但 最為人垢病親即是，因祕體積小，絲w，導致雜電腦無法應 用速度較快的晶片以及CPU (因為高速的晶片及CPU易產生高溫），而且較 不穩定’其散熱不良駐要賴乃縣其機殼小，無法裝設纽風扇進行 散熱’同時因為設於⑽上的散熱風扇，供法直接將熱空氣抽出機殼外， 導致有一部份的熱空氣在機殼内部循環。 【新型内容】 卿乍|電腦機殼散熱構造」，主要在針對於小型電腦的散熱構造， 用強道性空氣職的構造，能將冷空氣引内機殼⑽，進料錢 由架設請散細上方之風扇，將熱空氣排至機殼外部，避免_ 在^内部循環，而财效的控韻殼内部鱗在良料溫度條件下 【貝把方式】 首先如第一圖、第二圖以及第三圖所示， 之主要槿i你士“ J乍t腦機殼散熱構造 之主要構w係主要有機殼1G、前蓋板2G、後蓋板m门曰 成其中： 曼盍板30以及風扇模組40所捐 M295425 機殼10為一半封閉之鋁擠型，其内部中空部位，主要供電腦的ρ[β % 及其相關的電子組件設置，在機殼1〇前端之下方兩側設有進風口 n。 前蓋板20主要作為該電腦的面板，利用螺釘6〇鎖固於機殼1〇之前端。 後蓋板30，利用螺釘6〇螺固於機殼1〇之後端，後蓋板3〇上設有對應 於PCB 50上電源插座51、訊號挿座52的配置孔31，以及排風口 32。 風扇模組40係由一殼體41以及風扇42所構成，該殼體41呈中空狀， 具有一位於側邊的出口 43以及一位於底部的入口 44，風扇42係設於殼體 41入口 44處，風扇運轉時，能將空氣自底部的入口 44抽入後，由出口奶 排出。 本創作主要係將風扇模組4〇架設於電腦PCB上的cpu上方之散熱鰭片 53上方，並使風扇模組4〇之出口 43對應於後蓋板3〇之排風口犯，同時 當組裝完成後，侧前蓋板2G、後蓋板30與機殼1〇組合封閉之容器，將 PCB50包容於内，僅留機殼上之進風口 u與後蓋板洲上之排風口 32與外 界開放，請配合第四圖所示，當風扇42運轉後，冷空氣的進風口 ^被引 進後，首先經過硬碟54、光碟機55以及PCB 5〇 ±之相關電子零件，再經 過CPU上之散熱鰭片53，最後再經由風扇模組4〇之出口將熱交換後之熱空 氣，自排風口 32向外排出。 本創作「電職殼散熱構造」，主要係利用將冷空氣前進後出之強迫性 空氣對流賴造’祕輕氣引_殼_，贿熱交換，最終由架設於 ⑽散熱鰭片上方之風扇，將熱空氣排至機殼外部，避免熱空氣在機殼内部 循裒而此有效的控機殼内部保持在良好的溫度條件下運作。 需陳明者，社所述乃是補狀具體實麵及所運狀麟原理，若 M295425 依本創作之構想所作之等效改變，其所產生之功能作用仍未超出說明書及 圖式所涵蓋之精神時，均應依全要件原則或均等論原則而落入本創作申請 專利範圍中所陳述之範缚，合先陳明。 【圖式簡單說明】 第一圖為本創作之立體分解圖。 第二圖為本創作之另一角度之立體分解圖。 第三圖為本創作之立體組合圖。 > 第四圖為本創作内部空氣對流情形。 【主要元件符號說明】 10機殼 11進風口 20前蓋板 30後蓋板 31配置孔 32排風口 40風扇模組 41殼體 42風扇 43出口 | 44 入口 50 PCB 51電源插座 52訊號插座 53散熱鰭片 54硬碟 55光碟機 60螺釘The development of today's desktop PCs has evolved from standard size specifications to small size specifications (such as barebones, BOOK SIZE PC), which have their own advantages and disadvantages. Among them, the small computer 'has the advantages of small size, non-health and portability, but the most serious problem is that the small size, silk w, the miscellaneous computer can not apply faster wafers and CPU (because of high speed The chip and CPU are prone to high temperatures), and it is relatively unstable. 'There is a poor heat dissipation station. The case is small in Lai Nai County. It cannot be installed with a fan for heat dissipation. At the same time, because the cooling fan is located on (10), the supply will be directly hot. The air is drawn out of the casing, causing a portion of the hot air to circulate inside the casing. [New content] 乍 乍 | computer case heat dissipation structure, mainly for the heat dissipation structure of small computers, with a strong air structure, can introduce cold air into the inner casing (10) The fan above the fine, the hot air is discharged to the outside of the casing, avoiding _ internal circulation, and the inner scale of the control effect of the financial effect is under the condition of good temperature [before the way] first as the first picture, the second picture As shown in the third figure, the main 槿i you "J乍t brain shell heat dissipation structure of the main structure w main organic shell 1G, front cover 2G, rear cover m door into which: Mandang board 30 and the M295425 casing 10 donated by the fan module 40 is a semi-closed aluminum extrusion type, and its internal hollow portion is mainly provided for the computer's ρ[β% and its related electronic components, which are located below the front end of the casing 1〇. The air inlet n is provided on the side. The front cover 20 is mainly used as a panel of the computer, and is fastened to the front end of the casing 1 by screws 6〇. The rear cover 30 is screwed to the rear end of the casing 1 by screws 6〇. The rear cover 3 is provided with a configuration hole 31 corresponding to the power socket 51 and the signal socket 52 on the PCB 50. And the air outlet 32. The fan module 40 is composed of a casing 41 and a fan 42. The casing 41 has a hollow shape, and has an outlet 43 at the side and an inlet 44 at the bottom. The fan 42 is provided. At the inlet 44 of the casing 41, when the fan is running, air can be drawn from the inlet 44 at the bottom and then discharged by the outlet milk. The main purpose of this invention is to dispose the fan module 4〇 on the heat sink fin above the CPU on the computer PCB. Above the sheet 53, and the outlet 43 of the fan module 4 is corresponding to the air outlet of the rear cover 3, and when the assembly is completed, the side front cover 2G, the rear cover 30 and the casing 1 are combined and closed. The container, the PCB 50 is contained therein, and only the air inlet u on the casing and the air outlet 32 on the back cover are open to the outside, please cooperate with the air inlet of the cold air when the fan 42 is operated as shown in the fourth figure. ^ After being introduced, it first passes through the relevant electronic components of the hard disk 54, the optical disk drive 55 and the PCB 5〇±, and then passes through the heat dissipation fins 53 on the CPU, and finally the heat after the heat exchange through the outlet of the fan module 4〇 The air is discharged from the exhaust vent 32. The thermal structure is mainly based on the forced air convection that moves the cold air forward, and the heat is exchanged by the fan that is placed above the (10) heat sink fins. Outside the casing, hot air is prevented from circulating inside the casing and the inside of the effective control casing is kept operating at a good temperature. For those who need to be identified, the company's description is based on the specific facts of the supplement and the principle of the operation. If the equivalent change of M295425 is based on the concept of this creation, the functional role produced by it is still beyond the scope of the specification and drawings. In the spirit of the spirit, it should be based on the principle of the whole principle or the principle of equalization and fall into the limits of the scope stated in the scope of the patent application for this creation. [Simple description of the diagram] The first picture is an exploded view of the creation. The second picture is a perspective exploded view of another angle of the creation. The third picture is a three-dimensional combination of the creation. > The fourth picture is the internal air convection situation of the creation. [Main component symbol description] 10 casing 11 air inlet 20 front cover 30 rear cover 31 arrangement hole 32 exhaust port 40 fan module 41 housing 42 fan 43 outlet | 44 inlet 50 PCB 51 power socket 52 signal socket 53 heat dissipation Fin 54 hard disk 55 optical drive 60 screws