CN209474657U - Portable ultrasonic device - Google Patents
Portable ultrasonic device Download PDFInfo
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- CN209474657U CN209474657U CN201821975570.2U CN201821975570U CN209474657U CN 209474657 U CN209474657 U CN 209474657U CN 201821975570 U CN201821975570 U CN 201821975570U CN 209474657 U CN209474657 U CN 209474657U
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- heat
- ultrasonic device
- portable ultrasonic
- fan
- air outlet
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Abstract
A kind of portable ultrasonic device, with heat-transfer device, which is connect in a manner of being able to carry out heat transfer at least one heat-generating units, to conduct heat.The heat-transfer device has radiating end, which is arranged at air outlet and is located on the air-out direction of fan.The heat of heat-generating units is concentrated at conduction to air outlet since heat-transfer device is utilized, fan, which can be concentrated, radiates to the heat on the radiating end, improve radiating efficiency, therefore it can choose the fan of smaller air quantity, be conducive to the miniaturization of portable ultrasonic device, and rotation speed of the fan is low, will not generate higher noise.Meanwhile radiating end setting, in air outlet, the thermal current for blowing over radiating end is directly discharged from air outlet, will not run helter-skelter inside housings, and then can reduce influence of the thermal current to radiating efficiency.
Description
Technical field
This application involves ultrasonic devices, and in particular to the radiator structure of ultrasonic device.
Background technique
The air quantity of radiator fan is related to volume, and the fan volume of general Wind Volume also can accordingly become larger.Portable ultraphonic
Equipment can not use the fan of large volume due to volumetric constraint, and therefore, common portable ultrasonic device is used in heat dissipation
It is more suitable for the centrifugal fan in small space.The air-flow that the centrifugal fan generates brushes heat-generating units, is produced to take away heat-generating units
Raw heat.As the properties of product of portable ultrasonic device (such as Portable color equipment) are promoted, the power consumption of equipment is more next
Bigger, in addition equipment often works in high power consumption state, therefore its generated heat is very high.But centrifugal fan air outlet face
Product is small, and then causes heat dissipation area small, if to improve air quantity, it is necessary to increase rotation speed of the fan, this will be so that noise when heat dissipation
It is higher.
Summary of the invention
The application provides a kind of novel portable ultrasonic device, to improve radiating efficiency, reduces noise.
A kind of portable ultrasonic device is provided in a kind of embodiment, comprising:
Shell, the shell have installation cavity, air inlet and air outlet, and the air inlet and air outlet communicate；
Heat-generating units, the heat-generating units are mounted in installation cavity, can generate heat during operation；
Heat-transfer device, the heat-transfer device are connect in a manner of being able to carry out heat transfer at least one heat-generating units, are used
To conduct heat, the heat-transfer device has radiating end, and the radiating end is arranged at air outlet；
And fan, the fan are arranged at the air outlet, the air-out direction of the fan is described towards air outlet
Radiating end is arranged on the air-out direction of the fan.
In a kind of embodiment, the heat-generating units include central processing unit, programmable logic chip, analog front-end chip,
Memory chip, hard disk and battery.
In a kind of embodiment, the heat-transfer device includes heat-conducting piece and the heat sink assembly as radiating end, described thermally conductive
Part is connected in a manner of being able to carry out heat transfer with heat sink assembly and corresponding heat-generating units, and the heat sink assembly setting exists
At air outlet.
In a kind of embodiment, the central processing unit is connected in a manner of being able to carry out heat transfer with corresponding heat-conducting piece, is used
With the heat transfer that generates the central processing unit to heat sink assembly.
In a kind of embodiment, the heat-transfer device further includes the first absorber plate, the centrally disposed place of the first absorber plate
The top of device is managed, to absorb heat caused by central processing unit, first absorber plate is contacted with corresponding heat-conducting piece, will
Heat transfer is to heat-conducting piece.
In a kind of embodiment, first absorber plate has multiple hollowed out areas, to mitigate the weight of the first absorber plate.
In a kind of embodiment, the programmable logic chip is connected in a manner of being able to carry out heat transfer with corresponding heat-conducting piece
It connects, to the heat transfer that generates the programmable logic chip to heat sink assembly.
In a kind of embodiment, the heat-transfer device further includes the second absorber plate, and the second absorber plate setting is programmable
The top of logic chip, to absorb heat caused by programmable logic chip, second absorber plate with it is corresponding thermally conductive
Part contact, transfers heat to heat-conducting piece.
In a kind of embodiment, the heat-conducting piece uses heat conducting pipe, and one end of the heat conducting pipe is extend into heat sink assembly,
To carry out heat transfer.
In a kind of embodiment, the heat sink assembly includes multiple cooling fins, and the cooling fin is stacked, each cooling fin
Between gap face fan air outlet setting, air-flow is entered in the gap, is connect with more cooling fins
Touching.
In a kind of embodiment, rear wall that the shell has front side wall towards user, deviates from the front side wall
And it is connected to left side wall and right side wall between front side wall and rear wall, the air outlet is set to rear wall, the front side
At least one setting air inlet in wall, left side wall and right side wall.
In a kind of embodiment, the analog front-end chip and/or memory chip recline the inner wall setting of the installation cavity.
In a kind of embodiment, the air inlet and air outlet are connected to installation cavity, and the hard disk and/or battery setting exist
The position of face air inlet.
In a kind of embodiment, the air inlet and air outlet are connected to installation cavity, and the hard disk and/or battery setting exist
The position of face air inlet.
In a kind of embodiment, the fan uses aerofoil fan.
In a kind of embodiment, the fan be it is multiple, be arranged side by side and air-out direction be identical.
In a kind of embodiment, at least two fans have different revolving speeds.
According to the portable ultrasonic device of above-described embodiment, with heat-transfer device, the heat-transfer device and at least one hair
Hot cell is connected in a manner of being able to carry out heat transfer, to conduct heat.The heat-transfer device has radiating end, which sets
It sets at air outlet and is located on the air-out direction of fan.The heat of heat-generating units is concentrated into conduction since heat-transfer device is utilized
To air outlet, fan, which can be concentrated, radiates to the heat on the radiating end, improves radiating efficiency, therefore can choose
The fan of smaller air quantity is conducive to the miniaturization of portable ultrasonic device, and rotation speed of the fan is low, will not generate higher make an uproar
Sound.Meanwhile radiating end setting, in air outlet, the thermal current for blowing over radiating end is directly discharged from air outlet, it will not be in shell
Portion runs helter-skelter, and then can reduce influence of the thermal current to radiating efficiency.
Detailed description of the invention
Fig. 1 is arrangement schematic diagram of the heat-transfer device on portable ultrasonic device in a kind of embodiment of the application；
Fig. 2 is the first absorber plate heat conduction structure schematic diagram in a kind of embodiment of the application；
Fig. 3 is the second absorber plate heat conduction structure schematic diagram in a kind of embodiment of the application；
Fig. 4 is the position distribution schematic diagram of fan and heat sink assembly in a kind of embodiment of the application.
Specific embodiment
Below by specific embodiment combination attached drawing, invention is further described in detail.Wherein different embodiments
Middle similar component uses associated similar element numbers.In the following embodiments, many datail descriptions be in order to
The application is better understood.However, those skilled in the art can recognize without lifting an eyebrow, part of feature
It is dispensed, or can be substituted by other elements, material, method in varied situations.In some cases, this Shen
Please it is relevant it is some operation there is no in the description show or describe, this is the core in order to avoid the application by mistake
More descriptions are flooded, and to those skilled in the art, these relevant operations, which are described in detail, not to be necessary, they
Relevant operation can be completely understood according to the general technology knowledge of description and this field in specification.
It is formed respectively in addition, feature described in this description, operation or feature can combine in any suitable way
Kind embodiment.Meanwhile each step in method description or movement can also can be aobvious and easy according to those skilled in the art institute
The mode carry out sequence exchange or adjustment seen.Therefore, the various sequences in the description and the appended drawings are intended merely to clearly describe a certain
A embodiment is not meant to be necessary sequence, and wherein some sequentially must comply with unless otherwise indicated.
It is herein component institute serialization number itself, such as " first ", " second " etc., is only used for distinguishing described object,
Without any sequence or art-recognized meanings.And " connection ", " connection " described in the application, unless otherwise instructed, include directly and
It is indirectly connected with (connection).
A kind of embodiment provides a kind of portable ultrasonic device, especially a kind of Portable color equipment.
Referring to FIG. 1, in the embodiment, which includes shell 100, heat-generating units, thermally conductive dress
Set 200 and fan 300.Certainly, in addition to this, which can also include control button, probe, display
Etc. known elements, herein not in superfluous words.
The shell 100 has installation cavity (not indicating in figure), air inlet 101 and air outlet 102.The installation cavity can be used
In components such as installation mainboard 400, hard disk 500 and batteries 600.Heat-generating units are mounted in installation cavity, during operation can
Generate heat.The heat-generating units include the various components for generating heat during operation in portable ultrasonic device, for example, should
Heat-generating units may include central processing unit (CPU), programmable logic chip (FPGA), analog front-end chip (AFE), memory chip
(DDR), hard disk 500 and battery 600 etc..The heat-transfer device 200 and at least one heat-generating units are to be able to carry out heat transfer
Mode connects, to conduct heat.The heat-transfer device 200 has radiating end, and radiating end is arranged at air outlet 102.Described
The mode for being able to carry out heat transfer includes but is not limited to directly to contact with heat-generating units and contact with heat-generating units ambient air
Mode.
The fan 300 is arranged at air outlet 102.The air-out direction of fan 300 is arranged towards air outlet 102, radiating end
On the air-out direction of fan 300.The air inlet 101 and air outlet 102 communicate.Preferably, the air inlet 101 and air outlet
102 are connected to installation cavity, thus realize that air inlet 101 and air outlet 102 communicate, the air flowed into this way by air inlet 101
The all parts being arranged in installation cavity can be blown over, the heat of its generation is taken away.Certainly, in other embodiments, the air inlet
101 can also be connected to air outlet 102 using independent air duct, keep the air-flow flowed into from air inlet 101 direct along independent ventiduct
It is transmitted to the air inlet 101 of fan 300.
The present embodiment concentrates the heat of heat-generating units at conduction to air outlet 102 since heat-transfer device 200 is utilized, wind
Fan 300, which can be concentrated, radiates to the heat on the radiating end, improves radiating efficiency, therefore can choose smaller air quantity
Fan 300 is conducive to the miniaturization of portable ultrasonic device, and 300 revolving speed of fan is low, will not generate higher noise.Together
When, radiating end setting is directly discharged from air outlet 102 in air outlet 102, the thermal current for blowing over radiating end, will not be in shell
It runs helter-skelter inside 100, and then influence of the thermal current to radiating efficiency can be reduced.
Since aerofoil fan air quantity is small, wind pressure is low, if radiated directly on heat source using aerofoil fan, efficiency is too low,
Cooling requirements are unable to satisfy, aerofoil fan therefore, in common portable ultrasonic device is not used to radiate.This implementation
Example reduces the requirement to 300 air quantity of fan, therefore the fan 300 of all kinds of small sizes, such as smaller 25mm can be used
Aerofoil fan etc. enables aerofoil fan to be successfully applied in portable ultrasonic device.Certainly, in addition to aerofoil fan
Outside, fan 300 used by the present embodiment is also possible to centrifugal fan.
Referring to FIG. 1, the heat-transfer device 200 includes heat-conducting piece 210 and the cooling fin as radiating end in a kind of embodiment
Component 220.The heat-conducting piece 210 is connected in a manner of being able to carry out heat transfer with heat sink assembly 220 and corresponding heat-generating units,
The heat sink assembly 220 is arranged at air outlet 102.
Heat conducting pipe or other kinds of heat-conducting piece can be used in the heat-conducting piece 210.The heat conducting pipe has high thermal conductivity coefficient, can
Improve heat conduction efficiency.One end of the heat conducting pipe is extend into heat sink assembly 220, to carry out heat transfer.Heat conducting pipe it is another
One end can be used to carry out heat transfer with the heat-generating units for needing to radiate.
Further, referring to FIG. 1, the central processing unit can be directly welded on mainboard 400, PC module can also be passed through
(computer module) is installed on mainboard 400.Since central processing unit is one of the main heating source of portable ultrasonic device,
Special structure it can be arranged to radiate.In a kind of embodiment, central processing unit and corresponding heat-conducting piece 210 are with can be into
The mode of row heat transfer connects, to the heat transfer that generates central processing unit to heat sink assembly 220.
Specifically, referring to FIG. 2, the heat-transfer device 200 may also include the first absorber plate 230.The setting of first absorber plate 230
In the top (in Fig. 2, which is blocked by the first absorber plate 230) of central processing unit, to absorb central processing unit
Generated heat.First absorber plate 230 is contacted with corresponding heat-conducting piece 210, transfers heat to heat-conducting piece 210.Centre
The upward side space conduction of heat that device generates is managed, the first absorber plate 230 can be used the material with high thermal conductivity and be made, from
And it being capable of heat caused by efficient absorption central processing unit.The heat absorbed by the first absorber plate 230 is through heat-conducting piece
210 are finally conducted on heat sink assembly 220, and then are blown away by the concentration of fan 300.
Biggish size can be used in first absorber plate 230, covers entire central processing unit, improves to central processing unit
The assimilation effect of generated heat, heat caused by absorption central processing unit as much as possible.
Certainly, in some other embodiment, which can also directly contact with central processing unit, or
Person is directly contacted with the air of central processing unit or central processing unit surrounding by heat-conducting piece 210.
Further, referring to FIG. 2, in a kind of embodiment, the first absorber plate 230 has multiple hollowed out areas, such as round
Shape hole 231 to mitigate the weight of the first absorber plate 230, and then mitigates the weight of entire ultrasonic device.
Further, which is also one of main heating source of portable ultrasonic device, therefore, can also be right
It carries out special heat dissipation.The programmable logic chip is connected in a manner of being able to carry out heat transfer with corresponding heat-conducting piece 210, is used
With the heat transfer that generates programmable logic chip to heat sink assembly 220.
It please refers to Fig. 1 and 3, further includes the second absorber plate 240 in a kind of embodiment.Second absorber plate 240 setting is can
The top (in Fig. 3, which is blocked by the second absorber plate 240) of programmed logic chip, it is programmable to absorb
Heat caused by logic chip.Second absorber plate 240 is contacted with corresponding heat-conducting piece 210, transfers heat to heat-conducting piece
210。
Programmable logic chip generates the upward side space conduction of heat, and the second absorber plate 240, which can be used, to be had compared with high thermal conductivity
The material of coefficient is made, so as to heat caused by efficient absorption programmable logic chip.By the second absorber plate 240
The heat absorbed is finally conducted on heat sink assembly 220 through heat-conducting piece 210, and then is blown away by the concentration of fan 300.
Biggish size can also be used in second absorber plate 240, covers entire programmable logic chip, improves to can compile
The assimilation effect of heat caused by journey logic chip, heat caused by absorption programmable logic chip as much as possible.
Certainly, in some other embodiment, which can also directly connect with programmable logic chip
Touching, or directly contacted with the air of programmable logic chip or programmable logic chip surrounding by heat-conducting piece 210.
Further, also can be set in other heat-generating units corresponding heat-conducting piece 210 carry out it is thermally conductive.But, for
Some low power chips, such as analog front-end chip, memory chip etc., can also make the analog front-end chip and/or memory
Chip recline installation cavity inner wall setting, to be radiated by the heat transfer of shell 100.And for heat labile component
Or the lower component of calorific value, such as hard disk 500, battery 600 etc., referring to FIG. 1, hard disk 500 and/or battery can be made
600 are arranged in the position of face air inlet 101, so that the cold air being had just enter into using air inlet 101 is (relative to air outlet 102
Hot-fluid for) cool down.
Further, Fig. 2-4 is please referred to, in a kind of embodiment, radiating end can include multiple dissipate for heat sink assembly 220
Backing, the cooling fin are stacked.The heat dissipation area of heat sink assembly 220, Jin Erti can be improved in the cooling fin being stacked
High cooling efficiency.The air outlet 102 of gap face fan 300 between each cooling fin is arranged, and air-flow is allowed to enter this
In gap, contacted with more cooling fins.
Certainly, the radiating end of the heat-transfer device 200 is not necessarily heat sink assembly 220, may also be other structures
Or design, such as can directly be a part of heat-conducting piece 210, that is, omit the heat sink assembly 220.
Further, referring to FIG. 1, in a kind of embodiment, the shell 100 have front side wall 103 towards user, with
The rear wall 104 that front side wall 103 deviates from and the left side wall 105 and right side wall being connected between front side wall 103 and rear wall 104
106.The air outlet 102 is set to rear wall 104, in the front side wall 103, left side wall 105 and right side wall 106 at least one be arranged into
Air port 101.After this mode of outlet air both can influence to avoid hot wind to doctor and patient, also can guarantee that air duct is smooth, makes
It obtains small to the resistance of air-flow inside shell 100.In some embodiments, the 100 bottom not aperture of shell of the ultrasonic device can drop
The low absorption to desktop dust.
In a kind of embodiment, referring to FIG. 1, the fan 300 be it is multiple, be arranged side by side and air-out direction be identical.Preferably
, 300 quantity of fan and heat dissipation area can be determined according to CPU, FPGA and system power dissipation.Pass through the setting to fan 300 simultaneously
Or control, so that revolving speed is different between adjacent fans 300, such as at least two fans is made to have different rotating speeds preferably can
So that all fans all have different revolving speeds, so that 300 frequency of fan is inconsistent, identical frequency sound is effectively avoided to be superimposed,
It avoids generating sharp noise, reduces system noise, improve sound quality.
Use above specific case is illustrated the present invention, is merely used to help understand the present invention, not to limit
The system present invention.For those skilled in the art, according to the thought of the present invention, can also make several simple
It deduces, deform or replaces.
Claims (16)
1. a kind of portable ultrasonic device characterized by comprising
Shell, the shell have installation cavity, air inlet and air outlet, and the air inlet and air outlet communicate；
Heat-generating units, the heat-generating units are mounted in installation cavity, can generate heat during operation；
Heat-transfer device, the heat-transfer device is connect in a manner of being able to carry out heat transfer at least one heat-generating units, to pass
Heat conduction amount, the heat-transfer device have radiating end, and the radiating end is arranged at air outlet；
And fan, the fan are arranged at the air outlet, the air-out direction of the fan is towards air outlet, the heat dissipation
End is arranged on the air-out direction of the fan.
2. portable ultrasonic device as described in claim 1, which is characterized in that the heat-generating units include central processing unit,
Programmable logic chip, analog front-end chip, memory chip, hard disk and battery.
3. portable ultrasonic device as claimed in claim 2, which is characterized in that the heat-transfer device includes heat-conducting piece and conduct
The heat sink assembly of radiating end, the heat-conducting piece are single with heat sink assembly and corresponding fever in a manner of being able to carry out heat transfer
Member connection, the heat sink assembly are arranged at air outlet.
4. portable ultrasonic device as claimed in claim 3, which is characterized in that the central processing unit and corresponding heat-conducting piece with
The mode for being able to carry out heat transfer connects, to the heat transfer that generates the central processing unit to heat sink assembly.
5. portable ultrasonic device as claimed in claim 4, which is characterized in that the heat-transfer device further includes the first heat absorption
Plate, the top of the centrally disposed processor of the first absorber plate, to absorb heat caused by central processing unit, described
One absorber plate is contacted with corresponding heat-conducting piece, transfers heat to heat-conducting piece.
6. portable ultrasonic device as claimed in claim 5, which is characterized in that first absorber plate has multiple vacancy sections
Domain, to mitigate the weight of the first absorber plate.
7. portable ultrasonic device as claimed in claim 3, which is characterized in that the programmable logic chip with it is corresponding thermally conductive
Part is connected in a manner of being able to carry out heat transfer, to the heat transfer that generates the programmable logic chip to cooling fin group
Part.
8. portable ultrasonic device as claimed in claim 7, which is characterized in that the heat-transfer device further includes the second heat absorption
The top of programmable logic chip is arranged in plate, second absorber plate, to absorb heat caused by programmable logic chip
Amount, second absorber plate are contacted with corresponding heat-conducting piece, transfer heat to heat-conducting piece.
9. portable ultrasonic device as claimed in claim 3, which is characterized in that the heat-conducting piece uses heat conducting pipe, described to lead
One end of heat pipe is extend into heat sink assembly, to carry out heat transfer.
10. portable ultrasonic device as claimed in claim 3, which is characterized in that the heat sink assembly includes multiple heat dissipations
Piece, the cooling fin are stacked, and the air outlet setting of the gap face fan between each cooling fin enters air-flow
Into the gap, contacted with more cooling fins.
11. the portable ultrasonic device as described in any one of claim 2 to 10, which is characterized in that the shell has face
The rear wall deviated to the front side wall of user and the front side wall and the left side wall being connected between front side wall and rear wall
And right side wall, the air outlet are set to rear wall, at least one setting air inlet in the front side wall, left side wall and right side wall
Mouthful.
12. the portable ultrasonic device as described in any one of claim 2 to 10, which is characterized in that the AFE(analog front end) core
Piece and/or memory chip recline the installation cavity inner wall setting.
13. the portable ultrasonic device as described in any one of claim 2 to 10, which is characterized in that the air inlet and go out
Air port is connected to installation cavity, and the position of face air inlet is arranged in the hard disk and/or battery.
14. the portable ultrasonic device as described in any one of claims 1 to 10, which is characterized in that the fan uses axis
Flow fan.
15. the portable ultrasonic device as described in any one of claims 1 to 10, which is characterized in that the fan be it is multiple,
It is arranged side by side and air-out direction is identical.
16. portable ultrasonic device as claimed in claim 15, which is characterized in that at least two fans have different turn
Speed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821975570.2U CN209474657U (en) | 2018-11-28 | 2018-11-28 | Portable ultrasonic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821975570.2U CN209474657U (en) | 2018-11-28 | 2018-11-28 | Portable ultrasonic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209474657U true CN209474657U (en) | 2019-10-11 |
Family
ID=68116827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821975570.2U Active CN209474657U (en) | 2018-11-28 | 2018-11-28 | Portable ultrasonic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209474657U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035640A (en) * | 2019-05-07 | 2019-07-19 | 东软医疗系统股份有限公司 | A kind of equipment cooling device |
| CN112754652A (en) * | 2020-12-31 | 2021-05-07 | 仕若普科技(深圳)有限公司 | Air duct heat dissipation assembly and depilating instrument |
-
2018
- 2018-11-28 CN CN201821975570.2U patent/CN209474657U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035640A (en) * | 2019-05-07 | 2019-07-19 | 东软医疗系统股份有限公司 | A kind of equipment cooling device |
| CN112754652A (en) * | 2020-12-31 | 2021-05-07 | 仕若普科技(深圳)有限公司 | Air duct heat dissipation assembly and depilating instrument |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Mindray Animal Medical Technology Co.,Ltd. Assignor: SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS Co.,Ltd. Contract record no.: X2022440020009 Denomination of utility model: Portable Ultrasound Equipment Granted publication date: 20191011 License type: Common License Record date: 20220804 |
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| EE01 | Entry into force of recordation of patent licensing contract |