CN105652991B - Cooling device for notebook computer and notebook computer - Google Patents
Cooling device for notebook computer and notebook computer Download PDFInfo
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- CN105652991B CN105652991B CN201511001803.XA CN201511001803A CN105652991B CN 105652991 B CN105652991 B CN 105652991B CN 201511001803 A CN201511001803 A CN 201511001803A CN 105652991 B CN105652991 B CN 105652991B
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- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
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Abstract
本发明公开了一种笔记本电脑散热装置及笔记本电脑。公开的笔记本电脑散热装置包括第一散热模组和第二散热模组；所述第一散热模组包括第一散热风扇、第一热管、CPU散热板和第一散热器；所述CPU散热板设置CPU芯片之上；第一热管一端焊接在CPU散热板上，另一端贯穿第一散热器；第一散热器安装在第一散热风扇的出口处；所述第二散热模组包括第二散热风扇、第二热管、GPU散热板和第二散热器；所述GPU散热板设置GPU芯片之上；第二热管一端焊接在GPU散热板上，另一端贯穿第二散热器；第二散热器安装在第二散热风扇的出口处；所述第一散热风扇和第二散热风扇分别布置在主机两侧。采用两套散热模组能够有效提高笔记本电脑的散热效果，以提高笔记本电脑的性能。
The invention discloses a cooling device for a notebook computer and a notebook computer. The disclosed notebook computer heat dissipation device includes a first heat dissipation module and a second heat dissipation module; the first heat dissipation module includes a first heat dissipation fan, a first heat pipe, a CPU cooling plate and a first radiator; the CPU cooling plate Set on the CPU chip; one end of the first heat pipe is welded on the CPU cooling plate, and the other end runs through the first radiator; the first radiator is installed at the outlet of the first cooling fan; the second cooling module includes a second cooling Fan, the second heat pipe, the GPU cooling plate and the second radiator; the GPU cooling plate is arranged on the GPU chip; one end of the second heat pipe is welded on the GPU cooling plate, and the other end runs through the second radiator; the second radiator is installed At the exit of the second cooling fan; the first cooling fan and the second cooling fan are respectively arranged on two sides of the host. Using two sets of cooling modules can effectively improve the cooling effect of the notebook computer, so as to improve the performance of the notebook computer.
Description
技术领域technical field
本发明涉及到计算机硬件领域，尤其涉及一种笔记本电脑散热装置及笔记本电脑。The invention relates to the field of computer hardware, in particular to a cooling device for a notebook computer and a notebook computer.
背景技术Background technique
笔记本电脑是一种小型、可便于携带的个人电脑，通常重1-3 公斤。随着科技的进步，笔记本的尺寸越来越小，重量越来越轻，而整体性能要求越来越高，功能要求越来越强大，同时部件越来越多，各部件的运行频率越来越高，功耗随之加大，从而对笔记本内部的散热要求越来越高。A laptop is a small, portable personal computer, usually weighing 1-3 kg. With the advancement of technology, the size of notebooks is getting smaller and lighter, but the overall performance requirements are getting higher and higher, and the function requirements are getting stronger and stronger. At the same time, there are more and more components, and the operating frequency of each component is getting higher and higher. The higher the power consumption, the higher the power consumption, and the higher the heat dissipation requirements inside the notebook.
目前，市面上笔记本电脑大都采用单散热风扇、单热管、单散热器的散热结构。但是这种散热方式散热较差，用户体验较差，主要因为：其一、散热风扇是笔记本内部气流动力源，起着强制对流的作用，其目的是将电脑主机运行时产生的热量，通过空气流动的方式，散发到主机之外，对笔记本散热起着至关重要的作用。在笔记本内部，因空间受限，单散热风扇结构提供的风量有限，无法满足现有高性能高功耗笔记本的散热要求。其二、热管是发热源和散热终端的传输工具，它能极大的带走笔记本内部芯片热量至散热端，但是单热管结构将CPU芯片和显卡芯片等连接在一起，容易造成单位面积上热管所承受的热载荷过大，笔记本热管有效长度变长，热管换热效率降低甚至达到传热极限，无法及时将热源热量传递到散热端。其三、散热器是散热终端，单个散热器散热面积少，所带走的热量也有限。At present, most notebook computers on the market adopt a heat dissipation structure with a single cooling fan, a single heat pipe, and a single radiator. However, this heat dissipation method has poor heat dissipation and poor user experience, mainly because: First, the cooling fan is the power source of airflow inside the notebook, which plays a role of forced convection. The way of flow, which is distributed outside the host, plays a vital role in the cooling of notebooks. Inside the notebook, due to the limited space, the air volume provided by the single cooling fan structure is limited, which cannot meet the heat dissipation requirements of existing high-performance and high-power consumption notebooks. Second, the heat pipe is a transmission tool between the heat source and the heat dissipation terminal. It can greatly take away the heat from the internal chip of the notebook to the heat dissipation end. However, the single heat pipe structure connects the CPU chip and the graphics card chip, etc., which is easy to cause heat pipes on a unit area. If the thermal load is too large, the effective length of the notebook heat pipe becomes longer, the heat transfer efficiency of the heat pipe decreases or even reaches the heat transfer limit, and the heat from the heat source cannot be transferred to the heat dissipation end in time. Third, the radiator is a heat dissipation terminal, and the heat dissipation area of a single radiator is small, and the heat taken away is also limited.
发明内容Contents of the invention
本发明要解决的技术问题是，克服现有技术存在的上述缺陷，提供一种笔记本电脑散热装置，能够有效提高笔记本电脑的散热效果，以提高笔记本电脑的性能。The technical problem to be solved by the present invention is to overcome the above-mentioned defects in the prior art, and provide a cooling device for a notebook computer, which can effectively improve the cooling effect of the notebook computer, so as to improve the performance of the notebook computer.
本发明进一步要解决的技术问题是，在提供上述笔记本电脑散热装置的基础上，还提供一种包括上述笔记本电脑散热装置的笔记本电脑。A further technical problem to be solved by the present invention is to provide a notebook computer including the above-mentioned heat dissipation device for a notebook computer on the basis of providing the above-mentioned heat dissipation device for a notebook computer.
本发明提供的笔记本电脑散热装置，包括第一散热模组和第二散热模组；The notebook computer heat dissipation device provided by the present invention includes a first heat dissipation module and a second heat dissipation module;
所述第一散热模组包括第一散热风扇、第一热管、CPU散热板和第一散热器；所述CPU散热板设置CPU芯片之上；第一热管一端焊接在CPU散热板上，另一端贯穿第一散热器；第一散热器安装在第一散热风扇的出口处；The first heat dissipation module includes a first cooling fan, a first heat pipe, a CPU cooling plate and a first radiator; the CPU cooling plate is arranged on the CPU chip; one end of the first heat pipe is welded on the CPU cooling plate, and the other end is through the first radiator; the first radiator is installed at the outlet of the first cooling fan;
所述第二散热模组包括第二散热风扇、第二热管、GPU散热板和第二散热器；所述GPU散热板设置GPU芯片之上；第二热管一端焊接在GPU散热板上，另一端贯穿第二散热器；第二散热器安装在第二散热风扇的出口处；The second cooling module includes a second heat dissipation fan, a second heat pipe, a GPU cooling plate and a second radiator; the GPU cooling plate is arranged on the GPU chip; one end of the second heat pipe is welded on the GPU cooling plate, and the other end is through the second radiator; the second radiator is installed at the outlet of the second cooling fan;
所述第一散热风扇和第二散热风扇分别布置在主机两侧。The first cooling fan and the second cooling fan are respectively arranged on two sides of the host.
优选地，内存芯片可设置在所述CPU散热板和第一热管下。Preferably, the memory chip can be arranged under the CPU cooling plate and the first heat pipe.
优选地，所述装置还包括五个进风口和两个出风口，具体为：Preferably, the device also includes five air inlets and two air outlets, specifically:
所述第一进风口设置在两个mini PCIE模块对应的笔记本电脑底部位置，第二进风口设置在第一散热风扇对应的笔记本电脑底部位置，第三进风口设置在CPU散热板和GPU散热板形成的中间区域对应的笔记本电脑底部位置，第四进风口设置在第二散热风扇对应的笔记本电脑底部位置，第五进风口设置在笔记本电脑背部中间1/4段位置；The first air inlet is arranged at the bottom position of the notebook computer corresponding to the two mini PCIE modules, the second air inlet is arranged at the bottom position of the notebook computer corresponding to the first cooling fan, and the third air inlet is arranged at the CPU cooling plate and the GPU cooling plate The formed middle area corresponds to the bottom position of the notebook computer, the fourth air inlet is set at the bottom position of the notebook computer corresponding to the second cooling fan, and the fifth air inlet is set at the middle 1/4 position of the back of the notebook computer;
所述第一出风口设置在第一散热风扇出风口对应的笔记本电脑背部位置，第二出风口设置在第二散热风扇出风口对应的笔记本电脑背部位置。The first air outlet is arranged on the back of the notebook computer corresponding to the air outlet of the first heat dissipation fan, and the second air outlet is arranged on the back of the notebook computer corresponding to the air outlet of the second heat dissipation fan.
优选地，所述进风口和出风口栅孔大小根据进出风流量分配比例进行设置，其中：Preferably, the size of the grilles of the air inlet and the air outlet is set according to the distribution ratio of the air flow in and out, wherein:
第一进风口栅孔进风流量为散热风扇额定风量的85%；第二进风口和第四进风口栅孔进风流量均为散热风扇额定风量的20%；第三进风口栅孔进风流量为散热风扇额定风量的55%；第五进风口栅孔进风流量为散热风扇额定风量的20%；The air flow rate of the grille hole of the first air inlet is 85% of the rated air volume of the cooling fan; the air flow rate of the grille hole of the second air inlet and the fourth air inlet is 20% of the rated air volume of the cooling fan; the air flow rate of the grille hole of the third air inlet is the rated air volume of the cooling fan 55% of the air intake of the fifth air inlet grid hole is 20% of the rated air volume of the cooling fan;
第一出风口和第二出风口栅孔出风流量均为散热风扇额定风量的100%。The air flow rate of the first air outlet and the second air outlet grid hole is 100% of the rated air volume of the cooling fan.
优选地，所述第一散热风扇和第二散热风扇为低噪音离心散热风扇。Preferably, the first cooling fan and the second cooling fan are low-noise centrifugal cooling fans.
优选地，所述第一热管和第二热管为真空毛细高效热管。Preferably, the first heat pipe and the second heat pipe are vacuum capillary high-efficiency heat pipes.
采用两套散热模组解决了现有单散热风扇风量不够大、单热管热承载能力不够和输送距离较长的问题，能够有效提高笔记本电脑的散热效果，以提高笔记本电脑的性能。The use of two sets of heat dissipation modules solves the problems of insufficient air volume of the existing single heat dissipation fan, insufficient heat carrying capacity of a single heat pipe, and long transmission distance, and can effectively improve the heat dissipation effect of the notebook computer to improve the performance of the notebook computer.
本发明进一步解决其技术问题采用的技术方案是，在提供所述笔记本电脑散热装置的基础上，本发明还提供一种包括所述笔记本电脑散热装置的笔记本电脑。所述笔记本电脑显然具有前述笔记本电脑散热装置的全部有益效果，在此不再赘述。The technical solution adopted by the present invention to further solve the technical problem is that, on the basis of providing the heat dissipation device for the notebook computer, the present invention also provides a notebook computer including the heat dissipation device for the notebook computer. The notebook computer obviously has all the beneficial effects of the heat dissipation device for the notebook computer mentioned above, and details are not repeated here.
附图说明Description of drawings
图1为本发明提供的一种笔记本电脑散热装置结构图；Fig. 1 is a kind of notebook computer cooling device structural diagram provided by the present invention;
图2为本发明提供的出风口和进风口布置示意图；Figure 2 is a schematic diagram of the layout of the air outlet and the air inlet provided by the present invention;
图3为本发明提供的一种笔记本电脑内部结构布置图。Fig. 3 is a layout diagram of the internal structure of a notebook computer provided by the present invention.
具体实施方式Detailed ways
为了使本技术领域的人员更好地理解本发明的技术方案，下面结合附图对本发明作进一步的详细说明。In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.
参见图1，图1为本发明提供的一种笔记本电脑散热装置结构图。Referring to FIG. 1 , FIG. 1 is a structural diagram of a cooling device for a notebook computer provided by the present invention.
本发明提供的一种笔记本电脑散热装置，包括两套模组，分别为第一散热模组和第二散热模组，针对笔记本电脑中功耗最高的两个芯片，即CPU芯片和GPU芯片，分别采用一套散热模组进行散热。A heat dissipation device for a notebook computer provided by the present invention includes two sets of modules, namely a first heat dissipation module and a second heat dissipation module, for the two chips with the highest power consumption in a notebook computer, namely a CPU chip and a GPU chip, A set of heat dissipation modules are used for heat dissipation.
所述第一散热模组包括第一散热风扇1、第一热管6、CPU散热板2和第一散热器5；所述CPU散热板2设置CPU芯片之上；第一热管6一端焊接在CPU散热板2上，另一端贯穿第一散热器5；第一散热器5安装在第一散热风扇1的出口处；The first cooling module includes a first cooling fan 1, a first heat pipe 6, a CPU cooling plate 2 and a first radiator 5; the CPU cooling plate 2 is arranged on the CPU chip; one end of the first heat pipe 6 is welded on the CPU On the cooling plate 2, the other end runs through the first radiator 5; the first radiator 5 is installed at the outlet of the first cooling fan 1;
所述第二散热模组包括第二散热风扇4、第二热管8、GPU散热板3和第二散热器9；所述GPU散热板3设置GPU芯片之上；第二热管8一端焊接在GPU散热板3上，另一端贯穿第二散热器9；第二散热器9安装在第二散热风扇4的出口处；The second cooling module includes a second cooling fan 4, a second heat pipe 8, a GPU cooling plate 3 and a second radiator 9; the GPU cooling plate 3 is arranged on the GPU chip; one end of the second heat pipe 8 is welded on the GPU On the cooling plate 3, the other end runs through the second radiator 9; the second radiator 9 is installed at the outlet of the second cooling fan 4;
所述第一散热风扇1和第二散热风扇4分别布置在主机两侧。The first cooling fan 1 and the second cooling fan 4 are respectively arranged on two sides of the host.
CPU散热板2和GPU散热板3分别设置CPU芯片和GPU芯片之上，CPU芯片和GPU芯片通过导热膏将热量分别传递到CPU散热板2和GPU散热板3上，两散热板2、3分别将热量传递给相应的热管6、8，两热管6、8将热量传递到各自的散热器5、9上，冷风流从散热风扇1、4的上下端面进入，通过散热风扇1、4加速后，经过散热器5、9的鳍片间隙，带走散热器5、9上的热量并排出主机外。采用两套散热模组解决了现有单散热风扇风量不够大、单热管热承载能力不够和输送距离较长的问题，能够有效提高笔记本电脑的散热效果，以提高笔记本电脑的性能。The CPU cooling plate 2 and the GPU cooling plate 3 are arranged on the CPU chip and the GPU chip respectively, and the CPU chip and the GPU chip transfer heat to the CPU cooling plate 2 and the GPU cooling plate 3 respectively through the thermal paste, and the two cooling plates 2 and 3 respectively The heat is transferred to the corresponding heat pipes 6 and 8, and the two heat pipes 6 and 8 transfer the heat to the respective radiators 5 and 9. The cold air flow enters from the upper and lower ends of the cooling fans 1 and 4, and is accelerated by the cooling fans 1 and 4. , through the fin gaps of the radiators 5 and 9, the heat on the radiators 5 and 9 is taken away and discharged outside the host. The use of two sets of heat dissipation modules solves the problems of insufficient air volume of the existing single heat dissipation fan, insufficient heat carrying capacity of a single heat pipe, and long transmission distance, and can effectively improve the heat dissipation effect of the notebook computer to improve the performance of the notebook computer.
为了解决目前内存芯片通过对流散热，提高内存芯片散热效果，在进一步的方案中内存芯片7可设置在所述CPU散热板2下，内存芯片7采用CPU散热板2散热，并通过热管6将热量传递到散热器5，从而排放到外界，有效的解决了内存散热问题，同时使得笔记本内部结构更加紧凑。In order to solve the problem that the current memory chip dissipates heat through convection and improves the heat dissipation effect of the memory chip, in a further solution, the memory chip 7 can be arranged under the CPU cooling plate 2, and the memory chip 7 adopts the CPU cooling plate 2 to dissipate heat, and the heat is dissipated by the heat pipe 6. The heat is transmitted to the radiator 5, thereby being discharged to the outside, which effectively solves the heat dissipation problem of the memory, and makes the internal structure of the notebook more compact at the same time.
优选地，所述第一散热风扇1和第二散热风扇4为低噪音离心散热风扇。Preferably, the first cooling fan 1 and the second cooling fan 4 are low-noise centrifugal cooling fans.
优选地，所述第一热管6和第二热管8为真空毛细高效热管。Preferably, the first heat pipe 6 and the second heat pipe 8 are vacuum capillary high-efficiency heat pipes.
参见图2，图2为本发明提供的出风口和进风口布置示意图。Referring to Fig. 2, Fig. 2 is a schematic diagram of the layout of the air outlet and the air inlet provided by the present invention.
冷风流从散热风扇1、4的上下端面进入，通过散热风扇1、4加速后，经过散热器5、9的鳍片间隙，带走散热器5、9上的热量并排出主机外。因而所述笔记本电脑的散热装置还包括进风口11、12、13、14、15和出风口16、17，使冷风流通过进风口11、12、13、14、15进入笔记本电脑内部，并将散热器5、9上的热量通过出风口16、17排出。The cold air flow enters from the upper and lower end surfaces of the cooling fans 1,4, after being accelerated by the cooling fans 1,4, through the fin gaps of the radiators 5,9, the heat on the radiators 5,9 is taken away and discharged outside the main frame. Thereby the cooling device of described notebook computer also comprises air inlet 11,12,13,14,15 and air outlet 16,17, makes cold wind current enter notebook computer interior by air inlet 11,12,13,14,15, and will The heat on the radiator 5,9 is discharged through the air outlets 16,17.
所述进风口11、12、13、14分别设置在笔记本电脑底部，其中第一进风口11设置在两个mini PCIE10模块对应的笔记本电脑底部位置，第二进风口12设置在第一散热风扇1对应的笔记本电脑底部位置，第三进风口13设置在CPU散热板2和GPU散热板3形成的中间区域对应的笔记本电脑底部位置，第四进风口14设置在第二散热风扇4对应的笔记本电脑底部位置，第五进风口设置15在笔记本电脑背部中间1/4段位置；第一出风口16设置在第一散热风扇1出风口对应的笔记本电脑背部位置，第二出风口17设置在第二散热风扇4出风口对应的笔记本电脑背部位置。The air inlets 11, 12, 13, 14 are respectively arranged at the bottom of the notebook computer, wherein the first air inlet 11 is arranged at the bottom position of the notebook computer corresponding to the two mini PCIE10 modules, and the second air inlet 12 is arranged at the first cooling fan 1 Corresponding to the bottom position of the notebook computer, the third air inlet 13 is arranged on the bottom position of the notebook computer corresponding to the middle area formed by the CPU cooling plate 2 and the GPU cooling plate 3, and the fourth air inlet 14 is arranged on the corresponding notebook computer of the second cooling fan 4 At the bottom position, the fifth air inlet is set 15 at the middle 1/4 position of the back of the notebook computer; the first air outlet 16 is set at the back position of the notebook computer corresponding to the air outlet of the first cooling fan 1, and the second air outlet 17 is set at the second The location on the back of the notebook computer corresponding to the cooling fan 4 air outlet.
优选地，所述进风口和出风口栅孔大小根据进出风流量分配比例进行设置，其中：第一进风口栅孔进风流量为散热风扇额定风量的85%；第二进风口和第四进风口栅孔进风流量均为散热风扇额定风量的20%；第三进风口栅孔进风流量为散热风扇额定风量的55%；第五进风口栅孔进风流量为散热风扇额定风量的20%；第一出风口和第二出风口栅孔出风流量均为散热风扇额定风量的100%。Preferably, the size of the grid hole of the air inlet and the air outlet is set according to the distribution ratio of the air flow in and out, wherein: the air flow rate of the first air inlet grid hole is 85% of the rated air volume of the cooling fan; the second air inlet and the fourth air inlet grid The air intake flow rate of the holes is 20% of the rated air volume of the cooling fan; the air intake flow rate of the third air inlet grid hole is 55% of the rated air volume of the cooling fan; the air intake flow rate of the fifth air intake grid hole is 20% of the rated air volume of the cooling fan; The air flow rate of the grill holes of the two air outlets is 100% of the rated air volume of the cooling fan.
通过CFD仿真分析得到优化流量分配比例，即所述进风口流量分配比例如下：第一进风口栅孔11进风流量为散热风扇额定风量的85%；第二进风口12和第四进风口栅孔14进风流量均为散热风扇额定风量的20%；第三进风口13栅孔进风流量为散热风扇额定风量的55%；第五进风口15栅孔进风流量为散热风扇额定风量的20%；两个出风口16、17栅孔出风流量均为散热风扇额定风量的100%。其中，散热风扇额定风量是指单个散热风扇的额定风量，所有进风口流量和为散热风扇额定风量的200%，所有出风口流量和为散热风扇额定风量的200%。根据流量分配比例从而借助CFD仿真分析计算出每个进风口和出风口的栅孔大小。Through CFD simulation analysis, the optimal flow distribution ratio is obtained, that is, the air inlet flow distribution ratio is as follows: the air inlet flow rate of the first air inlet grid hole 11 is 85% of the rated air volume of the cooling fan; the second air inlet 12 and the fourth air inlet grid The air intake flow rate of hole 14 is 20% of the rated air volume of the cooling fan; the air intake flow rate of the third air inlet 13 grid hole is 55% of the rated air volume of the cooling fan; the air intake flow rate of the fifth air inlet 15 grid hole is 20% of the rated air volume of the cooling fan; Each air outlet 16, 17 grille holes air flow rate is 100% of the rated air volume of the cooling fan. Among them, the rated air volume of the cooling fan refers to the rated air volume of a single cooling fan, the flow rate of all air inlets is 200% of the rated air volume of the cooling fan, and the flow rate of all air outlets is 200% of the rated air volume of the cooling fan. According to the flow distribution ratio, the grid hole size of each air inlet and air outlet is calculated by means of CFD simulation analysis.
笔记本电脑的风道布局为外界冷空气通过进风口11、12、13、14、15进入到笔记本电脑内，经由CPU散热板2、GPU散热板3、mini PCIE模块10并扫过主板时带走它们的热量，并由第一散热风扇1和第二散热风扇4的上、下端吸风面进入风扇内部，通过风扇的离心加速后由风扇出风口排出并进入第一散热器5和第二散热器9的鳍片间隙，最后由笔记本电脑背部两侧的出风口16、17排出，同时将热量排放到外界。The air duct layout of the notebook computer is such that external cold air enters the notebook computer through the air inlets 11, 12, 13, 14, and 15, and is taken away when passing through the CPU cooling plate 2, GPU cooling plate 3, and mini PCIE module 10. Their heat enters the inside of the fan from the upper and lower suction surfaces of the first cooling fan 1 and the second cooling fan 4, and is discharged by the fan air outlet after passing through the centrifugal acceleration of the fan and enters the first radiator 5 and the second radiator. The fin gap of device 9 is finally discharged by the air outlets 16, 17 on both sides of the notebook computer back, and the heat is discharged to the outside world at the same time.
进风口和出风口设计使得笔记本电脑的结构更加紧凑，风道更加合理，有效的解决了笔记本电脑局部温度过高的问题。The design of the air inlet and air outlet makes the structure of the notebook computer more compact, and the air duct is more reasonable, which effectively solves the problem of local overheating of the notebook computer.
参见图3，图3为本发明提供的一种笔记本电脑内部结构布置图。Referring to Fig. 3, Fig. 3 is a layout diagram of the internal structure of a notebook computer provided by the present invention.
除了上述笔记本电脑散热装置，本发明还提供一种包括上述笔记本电脑散热装置的笔记本电脑。从全局考虑布置，笔记本电脑内部前半部布置喇叭18、19、光驱20和电池21等，后半部布置主板24、笔记本电脑散热装置和IO小板22。两套散热风扇1、4和散热器5、9对称布置在后两侧，距离尽量远；因CPU芯片和GPU芯片的功耗不相上下，因此分别使用一套散热板2、3和热管6、8来给两芯片传递热量，同时为减短热管的长度，两芯片应尽可能靠近各自的散热器5、9布置，形成热量由后中部往后两侧传递的态势。综上，分别使用一套散热模组解决此两高功耗芯片的散热问题。In addition to the above heat dissipation device for a notebook computer, the present invention also provides a notebook computer including the above heat dissipation device for a notebook computer. Considering the overall layout, speakers 18, 19, optical drive 20, battery 21, etc. are arranged in the front half of the notebook computer, and the main board 24, notebook computer cooling device and IO small board 22 are arranged in the rear half. Two sets of cooling fans 1, 4 and radiators 5, 9 are arranged symmetrically on both sides of the rear, with the distance as far as possible; because the power consumption of the CPU chip and the GPU chip are comparable, a set of cooling plates 2, 3 and heat pipes 6 are used respectively , 8 to transfer heat to the two chips, and to shorten the length of the heat pipe, the two chips should be arranged as close as possible to the respective heat sinks 5, 9 to form a situation where heat is transferred from the rear middle to the rear sides. To sum up, a set of heat dissipation modules is used to solve the heat dissipation problem of the two high power consumption chips.
对笔记本整体布局进行了优化设计，使得笔记本结构更加紧凑，风道更加合理，有效的解决了目前笔记本局部温度过高的问题。The overall layout of the notebook has been optimized to make the structure of the notebook more compact and the air duct more reasonable, which effectively solves the problem of excessive local temperature of the notebook.
以上对本发明所提供的一种笔记本电脑散热装置及笔记本电脑进行了详细介绍。本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的核心思想。应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以对本发明进行若干改进和修饰，这些改进和修饰也落入本发明权利要求的保护范围内。The heat dissipation device for a notebook computer and the notebook computer provided by the present invention have been introduced in detail above. In this paper, specific examples are used to illustrate the principles and implementation modes of the present invention, and the descriptions of the above embodiments are only used to help understand the core idea of the present invention. It should be pointed out that for those skilled in the art, without departing from the principles of the present invention, some improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.
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| CN106648000A (en) * | 2016-12-27 | 2017-05-10 | 上海豊恒信息科技有限公司 | Built-in radiator of notebook computer |
| CN106933314A (en) * | 2016-12-29 | 2017-07-07 | 上海豊恒信息科技有限公司 | The built-in radiator of notebook |
| CN108255276A (en) * | 2018-04-26 | 2018-07-06 | 刘康 | Heat dissipation performance is not easy the air-cooled laptop decayed |
| CN110597356A (en) * | 2019-09-12 | 2019-12-20 | 华为技术有限公司 | Notebook computer |
| CN112506316A (en) * | 2020-11-27 | 2021-03-16 | 深圳微步信息股份有限公司 | Small computer with integrated heat dissipation function and heat dissipation method |
| CN112711317A (en) * | 2021-01-07 | 2021-04-27 | 联想长风科技(北京)有限公司 | Notebook computer cooling system and method |
| CN112837962A (en) * | 2021-03-08 | 2021-05-25 | 深圳市斯迪乔科技有限公司 | A high-performance gaming laptop with a mechanical keyboard |
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