CN105652991B - A kind of heat radiator for notebook computer and laptop - Google Patents
A kind of heat radiator for notebook computer and laptop Download PDFInfo
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- CN105652991B CN105652991B CN201511001803.XA CN201511001803A CN105652991B CN 105652991 B CN105652991 B CN 105652991B CN 201511001803 A CN201511001803 A CN 201511001803A CN 105652991 B CN105652991 B CN 105652991B
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- radiator
- heat
- radiator fan
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of heat radiator for notebook computer and laptops.Disclosed heat radiator for notebook computer includes the first heat radiation module and the second heat radiation module；First heat radiation module includes the first radiator fan, the first heat pipe, CPU heat sink and the first radiator；On the CPU heat sink setting cpu chip；First heat pipe one end is welded on CPU heat sink, and the other end runs through the first radiator；First radiator is mounted on the exit of the first radiator fan；Second heat radiation module includes the second radiator fan, the second heat pipe, GPU heat sink and the second radiator；On the GPU heat sink setting GPU chip；Second heat pipe one end is welded on GPU heat sink, and the other end runs through the second radiator；Second radiator is mounted on the exit of the second radiator fan；First radiator fan and the second radiator fan are arranged in host two sides.The heat dissipation effect of laptop can be effectively improved, using two sets of heat radiation modules to improve the performance of laptop.
Description
Technical field
The present invention relates to computer hardware field more particularly to a kind of heat radiator for notebook computer and notebook electricity
Brain.
Background technique
Laptop be it is a kind of it is small-sized, can portable PC, usually 1-3 kilograms of weight.With science and technology into
Step, the size of notebook is smaller and smaller, and weight is more and more lighter, and overall performance requirement is higher and higher, and functional requirement is more and more stronger
Greatly, while component is more and more, and the running frequency of each component is higher and higher, and power consumption increases therewith, thus inside to notebook
Cooling requirements are higher and higher.
Currently, laptop mostly uses the radiator structure of single radiator fan, single heat pipe, single radiator on the market.But
It is that this radiating mode heat dissipation is poor, user experience is poor, and be primarily due to: one, radiator fan are that notebook internal gas flow is dynamic
Power source, plays a part of forced convertion, the heat generated when the purpose is to run host computer, the side flowed by air
Formula is dispersed into except host, is played a crucial role to laptop heat-dissipation.It is single to dissipate because of limited space inside notebook
The air quantity that hot wind fan structure provides is limited, is unable to satisfy the cooling requirements of existing high-performance high power consumption notebook.Secondly, heat pipe be
The delivery means of pyrotoxin and heat dissipation terminal, it can greatly take away notebook inside chip heat to radiating end, but single heat
Pipe structure links together cpu chip and display card chip etc., be easy to cause the thermal force mistake that heat pipe is born on unit area
Greatly, notebook heat pipe effective length is elongated, and heat pipe heat exchanging efficiency, which reduces, is even up to heat transport limitation, can not be in time by heat from heat source
It is transmitted to radiating end.Thirdly, radiator be heat dissipation terminal, single radiator heat-dissipation area is few, and the heat taken away is also limited.
Summary of the invention
The technical problem to be solved by the present invention is to overcome drawbacks described above of the existing technology, provide a kind of notebook electricity
Brain radiator can effectively improve the heat dissipation effect of laptop, to improve the performance of laptop.
The further technical problems to be solved of the present invention are, on the basis of above-mentioned heat radiator for notebook computer is provided,
A kind of laptop including above-mentioned heat radiator for notebook computer is also provided.
Heat radiator for notebook computer provided by the invention, including the first heat radiation module and the second heat radiation module；
First heat radiation module includes the first radiator fan, the first heat pipe, CPU heat sink and the first radiator；It is described
CPU heat sink is arranged on cpu chip；First heat pipe one end is welded on CPU heat sink, and the other end runs through the first radiator；
First radiator is mounted on the exit of the first radiator fan；
Second heat radiation module includes the second radiator fan, the second heat pipe, GPU heat sink and the second radiator；It is described
GPU heat sink is arranged on GPU chip；Second heat pipe one end is welded on GPU heat sink, and the other end runs through the second radiator；
Second radiator is mounted on the exit of the second radiator fan；
First radiator fan and the second radiator fan are arranged in host two sides.
Preferably, memory chip may be provided under the CPU heat sink and the first heat pipe.
Preferably, described device further includes five air inlets and two air outlets, specifically:
First air inlet setting in the corresponding laptop bottom position of two mini PCIE modules, second into
Air port setting is arranged in the corresponding laptop bottom position of the first radiator fan, third air inlet in CPU heat sink and GPU
The corresponding laptop bottom position in intermediate region that heat sink is formed, the setting of the 4th air inlet are corresponding in the second radiator fan
Laptop bottom position, the 5th air inlet be arranged among laptop back 1/4 fragment position；
First air outlet is arranged in the corresponding laptop back position of the first radiator fan air outlet, and second goes out
Air port is arranged in the corresponding laptop back position of the second radiator fan air outlet.
Preferably, the air inlet and air outlet gate hole size are configured according to air inlet/outlet assignment of traffic ratio, in which:
First air inlet gate hole enters the wind 85% that flow is radiator fan nominal air delivery；Second air inlet and the 4th air inlet
It is the 20% of radiator fan nominal air delivery that gate hole, which enters the wind flow,；It is the specified wind of radiator fan that third air inlet gate hole, which enters the wind flow,
The 55% of amount；5th air inlet gate hole enters the wind 20% that flow is radiator fan nominal air delivery；
First air outlet and the second air outlet gate hole air-out flow are the 100% of radiator fan nominal air delivery.
Preferably, first radiator fan and the second radiator fan are low noise centrifugal radiator fan.
Preferably, first heat pipe and the second heat pipe are vacuum capillary high-efficiency heat pipe.
Using two sets of heat radiation modules solve existing not big enough, the single heat pipe thermal bearing capacity of single radiator fan air quantity not enough and
The longer problem of conveying distance, can effectively improve the heat dissipation effect of laptop, to improve the performance of laptop.
The present invention further solve its technical problem the technical solution adopted is that, laptop radiating dress is being provided
On the basis of setting, the present invention also provides a kind of laptops including the heat radiator for notebook computer.The notebook
Computer obviously has whole beneficial effects of aforementioned heat radiator for notebook computer, and details are not described herein.
Detailed description of the invention
Fig. 1 is a kind of heat radiator for notebook computer structure chart provided by the invention；
Fig. 2 is air outlet provided by the invention and air inlet arrangement schematic diagram；
Fig. 3 is a kind of laptop internal structure layout drawing provided by the invention.
Specific embodiment
In order that those skilled in the art will better understand the technical solution of the present invention, with reference to the accompanying drawing to the present invention
It is described in further detail.
Referring to Fig. 1, Fig. 1 is a kind of heat radiator for notebook computer structure chart provided by the invention.
A kind of heat radiator for notebook computer provided by the invention, including two cover die groups, respectively the first heat radiation module and
Second heat radiation module is respectively adopted one for highest two chips of power consumption in laptop, i.e. cpu chip and GPU chip
Set heat radiation module radiates.
First heat radiation module includes the first radiator fan 1, the first heat pipe 6, CPU heat sink 2 and the first radiator 5；
The CPU heat sink 2 is arranged on cpu chip；First heat pipe, 6 one end is welded on CPU heat sink 2, and the other end runs through first
Radiator 5；First radiator 5 is mounted on the exit of the first radiator fan 1；
Second heat radiation module includes the second radiator fan 4, the second heat pipe 8, GPU heat sink 3 and the second radiator 9；
The GPU heat sink 3 is arranged on GPU chip；Second heat pipe, 8 one end is welded on GPU heat sink 3, and the other end runs through second
Radiator 9；Second radiator 9 is mounted on the exit of the second radiator fan 4；
First radiator fan 1 and the second radiator fan 4 are arranged in host two sides.
CPU heat sink 2 and GPU heat sink 3 are respectively set on cpu chip and GPU chip, and cpu chip and GPU chip are logical
It crosses heat-conducting cream and heat is transmitted to respectively on CPU heat sink 2 and GPU heat sink 3, two heat sinks 2,3 transfer heat to respectively
Corresponding heat pipe 6,8, two heat pipes 6,8 transfer heat on respective radiator 5,9, and cold wind stream is upper from radiator fan 1,4
Lower end surface enters, and after accelerating by radiator fan 1,4, by the fin gap of radiator 5,9, takes away the heat on radiator 5,9
It measures and is discharged outside host.It solves existing single not big enough, single heat pipe heat of radiator fan air quantity using two sets of heat radiation modules and carries energy
Power not enough and the longer problem of conveying distance, the heat dissipation effect of laptop can be effectively improved, to improve laptop
Performance.
In order to solve current memory chip by heat loss through convection, memory chip heat dissipation effect is improved, in further embodiment
Middle memory chip 7 may be provided under the CPU heat sink 2, and memory chip 7 is radiated using CPU heat sink 2, and will by heat pipe 6
Heat transfer is to radiator 5, to be discharged into the external world, effective solution memory heat radiation problem, while making inside notebook
Structure is more compact.
Preferably, first radiator fan 1 and the second radiator fan 4 are low noise centrifugal radiator fan.
Preferably, first heat pipe 6 and the second heat pipe 8 are vacuum capillary high-efficiency heat pipe.
Referring to fig. 2, Fig. 2 is air outlet provided by the invention and air inlet arrangement schematic diagram.
Cold wind stream enters from the upper and lower end face of radiator fan 1,4, after being accelerated by radiator fan 1,4, by radiator 5,9
Fin gap, take away the heat on radiator 5,9 and be discharged outside host.Thus the radiator of the laptop also wraps
Air inlet 11,12,13,14,15 and air outlet 16,17 are included, cold wind stream is made to enter notes by air inlet 11,12,13,14,15
Inside this computer, and the heat on radiator 5,9 is discharged by air outlet 16,17.
The air inlet 11,12,13,14 is separately positioned on laptop bottom, wherein the setting of the first air inlet 11 exists
The corresponding laptop bottom position of two mini PCIE10 modules, the setting of the second air inlet 12 are right in the first radiator fan 1
The intermediate region that CPU heat sink 2 and GPU heat sink 3 are formed is arranged in the laptop bottom position answered, third air inlet 13
Corresponding laptop bottom position, the 4th air inlet 14 are arranged in the corresponding laptop bottom of the second radiator fan 4
Position, 1/4 fragment position among laptop back of the 5th air inlet setting 15；The setting of first air outlet 16 is in the first heat dissipation
The corresponding laptop back position of 1 air outlet of fan, the setting of the second air outlet 17 are corresponding in 4 air outlet of the second radiator fan
Laptop back position.
Preferably, the air inlet and air outlet gate hole size are configured according to air inlet/outlet assignment of traffic ratio, in which:
First air inlet gate hole enters the wind 85% that flow is radiator fan nominal air delivery；Second air inlet and the 4th air inlet gate hole air inlet
Flow is the 20% of radiator fan nominal air delivery；Third air inlet gate hole enters the wind 55% that flow is radiator fan nominal air delivery；
5th air inlet gate hole enters the wind 20% that flow is radiator fan nominal air delivery；First air outlet and the second air outlet gate hole outlet air
Flow is the 100% of radiator fan nominal air delivery.
By CFD simulation analysis obtain optimization assignment of traffic ratio, i.e., the described air inlet distribution ratio of liquid flow for example under: first
Air inlet gate hole 11 enters the wind 85% that flow is radiator fan nominal air delivery；Second air inlet 12 and the 4th air inlet gate hole 14 into
Wind flow is the 20% of radiator fan nominal air delivery；It is radiator fan nominal air delivery that 13 gate hole of third air inlet, which enters the wind flow,
55%；5th air inlet, 15 gate hole enters the wind 20% that flow is radiator fan nominal air delivery；Two air outlets 16,17 gate hole are distinguished and admirable out
Amount is the 100% of radiator fan nominal air delivery.Wherein, radiator fan nominal air delivery refers to the nominal air delivery of single radiator fan,
All air inlet flows and be the 200% of radiator fan nominal air delivery, all air outlet flows and be radiator fan nominal air delivery
200%.The gate hole size of each air inlet and air outlet is calculated by CFD simulation analysis according to assignment of traffic ratio.
The air duct layout of laptop enters notebook by air inlet 11,12,13,14,15 for cool ambient air
In computer, their heat is taken away when via CPU heat sink 2, GPU heat sink 3, mini PCIE module 10 and inswept mainboard, and
Entered inside fan by the upper and lower end air draught face of the first radiator fan 1 and the second radiator fan 4, passes through the CENTRIFUGAL ACCELERATING of fan
The fin gap for escaping and enter the first radiator 5 and the second radiator 9 by fan outlet afterwards, is finally carried on the back by laptop
The air outlets 16,17 of portion two sides is discharged, while by heat dissipation to extraneous.
So that the structure of laptop is more compact, air duct is more reasonable, effective to solve for air inlet and air outlet design
The excessively high problem of laptop local temperature of having determined.
Referring to Fig. 3, Fig. 3 is a kind of laptop internal structure layout drawing provided by the invention.
It include above-mentioned heat radiator for notebook computer the present invention also provides one kind in addition to above-mentioned heat radiator for notebook computer
Laptop.Arrangement is considered from the overall situation, first half arrangement loudspeaker 18,19, CD-ROM drive 20 and battery 21 inside laptop
Deng latter half of arrangement mainboard 24, heat radiator for notebook computer and IO platelet 22.Two sets of radiator fans 1,4 and 5,9 pairs of radiator
Title is arranged in rear two sides, and distance is remote as far as possible；It is dissipated because the power consumption of cpu chip and GPU chip is equally matched, therefore respectively using a set of
Hot plate 2,3 and heat pipe 6,8 give two chips to transmit heat, while to shorten the length of heat pipe, two chips should be as close to each
From radiator 5,9 arrange, formed heat by rear middle part backward two sides transmitting situation.To sum up, a set of radiating mould is used respectively
Group solves the heat dissipation problem of this two high power consumptions chip.
Design is optimized to notebook integral layout, so that notebook structure is more compact, air duct is more reasonable, has
Effect solves the problems, such as that current notebook local temperature is excessively high.
A kind of heat radiator for notebook computer provided by the present invention and laptop are described in detail above.
Used herein a specific example illustrates the principle and implementation of the invention, and the explanation of above embodiments is only used
Core of the invention thought is understood in help.It should be pointed out that for those skilled in the art, not departing from
, can be with several improvements and modifications are made to the present invention under the premise of the principle of the invention, these improvement and modification also fall into this hair
In bright scope of protection of the claims.
Claims (6)
1. a kind of heat radiator for notebook computer, which is characterized in that described device includes the first heat radiation module and the second radiating mould
Group；
First heat radiation module includes the first radiator fan, the first heat pipe, CPU heat sink and the first radiator；The CPU dissipates
Hot plate is arranged on cpu chip；First heat pipe one end is welded on CPU heat sink, and the other end runs through the first radiator；First dissipates
Hot device is mounted on the exit of the first radiator fan；
Second heat radiation module includes the second radiator fan, the second heat pipe, GPU heat sink and the second radiator；The GPU dissipates
Hot plate is arranged on GPU chip；Second heat pipe one end is welded on GPU heat sink, and the other end runs through the second radiator；Second dissipates
Hot device is mounted on the exit of the second radiator fan；
First radiator fan and the second radiator fan are arranged in host two sides；
Described device further includes five air inlets and two air outlets, specifically:
The setting of first air inlet is in the corresponding laptop bottom position of two mini PCIE modules, the setting of the second air inlet
In the corresponding laptop bottom position of the first radiator fan, third air inlet is arranged in CPU heat sink and GPU heat sink shape
At the corresponding laptop bottom position in intermediate region, the 4th air inlet be arranged in the corresponding notebook of the second radiator fan
1/4 fragment position is arranged among laptop back in computer bottom position, the 5th air inlet；
The setting of first air outlet is in the corresponding laptop back position of the first radiator fan air outlet, the setting of the second air outlet
In the corresponding laptop back position of the second radiator fan air outlet.
2. heat radiator for notebook computer according to claim 1, which is characterized in that memory chip may be provided at described
Under CPU heat sink and the first heat pipe.
3. heat radiator for notebook computer according to claim 2, which is characterized in that the air inlet and air outlet gate hole
Size is configured according to air inlet/outlet assignment of traffic ratio, in which:
First air inlet gate hole enters the wind 85% that flow is radiator fan nominal air delivery；Second air inlet and the 4th air inlet gate hole
Entering the wind flow is the 20% of radiator fan nominal air delivery；It is radiator fan nominal air delivery that third air inlet gate hole, which enters the wind flow,
55%；5th air inlet gate hole enters the wind 20% that flow is radiator fan nominal air delivery；
First air outlet and the second air outlet gate hole air-out flow are the 100% of radiator fan nominal air delivery.
4. heat radiator for notebook computer according to any one of claims 1 to 3, which is characterized in that first heat dissipation
Fan and the second radiator fan are low noise centrifugal radiator fan.
5. heat radiator for notebook computer according to claim 4, which is characterized in that first heat pipe and the second heat pipe
For vacuum capillary high-efficiency heat pipe.
6. a kind of laptop, which is characterized in that filled including laptop radiating of any of claims 1-5
It sets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511001803.XA CN105652991B (en) | 2015-12-29 | 2015-12-29 | A kind of heat radiator for notebook computer and laptop |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511001803.XA CN105652991B (en) | 2015-12-29 | 2015-12-29 | A kind of heat radiator for notebook computer and laptop |
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| Publication Number | Publication Date |
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| CN105652991A CN105652991A (en) | 2016-06-08 |
| CN105652991B true CN105652991B (en) | 2019-09-03 |
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| CN201511001803.XA Active CN105652991B (en) | 2015-12-29 | 2015-12-29 | A kind of heat radiator for notebook computer and laptop |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617136A (en) * | 2016-12-09 | 2018-10-02 | 鸿富锦精密工业(武汉)有限公司 | Radiator structure |
| CN106648000A (en) * | 2016-12-27 | 2017-05-10 | 上海豊恒信息科技有限公司 | Built-in radiator of notebook computer |
| CN106933314A (en) * | 2016-12-29 | 2017-07-07 | 上海豊恒信息科技有限公司 | The built-in radiator of notebook |
| CN108255276A (en) * | 2018-04-26 | 2018-07-06 | 刘康 | Heat dissipation performance is not easy the air-cooled laptop decayed |
| CN110597356A (en) * | 2019-09-12 | 2019-12-20 | 华为技术有限公司 | Notebook computer |
| CN112506316A (en) * | 2020-11-27 | 2021-03-16 | 深圳微步信息股份有限公司 | Small computer with integrated heat dissipation function and heat dissipation method |
| CN112711317A (en) * | 2021-01-07 | 2021-04-27 | 联想长风科技(北京)有限公司 | Notebook computer cooling system and method |
| CN116048194B (en) * | 2022-07-07 | 2024-03-19 | 荣耀终端有限公司 | Notebook computer |
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| CN1420412A (en) * | 2001-11-21 | 2003-05-28 | 联想(北京)有限公司 | Heat sink of computer system |
| CN103149992A (en) * | 2012-12-28 | 2013-06-12 | 联宝(合肥)电子科技有限公司 | Fan tandem type heat dissipation method and fan tandem type heat dissipation system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2842547Y (en) * | 2005-09-29 | 2006-11-29 | 浩鑫股份有限公司 | Radiating system of multi-media host computer |
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2015
- 2015-12-29 CN CN201511001803.XA patent/CN105652991B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1420412A (en) * | 2001-11-21 | 2003-05-28 | 联想(北京)有限公司 | Heat sink of computer system |
| CN103149992A (en) * | 2012-12-28 | 2013-06-12 | 联宝(合肥)电子科技有限公司 | Fan tandem type heat dissipation method and fan tandem type heat dissipation system |
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| CN105652991A (en) | 2016-06-08 |
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Effective date of registration: 20220311 Address after: 410073 Hunan province Changsha Kaifu District, Deya Road No. 109 Patentee after: National University of Defense Technology Patentee after: HUNAN GREATWALL GALAXY TECHNOLOGY Co.,Ltd. Address before: 2 / F, headquarters building, 39 Jianshan Road, high tech Zone, Changsha City, Hunan Province, 410205 Patentee before: HUNAN GREATWALL GALAXY TECHNOLOGY Co.,Ltd. |
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