CN108617136A - Radiator structure - Google Patents
Radiator structure Download PDFInfo
- Publication number
- CN108617136A CN108617136A CN201611128171.8A CN201611128171A CN108617136A CN 108617136 A CN108617136 A CN 108617136A CN 201611128171 A CN201611128171 A CN 201611128171A CN 108617136 A CN108617136 A CN 108617136A
- Authority
- CN
- China
- Prior art keywords
- conducting element
- heat conducting
- fan
- heat
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of radiator structure, radiating fin group including fan component, positioned at the fan component air side and the heat conducting element that is connected between heater element and the radiating fin group, the heat conducting element includes one first heat conducting element and one second heat conducting element, one end of first heat conducting element and second heat conducting element is connected to the radiating fin group, the other end of first heat conducting element is connected to one first functional component, and the other end of second heat conducting element is connected to one second functional component.The heat of first functional component and the second functional component can be concentrated to same radiating fin group by the first heat conducting element and the guiding of one second heat conducting element and by fan cooling, keep radiator structure compact, while having higher radiating efficiency.
Description
Technical field
The present invention relates to a kind of radiator structures.
Background technology
With the continuous development of electronic technology, electronic equipment is increasingly lightening.For example, as conventional desktop computer and notes
The combination of this computer, all-in-one machine occupy more and more market shares, are welcome by consumer.Meanwhile such as integrally
Also increasingly at a high speed, following each main devices heating power consumption is increasing, heat flow density for the system operation of the electronic equipments such as machine
It is continuously increased, the heat dissipation pressure of electronic equipment accordingly increases.
Invention content
In view of this, it is necessary to provide a kind of radiator structure, keep its compact-sized, while there is higher radiating efficiency.
A kind of radiator structure, including fan component, positioned at the fan component air side radiating fin group and be connected to
Heat conducting element between heater element and the radiating fin group, the heat conducting element include one first heat conducting element and one second
One end of heat conducting element, first heat conducting element and second heat conducting element is connected to the radiating fin group, and described
The other end of one heat conducting element is connected to one first functional component, and the other end of second heat conducting element is connected to one second work(
It can component.
Preferably, the radiating fin group includes multiple radiating fins disposed in parallel, the side of adjacent two radiating fin
While engaging the air-out passage to form the air-out direction setting along the fan component.
Preferably, the radiating fin includes the wind deflector being arranged along the air-out direction of the fan component and vertically connects
It is connected to the wing side of the opposite sides of the wind deflector, adjacent radiating fin is abutted by the wing side to enclose the outlet air
Channel.
Preferably, the radiating fin is equipped with for passing through first heat conducting element and one second heat conducting element
The opening matched.
Preferably, the fan component includes an at least fan and the matched fan upper cover of the radial fan and wind
Lower cover is fanned, the fan upper cover and the fan lower cover fasten to form the chamber that side offers air outlet, the fan upper cover
It is equipped with upper air inlet, lid is equipped with lower air inlet under the fan, and the air outlet is connected to the air-out passage.
Preferably, the fan is a radial fan.
Preferably, the radiator structure further includes the first functional unit for fixing first functional component, institute
It includes the first heat-radiating substrate to state the first functional unit, and first heat-radiating substrate is equipped with for accommodating first functional component
The first storage tank, first heat conducting element connect with first heat-radiating substrate.
Preferably, first heat conducting element, which is one end, is embedded in the copper flat tube in first heat-radiating substrate.
Preferably, the other end of the copper flat tube is around being set as bending.
Preferably, the radiator structure further includes the second functional unit for fixing second functional component, institute
It includes the second heat-radiating substrate to state the second functional unit, and second heat-radiating substrate is equipped with for accommodating second functional component
The second storage tank, second heat conducting element connect with second heat-radiating substrate.
In above-mentioned radiator structure, one end of first heat conducting element and second heat conducting element is connected to the heat dissipation
The other end of fins group, first heat conducting element is connected to one first functional component, the other end of second heat conducting element
It is connected to one second functional component, to which the guiding of the heat of the first functional component and the second functional component is concentrated to same heat dissipation
Fins group and by fan cooling, keeps radiator structure compact, while having higher radiating efficiency.
Description of the drawings
Fig. 1 is structural schematic diagram of the radiator structure in a preferred embodiment.
Fig. 2 is the part-structure schematic diagram of the radiator structure of Fig. 1.
Fig. 3 is the decomposition view of the radiator structure of Fig. 2.
Main element symbol description
1 radiator structure
10 fan components
20 first heat conducting elements
30 second heat conducting elements
40 radiating fins
50 first functional units
60 second functional units
101 air outlets
110 fan upper covers
120 fan blade
130 fan lower covers
140 air-guiding aisles
401 air-out passages
410 wind deflectors
420 wing sides
510 first heat-radiating substrates
520 first functional components
530 screws
540 heat-conducting creams
610 second heat-radiating substrates
620 second functional components
630 heat-conducting creams
5101 screw holes
5102 first storage tanks
6101 second storage tanks
Following specific implementation mode will be further illustrated the present invention in conjunction with above-mentioned attached drawing.
Specific implementation mode
As shown in Figure 1 to Figure 3, radiator structure 1 includes fan component 10, radiating fin group, multiple first heat conducting elements 20
And one second heat conducting element 30.In specific implementation, the quantity of the first heat conducting element 20 and the second heat conducting element 30 can basis
Demand is selected one or more.
Radiating fin group is located at the air side of fan component 10, and radiating fin group includes multiple radiating fins 40.It needs
It is bright, to show the portions structure of the masking of radiating fin 40, multiple radiating fins 40 are omitted in Fig. 2 and Fig. 3.
First heat conducting element 20 is connected between one second functional component 620 and radiating fin group, i.e. the first heat conducting element
20 one end is contacted with the first functional component 520, and the other end is contacted with multiple radiating fins 40, by the first functional component 520
The heat of generation is conducted to multiple radiating fins 40.In specific implementation, the first heat conducting element 20 can be with the first functional component 520
It is in direct contact, can also be connect indirectly with the first functional component 520 by other component, only need to meet the needs of heat transfer i.e.
It can.
Second heat conducting element 30 is connected between one second functional component 620 and radiating fin group, i.e. the second heat conducting element
30 one end is contacted with the second functional component 620, and the other end is contacted with multiple radiating fins 40, by the second functional component 620
The heat of generation is conducted to multiple radiating fins 40.Reason is the same as the first heat conducting element 20, in specific implementation, the second heat conducting element 30
It can be in direct contact, can also be connect indirectly with the second functional component 620 by other component with the second functional component 620, only be needed
Meets the needs of heat transfer.In specific implementation, to avoid the mutual of the first heat conducting element 20 and the second heat conducting element 30
Interference, while being the heat dissipation pressure of reasonable layout radiating fin group, the first heat conducting element 20 and the layering of the second heat conducting element 30 are worn
Multiple radiating fins 40 are crossed, for example, the first heat conducting element 20 and the second heat conducting element 30 can be each passed through the upper of radiating fin 40
Side and downside.
In radiating fin group, multiple radiating fins 40 can be arranged in parallel.Radiating fin 40 may include along fan component 10
Air-out direction setting wind deflector 410 and be vertically connected at wind deflector 410 opposite sides wing side 420.Adjacent heat radiating fin
Piece 40 is abutted by wing side 420 to enclose an air-out passage 401.Specifically, in two adjacent radiating fins 40, wherein one
The both wings side 420 of radiating fin 40 is resisted against on the wind deflector 410 of another radiating fin 40, then two wind-guidings of two radiating fins 40
Plate 410 and aforementioned both wings side 420 be correspondingly formed a four sides enclose, the air-out passage 401 of both ends open.
Radiating fin 40 is equipped with and 30 matched opening of the first heat conducting element 20 and the second heat conducting element.For example, first
Copper flat tube can be selected in heat conducting element 20, the second heat conducting element 30.Opening on multiple radiating fins 40 is along the extension with copper flat tube
The matched path profile in direction, copper flat tube sequentially pass through the opening on each radiating fin 40 and are connect with radiating fin 40 by being open
It touches, by the first functional component 520, the heat of the second functional component 620 conduction to the first heat conducting element 20, the second heat conducting element 30
Amount is conducted to each radiating fin 40.
Fan component 10 includes two groups of fans 120, and every group of fan 120 is correspondingly provided with respectively under fan upper cover 110 and fan
Lid 130.Fan upper cover 110 and the fastening of fan lower cover 130 form the chamber that side offers air outlet 101.In fan upper cover 110
Equipped with upper air inlet 1101, fan lower cover 130 is equipped with lower air inlet 1301.Air outlet 101 and aforesaid plurality of air-out passage 401
Connection.Radial fan can be selected in fan 120, and external cold air is entered by upper air inlet 1101 and lower air inlet 1301 on fan
Lid 110 and fan lower cover 130 fasten in the chamber formed, and are blown between radiating fin 40 by the air outlet of fan 120 101
Air-out passage 401, to cool down radiating fin 40.
First functional component 520 can be a CPU.Correspondingly, radiator structure 1 further includes the first work(for fixing the CPU
It can unit 50.First functional unit 50 includes the first heat-radiating substrate 510, and the first heat-radiating substrate 510 is equipped with for accommodating first
First storage tank 5102 of functional component 520.First heat conducting element 20 is connect with the first heat-radiating substrate 510.When the first heat conduction member
When part 20 selects copper flat tube, the end of copper flat tube can be embedded in the first heat-radiating substrate 510.First functional component 520 is installed on
In first storage tank 5102, when work, heat that the first functional component 520 generates is transferred to the via the first heat-radiating substrate 510
One heat conducting element 20.The position that first functional component 520 is contacted with the first storage tank 5102 can be filled by the first heat-conducting cream 540,
To reduce the air gap, heat transfer efficiency is improved.
In a preferred embodiment, the copper flat tube that the first heat conducting element 20, the second heat conducting element 30 are selected is set to heat radiating fin
Part in piece 40 is around bending is set as, to increase the contact area with radiating fin 40, to improve radiating efficiency.
Second functional component 620 can be a GPU.Radiator structure 1 further includes the second functional unit for fixing the GPU
60.Second functional unit 60 includes the second heat-radiating substrate 610, and the second heat-radiating substrate 610 is equipped with for accommodating the second function part
Second storage tank 6101 of part 620.Second heat conducting element 30 is connect with the second heat-radiating substrate 610.Second functional unit 60 is set
It sets essentially identical with the first functional unit 50, repeats no more.
In above-mentioned radiator structure 1, one end of the first heat conducting element 20 and the second heat conducting element 30 is connected to radiating fin group,
The other end of first heat conducting element 20 is connected to the first functional component 520, and the other end of the second heat conducting element 30 is connected to second
Functional component 620, to which the guiding of the heat of the first functional component 520 and the second functional component 620 is concentrated to same heat radiating fin
Piece group is simultaneously radiated by fan component 10, keeps radiator structure compact, while having higher radiating efficiency.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (10)
1. a kind of radiator structure, including fan component, positioned at the fan component air side radiating fin group and be connected to hair
Heat conducting element between thermal element and the radiating fin group, it is characterised in that:The heat conducting element includes one first heat conduction member
One end of part and one second heat conducting element, first heat conducting element and second heat conducting element is connected to the radiating fin
The other end of group, first heat conducting element is connected to one first functional component, the other end connection of second heat conducting element
To one second functional component.
2. radiator structure as described in claim 1, it is characterised in that:The radiating fin group includes multiple disposed in parallel scattered
Hot fin, the side of adjacent two radiating fin engage the air-out passage to form the air-out direction setting along the fan component.
3. radiator structure as claimed in claim 2, it is characterised in that:The radiating fin includes going out along the fan component
The wind deflector of wind direction setting and be vertically connected at the wind deflector opposite sides wing side, adjacent radiating fin passes through institute
Wing side is stated to abut to enclose the air-out passage.
4. radiator structure as claimed in claim 2, it is characterised in that:The radiating fin is equipped with for passing through described first
Heat conducting element and the one second matched opening of heat conducting element.
5. radiator structure as claimed in claim 2, it is characterised in that:The fan component include an at least fan, with it is described
The matched fan upper cover of radial fan and fan lower cover, the fan upper cover and the fan lower cover, which fasten, to be formed side and offers
The chamber of air outlet, lid is equipped with upper air inlet on the fan, and lid is equipped with lower air inlet, the air outlet under the fan
It is connected to the air-out passage.
6. radiator structure as claimed in claim 5, it is characterised in that:The fan is a radial fan.
7. radiator structure as described in claim 1, it is characterised in that:The radiator structure further includes for fixing described first
First functional unit of functional component, first functional unit include the first heat-radiating substrate, are set on first heat-radiating substrate
It is useful for accommodating the first storage tank of first functional component, first heat conducting element connects with first heat-radiating substrate
It connects.
8. radiator structure as claimed in claim 7, it is characterised in that:First heat conducting element is that one end is embedded in described the
Copper flat tube in one heat-radiating substrate.
9. radiator structure as claimed in claim 8, it is characterised in that:The other end of the copper flat tube is around being set as bending.
10. radiator structure as claimed in claim 7, it is characterised in that:The radiator structure further includes for fixing described
Second functional unit of two functional components, second functional unit includes the second heat-radiating substrate, on second heat-radiating substrate
Equipped with the second storage tank for accommodating second functional component, second heat conducting element connects with second heat-radiating substrate
It connects.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611128171.8A CN108617136A (en) | 2016-12-09 | 2016-12-09 | Radiator structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611128171.8A CN108617136A (en) | 2016-12-09 | 2016-12-09 | Radiator structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108617136A true CN108617136A (en) | 2018-10-02 |
Family
ID=63643923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611128171.8A Pending CN108617136A (en) | 2016-12-09 | 2016-12-09 | Radiator structure |
Country Status (1)
Country | Link |
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CN (1) | CN108617136A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021027014A1 (en) * | 2019-08-09 | 2021-02-18 | 深圳市洋沃电子有限公司 | Portable depilation instrument |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2755781Y (en) * | 2004-11-03 | 2006-02-01 | 英业达股份有限公司 | Integrated radiator |
CN2842546Y (en) * | 2005-09-28 | 2006-11-29 | 浩鑫股份有限公司 | Radiator structure |
US20080115914A1 (en) * | 2006-11-17 | 2008-05-22 | Foxconn Technology Co., Ltd. | Heat dissipation device with heat pipes |
CN101198243A (en) * | 2006-12-06 | 2008-06-11 | 英业达股份有限公司 | Radiating module |
CN201369011Y (en) * | 2009-03-13 | 2009-12-23 | 广东新创意专利发展有限公司 | Power supply heat dissipation device for computer |
CN201716656U (en) * | 2010-08-02 | 2011-01-19 | 苏州聚力电机有限公司 | Multi-heat-source heat dissipation module structure |
CN102314196A (en) * | 2010-06-30 | 2012-01-11 | 英业达股份有限公司 | Notebook computer with easily-replaced cooling module |
JP2013115361A (en) * | 2011-11-30 | 2013-06-10 | Toshiba Corp | Temperature controller and chassis |
CN105652991A (en) * | 2015-12-29 | 2016-06-08 | 湖南长城银河科技有限公司 | Laptop cooling device and laptop |
CN105744799A (en) * | 2014-12-12 | 2016-07-06 | 鸿富锦精密工业(武汉)有限公司 | Heat dissipation apparatus and heat dissipation system |
-
2016
- 2016-12-09 CN CN201611128171.8A patent/CN108617136A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2755781Y (en) * | 2004-11-03 | 2006-02-01 | 英业达股份有限公司 | Integrated radiator |
CN2842546Y (en) * | 2005-09-28 | 2006-11-29 | 浩鑫股份有限公司 | Radiator structure |
US20080115914A1 (en) * | 2006-11-17 | 2008-05-22 | Foxconn Technology Co., Ltd. | Heat dissipation device with heat pipes |
CN101198243A (en) * | 2006-12-06 | 2008-06-11 | 英业达股份有限公司 | Radiating module |
CN201369011Y (en) * | 2009-03-13 | 2009-12-23 | 广东新创意专利发展有限公司 | Power supply heat dissipation device for computer |
CN102314196A (en) * | 2010-06-30 | 2012-01-11 | 英业达股份有限公司 | Notebook computer with easily-replaced cooling module |
CN201716656U (en) * | 2010-08-02 | 2011-01-19 | 苏州聚力电机有限公司 | Multi-heat-source heat dissipation module structure |
JP2013115361A (en) * | 2011-11-30 | 2013-06-10 | Toshiba Corp | Temperature controller and chassis |
CN105744799A (en) * | 2014-12-12 | 2016-07-06 | 鸿富锦精密工业(武汉)有限公司 | Heat dissipation apparatus and heat dissipation system |
CN105652991A (en) * | 2015-12-29 | 2016-06-08 | 湖南长城银河科技有限公司 | Laptop cooling device and laptop |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021027014A1 (en) * | 2019-08-09 | 2021-02-18 | 深圳市洋沃电子有限公司 | Portable depilation instrument |
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WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181002 |
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