CN202887090U - Laptop built-in type heat dissipation device - Google Patents
Laptop built-in type heat dissipation device Download PDFInfo
- Publication number
- CN202887090U CN202887090U CN 201220542398 CN201220542398U CN202887090U CN 202887090 U CN202887090 U CN 202887090U CN 201220542398 CN201220542398 CN 201220542398 CN 201220542398 U CN201220542398 U CN 201220542398U CN 202887090 U CN202887090 U CN 202887090U
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- CN
- China
- Prior art keywords
- heat dissipation
- notebook
- emission device
- computer
- semiconductor chilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a computer heat dissipation device, in particular to a laptop built-in type heat dissipation device. The heat dissipation is arranged inside a machine shell, a computer chip is provided with a semiconductor thermoelectric cooler connected with a heat dissipation fin through a hot pipe, and a heat dissipation fan is arranged on the side edge of the heat dissipation fin. The laptop built-in type heat dissipation device integrates advantages of the semiconductor thermoelectric cooler, the heat dissipation fin and the heat dissipation fan, and provides a high-efficiency heat dissipation scheme for a laptop.
Description
Technical field
The utility model relates to computer radiating apparatus, particularly a kind of notebook integral heat emission device.
Background technology
Notebook computer because of its compact conformation, be easy to carry, also can provide simultaneously the function identical with desktop computer and performance and very popular.But the above-mentioned feature just because of notebook, need in very compact volume, reach higher runnability, so that there is inadequate natural endowment in notebook computer at radiating capacity of equipment, and the bad one side of dispelling the heat causes the computer operational efficiency to descend, also affect on the other hand user's use impression, reach the heat radiation purpose so notebook will adopt than the more measure of desktop computer.
The utility model content
The purpose of this utility model is to provide a kind of notebook integral heat emission device of good heat dissipation effect.
The purpose of this utility model is achieved through the following channels: a kind of notebook integral heat emission device, this heat abstractor is loaded in the casing, it is at computer chip semiconductor chilling plate to be installed, semiconductor chilling plate connects radiating fin by heat pipe, and the radiating fin side is equipped with radiator fan.
As the further optimization of scheme, described computer chip refers to board chip set or video card chip.
As the further optimization of scheme, the air outlet of described radiator fan is positioned at the sidewall of casing.
As the further optimization of scheme, described semiconductor chilling plate sticks on the computer chip by silica gel.
The utility model notebook integral heat emission device, when notebook computer normally moves, its internal main is wanted the heat-absorbent surface of the heat transferred semiconductor chilling plate of heater element generation, and then quick collecting is to the heat delivery surface of semiconductor chilling plate, and then pass to heat pipe evaporator section, make the actuating medium heat absorption vaporization in the heat pipe evaporator section, under differential pressure action, the steam Rapid Flow is to heat pipe condenser section, by radiating fin and radiator fan that heat is quick, efficiently be discharged in the notebook external environment condition and go, under the liquid-sucking core capillary suction force effect of thermotube shell inwall, the actuating medium in the heat pipe condenser section flows back to heat pipe evaporator section and continues to absorb heat.So circulation, heat constantly is transported to the low temperature place from high temperature, satisfies the radiating requirements of high-performance notebook computer.
Description of drawings
Below in conjunction with accompanying drawing the utility model is described in further detail:
Fig. 1 is the utility model structural representation;
Among the figure, casing 1, computer chip 2, semiconductor chilling plate 3, radiator fan 4, air outlet 5, heat pipe 6, radiating fin 7.
Embodiment
As shown in Figure 1, the utility model notebook integral heat emission device, this heat abstractor is loaded in the casing 1, it is to paste semiconductor chilling plate 3 by silica gel on the computer chips 2 such as CPU, board chip set, video card chip, semiconductor chilling plate 3 connects radiating fin 7 by heat pipe 6, radiating fin 7 sides are equipped with radiator fan 4, and the air outlet 5 of radiator fan 4 is positioned at the sidewall of casing 1.
Claims (4)
1. notebook integral heat emission device, it is characterized in that: this heat abstractor is loaded in the casing (1), it is at computer chip (2) semiconductor chilling plate (3) to be installed, semiconductor chilling plate (3) connects radiating fin (7) by heat pipe (6), and radiating fin (7) side is equipped with radiator fan (4).
2. notebook integral heat emission device as claimed in claim 1, it is characterized in that: described computer chip (2) refers to board chip set or video card chip.
3. notebook integral heat emission device as claimed in claim 1, it is characterized in that: the air outlet (5) of described radiator fan (4) is positioned at the sidewall of casing (1).
4. notebook integral heat emission device as claimed in claim 1, it is characterized in that: described semiconductor chilling plate (3) sticks on the computer chip (2) by silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220542398 CN202887090U (en) | 2012-10-23 | 2012-10-23 | Laptop built-in type heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220542398 CN202887090U (en) | 2012-10-23 | 2012-10-23 | Laptop built-in type heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202887090U true CN202887090U (en) | 2013-04-17 |
Family
ID=48078496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220542398 Expired - Fee Related CN202887090U (en) | 2012-10-23 | 2012-10-23 | Laptop built-in type heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202887090U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107329553A (en) * | 2017-09-08 | 2017-11-07 | 合肥宗平计算机科技有限公司 | Display card cooling device |
| CN108415539A (en) * | 2018-05-02 | 2018-08-17 | 昆山莹帆精密五金有限公司 | Twin automatic cycle cooling device |
-
2012
- 2012-10-23 CN CN 201220542398 patent/CN202887090U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107329553A (en) * | 2017-09-08 | 2017-11-07 | 合肥宗平计算机科技有限公司 | Display card cooling device |
| CN108415539A (en) * | 2018-05-02 | 2018-08-17 | 昆山莹帆精密五金有限公司 | Twin automatic cycle cooling device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20131023 |