CN209626206U - A kind of semiconductor chip radiator - Google Patents
A kind of semiconductor chip radiator Download PDFInfo
- Publication number
- CN209626206U CN209626206U CN201920669671.5U CN201920669671U CN209626206U CN 209626206 U CN209626206 U CN 209626206U CN 201920669671 U CN201920669671 U CN 201920669671U CN 209626206 U CN209626206 U CN 209626206U
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- CN
- China
- Prior art keywords
- chilling plate
- semiconductor chilling
- heat
- semiconductor chip
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of semiconductor chip radiators, including semiconductor chilling plate, cooling fin is connected on the radiating surface of the semiconductor chilling plate, cooling fin two sides are connected with heat-dissipating pipe, and radiating fin is fixed on heat-dissipating pipe, and the chill surface lower end of semiconductor chilling plate is equipped with cold head, cold head is equipped with groove, the floor space of groove is greater than the floor space of semiconductor chilling plate chill surface, and the chill surface of groove and semiconductor chilling plate connects to form water storage tank, and one end is connected with discharge outlet.The condensing drip that the utility model can prevent semiconductor chilling plate from generating enters mainboard, and without cooperating water cooling plant to use, structure is simple, cheap.
Description
Technical field
The utility model relates to chip cooling technical field, in particular to a kind of semiconductor chip radiator.
Background technique
Chip can generate a large amount of heat at work, if these heats not distributed in time, gently if cause
It crashes, heavy then may burn chip, chip radiator is for for chip cooling, stable operation of the radiator to chip
Play conclusive effect.As chip industry develops rapidly, current chip power consumption can reach tens watts of even upper hectowatts, chip
Generated heat is very big.
Existing chip radiator belongs to wind-cooling heat dissipating mostly, and the heat of cooling fin is passed through the air of flowing using fan
It blows away, heat dissipation performance is not able to satisfy the big chip of some calorific values, if there is the feelings that environment temperature is excessively high or draws badly
Condition, the temperature of chip are easy aggregation and increase, and influence its working efficiency；Also occur a kind of semiconductor heat dissipation device currently on the market,
The semiconductor chilling plate of semiconductor heat dissipation device is easy to produce condensed water, and condensed water, which can instill in mainboard, causes main plate short to burn
It ruins, so structure is complicated it is generally necessary to which water cooling plant is cooperated to use, it is at high price.
Utility model content
The technical problem to be solved by the present invention is to provide a kind of semiconductor chip radiators, can prevent semiconductor system
The condensing drip of cold generation enters mainboard, and without cooperating water cooling plant to use, structure is simple, cheap.
In order to solve the above-mentioned technical problem, the technical solution of the utility model are as follows:
A kind of semiconductor chip radiator, including semiconductor chilling plate connect on the radiating surface of the semiconductor chilling plate
It is connected to cooling fin, cooling fin two sides are connected with heat-dissipating pipe, and radiating fin, the chill surface of semiconductor chilling plate are fixed on heat-dissipating pipe
Lower end is equipped with cold head, and cold head is equipped with groove, and the floor space of groove is greater than the floor space of semiconductor chilling plate chill surface, groove with
The chill surface of semiconductor chilling plate connects to form water storage tank, and one end is connected with discharge outlet.
Preferably, the radiating fin two sides are equipped with No.1 radiator fan.
Preferably, the radiating fin is equipped with hollow slots.
Preferably, the radiating fin upper end, which corresponds to, is equipped with No. two radiator fans at hollow slots.
Preferably, the material of the cooling fin and heat-dissipating pipe is copper.
Preferably, the material of the radiating fin is aluminium.
By adopting the above technical scheme, by the chill surface lower end of semiconductor chilling plate be arranged cold head, the groove of cold head with
The chill surface of semiconductor chilling plate connects to form water storage tank, so that the condensed water that semiconductor chilling plate generates is from semiconductor chilling plate
On run underneath to water storage tank, and pass through discharge outlet and be discharged.
Detailed description of the invention
Fig. 1 is the perspective view of the utility model；
Fig. 2 is the main view of the utility model；
Fig. 3 is the perspective view of cold head；
Fig. 4 is the sectional side elevation of the utility model.
In figure, 1- semiconductor chilling plate, 2- cooling fin, 3- heat-dissipating pipe, 4- radiating fin, 41- hollow slots, 5- cold head, 51-
Groove, 52- water storage tank, 53- discharge outlet, 61- No.1 radiator fan, No. bis- radiator fans of 62-.
Specific embodiment
Specific embodiment of the present utility model is described further with reference to the accompanying drawing.It should be noted that
The explanation of these embodiments is used to help to understand the utility model, but does not constitute the restriction to the utility model.This
Outside, technical characteristic involved in the various embodiments of the present invention described below is as long as they do not conflict with each other
It can be combined with each other.
As shown in figures 1-4, the utility model provides a kind of semiconductor chip radiator, including semiconductor chilling plate
1, it is connected with cooling fin 2 on the radiating surface of the semiconductor chilling plate 1,2 two sides of cooling fin are connected with two groups of heat-dissipating pipes 3, and every group
There are 4 heat-dissipating pipes 3, the material of cooling fin 2 and heat-dissipating pipe 3 is copper, is conducive to the thermally conductive of the radiating surface of semiconductor chilling plate 1
Property, one group of radiating fin 4 is respectively and fixedly provided on every group of heat-dissipating pipe 3, every group is equipped with 22 radiating fins 4, and the material of radiating fin 4 is
The heat dissipation performance of aluminium, aluminium is strong, and 4 two sides of radiating fin are equipped with No.1 radiator fan 61, and radiator fan 61 increases between radiating fin 4
Air flow property, reach better heat dissipation effect, radiating fin 4 is equipped with hollow slots 41, and hollow slots 41 increase radiating fin
The area contacted with air, 4 upper end of radiating fin, which corresponds to, is equipped with 4 No. two radiator fans 62, No. two radiation airs at hollow slots 41
Fan 62 increases air duct, and the chill surface lower end of heat radiation efficiency, semiconductor chilling plate 1 is equipped with cold head 5, and cold head is contacted with chip,
Cold head 5 quickly absorbs the heat of chip, and cold head 5 is equipped with groove 51, and the floor space of groove 51 is freezed greater than semiconductor chilling plate 1
The floor space in face, groove 51 connect to form water storage tank 52 with the chill surface of semiconductor chilling plate 1, and one end is connected with discharge outlet 53,
Discharge outlet 53 can connect water pipe.
Working principle of the utility model is: semiconductor chilling plate 1 chill surface lower end be arranged cold head, cold head 5 with partly lead
The chill surface of body cooling piece 1 connects, and cold head 5 is connect with chip, and the groove 51 of cold head 5 and the chill surface of semiconductor chilling plate 1 connect
It connects to form water storage tank 52, so that the condensed water that semiconductor chilling plate 1 generates runs underneath to water storage tank 52 from semiconductor chilling plate 1,
And water pipe is discharged to by discharge outlet 53, the condensed water that semiconductor chilling plate 1 generates will not instill mainboard, main plate short is caused to be burnt
It ruins, the heat of chip is absorbed by cold head 5 by semiconductor chilling plate 1, and heat is from the radiating surface of semiconductor chilling plate 1 by dissipating
Backing 2 exports to radiating fin 4, reaches good heat dissipation.
The embodiments of the present invention is explained in detail in conjunction with attached drawing above, but the utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, right in the case where not departing from the utility model principle and spirit
These embodiments carry out a variety of change, modification, replacement and modification, still fall in the protection scope of the utility model.
Claims (6)
1. a kind of semiconductor chip radiator, including semiconductor chilling plate (1), it is characterised in that: the semiconductor chilling plate
(1) it is connected on radiating surface cooling fin (2), cooling fin (2) two sides are connected with heat-dissipating pipe (3), are fixed on heat-dissipating pipe (3) scattered
The chill surface lower end of hot fin (4), semiconductor chilling plate (1) is equipped with cold head (5), and cold head (5) is equipped with groove (51), groove
(51) floor space is greater than the floor space of semiconductor chilling plate (1) chill surface, the refrigeration of groove (51) and semiconductor chilling plate (1)
Face connects to be formed water storage tank (52), and one end is connected with discharge outlet (53).
2. semiconductor chip radiator according to claim 1, it is characterised in that: radiating fin (4) two sides are set
There are No.1 radiator fan (61).
3. semiconductor chip radiator according to claim 1, it is characterised in that: the radiating fin (4) is equipped with
Hollow slots (41).
4. semiconductor chip radiator according to claim 3, it is characterised in that: radiating fin (4) upper end pair
It answers and is equipped with No. two radiator fans (62) at hollow slots (41).
5. semiconductor chip radiator according to claim 1, it is characterised in that: the cooling fin (2) and heat-dissipating pipe
(3) material is copper.
6. semiconductor chip radiator according to claim 1, it is characterised in that: the material of the radiating fin (4)
For aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920669671.5U CN209626206U (en) | 2019-05-11 | 2019-05-11 | A kind of semiconductor chip radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920669671.5U CN209626206U (en) | 2019-05-11 | 2019-05-11 | A kind of semiconductor chip radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209626206U true CN209626206U (en) | 2019-11-12 |
Family
ID=68442770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920669671.5U Expired - Fee Related CN209626206U (en) | 2019-05-11 | 2019-05-11 | A kind of semiconductor chip radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209626206U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115951769A (en) * | 2023-03-10 | 2023-04-11 | 山东合众智远信息技术有限公司 | Heat radiator for computer CPU |
| CN116769591A (en) * | 2023-08-28 | 2023-09-19 | 四川杰莱美科技有限公司 | Real-time fluorescence quantitative PCR instrument |
-
2019
- 2019-05-11 CN CN201920669671.5U patent/CN209626206U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115951769A (en) * | 2023-03-10 | 2023-04-11 | 山东合众智远信息技术有限公司 | Heat radiator for computer CPU |
| CN115951769B (en) * | 2023-03-10 | 2023-05-09 | 山东合众智远信息技术有限公司 | Heat abstractor for computer CPU |
| CN116769591A (en) * | 2023-08-28 | 2023-09-19 | 四川杰莱美科技有限公司 | Real-time fluorescence quantitative PCR instrument |
| CN116769591B (en) * | 2023-08-28 | 2023-10-31 | 四川杰莱美科技有限公司 | Real-time fluorescence quantitative PCR instrument |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191112 Termination date: 20200511 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |