CN106766346B - Circulating water-cooled heat dissipation semiconductor refrigerating system - Google Patents
Circulating water-cooled heat dissipation semiconductor refrigerating system Download PDFInfo
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- CN106766346B CN106766346B CN201611219116.XA CN201611219116A CN106766346B CN 106766346 B CN106766346 B CN 106766346B CN 201611219116 A CN201611219116 A CN 201611219116A CN 106766346 B CN106766346 B CN 106766346B
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- refrigerating
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 68
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 113
- 238000005057 refrigeration Methods 0.000 claims abstract description 69
- 238000005507 spraying Methods 0.000 claims abstract description 39
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 14
- 238000001816 cooling Methods 0.000 abstract description 10
- 239000007921 spray Substances 0.000 description 8
- 239000000498 cooling water Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a circulating water-cooled heat dissipation semiconductor refrigeration system which comprises a power supply, a water storage barrel, a water pump, a refrigeration mechanism and a spraying mechanism, wherein the power supply is connected with the refrigeration mechanism, a water inlet of the water pump is connected with the lower end of the water storage barrel through a first water pipe, a water outlet of the water pump is connected with one end of the refrigeration mechanism through a second water pipe, the other end of the refrigeration mechanism is connected with the spraying mechanism, the spraying mechanism is arranged above the water storage barrel, and a spraying outlet of the spraying mechanism is communicated with an opening in the upper end of the water storage barrel. The invention utilizes the water flow loop composed of the water pump, the water pipe, the refrigerating mechanism, the spraying mechanism, the water storage barrel and the like to carry out circulating water cooling type heat dissipation on the hot end of the semiconductor refrigerating sheet, has better water cooling effect, can effectively reduce the temperature of the hot end, and improves the heat dissipation efficiency of the refrigerating mechanism, thereby improving the refrigerating efficiency of the refrigerating mechanism.
Description
Technical Field
The invention relates to a refrigeration technology, in particular to a circulating water-cooled heat dissipation semiconductor refrigeration system.
Background
Most of the current refrigeration equipments are composed of a compressor, a condenser and an evaporator, and their working substances are harmful to the environment, and generate vibration and noise. Semiconductor refrigeration is a new and developed refrigeration technology, is a refrigeration mode with good prospect, and the theoretical basis of the semiconductor refrigeration is thermoelectric refrigeration. Its advantages are no need of refrigerant, compact structure, no environmental pollution and wide application. However, the currently used semiconductor refrigeration system has the following defects: 1. the volume is large, and the manufacturing cost is high; 2. the efficiency of heat dissipation and cold conduction is low, and the refrigeration efficiency is not ideal. 3. The power of the existing semiconductor refrigerating system is constant, and the constantly changing environment cannot be met.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides the circulating water-cooled heat dissipation semiconductor refrigeration system which is simple and compact in structure, high in efficiency, energy-saving and environment-friendly.
In order to achieve the purpose, the invention adopts the following technical scheme: the utility model provides a circulating water-cooled heat dissipation semiconductor refrigerating system, includes power, retaining bucket, water pump, refrigeration mechanism and sprays the mechanism, the power is connected with refrigeration mechanism, the water inlet of water pump is connected with the lower extreme of retaining bucket through first water pipe, the delivery port of water pump is connected with refrigeration mechanism's one end through the second water pipe, refrigeration mechanism's the other end with spray the mechanism and be connected, it installs in the top of retaining bucket to spray the mechanism, the spraying outlet that sprays the mechanism communicates with each other with the opening of retaining bucket upper end.
The refrigerating mechanism comprises a heat-radiating water pipe, a cold air pipe, a heat-transfer sleeve, a semiconductor refrigerating sheet and a cold guide block, the heat-transfer sleeve is sleeved with the heat-radiating water pipe, the hot end of the semiconductor refrigerating sheet is fixed on the heat-transfer sleeve, and the cold end of the semiconductor refrigerating sheet is connected with the cold guide block; the cold air pipe comprises a round cake part and two round pipe parts, the round cake part wraps a heat transfer sleeve, a semiconductor refrigeration sheet and a cold guide block, one ends of the two round pipe parts are respectively connected with two ends of the round cake part, one end of the heat dissipation water pipe penetrates through one side of the round cake part and then is connected with a second water pipe, and the other end of the heat dissipation water pipe penetrates through the other side of the round cake part and then is connected with a spraying mechanism; the other ends of the two round pipe parts are respectively provided with a cold air fan, and the semiconductor refrigerating sheet is connected with a power supply; the 2 round pipe parts are symmetrically arranged relative to the axis of the round cake part.
The outer wall of the heat transfer sleeve is provided with a plurality of fixed planes, and the number of the semiconductor refrigeration sheets and the number of the cold guide blocks are equal to the number of the fixed planes; the hot end of each semiconductor refrigeration piece is fixed in corresponding fixed plane respectively, and each leads cold block to be fixed in the cold junction of corresponding semiconductor refrigeration piece.
The fixing planes are evenly circumferentially distributed around the axis of the heat transfer sleeve.
The heat transfer sleeve is made of copper or aluminum alloy. The inner diameter of the heat transfer sleeve is equal to the outer diameter of the heat dissipation water pipe.
The spraying mechanism comprises a connecting pipe and a spraying head, the spraying head is connected with the heat dissipation water pipe through the connecting pipe, and a spraying outlet of the spraying head is opposite to an opening in the upper end of the water storage barrel.
The heat dissipation water pipe and the cold air pipe are vertically arranged.
The first water pipe is provided with a first valve, and the second water pipe is provided with a second valve.
The second water pipe is provided with at least two corner portions.
Compared with the prior art, the invention has the following advantages:
1. the circulating water-cooled heat dissipation semiconductor refrigeration system mainly comprises a direct-current power supply, a water storage barrel, a water pump, a refrigeration mechanism and a spraying mechanism, and utilizes a water flow loop formed by the water pump, a water pipe, the refrigeration mechanism, the spraying mechanism, the water storage barrel and the like to perform circulating water-cooled heat dissipation on the hot end of a semiconductor refrigeration sheet, so that the water cooling effect is good, the temperature of the hot end can be effectively reduced, the heat dissipation efficiency of the refrigeration mechanism is improved, and the refrigeration efficiency of the refrigeration mechanism is improved.
2. The refrigerating mechanism in the circulating water-cooled heat dissipation semiconductor refrigerating system mainly comprises a heat dissipation water pipe, a cold air pipe, a heat transfer sleeve, semiconductor refrigerating sheets and a cold guide block, the structure is simple and compact, the heat transfer sleeve can be fixedly connected with the semiconductor refrigerating sheets, the maximization of space utilization is realized, the structure is compact, and the size of the whole system is reduced.
3. This circulation water-cooled heat dissipation semiconductor refrigeration system utilizes the rivers return circuit of water pump, water pipe, refrigeration mechanism, spraying mechanism and retaining bucket etc. constitution, then the cooling water forms circulation circuit, need not continuously supply the water source, reaches resources are saved, uses convenient effect.
Drawings
Fig. 1 is a block diagram of a circulating water-cooled heat dissipating semiconductor refrigeration system according to the present invention.
Fig. 2 is a schematic structural diagram of a circulating water-cooled heat dissipation semiconductor refrigeration system according to the present invention.
Fig. 3 is a schematic view of the structure of the refrigeration mechanism of the present invention.
Fig. 4 is a schematic view of the internal structure of the refrigeration mechanism of the present invention.
Fig. 5 is a schematic view of the structure of the heat transfer jacket of the present invention.
Detailed Description
For the understanding of those skilled in the art, the present invention will be described in further detail with reference to the accompanying drawings and examples.
As shown in fig. 1 and 2, the circulating water-cooled heat dissipation semiconductor refrigeration system comprises a power supply 1, a water storage barrel 2, a water pump 3, a refrigeration mechanism 4 and a spraying mechanism 5, wherein the power supply 1 is connected with the refrigeration mechanism 4, a water inlet of the water pump 3 is connected with the lower end of the water storage barrel 2 through a first water pipe 6, a water outlet of the water pump 3 is connected with one end of the refrigeration mechanism 4 through a second water pipe 7, the other end of the refrigeration mechanism 4 is connected with the spraying mechanism 5, the spraying mechanism 5 is installed above the water storage barrel 2, and a spraying outlet of the spraying mechanism 5 is communicated with an opening in the upper end of the water storage barrel 2.
In the actual work, the water pump 3, the water pipe (i.e. the first water pipe 6 and the second water pipe 7), the refrigerating mechanism 4, the cooling water loop that constitutes such as the mechanism 5 and the storage bucket 2 sprays, promptly earlier through the water pump 3 from storage bucket 2 extraction moisture supply to refrigerating mechanism 4, this moisture absorbs the heat that semiconductor refrigeration piece 404 produced when getting into the cooling water pipe 401 of refrigerating mechanism 4, then the water of heat absorption rethread sprays storage bucket 2 down through the mechanism 5 that sprays, in-process that falls storage bucket 2 is sprayed from spraying mechanism 5 to moisture, the temperature of moisture falls back to storage bucket 2 after the temperature is fast down, these moisture that get back to storage bucket 2 can be used as the cooling water once more, can be extracted by the water pump 3 once more and send to refrigerating mechanism 4 absorption heat again. The cooling water forms a circulation loop, and a water source does not need to be continuously supplemented, so that the effects of saving resources and being convenient and fast to use are achieved. In order to further improve the cooling effect of water, the water storage barrel 2 is provided with a cooling tower which can be directly bought in the market. And the refrigerating mechanism 4 radiates heat through water cooling, which improves the heat radiation effect of the refrigerating mechanism 4 to ensure that the refrigerating mechanism 4 has good refrigerating effect.
As shown in fig. 3 and 4, the refrigerating mechanism 4 includes a heat-dissipating water pipe 401, a cold air pipe 402, a heat-transferring sleeve 403, a semiconductor chilling plate 404 and a cold-guiding block 405, the heat-transferring sleeve 403 is sleeved with the heat-dissipating water pipe 401, a hot end of the semiconductor chilling plate 404 is fixed to the heat-transferring sleeve 403, and a cold end of the semiconductor chilling plate 404 is connected with the cold-guiding block 405; the cold air duct 402 comprises a round cake part 4021 and two round tube parts 4022, the round cake part 4021 wraps the heat transfer sleeve 403, the semiconductor refrigeration sheet 404 and the cold guide block 405, one ends of the two round tube parts 4022 are respectively connected with two ends of the round cake part 4021, one end of the heat dissipation water pipe 401 penetrates through one side of the round cake part 4021 and then is connected with the second water pipe 7, and the other end of the heat dissipation water pipe 401 penetrates through the other side of the round cake part 4021 and then is connected with the spraying mechanism 5; the other ends of the two round pipe parts 4022 are respectively provided with a cold air fan 8, and the semiconductor refrigeration piece 404 is connected with the power supply 1; the 2 round pipe parts are symmetrically arranged relative to the axis of the round cake part. The refrigerating mechanism 4 is simple in structure and convenient to install and maintain. The cold air duct 402 has a round cake portion 4021 and a round tube portion 4022, so that the air blown by the cold air blower 8 can form a circulation in the round cake portion 4021, thereby further improving the cooling and heat dissipation effects of the cooling mechanism 4.
As shown in fig. 5, the outer wall of the heat transfer sleeve 403 is provided with a plurality of fixed planes 9, and the number of the semiconductor chilling plates 404 and the number of the cold-conducting blocks 405 are equal to the number of the fixed planes 9; the hot end of each semiconductor chilling plate 404 is fixed on the corresponding fixed plane 9, and each cold guide block 405 is fixed on the cold end of the corresponding semiconductor chilling plate 404. The fixing plane 9 can increase the contact area between the heat-transfer sleeve 403 and the semiconductor chilling plate 404, so as to further improve the heat generated at the hot end of the semiconductor chilling plate 404 to be transferred to the water in the heat-dissipation water pipe 401 through the heat-transfer sleeve 403, thereby improving the heat dissipation effect of the chilling mechanism 4. In this embodiment, the number of fixing planes is 6, and the 6 fixing planes are uniformly distributed circumferentially around the axis of the heat transfer sleeve. The number of the fixed planes is not limited to 6, but can be 5, 8, 12 and the like, so that the number can be increased or decreased according to the change of the environment, and the load change can be adapted to the maximum extent.
The heat transfer sleeve 403 is made of copper or aluminum alloy. The material of the heat transfer sleeve 403 is not limited to copper or aluminum alloy, and other metal materials with good heat conductivity may be used. The heat transfer sleeve made of the material with good heat transfer effect is adopted to further improve the heat dissipation effect of the refrigerating mechanism.
The inner diameter of the heat transfer sleeve 403 is equal to the outer diameter of the heat radiation water pipe 401. This ensures sufficient contact between the inner wall of the heat transfer sleeve 403 and the outer wall of the heat radiation water pipe 401 to ensure heat transfer efficiency, further improving the heat radiation effect of the refrigeration mechanism.
The spraying mechanism 5 comprises a connecting pipe 501 and a spraying head 502, the spraying head 502 is connected with the heat dissipation water pipe 401 through the connecting pipe 501, and a spraying outlet of the spraying head 502 is opposite to an opening at the upper end of the water storage barrel 2. The structure is simple and the installation is convenient. The water absorbing heat can be cooled by natural air when being sprayed to the water storage barrel 2 through the spray header 502, so that the temperature of the water is reduced, and the effects of energy conservation and environmental protection are achieved.
The heat dissipation water pipe 401 and the cold air pipe 402 are vertically arranged. The design is compact, and the gas circulation in the round cake part 4021 of the cold air duct 402 is ensured to be fully contacted with the cold guide block, so that the refrigeration effect of the refrigeration mechanism 4 is improved.
The first water pipe 6 is provided with a first valve 10, and the second water pipe 7 is provided with a second valve 11. The valves (i.e. the first valve 10 and the second valve 11) can effectively control the flow rate of the water flow, and ensure the heat dissipation effect of the refrigeration mechanism 4.
The second water tube 7 is provided with at least two corners 12. The bent portion 12 can slow down the flow velocity of the water flow, so that the water can sufficiently absorb the heat transferred from the heat transfer sleeve 403, and the water-cooling heat dissipation effect is further improved.
In practice, the number of the semiconductor refrigeration sheets in the refrigeration device in the circulating water-cooled heat dissipation semiconductor refrigeration system of the embodiment is 6, the rated power of a single semiconductor refrigeration sheet is 93W, the hot end of the semiconductor refrigeration sheet is attached to the fixed plane of the heat transfer sleeve, and the cold end of the semiconductor refrigeration sheet is attached to the cold guide block. In addition, for better heat conduction and cold conduction, heat-conducting glue is arranged between the hot end of the semiconductor refrigeration piece and the joint surface of the heat-conducting sleeve and between the cold end of the semiconductor refrigeration piece and the joint surface of the cold-conducting block; the actual power of the power supply in this embodiment is 600W of dc power supply, which is connected to 6 semiconductor cooling fins. When the direct current power supply semiconductor refrigerating chip works, 9.3V voltage is provided by the direct current power supply semiconductor refrigerating chip. The hot ends of the 6 semiconductor refrigerating fins are tightly attached to the fixed plane of the heat transfer sleeve, and cooling water flows through the heat dissipation water pipe to absorb heat transferred from the heat transfer sleeve. The cold end of the semiconductor refrigerating sheet is conducted through the cold guide block, the fins of the cold guide block are provided with three-dimensional groove ripples, and airflow blown by the fan sweeps across the two sides of the cold guide fins, so that the airflow turbulence degree can be improved.
The above-mentioned embodiments are preferred embodiments of the present invention, and the present invention is not limited thereto, and any other modifications or equivalent substitutions that do not depart from the technical spirit of the present invention are included in the scope of the present invention.
Claims (9)
1. A circulating water-cooled heat dissipation semiconductor refrigerating system is characterized in that: the water-saving device comprises a power supply, a water storage barrel, a water pump, a refrigerating mechanism and a spraying mechanism, wherein the power supply is connected with the refrigerating mechanism, a water inlet of the water pump is connected with the lower end of the water storage barrel through a first water pipe, a water outlet of the water pump is connected with one end of the refrigerating mechanism through a second water pipe, the other end of the refrigerating mechanism is connected with the spraying mechanism, the spraying mechanism is arranged above the water storage barrel, and a spraying outlet of the spraying mechanism is communicated with an opening in the upper end of the water storage barrel;
the refrigerating mechanism comprises a heat-radiating water pipe, a cold air pipe, a heat-transfer sleeve, a semiconductor refrigerating sheet and a cold guide block, the heat-transfer sleeve is sleeved with the heat-radiating water pipe, the hot end of the semiconductor refrigerating sheet is fixed on the heat-transfer sleeve, and the cold end of the semiconductor refrigerating sheet is connected with the cold guide block; the cold air pipe comprises a round cake part and two round pipe parts, the round cake part wraps a heat transfer sleeve, a semiconductor refrigeration sheet and a cold guide block, one ends of the two round pipe parts are respectively connected with two ends of the round cake part, one end of the heat dissipation water pipe penetrates through one side of the round cake part and then is connected with a second water pipe, and the other end of the heat dissipation water pipe penetrates through the other side of the round cake part and then is connected with a spraying mechanism; the other ends of the two round pipe parts are respectively provided with a cold air fan, and the semiconductor refrigerating sheet is connected with a power supply; the 2 round pipe parts are symmetrically arranged relative to the axis of the round cake part.
2. The circulating water-cooled heat dissipating semiconductor refrigeration system of claim 1, wherein: the outer wall of the heat transfer sleeve is provided with a plurality of fixed planes, and the number of the semiconductor refrigeration sheets and the number of the cold guide blocks are equal to the number of the fixed planes; the hot end of each semiconductor refrigeration piece is fixed in corresponding fixed plane respectively, and each cold conduction piece is fixed in the cold junction of corresponding semiconductor refrigeration piece.
3. The circulating water-cooled heat dissipating semiconductor refrigeration system of claim 2, wherein: the fixing planes are evenly circumferentially distributed around the axis of the heat transfer sleeve.
4. The circulating water-cooled heat dissipating semiconductor refrigeration system of claim 1, wherein: the heat transfer sleeve is made of copper or aluminum alloy.
5. The circulating water-cooled heat dissipating semiconductor refrigeration system of claim 1, wherein: the inner diameter of the heat transfer sleeve is equal to the outer diameter of the heat dissipation water pipe.
6. The circulating water-cooled heat dissipating semiconductor refrigeration system of claim 1, wherein: the spraying mechanism comprises a connecting pipe and a spraying head, the spraying head is connected with the heat dissipation water pipe through the connecting pipe, and a spraying outlet of the spraying head is opposite to an opening in the upper end of the water storage barrel.
7. The circulating water-cooled heat dissipating semiconductor refrigeration system of claim 1, wherein: the heat dissipation water pipe and the cold air pipe are vertically arranged.
8. The circulating water-cooled heat dissipating semiconductor refrigeration system of claim 1, wherein: the first water pipe is provided with a first valve, and the second water pipe is provided with a second valve.
9. The circulating water-cooled heat dissipating semiconductor refrigeration system of claim 1, wherein: the second water pipe is provided with at least two corner portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611219116.XA CN106766346B (en) | 2016-12-26 | 2016-12-26 | Circulating water-cooled heat dissipation semiconductor refrigerating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611219116.XA CN106766346B (en) | 2016-12-26 | 2016-12-26 | Circulating water-cooled heat dissipation semiconductor refrigerating system |
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| CN106766346A CN106766346A (en) | 2017-05-31 |
| CN106766346B true CN106766346B (en) | 2022-09-20 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108834366B (en) * | 2018-06-08 | 2023-10-27 | 贵州绿云科技有限公司 | Air conditioning system of data machine room |
| CN109622925A (en) * | 2018-11-16 | 2019-04-16 | 镇江市富德数控机床科技有限公司 | A kind of small-sized cast member cooling device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2569048Y (en) * | 2002-08-22 | 2003-08-27 | 深圳市唯亚太科技股份有限公司 | Small semiconductor air conditioner |
| CN2581907Y (en) * | 2002-11-05 | 2003-10-22 | 卢振涛 | Semiconductor refrigerating liquid circulation heat radiator |
| CN202109600U (en) * | 2011-06-03 | 2012-01-11 | 王恒月 | Semiconductor air conditioner with high refrigeration efficiency |
| CN105066507A (en) * | 2015-09-02 | 2015-11-18 | 北京三相典创科技有限公司 | Air-cooling semiconductor refrigeration device for circulating cooling system |
| CN105180504A (en) * | 2015-09-02 | 2015-12-23 | 北京三相典创科技有限公司 | Semiconductor refrigeration device for circulating cooling system |
| CN206420184U (en) * | 2016-12-26 | 2017-08-18 | 华南理工大学 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
-
2016
- 2016-12-26 CN CN201611219116.XA patent/CN106766346B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2569048Y (en) * | 2002-08-22 | 2003-08-27 | 深圳市唯亚太科技股份有限公司 | Small semiconductor air conditioner |
| CN2581907Y (en) * | 2002-11-05 | 2003-10-22 | 卢振涛 | Semiconductor refrigerating liquid circulation heat radiator |
| CN202109600U (en) * | 2011-06-03 | 2012-01-11 | 王恒月 | Semiconductor air conditioner with high refrigeration efficiency |
| CN105066507A (en) * | 2015-09-02 | 2015-11-18 | 北京三相典创科技有限公司 | Air-cooling semiconductor refrigeration device for circulating cooling system |
| CN105180504A (en) * | 2015-09-02 | 2015-12-23 | 北京三相典创科技有限公司 | Semiconductor refrigeration device for circulating cooling system |
| CN206420184U (en) * | 2016-12-26 | 2017-08-18 | 华南理工大学 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
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| CN106766346A (en) | 2017-05-31 |
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