CN206420184U - A kind of circulated water-cooled heat-radiating semiconductor refrigeration system - Google Patents
A kind of circulated water-cooled heat-radiating semiconductor refrigeration system Download PDFInfo
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- CN206420184U CN206420184U CN201621441852.5U CN201621441852U CN206420184U CN 206420184 U CN206420184 U CN 206420184U CN 201621441852 U CN201621441852 U CN 201621441852U CN 206420184 U CN206420184 U CN 206420184U
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Abstract
The utility model discloses a kind of circulated water-cooled heat-radiating semiconductor refrigeration system, including power supply, water storage barrel, water pump, refrigeration mechanism and spraying mechanism, the power supply is connected with refrigeration mechanism, the water inlet of the water pump is connected by the lower end of the first water pipe and water storage barrel, the delivery port of the water pump is connected by one end of the second water pipe and refrigeration mechanism, the other end of the refrigeration mechanism is connected with spraying mechanism, the spraying mechanism is installed on the top of water storage barrel, and the discharge outlet of the spraying mechanism is communicated with the opening of water storage barrel upper end.The utility model utilizes the water flow circuits of the compositions such as water pump, water pipe, refrigeration mechanism, spraying mechanism and water storage barrel, circulated water-cooled radiating is carried out to semiconductor chilling plate hot junction, water-cooled effect is preferable, hot-side temperature can effectively be reduced, the radiating efficiency of refrigeration mechanism is improved, so as to improve the refrigerating efficiency of refrigeration mechanism.
Description
Technical field
The utility model is related to Refrigeration Technique, specifically a kind of circulated water-cooled heat-radiating semiconductor refrigeration system.
Background technology
Most current refrigeration plant is made up of compressor, condenser and evaporator, and pollution of its working medium to environment is destroyed,
And produce vibration and noise.Semiconductor refrigerating, as a kind of emerging Refrigeration Technique grown up, is before one kind has well
Its theoretical foundation of the refrigeration modes of scape is thermoelectric cooling.Its advantage is not need refrigerant, and compact conformation is environmentally safe,
Therefore accept and widely use.But the current semiconductor refrigeration system used can also have following defect：1st, its volume is larger, and system
Cause this higher；2nd, radiating and conduction cooling it is less efficient, refrigerating efficiency is undesirable.3rd, the power of current semiconductor refrigeration system
It is constant, it is impossible to meet the environment being continually changing.
Utility model content
The purpose of this utility model is to overcome the shortcomings of that above prior art has that there is provided a kind of simple in construction, tight
Gather and efficiency high, the circulated water-cooled heat-radiating semiconductor refrigeration system of energy-conserving and environment-protective.
In order to achieve the above object, the utility model uses following technical scheme：A kind of circulated water-cooled heat-radiating semiconductor
Refrigeration system, including power supply, water storage barrel, water pump, refrigeration mechanism and spraying mechanism, the power supply is connected with refrigeration mechanism, described
The water inlet of water pump is connected by the lower end of the first water pipe and water storage barrel, and the delivery port of the water pump passes through the second water pipe and refrigeration
One end connection of mechanism, the other end of the refrigeration mechanism is connected with spraying mechanism, and the spraying mechanism is installed on water storage barrel
Top, the discharge outlet of the spraying mechanism is communicated with the opening of water storage barrel upper end.
The refrigeration mechanism includes heat dissipation pipe, cold wind airduct, heat transfer sleeve pipe, semiconductor chilling plate and cool guiding block, described
The sleeve pipe that conducts heat is socketed with heat dissipation pipe, and heat transfer sleeve pipe, the semiconductor chilling plate are fixed in the hot junction of the semiconductor chilling plate
Cold end be connected with cool guiding block；The cold wind airduct includes cake portion and two pipe portions, cake portion parcel heat transfer sleeve pipe,
Semiconductor chilling plate and cool guiding block, the two ends of the one end in two pipe portions respectively with cake portion are connected, and the one of the heat dissipation pipe
End through be connected with the second water pipe behind the side in cake portion, the other end of the heat dissipation pipe through after the opposite side in cake portion and
Spraying mechanism is connected；The other end in two pipe portions is equipped with cold wind blower fan, and the semiconductor chilling plate is connected with power supply.
The outer wall of the heat transfer sleeve pipe is provided with multiple fixed pans, and the quantity of semiconductor chilling plate and the quantity of cool guiding block
It is equal with the quantity of fixed pan；The hot junction of each semiconductor chilling plate is individually fixed in corresponding fixed pan, and each is led
Cold piece be fixed on corresponding semiconductor chilling plate cold end.
Axis uniform circular distribution of the fixed pan around heat transfer sleeve pipe.
The heat transfer sleeve pipe is made of copper or aluminium alloy.The internal diameter and the external diameter phase of heat dissipation pipe of the heat transfer sleeve pipe
Deng.
The spraying mechanism includes connecting tube and spray head, and the spray head is connected by connecting tube with heat dissipation pipe, institute
State opening of the discharge outlet of spray head just to water storage barrel upper end.
The heat dissipation pipe and cold wind airduct are vertically arranged.
First water pipe is provided with the first valve, and second water pipe is provided with the second valve.
Second water pipe is provided with least two angle sections.
The utility model has the following advantages relative to prior art：
1st, this circulated water-cooled heat-radiating semiconductor refrigeration system it is main by dc source, water storage barrel, water pump, refrigeration mechanism and
Spraying mechanism, it utilizes the water flow circuits of the compositions such as water pump, water pipe, refrigeration mechanism, spraying mechanism and water storage barrel, to semiconductor system
Cold hot junction carries out circulated water-cooled radiating, and water-cooled effect preferably, can effectively reduce hot-side temperature, improve the radiating of refrigeration mechanism
Efficiency, so as to improve the refrigerating efficiency of refrigeration mechanism.
2nd, refrigeration mechanism in this circulated water-cooled heat-radiating semiconductor refrigeration system it is main by heat dissipation pipe, cold wind airduct,
Heat transfer sleeve pipe, semiconductor chilling plate and cool guiding block are constituted, and this is simple and compact for structure, and heat transfer sleeve pipe can be with multiple semiconductor refrigeratings
Piece is fixedly connected, and this realizes the maximization to space utilization, and compact conformation reduces the volume of whole system.
3rd, this circulated water-cooled heat-radiating semiconductor refrigeration system utilizes water pump, water pipe, refrigeration mechanism, spraying mechanism and retaining
Bucket etc. composition water flow circuits, then cooling water formation circulation loop, it is not necessary to continue make-up water source, reach and economize on resources, use
Easily effect.
Brief description of the drawings
Fig. 1 is the structured flowchart of circulated water-cooled heat-radiating semiconductor refrigeration system of the present utility model.
Fig. 2 is the structural representation of circulated water-cooled heat-radiating semiconductor refrigeration system of the present utility model.
Fig. 3 is the structural representation of refrigeration mechanism of the present utility model.
Fig. 4 is the internal structure schematic diagram of refrigeration mechanism of the present utility model.
Fig. 5 is the structural representation of heat transfer sleeve pipe of the present utility model.
Embodiment
For ease of it will be appreciated by those skilled in the art that below in conjunction with the accompanying drawings and embodiment makees further detailed to the utility model
Describe in detail bright.
As depicted in figs. 1 and 2, this circulated water-cooled heat-radiating semiconductor refrigeration system, including power supply 1, water storage barrel 2, water pump
3rd, refrigeration mechanism 4 and spraying mechanism 5, the power supply 1 are connected with refrigeration mechanism 4, and the water inlet of the water pump 3 passes through the first water pipe
6 are connected with the lower end of water storage barrel 2, and the delivery port of the water pump 3 is connected by the second water pipe 7 with one end of refrigeration mechanism 4, described
The other end of refrigeration mechanism 4 is connected with spraying mechanism 5, and the spraying mechanism 5 is installed on the top of water storage barrel 2, the spray thrower
The discharge outlet of structure 5 is communicated with the opening of the upper end of water storage barrel 2.
In real work, water pump 3, water pipe (i.e. the first water pipe 6 and the second water pipe 7), refrigeration mechanism 4, the and of spraying mechanism 5
The cooling water flow circuits of the grade composition of water storage barrel 2, that is, first pass through water pump 3 and be fed to refrigeration mechanism 4 from the withdrawing moisture of water storage barrel 2, this
Moisture absorbs the heat that semiconductor chilling plate 404 is produced when entering the heat dissipation pipe 401 of refrigeration mechanism 4, then absorb heat
Water sprays lower water storage barrel 2 by spraying mechanism 5 again, during moisture content sprays from spraying mechanism 5 and falls on water storage barrel 2, moisture
Temperature quickly descend Wen Houzai to fall back to water storage barrel 2, these moisture for returning to water storage barrel 2 can be again used as cooling water, you can
Refrigeration mechanism 4 is sent to by the extraction of water pump 3 again and absorbs heat.This cooling water formation circulation loop, it is not necessary to continue make-up water source,
Reach and economize on resources, effect easy to use.Further to improve the cooling effect of water, water storage barrel 2 is provided with cooling tower, and this is cold
But tower directly can be bought in market.And refrigeration mechanism 4 is by water-cooling, this improves the radiating effect of refrigeration mechanism 4, to protect
Demonstrate,proving refrigeration mechanism 4 has good refrigeration.
As shown in Figure 3 and Figure 4, the refrigeration mechanism 4 include heat dissipation pipe 401, cold wind airduct 402, heat transfer sleeve pipe 403,
Semiconductor chilling plate 404 and cool guiding block 405, the heat transfer sleeve pipe 403 are socketed with heat dissipation pipe 401, the semiconductor chilling plate
Heat transfer sleeve pipe 403 is fixed in 404 hot junction, and the cold end of the semiconductor chilling plate 404 is connected with cool guiding block 405；The cold wind
Airduct 402 includes cake portion 4021 and two pipe portions 4022, the parcel of the cake portion 4021 heat transfer sleeve pipe 403, semiconductor system
Cold 404 and cool guiding block 405, the two ends of the one end in two pipe portions 4022 respectively with cake portion 4021 are connected, the water of radiation
One end of pipe 401 is connected after passing through the side in cake portion 4021 with the second water pipe 7, and the other end of the heat dissipation pipe 401 is passed through
It is connected after the opposite side in cake portion 4021 with spraying mechanism 5；The other end in two pipe portions 4022 is equipped with cold wind blower fan 8, institute
Semiconductor chilling plate 404 is stated to be connected with power supply 1.Simple in construction, the convenient installation and maintenance of this refrigeration mechanism 4.Wherein, cold wind wind
Pipe 402 has cake portion 4021 and pipe portion 4022, then cold wind blower fan 8 is advertised the gas of entrance and can formed in the cake portion 4021
Circulation, further to improve the refrigeration radiating effect of refrigeration mechanism 4.
As shown in figure 5, the outer wall of the heat transfer sleeve pipe 403 is provided with multiple fixed pans 9, and semiconductor chilling plate 404
Quantity and the quantity of cool guiding block 405 are equal with the quantity of fixed pan 9；The hot junction of each semiconductor chilling plate 404 is solid respectively
Due to corresponding fixed pan 9, each cool guiding block 405 is fixed on the cold end of corresponding semiconductor chilling plate 404.Fixed pan 9
The contact area between heat transfer sleeve pipe 403 and semiconductor chilling plate 404 can be increased, further to improve semiconductor chilling plate 404
The heat that hot junction is produced is delivered in the water of heat dissipation pipe 401 by the sleeve pipe 403 that conducts heat, therefore improves the radiating of refrigeration mechanism 4
Effect.In the present embodiment, the quantity of fixed pan is 6, axis uniform circular point of this 6 fixed pans around heat transfer sleeve pipe
Cloth.And the quantity of fixed pan is not limited only to 6, it can be also 5,8,12 etc., increase and decrease quantity with the change according to environment, with most
The adaptation load variations of limits.
The heat transfer sleeve pipe 403 is made of copper or aluminium alloy.The material of heat transfer sleeve pipe 403 is not limited only to copper or aluminium is closed
Gold, the metal material can also using other with Thermal conductivity.The heat transfer jacket being made of the material of good heat transfer effect
Pipe, further to improve the radiating effect of refrigeration mechanism.
The internal diameter of the heat transfer sleeve pipe 403 is equal with the external diameter of heat dissipation pipe 401.This ensures the inwall of heat transfer sleeve pipe 403
Fully contacted between the outer wall of heat dissipation pipe 401, to ensure heat transfer efficiency, further improve the radiating effect of refrigeration mechanism.
The spraying mechanism 5 includes connecting tube 501 and spray head 502, and the spray head 502 is by connecting tube 501 with dissipating
Hot-water line 401 is connected, the opening of the discharge outlet of the spray head 502 just to the upper end of water storage barrel 2.This is simple in construction, installation side
Just.Absorbing can be by natural air cooled, to reduce these moisture when the water of heat is sprayed onto water storage barrel 2 by spray head 502
Temperature, to reach the effect of energy-conserving and environment-protective.
The heat dissipation pipe 401 and cold wind airduct 402 are vertically arranged.This is compact to design, and ensures the circle of cold wind airduct 402
Gas circulating in cake portion 4021 is fully contacted with cool guiding block, improves the refrigeration of refrigeration mechanism 4.
First water pipe 6 is provided with the first valve 10, and second water pipe 7 is provided with the second valve 11.Valve (i.e. the first valve
The valve 11 of door 10 and second) it can effectively control the flow velocity of current, it is ensured that the radiating effect of refrigeration mechanism 4.
Second water pipe 7 is provided with least two angle sections 12.Angle section 12 can slow down the flow velocity of current, moisture is filled
Divide the heat for absorbing and being passed over from heat transfer sleeve pipe 403, further increase the effect of water-cooling.
In practice, semiconductor refrigerating in refrigerating plant in the circulated water-cooled heat-radiating semiconductor refrigeration system of the present embodiment
The number of piece is 6, and single semiconductor chilling plate rated power is 93W, the hot junction of semiconductor chilling plate and consolidating for heat transfer sleeve pipe
The face of allocating is affixed, and cold end and the cool guiding block of semiconductor chilling plate are affixed.In addition, being more preferable heat conduction, conduction cooling, semiconductor chilling plate
Hot junction and conduct heat sleeve pipe composition surface between and the cold end of semiconductor chilling plate and the composition surface of cool guiding block between be equipped with heat-conducting glue；
The actual power of power supply in the present embodiment is 600W dc source, is connected to 6 semiconductor chilling plates.During work, direct current
Power source semiconductor cooling piece provides 9.3V voltages.6 semiconductor chilling plate hot junctions are adjacent to the fixed pan of heat transfer sleeve pipe, cooling water
It is to absorb the heat that heat transfer sleeve pipe is passed over to flow through heat dissipation pipe.Semiconductor chilling plate cold end conducts cold by cool guiding block,
There is the groove ripple of three-dimensional on the fin of cool guiding block, the air-flow that fan is advertised is horizontal to plunder conduction cooling fin both sides, can improve air-flow rapid
Mobility.
Above-mentioned embodiment is preferred embodiment of the present utility model, and the utility model can not be defined,
Other any changes made without departing from the technical solution of the utility model or other equivalent substitute modes, are included in
Within protection domain of the present utility model.
Claims (10)
1. a kind of circulated water-cooled heat-radiating semiconductor refrigeration system, it is characterised in that：Including power supply, water storage barrel, water pump, refrigeration machine
Structure and spraying mechanism, the power supply are connected with refrigeration mechanism, and the water inlet of the water pump passes through under the first water pipe and water storage barrel
End connection, the delivery port of the water pump is connected by one end of the second water pipe and refrigeration mechanism, the other end of the refrigeration mechanism
It is connected with spraying mechanism, the spraying mechanism is installed on the top of water storage barrel, the discharge outlet and water storage barrel of the spraying mechanism
The opening of upper end is communicated.
2. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 1, it is characterised in that：The refrigeration mechanism
Including heat dissipation pipe, cold wind airduct, heat transfer sleeve pipe, semiconductor chilling plate and cool guiding block, the heat transfer sleeve pipe and water of radiation pipe sleeve
Connect, heat transfer sleeve pipe is fixed in the hot junction of the semiconductor chilling plate, and the cold end of the semiconductor chilling plate is connected with cool guiding block；Institute
Stating cold wind airduct includes cake portion and two pipe portions, and heat transfer sleeve pipe, semiconductor chilling plate and cool guiding block wrap up in the cake portion,
Two ends of the one end in two pipe portions respectively with cake portion are connected, one end of the heat dissipation pipe through behind the side in cake portion with
Second water pipe is connected, and the other end of the heat dissipation pipe is connected after passing through the opposite side in cake portion with spraying mechanism；Two pipes
The other end in portion is equipped with cold wind blower fan, and the semiconductor chilling plate is connected with power supply.
3. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 2, it is characterised in that：The heat transfer sleeve pipe
Outer wall be provided with multiple fixed pans, and the quantity phase of the quantity of semiconductor chilling plate and the quantity of cool guiding block with fixed pan
Deng；The hot junction of each semiconductor chilling plate is individually fixed in corresponding fixed pan, and each cool guiding block is fixed on partly leads accordingly
The cold end of body cooling piece.
4. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 3, it is characterised in that：The fixed pan
Around the axis uniform circular distribution of heat transfer sleeve pipe.
5. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 2, it is characterised in that：The heat transfer sleeve pipe
It is made of copper or aluminium alloy.
6. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 2, it is characterised in that：The heat transfer sleeve pipe
Internal diameter it is equal with the external diameter of heat dissipation pipe.
7. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 2, it is characterised in that：The spraying mechanism
Including connecting tube and spray head, the spray head is connected by connecting tube with heat dissipation pipe, and the discharge outlet of the spray head is just
To the opening of water storage barrel upper end.
8. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 2, it is characterised in that：The heat dissipation pipe
It is vertically arranged with cold wind airduct.
9. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 1, it is characterised in that：First water pipe
Provided with the first valve, second water pipe is provided with the second valve.
10. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 1, it is characterised in that：Second water
Pipe is provided with least two angle sections.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621441852.5U CN206420184U (en) | 2016-12-26 | 2016-12-26 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621441852.5U CN206420184U (en) | 2016-12-26 | 2016-12-26 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
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| Publication Number | Publication Date |
|---|---|
| CN206420184U true CN206420184U (en) | 2017-08-18 |
Family
ID=59576171
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621441852.5U Expired - Fee Related CN206420184U (en) | 2016-12-26 | 2016-12-26 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
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| Country | Link |
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| CN (1) | CN206420184U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106766346A (en) * | 2016-12-26 | 2017-05-31 | 华南理工大学 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
| CN111413133A (en) * | 2020-04-20 | 2020-07-14 | 华中科技大学 | Freezing slicer |
-
2016
- 2016-12-26 CN CN201621441852.5U patent/CN206420184U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106766346A (en) * | 2016-12-26 | 2017-05-31 | 华南理工大学 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
| CN106766346B (en) * | 2016-12-26 | 2022-09-20 | 华南理工大学 | Circulating water-cooled heat dissipation semiconductor refrigerating system |
| CN111413133A (en) * | 2020-04-20 | 2020-07-14 | 华中科技大学 | Freezing slicer |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170818 Termination date: 20191226 |