CN208888754U - A kind of server chips liquid cooling heat radiation system - Google Patents
A kind of server chips liquid cooling heat radiation system Download PDFInfo
- Publication number
- CN208888754U CN208888754U CN201821978193.8U CN201821978193U CN208888754U CN 208888754 U CN208888754 U CN 208888754U CN 201821978193 U CN201821978193 U CN 201821978193U CN 208888754 U CN208888754 U CN 208888754U
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- Prior art keywords
- liquid cooling
- liquid
- cooling pipeline
- server
- circulation device
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- 239000007788 liquid Substances 0.000 title claims abstract description 84
- 238000001816 cooling Methods 0.000 title claims abstract description 65
- 230000005855 radiation Effects 0.000 title claims abstract description 11
- 239000002826 coolant Substances 0.000 claims abstract description 17
- 239000000110 cooling liquid Substances 0.000 claims abstract description 8
- 239000006185 dispersion Substances 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000012809 cooling fluid Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 206010037660 Pyrexia Diseases 0.000 abstract description 5
- 239000000428 dust Substances 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of server chips liquid cooling heat radiation system, including temperature reduction circulation device, liquid cooling pipeline, server chips, the temperature reduction circulation device connects server chips by liquid cooling pipeline；The temperature reduction circulation device includes liquid pump, and the liquid pump connects liquid cooling pipeline；There are many chip of the various fevers of present server, individually can no longer meet the euthermic chip of each position using wind-cooling heat dissipating, and a liquid cooling pipeline is the heat dissipation of one or several euthermic chips.Coolant flow is driven by liquid pump, consumed energy plays the role of energy-efficient unlike fan height.The temperature reduction circulation device is connected with multiple liquid cooling pipelines, and each liquid cooling pipeline is all connected with a liquid pump.Each chip the degree of heat is different, the liquid pump working strength of corresponding liquid cooling pipeline connection can be adjusted according to chip temperature signal, and then change the cooling liquid speed in liquid cooling pipeline, and it can achieve the accurate temperature for adjusting corresponding chip, it is more advantageous than air-cooled orientation cooling.
Description
Technical field
The utility model relates to server refrigerating field, specifically a kind of server chips liquid cooling heat radiation system.
Background technique
With the progress of information technology, requirement of the people for server is higher and higher, then possessed by various chips
Function is also stronger and stronger, and the powerful increase for meaning power consumption of function also means that the increase of calorific value.Heat dissipation is set
Meter work is the challenge of a Xiang Geng great.Current server radiating field, air-cooled radiator generally towards large volume, go back by more heat pipes
There is the direction of excess weight to develop, this brings big inconvenience to radiator and actual use and installation maintenance aspect, while
Very big test is brought to the load-bearing pressure energy power of cabinet accessory.In view of the difficulty that the above-mentioned air-cooled epoch occur, liquid cooling just body
The big advantage of specific heat small in size is revealed.
Summary of the invention
The utility model is exactly that it is scattered to provide a kind of server chips liquid cooling in order to solve deficiencies of the prior art
There are many chip of hot systems, the various fevers of present server, individually can no longer meet each position using wind-cooling heat dissipating
Euthermic chip, a liquid cooling pipeline are the heat dissipation of one or several euthermic chips.Coolant flow is driven by liquid pump, it is consumed
Energy plays the role of energy-efficient unlike fan height.
The technical solution adopted by the utility model to solve its technical problems is that:
A kind of server chips liquid cooling heat radiation system, including temperature reduction circulation device, liquid cooling pipeline, server chips, it is described
Temperature reduction circulation device by liquid cooling pipeline connect server chips；The temperature reduction circulation device includes liquid pump, the liquid
Pump connection liquid cooling pipeline；
There are many chip of the various fevers of present server, individually can no longer meet each position using wind-cooling heat dissipating
Euthermic chip, a liquid cooling pipeline are the heat dissipation of one or several euthermic chips.Coolant flow is driven by liquid pump, it is consumed
Energy plays the role of energy-efficient unlike fan height.
The temperature reduction circulation device is connected with multiple liquid cooling pipelines, and each liquid cooling pipeline is all connected with a liquid pump.
Each chip the degree of heat is different, and the liquid pump of corresponding liquid cooling pipeline connection can be adjusted according to chip temperature signal
Working strength, and then change the cooling liquid speed in liquid cooling pipeline, it can achieve the accurate temperature for adjusting corresponding chip, than air-cooled
Orientation cooling it is more advantageous.
The liquid cooling pipeline further includes that coolant liquid is guided to flow to the cooling liquid tube of cooler, guidance high temperature from temperature reduction circulation device
Coolant liquid is flowed to the hydrothermal solution pipe of temperature reduction circulation device by cooler, is connected to the connecting tube of cooler.
The temperature reduction circulation device connection reduces the refrigerating plant of water temperature.Refrigerating plant can be fluorine cool equipment or air-cooled
Recycle unit.
The heavier temperature reduction circulation device of whole system can be similar to outdoor machine of air-conditioner, is mounted on outside server, in inside
It only needs some pipelines to arrange, does not need to divulge information, so will not introduce dirt into server, and flow to cooling and follow
High temperature coolant in loop device can carry out heat exchange with environment, can reduce energy consumption, and substantially reduce in server
Portion's dust bring is dangerous.
The liquid cooling pipeline includes cooler, and cooler is bonded with euthermic chip, and dispersion is equipped in the cooler
The flow distribution plate of liquid cooling fluid.
The flow distribution plate is multiple arcs partition, and multiple flow distribution plates form the water stream channel of dispersion.Arc-shaped partition can incite somebody to action
Coolant liquid dispersion, carries out heat exchange with euthermic chip in cooler to greatest extent, substantially increases the speed of heat exchange.
The beneficial effects of the utility model are:
1, there are many chip of the various fevers of present server, individually can no longer meet each position using wind-cooling heat dissipating
Euthermic chip, a liquid cooling pipeline be one or several euthermic chips heat dissipation.Coolant flow is driven by liquid pump, is consumed
Energy unlike fan height, play the role of energy-efficient.
2, each chip the degree of heat is different, and the liquid of corresponding liquid cooling pipeline connection can be adjusted according to chip temperature signal
Pump work intensity, and then change the cooling liquid speed in liquid cooling pipeline, it can achieve the accurate temperature for adjusting corresponding chip, compare wind
Cold orientation cooling is more advantageous.
3, the heavier temperature reduction circulation device of whole system can be similar to outdoor machine of air-conditioner, is mounted on outside server, inside
Portion only needs some pipelines to arrange, does not need to divulge information, so will not introduce dirt into server, and flows to cooling
High temperature coolant in circulator can carry out heat exchange with environment, can reduce energy consumption, and substantially reduce server
Internal dust bring is dangerous.
4, arc-shaped partition can disperse coolant liquid, carry out heat exchange with euthermic chip in cooler to greatest extent,
Substantially increase the speed of heat exchange.
Detailed description of the invention
Fig. 1 is the utility model and assembled view；
Fig. 2 is the utility model cooler interior views.
In figure: 1- temperature reduction circulation device, 2- liquid cooling pipeline, 3- server chips, 21- cooling liquid tube, 22- hydrothermal solution pipe, 23- connect
Adapter tube, 24- cooler, 25- flow distribution plate.
Specific embodiment
The utility model in order to better understand explains in detail the specific embodiment party of the utility model with reference to the accompanying drawing
Formula.
A kind of server chips liquid cooling heat radiation system, including temperature reduction circulation device 1, liquid cooling pipeline 2, server chips 3, institute
The temperature reduction circulation device 1 stated connects server chips 3 by liquid cooling pipeline 2；The temperature reduction circulation device 1 includes liquid pump, institute
The liquid pump connection liquid cooling pipeline 2 stated；
There are many chip of the various fevers of present server, individually can no longer meet each position using wind-cooling heat dissipating
Euthermic chip, a liquid cooling pipeline 2 are the heat dissipation of one or several euthermic chips.Coolant flow is driven by liquid pump, is consumed
Energy unlike fan height, play the role of energy-efficient.
The temperature reduction circulation device 1 is connected with multiple liquid cooling pipelines 2, and each liquid cooling pipeline 2 is all connected with a liquid pump.
Each chip the degree of heat is different, and the liquid pump of corresponding liquid cooling pipeline connection can be adjusted according to chip temperature signal
Working strength, and then change the cooling liquid speed in liquid cooling pipeline 2, it can achieve the accurate temperature for adjusting corresponding chip, compare wind
Cold orientation cooling is more advantageous.
The liquid cooling pipeline 2 further includes that coolant liquid is guided to flow to the cooling liquid tube 21 of cooler 24 from temperature reduction circulation device 1, draw
It leads high temperature coolant and the hydrothermal solution pipe 22 of temperature reduction circulation device 1, the connecting tube 23 of connection cooler 24 is flowed to by cooler 24.Connection
Pipe 23 is for cooler 24 of connecting, and this cooler 24 is on the less chip of calorific value.
The connection of temperature reduction circulation device 1 reduces the refrigerating plant of water temperature.Refrigerating plant can be fluorine cool equipment or wind
SAPMAC method equipment.
The heavier temperature reduction circulation device 1 of whole system can be similar to outdoor machine of air-conditioner, is mounted on outside server, in inside
It only needs some pipelines to arrange, does not need to divulge information, so will not introduce dirt into server, and flow to cooling and follow
High temperature coolant in loop device 1 can carry out heat exchange with environment, can reduce energy consumption, and substantially reduce in server
Portion's dust bring is dangerous.
The liquid cooling pipeline includes cooler 24, and cooler 24 is bonded with euthermic chip, is set in the cooler 24
There is the flow distribution plate 25 of dispersion liquid cooling fluid.
The flow distribution plate 25 is multiple arcs partition, and multiple flow distribution plates 25 form the water stream channel of dispersion.Arc-shaped partition can
To disperse coolant liquid, heat exchange is carried out with euthermic chip in cooler to greatest extent, substantially increases the speed of heat exchange
Degree.
Above-described embodiment is the preferable embodiment of the utility model, but the embodiments of the present invention is not by above-mentioned
The limitation of embodiment, it is made under other any spiritual essence and principles without departing from the utility model to change, modify, replacing
In generation, simplifies combination, should be equivalent substitute mode, is included within the protection scope of the utility model.
Claims (5)
1. a kind of server chips liquid cooling heat radiation system, which is characterized in that including temperature reduction circulation device, liquid cooling pipeline, server
Chip, the temperature reduction circulation device connect server chips by liquid cooling pipeline；
The temperature reduction circulation device includes liquid pump, and the liquid pump connects liquid cooling pipeline；
The liquid cooling pipeline includes cooler, and the flow distribution plate of dispersion liquid cooling fluid is equipped in the cooler.
2. a kind of server chips liquid cooling heat radiation system according to claim 1, which is characterized in that the down cycles dress
It sets and is connected with multiple liquid cooling pipelines, each liquid cooling pipeline is all connected with a liquid pump.
3. a kind of server chips liquid cooling heat radiation system according to claim 2, which is characterized in that the liquid cooling pipeline is also
The cooling liquid tube of cooler is flowed to from temperature reduction circulation device including guidance coolant liquid, guidance high temperature coolant is flowed to by cooler and cooled down
The hydrothermal solution pipe of circulator, the connecting tube for being connected to cooler.
4. a kind of server chips liquid cooling heat radiation system according to claim 1, which is characterized in that the down cycles dress
Setting connection reduces the refrigerating plant of water temperature.
5. a kind of server chips liquid cooling heat radiation system according to claim 1, which is characterized in that the flow distribution plate is more
A arc-shaped partition, multiple flow distribution plates form the water stream channel of dispersion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821978193.8U CN208888754U (en) | 2018-11-28 | 2018-11-28 | A kind of server chips liquid cooling heat radiation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821978193.8U CN208888754U (en) | 2018-11-28 | 2018-11-28 | A kind of server chips liquid cooling heat radiation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208888754U true CN208888754U (en) | 2019-05-21 |
Family
ID=66518656
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821978193.8U Active CN208888754U (en) | 2018-11-28 | 2018-11-28 | A kind of server chips liquid cooling heat radiation system |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211936A (en) * | 2019-06-17 | 2019-09-06 | 张礼 | A kind of integrated circuit water cooling liquid circulation cooling framework |
| CN113031727A (en) * | 2021-02-26 | 2021-06-25 | 山东英信计算机技术有限公司 | Coupling heat dissipation control method and system for server wind-liquid integrated heat dissipation system |
| CN113157069A (en) * | 2021-02-26 | 2021-07-23 | 山东英信计算机技术有限公司 | Coupling heat dissipation control method and system for liquid cooling heat dissipation system of server |
| CN113190097A (en) * | 2021-04-01 | 2021-07-30 | 山东英信计算机技术有限公司 | Two-phase flow mixed server liquid cooling automatic temperature control system and method |
-
2018
- 2018-11-28 CN CN201821978193.8U patent/CN208888754U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211936A (en) * | 2019-06-17 | 2019-09-06 | 张礼 | A kind of integrated circuit water cooling liquid circulation cooling framework |
| CN113031727A (en) * | 2021-02-26 | 2021-06-25 | 山东英信计算机技术有限公司 | Coupling heat dissipation control method and system for server wind-liquid integrated heat dissipation system |
| CN113157069A (en) * | 2021-02-26 | 2021-07-23 | 山东英信计算机技术有限公司 | Coupling heat dissipation control method and system for liquid cooling heat dissipation system of server |
| CN113031727B (en) * | 2021-02-26 | 2022-12-02 | 山东英信计算机技术有限公司 | Coupling heat dissipation control method and system for server wind-liquid integrated heat dissipation system |
| CN113190097A (en) * | 2021-04-01 | 2021-07-30 | 山东英信计算机技术有限公司 | Two-phase flow mixed server liquid cooling automatic temperature control system and method |
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