CN112229090A - System for cooling circulating water based on semiconductor refrigeration technology - Google Patents
System for cooling circulating water based on semiconductor refrigeration technology Download PDFInfo
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- CN112229090A CN112229090A CN202011190244.2A CN202011190244A CN112229090A CN 112229090 A CN112229090 A CN 112229090A CN 202011190244 A CN202011190244 A CN 202011190244A CN 112229090 A CN112229090 A CN 112229090A
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- water
- cooling
- circulating water
- semiconductor refrigeration
- semiconductor
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
Abstract
The invention relates to the technical field of semiconductor refrigeration temperature control, in particular to a system for cooling circulating water based on a semiconductor refrigeration technology, which comprises: the device comprises a water cooling plate, a semiconductor refrigerating device and a power module; wherein, the water-cooling board passes through the fixed bolster setting inside the box, and semiconductor refrigerating plant sets up on the lateral wall of water-cooling board one end, power module sets up at the fixed bolster, and with semiconductor refrigerating plant control connection. The device utilizes the difference in temperature that the semiconductor refrigeration piece produced to cool down the inside circulating water of aluminium water-cooling board for the circulating water cooling of anti-oxidation coating spraying equipment of steel billet, the coating preparation jar that can stabilize spraying equipment is within suitable temperature range, and the anti-oxidation coating on guarantee steel billet surface is complete orderly, reduces the oxidation scaling loss of steel billet in the smelting process, thereby has satisfied steel smelting process demand.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration temperature control, in particular to a system for cooling circulating water based on a semiconductor refrigeration technology.
Background
The cast steel billet needs to be heated by a heating furnace and then rolled, the heating temperature is more than 1100 ℃, the heating time is more than 2 hours, the steel billet is easy to generate oxidation burning loss in the heating furnace, the burning loss rate is 0.5-1.5%, the burning loss of the steel billet not only affects the yield of the product, but also affects the surface quality of the product, and therefore, a layer of anti-oxidation coating needs to be sprayed on the cast steel billet.
The requirement of the anti-oxidation coating on the environmental temperature is high, and when the temperature is too high, the sprayed anti-oxidation coating cannot form a complete and continuous coating on the surface of the billet. The spraying equipment of the anti-oxidation coating is in a high working environment temperature, so circulating water is needed to cool the surface of the spraying equipment so as to ensure that the internal temperature of the coating preparation tank of the spraying equipment is within a proper temperature range. In the summer season, the temperature of the workshop environment is very high, the initial temperature of the circulating water is high, and the cooling effect is poor.
Based on semiconductor refrigeration, circulating water of the billet anti-oxidation coating spraying equipment is cooled, a coating preparation tank of the spraying equipment can be stabilized within a proper temperature range, the anti-oxidation coating on the surface of a billet is ensured to be complete and orderly, and the oxidation burning loss of the billet in the smelting process is reduced, so that the steel smelting process requirement is met.
Disclosure of Invention
The invention aims to provide a device for cooling circulating water based on a semiconductor refrigeration technology, which is used for cooling the circulating water of billet anti-oxidation coating spraying equipment, can stabilize a coating preparation tank of the spraying equipment within a proper temperature range, ensure the completeness and the order of an anti-oxidation coating on the surface of a billet, and reduce the oxidation burning loss of the billet in the smelting process, thereby meeting the requirements of the steel smelting process.
In order to achieve the purpose, the technical scheme of the invention is as follows: a system for cooling circulating water based on semiconductor refrigeration technology, the system comprising:
the water cooling plate is used for carrying out heat exchange on circulating water flowing through the water cooling plate, reducing the temperature of the circulating water and guiding out heat;
the semiconductor refrigerating device is used for absorbing the heat led out by the water cooling plate and cooling the water cooling plate;
a power module; the power supply is used for supplying power to the semiconductor refrigerating device;
the water cooling plate is arranged inside the box body through the fixing support, the semiconductor refrigerating device is arranged on the side wall of one end of the water cooling plate, and the power supply module is arranged on the fixing support and is in control connection with the semiconductor refrigerating device.
Furthermore, two ends of the box body are respectively provided with a portable detachable door plate, the door plate is provided with an air suction opening, the side surfaces of the box body are respectively provided with a louver grid,
the top of box is equipped with inlet tube and outlet pipe, all inlet tubes and outlet pipe with the water-cooling board is connected.
Further, the water cooling plate comprises a main body, a water circulation loop and a fin structure;
the water cooling plate comprises a main body, a water circulation loop and a fin structure;
the water circulation loop is arranged in the main body, and the fin structures are arranged in the water circulation loop;
the water circulation loop is formed by connecting at least two U-shaped units end to end.
Furthermore, the semiconductor refrigerating device comprises a radiating fan, a hot end outer cover, radiating fins, semiconductor refrigerating fins and a cooling fin structure;
the hot end outer cover, the radiating fins, the semiconductor refrigerating fins and the cooling fins are arranged in a sequentially attaching mode, and heat-conducting silicone grease is coated between attaching surfaces;
the other end face of the cooling fin is attached to one end face of the water cooling plate, heat-conducting silicone grease is coated between the attached faces, and the cooling fan is arranged on the cooling fin.
Further, the semiconductor refrigerating device further comprises a heat insulation layer, and the heat insulation layer is arranged between the radiating fin and the cooling fin.
Further, the heat insulation layer is a heat insulation sponge mat.
Further, the water circulation loop is a copper pipe or an aluminum pipe.
Further, the system also comprises a dust cover, and the dust cover is arranged on the air suction opening.
Further, the main body is made of aluminum.
The utility model provides a circulating water supply system, circulating water cooling system includes water supply pipeline and temperature detecting element, wherein the circulating water adopts foretell system based on semiconductor refrigeration technology to make the circulating water cooling to the circulating water in the water supply pipeline.
The invention has the beneficial effects that:
(1) the invention has simple and compact structure, and can be installed and stably operated in a narrow working space;
(2) the invention has novel refrigeration principle, excellent refrigeration effect, no need of adding refrigerant, environmental protection and reliability;
(3) the invention has simple operation, high operation reliability and long service life.
Drawings
Fig. 1 is an internal structure diagram of an apparatus for cooling circulating water based on semiconductor refrigeration technology.
Fig. 2 is an external view of a device for cooling circulating water based on semiconductor refrigeration technology.
Fig. 3 is a structural view of the semiconductor refrigeration system of the present invention.
FIG. 4 is a schematic diagram of the internal structure of the water-cooling plate of the present invention.
In the figure:
the device comprises a box body 1, a fixing support 2, a water cooling plate 3, a main body 3, a water circulation loop 2, a fin structure 3, a semiconductor cooling device 4, a water inlet pipe 5, a water outlet pipe 6, a power supply module 7, a heat radiating fan 8, a hot end outer cover 9, a heat radiating fin 10, a semiconductor cooling fin 11, a cooling fin 12, a heat insulating layer 13, a dust cover 14, an air suction inlet 15, a door plate 16 and a louver grid 17.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings.
As shown in fig. 1, the present invention relates to a system for cooling circulating water based on semiconductor refrigeration technology, the system includes:
the water cooling plate 3 is used for carrying out heat exchange on circulating water flowing through the water cooling plate, reducing the temperature of the circulating water and guiding out heat;
a semiconductor refrigerating device 4 for absorbing the heat conducted out by the water cooling plate 3 and cooling the water cooling plate;
a power module 7; for supplying power to the semiconductor refrigeration device 4;
the water cooling plate 3 is arranged inside the box body 1 through the fixing support 2, the semiconductor refrigerating device 4 is arranged on the side wall of one end of the water cooling plate 3, and the power supply module 7 is arranged on the surface of the water cooling plate 3 and is in control connection with the semiconductor refrigerating device 4.
The portable detachable door plate 16 is arranged at each of two ends of the box body 1, the air suction opening 15 is formed in the door plate 16, the water inlet pipe 5 and the water outlet pipe 6 are arranged at the top of the box body 1, and the louver grids 17 are arranged on the side faces of the box body 1.
The water cooling plate 3 comprises a main body 3-1, a water circulation loop 3-2 and a fin structure 3-3;
the water circulation loop 3-2 is arranged inside the main body 3-1, and the fin structures 3-3 are arranged inside the water circulation loop 3-2;
the water circulation loop 3-2 is formed by connecting at least two U-shaped units end to end.
The semiconductor refrigerating device 4 comprises a radiating fan 8, a hot end outer cover 9, radiating fins 10, semiconductor refrigerating fins 11 and cooling fins 12;
the hot end outer cover 9, the radiating fins 10, the semiconductor refrigeration fins 11 and the cooling fins 12 are arranged on the surface of the water cooling plate 3 in a sequentially attaching mode, and the radiating fan 8 is arranged on the radiating fins 10;
between the heat dissipation fan 8 and the heat dissipation fins 10; and heat-conducting silicone grease is coated among the radiating fin 10, the semiconductor refrigerating fin 11, the cooling fin 12 and the water cooling plate 3.
The semiconductor refrigeration device 4 further comprises a heat insulation layer 13, and the heat insulation layer 13 is arranged between the heat sink 10 and the cooling fin 3.
The heat insulation layer 13 is a heat insulation sponge mat.
The water circulation loop 3-1 is made of copper.
The system further comprises a dust cover 14, wherein the dust cover 14 is arranged on the air suction opening 15.
The main body 3-1 is made of aluminum.
The utility model provides a circulating water supply system, circulating water cooling system includes water supply pipeline and temperature detecting element, wherein the circulating water adopts foretell system based on semiconductor refrigeration technology to make the circulating water cooling to the circulating water in the water supply pipeline.
Example (b):
a device for cooling circulating water based on a semiconductor refrigeration technology comprises a box body 1, an aluminum water cooling plate 3, a fixing support 2, a semiconductor refrigeration device 4, a water inlet pipe 5, a water outlet pipe 6, a power supply module 7 and a dust cover 14. The upper bottom surface of the box body 1 is provided with a water inlet copper pipe hole and a water outlet copper pipe hole for circulating water, and the left side surface and the right side surface of the box body 1 are provided with shutter grids. The front and the back of the box body 1 are preferably designed by adopting a detachable door panel 16 structure, the door panel 16 is connected with the side surface of the box body 1 through a hinge, an air suction opening 15 of a cooling fan of a refrigerating system is formed in the door panel 16, and dust covers 14 are arranged at the positions of the air suction openings 15 at the front and the back of the box body 1. The fixed support 3 is welded and fixed with the lower bottom surface of the box body 1, and the water cooling plate 3 is fixedly connected with the fixed support 2 through bolts. The power supply connection module 7 is fixed on the fixed support 2 by screws.
Referring to fig. 3, the semiconductor refrigeration device 4 includes a cooling fan 8, a hot-end housing 9, a heat sink 10, a heat insulating layer 13, a semiconductor refrigeration sheet 11, and a cooling sheet 12. The air blowing port of the cooling fan 8, the hot end outer cover 9, the cooling fin 10, the semiconductor refrigeration piece 11 and the cooling piece 12 are arranged on the surface of the water cooling plate 3 in a sequentially attaching mode. The heat insulation spongy cushion 13 is filled between the radiating fins 10 and the aluminum water cooling plate 3, meanwhile, through grooves are formed in the heat insulation layer 13, and the semiconductor refrigeration pieces 11 and the cooling pieces 12 are placed in the through grooves of the heat insulation spongy cushion. The radiating fins 10 and the water cooling plate 3 are fixed in a bolt connection mode, and the hot end outer cover 9 is fixed on the side faces of the radiating fins 10 in a bolt connection mode. The heat radiating fins 10 and the hot ends of the semiconductor refrigerating fins 11, the cold ends of the semiconductor refrigerating fins 11, the cooling fins 12 and the water cooling plate 3 are bonded by heat-conducting silicone grease. The water inlet copper pipe 5 and the water outlet copper pipe 6 are fixed on the upper bottom surface of the aluminum water cooling plate 3 in a threaded connection mode. When the device of the invention passes through a direct current power supply, a P-N junction in the refrigerating sheet of the semiconductor refrigerating sheet 11 forms a thermocouple pair to generate a Peltier effect, and the hot end and the cold end of the semiconductor refrigerating sheet 11 are formed. The heat end of the semiconductor refrigeration piece 11 continuously exchanges heat with the outside air through the radiating fin 10 and the radiating fan 8 to dissipate heat and keep a certain temperature, and the cold energy generated by the cold end of the semiconductor refrigeration piece 11 is transferred to the aluminum water cooling plate 3 through the cooling piece 12, so that the temperature of the circulating water is reduced after passing through the water cooling plate 3.
Referring to fig. 4, a water circulation loop 3-1 is arranged inside the water cooling plate 3, a fin structure 3-3 is arranged inside the water circulation loop 3-1, and the distribution position of the fin structure 3-3 depends on the distribution position of the semiconductor chilling plates 11. The fin structures 3-3 can increase the contact area between the circulating water and the water cooling plate 3, and simultaneously control the flow rate of the water circulation to realize the rapid cooling of the circulating water.
The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the invention, but all modifications and changes made by the contents of the present invention or directly used in other fields without departing from the spirit and scope of the present invention are encompassed in the claims of the present invention.
Claims (10)
1. A system for cooling circulating water based on semiconductor refrigeration technology, the system comprising:
the water cooling plate is used for carrying out heat exchange on circulating water flowing through the water cooling plate, reducing the temperature of the circulating water and guiding out heat;
the semiconductor refrigerating device is used for absorbing the heat led out by the water cooling plate and cooling the water cooling plate;
a power module; the power supply is used for supplying power to the semiconductor refrigerating device;
the water cooling plate is arranged inside the box body through the fixing support, the semiconductor refrigerating device is arranged on the side wall of one end of the water cooling plate, and the power supply module is arranged on the fixing support and is in control connection with the semiconductor refrigerating device.
2. The system of claim 1, wherein the two ends of the box body are respectively provided with a portable detachable door plate, the door plates are provided with air suction openings, the side surfaces of the box body are respectively provided with a louver grid,
the top of box is equipped with inlet tube and outlet pipe, all inlet tubes and outlet pipe with the water-cooling board is connected.
3. The system of claim 1, wherein the water cooled plate comprises a body, a water circulation loop and a fin structure;
the water circulation loop is arranged in the main body, and the fin structures are arranged in the water circulation loop;
the water circulation loop is formed by connecting at least two U-shaped units end to end.
4. The system of claim 1, wherein the semiconductor refrigeration device comprises a heat dissipation fan, a hot end housing, a heat sink, a semiconductor refrigeration fin, and a cooling fin structure;
the hot end outer cover, the radiating fins, the semiconductor refrigerating fins and the cooling fins are arranged in a sequentially attaching mode, and heat-conducting silicone grease is coated between attaching surfaces;
the other end face of the cooling fin is attached to one end face of the water cooling plate, heat-conducting silicone grease is coated between the attached faces, and the cooling fan is arranged on the cooling fin.
5. The system of claim 4, wherein the semiconductor refrigeration unit further comprises a thermal insulation layer disposed between the heat sink and the cooling fins.
6. The system of claim 5, wherein the insulating layer is an insulating foam pad.
7. The system of claim 3, wherein the water circulation loop is a copper or aluminum tube.
8. The system of claim 2, further comprising a dust cover disposed over the air suction opening.
9. The system of claim 3, wherein the body is aluminum.
10. A circulating water supply system, the circulating water cooling system comprises a water supply pipeline and a temperature detection unit, wherein the circulating water in the water supply pipeline is cooled by the system for cooling the circulating water based on the semiconductor refrigeration technology according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011190244.2A CN112229090A (en) | 2020-10-30 | 2020-10-30 | System for cooling circulating water based on semiconductor refrigeration technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011190244.2A CN112229090A (en) | 2020-10-30 | 2020-10-30 | System for cooling circulating water based on semiconductor refrigeration technology |
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| Publication Number | Publication Date |
|---|---|
| CN112229090A true CN112229090A (en) | 2021-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011190244.2A Pending CN112229090A (en) | 2020-10-30 | 2020-10-30 | System for cooling circulating water based on semiconductor refrigeration technology |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115060019A (en) * | 2022-04-14 | 2022-09-16 | 永新县博硕电子有限公司 | Cooling device for data line production and cooling method thereof |
-
2020
- 2020-10-30 CN CN202011190244.2A patent/CN112229090A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115060019A (en) * | 2022-04-14 | 2022-09-16 | 永新县博硕电子有限公司 | Cooling device for data line production and cooling method thereof |
| CN115060019B (en) * | 2022-04-14 | 2023-02-28 | 永新县博硕电子有限公司 | Cooling device for data line production and cooling method thereof |
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