CN115060019B - Cooling device for data line production and cooling method thereof - Google Patents
Cooling device for data line production and cooling method thereof Download PDFInfo
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- CN115060019B CN115060019B CN202210389698.5A CN202210389698A CN115060019B CN 115060019 B CN115060019 B CN 115060019B CN 202210389698 A CN202210389698 A CN 202210389698A CN 115060019 B CN115060019 B CN 115060019B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/40—Fluid line arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B47/00—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass
- F25B47/006—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass for preventing frost
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- General Engineering & Computer Science (AREA)
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Abstract
The invention relates to a cooling technology for data line production, which is used for solving the problems that a water-cooling circulation device is complex and occupies a large space, the refrigeration effect of a semiconductor is restricted by heat dissipation of a heating end and water circulation is blocked due to icing, and particularly relates to a cooling device for data line production and a cooling method thereof, wherein the cooling device comprises a material loading table, a welding table, a data line interface and a welding plate, and one side of the outer side wall of the material loading table is connected with the welding table; according to the invention, the cooling end and the heating end of the semiconductor refrigeration piece respectively act on the water-cooling circulation main pipe and the welding plate, so that a water-cooling circulation structure is formed, less equipment is required, the occupied space is small, the welding plate is cooled by rotating the cooling fan, the heat generated by the heating end of the semiconductor refrigeration piece can be quickly dissipated, the refrigeration effect of the cooling end is not influenced, the water-cooling circulation branch pipe is knocked by one end of the movable frame, the condition that the inside of the water-cooling circulation branch pipe is frozen is prevented, and the water circulation is blocked.
Description
Technical Field
The invention relates to a cooling technology for data line production, in particular to a cooling device for data line production and a cooling method thereof.
Background
Data lines, which are necessary components for connecting a hard disk and a motherboard, are usually sent when the motherboard is purchased, and each data line can only be connected with two IDE devices, such as an optical drive, a hard disk, a recorder and the like;
in the prior art, the cooling mode of equipment is mostly carried out by adopting a water cooling or air cooling mode, the air cooling is greatly limited by the ambient temperature, the water cooling is mostly carried out by adopting a water circulation mode in order to prevent the waste of water resources in the using process, the equipment required by the water circulation is more, the occupied space is larger, water drops appearing on the surface of a water cooling pipe in the using process fall down after being gathered, and the falling water drops fall on the surface of production equipment to absorb heat and evaporate, so that the production equipment is easily cooled unevenly; when the semiconductor refrigerating sheet is used for cooling the temperature of water flow in the water circulation system, the semiconductor refrigerating sheet is easy to quickly dissipate heat generated on the heating end, so that the refrigerating end is influenced, the refrigerating effect is poor, and the cooling effect on production equipment is adversely influenced; when the semiconductor refrigeration piece is used for water cooling operation, the water flow at the position of the water cooling circulation branch pipe is easy to condense into flocculent water flow due to lower temperature when flowing through the position of the semiconductor refrigeration piece, and flocculent ice slag is easy to condense into block after being cooled continuously, so that the circulation of ice blocks in the water cooling circulation branch pipe is blocked;
in view of the above technical problems, the present application proposes a solution.
Disclosure of Invention
The invention aims to form a water-cooling circulation structure through the action of a refrigerating end and a heating end of a semiconductor refrigerating sheet on a water-cooling circulation main pipe and a welding plate respectively, so that less equipment is needed, the occupied space is small, the welding plate is cooled through the rotation of a radiating fan, the heat generated by the refrigerating end of the semiconductor refrigerating sheet can be quickly dissipated, the refrigerating effect of the refrigerating end is not influenced, a water-cooling circulation branch pipe is knocked through one end of a movable frame, the condition that the inside of the water-cooling circulation branch pipe is frozen is prevented, the water circulation is blocked, the problems that the water-cooling circulation equipment is complex, the occupied space is large, the refrigerating effect of a semiconductor is restricted by the heat dissipation of the heating end and the water circulation is blocked due to freezing are solved, and the cooling device and the cooling method for data line production are provided.
The purpose of the invention can be realized by the following technical scheme:
the utility model provides a heat sink and cooling method for data line production, includes and carries material platform, welding bench, data line interface and welded plate, it is connected with the welding bench to carry material platform lateral wall one side, it is connected with the data line interface to carry the inside lower surface of material platform, the welding bench upper surface corresponds data line interface position department is equipped with the welded plate, welded plate lateral wall one side is connected with the semiconductor refrigeration piece, the semiconductor refrigeration piece lateral wall is kept away from one side of welded plate is connected with water-cooling circulation house steward, water-cooling circulation house steward keeps away from the one end integrated into one piece of welded plate has a plurality of water-cooling circulation branch pipe, water-cooling circulation branch pipe lateral wall is connected with a plurality of evenly distributed's fin, a plurality of the fin lower surface all is connected with pastes the board, water-cooling circulation house steward lateral wall is connected with the conveying water pump, one side that water-cooling circulation house steward lateral wall is close to the conveying water pump is connected with the storage water tank, water-cooling circulation branch pipe lateral wall is close to fin position department is provided with air cooling mechanism.
According to a preferred embodiment of the invention, the air cooling mechanism comprises a first transmission case, the lower surface inside the first transmission case is rotatably connected with a propeller blade through a support frame at a position corresponding to the water-cooling circulation branch pipe, a connecting rotating wheel is rotatably connected above the inner side wall of the first transmission case through a rotating shaft, the outer side wall of the connecting rotating wheel is connected with a transmission belt, one end of the connecting rotating wheel, which is connected with the rotating shaft, is connected with an air-cooling fan blade, the outer side wall of the first transmission case is connected with an air cooling pipe at a position corresponding to the air-cooling fan blade, and the outer side wall of the air cooling pipe is provided with a plurality of air suction ports which are uniformly distributed.
As a preferred embodiment of the invention, one end of the air cooling pipe, which is far away from the first transmission case, is connected with a hose, the outer side wall of the hose is provided with a plurality of uniformly distributed vent holes, the outer side wall of the hose is provided with a connecting support ring at fixed intervals, and one side of the outer side wall of the welding plate, which is close to the water-cooling circulation header pipe, is provided with a heat dissipation mechanism.
As a preferred embodiment of the present invention, the heat dissipation mechanism includes a limiting frame, one side of the outer side wall of the limiting frame is connected to a second transmission box through a connecting plate, one side of the outer side wall of the second transmission box is rotatably connected to a driving gear through a rotating shaft, a position of the outer side wall of the second transmission box, which is close to the driving gear, is rotatably connected to a transmission gear through a rotating shaft, one end of the transmission gear, which is connected to the rotating shaft, is connected to a transmission runner, and a position of the upper surface of the second transmission box, which corresponds to the transmission runner, is connected to a heat dissipation fan.
As a preferred embodiment of the present invention, one side of the outer side wall of the heat dissipation fan, which is far away from the second transmission case, is connected with an air suction pipe, the outer side wall of the air suction pipe is connected with a dust filtration case, a plurality of activated carbon plates which are uniformly distributed are connected inside the dust filtration case, and an anti-blocking mechanism is arranged at a position of the outer side wall of the limiting frame, which corresponds to the water-cooling circulation main pipe.
As a preferred embodiment of the invention, the anti-blocking mechanism comprises an extrusion opening, the outer side wall of the limiting frame is connected with a plurality of uniformly distributed supporting frames at positions corresponding to the extrusion opening, the middle position of the outer side wall of the supporting frame is rotatably connected with a reciprocating lead screw, one end of the reciprocating lead screw, which is far away from the supporting frame, is connected with a linkage rotating wheel, the outer side wall of the reciprocating lead screw is connected with a movable frame, and the outer side wall of the supporting frame is provided with a jack at a position corresponding to the movable frame.
As a preferred embodiment of the present invention, a cooling method of a cooling device includes the steps of:
the method comprises the following steps: the heating end of the semiconductor refrigeration piece is connected to the outer side wall of the welding plate, the water-cooling circulation main pipe is attached to the refrigeration end of the semiconductor refrigeration piece under the extrusion action of the limiting frame, water flow inside a water storage tank connected with the water-cooling circulation main pipe is continuously conveyed into the water-cooling circulation main pipe under the action of a conveying water pump, the water flow flows into the water-cooling circulation main pipe from one end of the water-cooling circulation main pipe to the inside of the water-cooling circulation branch pipe and then flows into the other end of the water-cooling circulation main pipe from the other end of the water-cooling circulation branch pipe to achieve the effect of water circulation, the heating end of the semiconductor refrigeration piece heats the welding plate, so that the welding plate can be subjected to tin soldering operation, the refrigeration end of the semiconductor refrigeration piece can cool the water flow flowing through the position of the semiconductor piece in the water-cooling circulation main pipe, and the cooled water flow can flow to the position of the water-cooling circulation branch pipe to cool all parts of the data line production equipment;
step two: the radiating fins which are uniformly distributed and connected with the outer side wall of the water-cooling circulation branch pipe are connected together through the adhesive plate, the adhesive plate can adhere the radiating fins on the surface of a position, which needs to be cooled, of the data line production equipment, so that heat generated by the production equipment during working is transmitted to the radiating fins and then absorbed by cooling water flow passing through the water-cooling circulation main pipe to achieve the effect of cooling, the water flow in the water-cooling circulation branch pipe drives the propeller blades in the first transmission box to rotate in the high-speed flowing process, the driving rotating wheel on the propeller blade connecting shaft is connected with the connecting rotating wheel through a driving belt, so that the propeller blade can drive the air cooling fan blade coaxial with the connecting rotating wheel to rotate in the rotating process, the air cooling fan blade accelerates the external air adsorbed from the position of an air suction opening and then transmits the air along the hose in the rotating process, the other end of the hose is of a blocking structure, the air flow can only flow out from the position of the air vent on the hose, and the flowing air flow can take away part of heat of the radiating fins, so that the effect of cooling the radiating fins is achieved;
step three: the structure of the inside of the second transmission box is the same as that of the first transmission box, so that water flow in the water-cooling circulation header pipe can drive a driving gear connected to the second transmission box to rotate in the circulating process, the driving gear and the transmission gear are perpendicular to each other and are mutually embedded, a transmission rotating wheel coaxial with the transmission gear is mutually transmitted with a transmission rotating wheel on a transmission shaft of a heat dissipation fan through a transmission belt, the heat dissipation fan rotates to accelerate the flow of air flow, the accelerated air flow is blown to the position of the welding plate, the heat dissipation of the welding plate is accelerated, and the heat generated at the heating end of the semiconductor refrigerating piece can be continuously transmitted to the welding plate;
step four: the movable frame is inserted on the supporting frame through the jack and connected to the outer side wall of the reciprocating lead screw through the sliding piece, the reciprocating lead screw rotates in the reciprocating process and reciprocates along the extension direction of the reciprocating lead screw, the linkage rotating wheels connected to one end of the reciprocating lead screw are in transmission connection with the transmission rotating wheels through transmission belts, and the transmission connection is performed between every two adjacent linkage rotating wheels through the transmission belts.
Compared with the prior art, the invention has the beneficial effects that:
1. the cooling end and the heating end of the semiconductor refrigeration piece respectively act on the water-cooling circulation main pipe and the welding plate, so that a water-cooling circulation structure is formed, required equipment is less, the occupied space is small, water flow in the water-cooling circulation branch pipe can drive the air-cooling structure on the first transmission box to perform air-cooling measures on the cooling fins when circulating, and water drops on the water-cooling circulation branch pipe cannot drop on the surface of production equipment to cause uneven cooling of the production equipment in the cooling process, so that the normal operation of the production equipment is influenced;
2. the internal structure of the second transmission box is driven to rotate in the water flow circulation process of the water-cooling circulation branch pipe, so that the second transmission box drives the heat dissipation fan to rotate to cool the welding plate, heat generated at the heating end of the semiconductor refrigerating sheet can be quickly dissipated, the refrigerating effect of the heating end is not influenced, and smoke generated by welding can be adsorbed in the rotation process of the heat dissipation fan;
3. the transmission runner outside the second transmission box drives the linkage runner at one end of the reciprocating screw rod to rotate, so that the movable frame connected outside the reciprocating screw rod does reciprocating motion inside the jack on the supporting frame, one end of the movable frame knocks the water-cooling circulation branch pipe, and the freezing condition inside the water-cooling circulation branch pipe is prevented from blocking water circulation.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a main body structure view of the present invention;
FIG. 2 is a structural view of an air-cooling duct of the present invention;
FIG. 3 is a view showing the internal structure of the first transmission case according to the present invention;
FIG. 4 is a view showing the construction of a dust box according to the present invention;
FIG. 5 is a block diagram of a semiconductor chilling plate of the present invention;
FIG. 6 is a structural view of a second transmission case of the present invention;
FIG. 7 is a block diagram of the spacing frame of the present invention;
FIG. 8 is a view of the support frame of the present invention;
in the figure: 1. a material loading platform; 2. a welding table; 3. a data line interface; 4. welding the plate; 51. a water-cooled circulation main pipe; 52. a pasting plate; 53. a heat sink; 54. water-cooling the circulating branch pipe; 55. an air-cooled pipe; 56. an air inlet; 57. a first transmission case; 58. air-cooling fan blades; 59. connecting a rotating wheel; 510. a transmission belt; 511. a propeller blade; 512. a support frame; 513. a semiconductor refrigeration sheet; 61. a limiting frame; 62. an air suction pipe; 63. a dust filtering box; 64. a connecting plate; 65. a second transmission case; 66. a heat dissipation fan; 67. a drive gear; 68. a transmission gear; 69. a transmission runner; 71. a support frame; 72. a movable frame; 73. an extrusion port; 74. a reciprocating screw; 75. the rotating wheel is linked.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
referring to fig. 1-3, a cooling device for data line production and a cooling method thereof include a material loading platform 1, a welding platform 2, a data line interface 3 and a welding plate 4, wherein one side of the outer side wall of the material loading platform 1 is connected with the welding platform 2, the lower surface inside the material loading platform 1 is connected with the data line interface 3, and the position of the upper surface of the welding platform 2 corresponding to the data line interface 3 is provided with the welding plate 4;
the outer side wall of the welding plate 4 is connected with a semiconductor refrigerating sheet 513, one side of the outer side wall of the semiconductor refrigerating sheet 513, which is far away from the welding plate 4, is connected with a water-cooling circulation main pipe 51, the position of the water-cooling circulation main pipe 51, which corresponds to the position of the limiting frame 61, is extruded and deformed by the limiting frame 61, the contact area of the water-cooling circulation main pipe and the refrigerating end of the semiconductor refrigerating sheet 513 is increased, so that water flow with higher temperature can be rapidly cooled when passing through the position, one end of the water-cooling circulation main pipe 51, which is far away from the welding plate 4, is integrally formed with a plurality of water-cooling circulation branch pipes 54, the outer side wall of the water-cooling circulation branch pipes 54 is connected with a plurality of uniformly distributed radiating fins 53, the lower surfaces of the plurality of radiating fins 53 are connected with an adhesive plate 52, the adhesive plate 52 is of a flexible structure, the radiating fins 53 can be adhered on the surface of irregular equipment, the outer side wall of the water-cooling circulation main pipe 51 is connected with a water conveying pump, one side of the outer side wall of the water-cooling circulation main pipe 51, which is close to the water conveying pump, is connected with a water storage tank, the outer side wall of the water-cooling circulation branch pipe 54 is connected with a first transmission box 57 near the radiating fins 53, the lower surface inside the first transmission box 57 is rotatably connected with a propeller blade 511 through a support frame 512 corresponding to the position of the water-cooling circulation branch pipe 54, the upper part of the inner side wall of the first transmission box 57 is rotatably connected with a connecting runner 59 through a rotating shaft, the outer side wall of the connecting runner 59 is connected with a transmission belt 510, one end of the connecting runner 59 connected with the rotating shaft is connected with an air-cooling fan blade 58, the outer side wall of the first transmission box 57 is connected with an air-cooling pipe 55 corresponding to the position of the air-cooling fan blade 58, the outer side wall of the air-cooling pipe 55 is provided with a plurality of uniformly distributed air suction openings 56, the position of the air suction opening 56 is provided with a blocking net to prevent impurities from entering and influencing the normal rotation of the air-cooling fan blade 58, one end of the air-cooling pipe 55 far away from the first transmission box 57 is connected with a hose, the outer side wall of the hose is provided with a plurality of uniformly distributed air vents, the outer side wall of the hose is provided with connecting support rings at intervals of a fixed distance, the hose is supported by the support ring part of the connecting support rings to prevent the hose from being flattened to influence normal transmission of water flow, and the connecting part of the connecting support rings enables the connecting position of the hose to be matched with the position of the radiating fins 53;
in the prior art, the cooling mode of equipment is mostly water cooling or air cooling, the air cooling is greatly limited by the ambient temperature, the water cooling is mostly carried out in a water circulation mode in order to prevent water resource waste in the using process, the water cooling operation is mostly carried out in the water circulation mode, the water circulation needs more equipment and occupies larger space, water drops on the surface of a water cooling pipe fall after being gathered in the using process, and the falling water drops fall on the surface of production equipment to absorb heat and evaporate, so that the production equipment is easily cooled unevenly;
the heating end of the semiconductor chilling plate 513 is connected to the outer side wall of the welding plate 4, the water-cooling circulation main pipe 51 is attached to the cooling end of the semiconductor chilling plate 513 under the extrusion action of the limiting frame 61, water flow in the water storage tank connected with the water-cooling circulation main pipe 51 is continuously conveyed into the water-cooling circulation main pipe 51 under the action of the conveying water pump, the water flow flows into the water-cooling circulation branch pipe 54 from one end of the water-cooling circulation main pipe 51 to achieve the water circulation effect after flowing into the water-cooling circulation branch pipe 54 from the other end of the water-cooling circulation main pipe 51, the heating end of the semiconductor chilling plate 513 heats the welding plate 4, the welding plate 4 can be soldered, the cooling end of the semiconductor chilling plate 513 can cool water flow flowing through the position of the semiconductor chilling plate 513 in the water-cooling circulation main pipe 51, and the cooled water flow can flow to the position of the water-cooling circulation branch pipe 54 to cool all parts of the data line production equipment, the plurality of uniformly distributed radiating fins 53 connected with the outer side wall of the water-cooling circulation branch pipe 54 are connected together through the adhesive plate 52, the adhesive plate 52 can adhere the plurality of radiating fins 53 on the surface of the position of the data line production equipment which needs to be cooled, so that heat generated by the work of the production equipment is transmitted to the radiating fins 53 and then absorbed by cooling water flow passing through the water-cooling circulation main pipe 51 to achieve the effect of cooling, water drops appearing on the surface of the water-cooling circulation branch pipe 54 are collected and fall off, then are blocked by the radiating fins 53 and the adhesive plate 52 and cannot fall on the surface of the production equipment, the condition that the production equipment is cooled unevenly is prevented, part of heat of the radiating fins 53 can be taken away by the water drops falling on the radiating fins 53, and water flow in the water-cooling circulation branch pipe 54 drives the screw blades 511 in the first transmission box 57 to rotate in the high-speed flowing process, the driving rotating wheel on the connecting shaft of the propeller blade 511 is connected with the connecting rotating wheel 59 through the driving belt 510, the propeller blade 511 can drive the air-cooled fan blade 58 coaxial with the connecting rotating wheel 59 to rotate in the rotating process, the air-cooled fan blade 58 accelerates the external air adsorbed from the position of the air suction opening 56 in the rotating process and then transmits the air along the hose, the sucked air is cold air influenced by the low temperature of the first transmission box 57 nearby the first transmission box 57, the other end of the hose is of a blocking structure, the air flow can only flow out from the position of the air vent on the hose, partial heat of the radiating fin 53 can be taken away by the flowing air flow, and the effect of cooling the radiating fin 53 is achieved.
Example 2:
referring to fig. 4-6, a limiting frame 61 is connected to one side of the outer side wall of the welding plate 4 close to the water-cooling circulation header 51, the lower end of the limiting frame 61 is connected to the welding plate 4 through a rotating base, the upper end of the limiting frame is connected to the welding plate 4 through a connecting buckle, so that the limiting frame 61 can be rotated to open and close, one side of the outer side wall of the limiting frame 61 is connected to a second transmission box 65 through a connecting plate 64, the internal structure of the second transmission box 65 is the same as that of the first transmission box 57, one side of the outer side wall of the second transmission box 65 is rotatably connected to a driving gear 67 through a rotating shaft, a position of the outer side wall of the second transmission box 65 close to the driving gear 67 is rotatably connected to a transmission gear 68 through a rotating shaft, one end of the transmission gear 68 connected to the rotating shaft is connected to a transmission runner 69, the driving gear 67 and the transmission gear 68 are mutually perpendicular to and mutually embedded, a heat dissipation fan 66 is connected to the upper surface of the second transmission box 65 corresponding to the transmission runner 69, one side of the outer side wall of the heat dissipation fan 66 is connected to an air suction pipe 62, a dust filtering box 63, and the dust filtering box 63 is connected to a plurality of active carbon plates uniformly distributed in the filtering box 63;
in the prior art, when the semiconductor refrigeration sheet 513 is used for cooling the temperature of water flow in the water circulation system, the semiconductor refrigeration sheet 513 is easy to lose heat generated on the heating end rapidly, so that the cooling end is affected, the cooling effect is poor, and the cooling effect on production equipment is adversely affected;
the water flow in the water-cooling circulation main pipe 51 can drive the driving gear 67 connected to the second transmission box 65 to rotate in the process of flowing, the driving gear 67 and the transmission gear 68 are mutually vertical and are mutually embedded, the transmission runner 69 coaxial with the transmission gear 68 is mutually transmitted with the transmission runner 69 on the connection shaft of the heat dissipation fan 66 through the transmission belt 510, so that the heat dissipation fan 66 rotates to accelerate the flow of the air flow and blow the accelerated air flow to the position of the welding plate 4, the heat dissipation of the welding plate 4 is accelerated, the heat generated at the heating end of the semiconductor refrigeration sheet 513 can be continuously transmitted to the welding plate 4, the low temperature generated at the cooling end is less influenced by the heat dissipation speed of the heating end, and when the heat dissipation fan 66 is driven by the air flow, the smoke generated by welding can be easily transmitted to the interior of the air suction pipe 62 along with the air flow, and harmful substances in the smoke can be adsorbed at the position of the dust filtering box 63 through the active carbon plate in the dust filtering box 63.
Example 3:
referring to fig. 7-8, an extrusion port 73 is formed in a position, corresponding to the water-cooling circulation main pipe 51, of the outer side wall of the limiting frame 61, a plurality of supporting frames 71 are connected to the position, corresponding to the extrusion port 73, of the outer side wall of the limiting frame 61, a reciprocating lead screw 74 is rotatably connected to a middle position of the outer side wall of each supporting frame 71, one end, far away from the supporting frame 71, of each reciprocating lead screw 74 is connected with a linkage runner 75, each linkage runner 75 is a double runner, the outer side wall of each reciprocating lead screw 74 is connected with a movable frame 72, and a jack is formed in a position, corresponding to the movable frame 72, of the outer side wall of each supporting frame 71;
in the prior art, when the semiconductor refrigeration sheet 513 is used for water cooling operation, when water flow at the position of the water-cooling circulation branch pipe 54 flows through the position of the semiconductor refrigeration sheet 513, the water flow is easy to be condensed into flocculent due to low temperature, and flocculent ice slag is easy to be condensed into blocks after being continuously cooled, so that the inside of the water-cooling circulation branch pipe 54 is blocked due to ice blocks;
the transmission runner 69 is in transmission connection with the interlocking runner 75 on one end of the reciprocating screw 74 through a transmission belt 510, the reciprocating screw 74 on two adjacent supporting frames 71 are in transmission connection with each other through the interlocking runner 75 and the transmission belt 510 which are connected on one end of the reciprocating screw 74, the movable frame 72 connected on the outer side of the reciprocating screw 74 is made to do reciprocating motion on the inner side of the jack on the supporting frame 71 in the rotation process of the reciprocating screw 74, the movable frame 72 is made to pass through the extrusion port 73 to knock the water-cooling circulation branch pipe 54 intermittently, the occurrence of the situation that flocculent ice slag in the water-cooling circulation branch pipe 54 is condensed into ice blocks is prevented, and the situation that the water circulation of the water-cooling circulation branch pipe 54 is blocked due to icing is avoided.
When the invention is used, the heating end of the semiconductor chilling plate 513 is connected on the outer side wall of the welding plate 4, the water-cooling circulation main pipe 51 is attached to the chilling end of the semiconductor chilling plate 513 under the extrusion action of the limiting frame 61, water flow in the water storage tank connected with the water-cooling circulation main pipe 51 is continuously conveyed into the water-cooling circulation main pipe 51 under the action of the conveying water pump, the water flow flows into the water-cooling circulation branch pipe 54 from one end of the water-cooling circulation main pipe 51 and then flows into the other end of the water-cooling circulation main pipe 51 from the other end of the water-cooling circulation branch pipe 54 to achieve the water circulation effect, the heating end of the semiconductor chilling plate 513 heats the welding plate 4, so that the welding plate 4 can be soldered, the cooling end of the semiconductor chilling plate 513 can cool the water flow flowing through the position of the semiconductor chilling plate 513 in the water-cooling circulation main pipe 51, and the cooled water flow can flow through the position of the water-cooling circulation branch pipe 54 to cool each part of the data line production equipment, the plurality of uniformly distributed radiating fins 53 connected with the outer side wall of the water-cooling circulation branch pipe 54 are connected together through the pasting plate 52, the pasting plate 52 can paste the plurality of radiating fins 53 on the surface of the position of the data line production equipment needing cooling, so that heat generated by the production equipment during working is transmitted to the radiating fins 53 and then absorbed by cooling water flow passing through the water-cooling circulation main pipe 51 to achieve the effect of cooling, water drops appearing on the surface of the water-cooling circulation branch pipe 54 are collected and fall off, then are blocked by the radiating fins 53 and the pasting plate 52 and cannot fall on the surface of the production equipment, the condition of uneven cooling of the production equipment is prevented, part of heat of the radiating fins 53 can be taken away by the water drops falling on the radiating fins 53, and water flow in the water-cooling circulation branch pipe 54 drives the screw blades 511 in the first transmission box 57 to rotate in the high-speed flow process, the driving rotating wheel on the connecting shaft of the propeller blade 511 is connected with the connecting rotating wheel 59 through the driving belt 510, so that the propeller blade 511 can drive the air-cooled fan blade 58 coaxial with the connecting rotating wheel 59 to rotate in the rotating process, the outside air adsorbed from the position of the air suction opening 56 is accelerated and then transmitted along the hose in the rotating process of the air-cooled fan blade 58, the sucked air is cold air influenced by the low temperature of the first transmission box 57 nearby the first transmission box 57, the other end of the hose is of a blocking structure, the airflow can only flow out from the position of the vent hole on the hose, and the partial heat of the radiating fin 53 can be taken away by the flowing airflow, so that the effect of cooling the radiating fin 53 is achieved;
the water flow in the water-cooling circulation header pipe 51 can drive the driving gear 67 connected to the second transmission box 65 to rotate in the circulating process, the driving gear 67 and the transmission gear 68 are perpendicular to each other and are embedded with each other, the transmission runner 69 coaxial with the transmission gear 68 is mutually transmitted with the transmission runner 69 on the connecting shaft of the heat dissipation fan 66 through the transmission belt 510, so that the heat dissipation fan 66 rotates to accelerate the flow of air flow and blow the accelerated air flow to the position of the welding plate 4, the heat dissipation of the welding plate 4 is accelerated, the heat generated at the heating end of the semiconductor refrigeration sheet 513 can be continuously transmitted to the welding plate 4, the influence of the heat dissipation speed of the heating end at the low temperature generated at the refrigerating end is reduced, and when the heat dissipation fan 66 is driven by the air flow, the smoke generated by welding can be easily transmitted to the interior of the air suction pipe 62 along with the air flow, and harmful substances in the smoke can be adsorbed by the active carbon plate in the dust filter box 63 at the position of the dust filter box 63;
the transmission runner 69 is in transmission connection with the interlocking runner 75 on one end of the reciprocating screw 74 through a transmission belt 510, the reciprocating screw 74 on two adjacent supporting frames 71 are in transmission connection with each other through the interlocking runner 75 and the transmission belt 510 which are connected on one end of the reciprocating screw 74, the movable frame 72 connected on the outer side of the reciprocating screw 74 is made to do reciprocating motion inside the insertion hole on the supporting frame 71 in the rotation process of the reciprocating screw 74, the movable frame 72 is made to pass through the extrusion port 73 to knock the water-cooling circulation branch pipe 54 discontinuously, the occurrence of the condition that flocculent ice ballast inside the water-cooling circulation branch pipe 54 is condensed into ice cubes is prevented, and the water-cooling circulation branch pipe 54 is prevented from being blocked due to icing.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (5)
1. The cooling device for the production of the data line comprises a material carrying table (1), a welding table (2), a data line interface (3) and a welding plate (4), wherein the welding table (2) is connected to one side of the outer side wall of the material carrying table (1), the data line interface (3) is connected to the lower surface inside the material carrying table (1), the welding plate (4) is arranged at a position corresponding to the data line interface (3) on the upper surface of the welding table (2), and the cooling device is characterized in that a plurality of water-cooling circulation branch pipes (54) are integrally formed at one side of the outer side wall of the welding plate (4), a plurality of cooling fins (53) which are uniformly distributed are connected to the outer side wall of the semiconductor cooling fin (513), a pasting plate (52) is connected to the lower surface of each cooling fin (53), a water-cooling circulation main pipe (51) is connected with a water pump, a water-cooling circulation main pipe (51) is connected to one side of the outer side wall of the welding plate (4), a plurality of the water-cooling circulation branch pipes (54) are connected with a plurality of cooling fins (53), and a water-cooling circulation main pipe (51) is connected with a water pump mechanism which is close to the outer side wall of the water-cooling water pump and a water storage tank;
the air cooling mechanism comprises a first transmission case (57), the lower surface inside the first transmission case (57) is rotatably connected with a propeller blade (511) through a support frame (512) at a position corresponding to the water-cooling circulation branch pipe (54), a connecting rotating wheel (59) is rotatably connected above the inner side wall of the first transmission case (57) through a rotating shaft, the outer side wall of the connecting rotating wheel (59) is connected with a transmission belt (510), one end of the connecting rotating wheel (59) connected with the rotating shaft is connected with an air-cooling fan blade (58), the outer side wall of the first transmission case (57) is connected with an air-cooling pipe (55) at a position corresponding to the air-cooling fan blade (58), and a plurality of uniformly distributed air suction ports (56) are formed in the outer side wall of the air-cooling pipe (55);
keep away from forced air cooling pipe (55) the one end of first transmission case (57) is connected with the hose, and a plurality of evenly distributed's ventilation hole is seted up to the hose lateral wall, and hose lateral wall every a section fixed distance is provided with the connection support ring, welded plate (4) lateral wall is close to water-cooling circulation house steward (51) one side is provided with heat dissipation mechanism.
2. The cooling device for data line production according to claim 1, wherein the heat dissipation mechanism comprises a limiting frame (61), one side of the outer side wall of the limiting frame (61) is connected with a second transmission case (65) through a connecting plate (64), one side of the outer side wall of the second transmission case (65) is rotatably connected with a driving gear (67) through a rotating shaft, the position, close to the driving gear (67), of the outer side wall of the second transmission case (65) is rotatably connected with a transmission gear (68) through the rotating shaft, one end, connected with the rotating shaft, of the transmission gear (68) is connected with a transmission rotating wheel (69), and the upper surface of the second transmission case (65) corresponds to the position, connected with a heat dissipation fan (66), of the transmission rotating wheel (69).
3. The cooling device for data line production according to claim 2, wherein an air suction pipe (62) is connected to one side of the outer side wall of the heat dissipation fan (66) away from the second transmission case (65), a dust filtering box (63) is connected to the outer side wall of the air suction pipe (62), a plurality of uniformly distributed activated carbon plates are connected to the inside of the dust filtering box (63), and an anti-blocking mechanism is arranged on the outer side wall of the limiting frame (61) at a position corresponding to the water cooling circulation main pipe (51).
4. The cooling device for data line production according to claim 3, wherein the anti-blocking mechanism comprises an extrusion port (73), a plurality of supporting frames (71) which are uniformly distributed are connected to the position of the outer side wall of the limiting frame (61) corresponding to the extrusion port (73), a reciprocating lead screw (74) is rotatably connected to the middle position of the outer side wall of each supporting frame (71), one end, far away from the supporting frame (71), of each reciprocating lead screw (74) is connected with a linkage rotating wheel (75), the outer side wall of each reciprocating lead screw (74) is connected with a movable frame (72), and a jack is formed in the position of the outer side wall of each supporting frame (71) corresponding to the movable frame (72).
5. The cooling method of the cooling device for the data line production according to claim 4, wherein the cooling method of the cooling device comprises the following steps:
the method comprises the following steps: the heating end of the semiconductor refrigeration piece (513) is connected to the outer side wall of the welding plate (4), the water-cooling circulation main pipe (51) is attached to the cooling end of the semiconductor refrigeration piece (513) under the extrusion action of the limiting frame (61), water flow inside a water storage tank connected with the water-cooling circulation main pipe (51) is continuously conveyed into the water-cooling circulation main pipe (51) under the action of a conveying water pump, the water flow flows into the water-cooling circulation main pipe (51) from one end of the water-cooling circulation main pipe (51) to the inside of the water-cooling circulation branch pipe (54) and then flows into the other end of the water-cooling circulation main pipe (51) from the other end of the water-cooling circulation branch pipe (54) to achieve the water circulation effect, the heating end of the semiconductor refrigeration piece (513) heats the welding plate (4), the welding plate (4) can be subjected to tin soldering operation, the heating end of the semiconductor refrigeration piece (513) can cool the water flow flowing through the position of the semiconductor refrigeration piece (513) in the water-cooling circulation main pipe (51), and the cooled water flow can flow to the position of the water-cooling circulation branch pipe (54) to cool each part of the data line production equipment;
step two: a plurality of uniformly distributed radiating fins (53) connected with the outer side wall of a water-cooling circulation branch pipe (54) are connected together through a pasting plate (52), the pasting plate (52) can paste the plurality of radiating fins (53) on the surface of a position, needing cooling, of data line production equipment, heat generated by the production equipment is transmitted to the radiating fins and then absorbed by cooling water flow passing through a water-cooling circulation main pipe (51) to achieve the effect of cooling, the water flow in the water-cooling circulation branch pipe (54) drives a propeller blade (511) in a first transmission box (57) to rotate in the high-speed flowing process, a driving rotating wheel on a connecting shaft of the propeller blade (511) is connected with a connecting rotating wheel (59) through a transmission belt (510), the propeller blade (511) can drive an air-cooling fan blade (58) coaxial with the connecting rotating wheel (59) to rotate, the air-cooling fan blade (58) accelerates external air adsorbed from a position of an air suction opening (56) in the rotating process and then transmits the external air along a hose, the other end of the hose is of a sealing structure, air flow can only flow out from a ventilation hole on the hose, and the heat of the radiating fins can be taken away;
step three: the internal structure of the second transmission box (65) is the same as that of the first transmission box (57), so that water flow in the water-cooling circulation header pipe (51) can drive a driving gear (67) connected to the second transmission box (65) to rotate in the circulating process, the driving gear (67) and a transmission gear (68) are perpendicular to each other and are embedded into each other, a transmission rotating wheel (69) coaxial with the transmission gear (68) is mutually transmitted with a transmission rotating wheel (69) on a connecting shaft of a heat dissipation fan (66) through a transmission belt (510), the heat dissipation fan (66) rotates to accelerate the flow of air flow, the accelerated air flow is blown to the position of the welding plate (4), the heat dissipation of the welding plate (4) is accelerated, and the heat generated at the heating end of the semiconductor refrigeration sheet (513) can be continuously transmitted to the welding plate (4);
step four: the movable frame (72) is inserted into the supporting frame (71) through the insertion hole, connected to the outer side wall of the reciprocating lead screw (74) through the sliding piece and capable of reciprocating along the extending direction of the reciprocating lead screw (74) in the rotating process of the reciprocating lead screw (74), the linkage rotating wheel (75) connected to one end of the reciprocating lead screw (74) is in transmission connection with the transmission rotating wheel (69) through the transmission belt (510), and two adjacent linkage rotating wheels (75) are in transmission connection through the transmission belt (510).
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