CN211481768U - Radio frequency head cooling structure and radio frequency head - Google Patents
Radio frequency head cooling structure and radio frequency head Download PDFInfo
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- CN211481768U CN211481768U CN201921704980.8U CN201921704980U CN211481768U CN 211481768 U CN211481768 U CN 211481768U CN 201921704980 U CN201921704980 U CN 201921704980U CN 211481768 U CN211481768 U CN 211481768U
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- radio frequency
- electrode column
- cooling structure
- head cooling
- refrigerating sheet
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Abstract
A radio frequency head cooling structure and a radio frequency head relate to the field of beauty equipment, and the radio frequency head cooling structure comprises a fixing plate, an electrode column, a semiconductor refrigeration sheet and a heat dissipation device; the electrode column and the semiconductor refrigerating sheet are respectively arranged on two opposite side surfaces of the fixed plate, and one end of the electrode column penetrates through the fixed plate to be contacted with the cold end of the semiconductor refrigerating sheet; the heat dissipation device is arranged on the fixing plate and is contacted with the hot end of the semiconductor refrigeration sheet. The utility model has the advantages of simple structure and reasonable design, can effectual reduction electrode column's temperature to realize the cooling to the epidermis through electrode column, thereby prevent that scorching heat phenomenon from appearing in the epidermis.
Description
Technical Field
The utility model relates to a beauty equipment field, in particular to radio frequency head cooling structure and radio frequency head.
Background
When people age, metabolism of a human body can become slow gradually along with reduction of cell activity, so that harmful substances to the human body can be gradually accumulated in the human body, the skin of people can become dark, loose, color spots and the like, a plurality of parts such as eye corners, mouth corners and cheek positions can droop and deform, if the skin is not treated, people can become old, the skin does not have a model when young, beauty lovers often select skin care products to maintain, but the existing skin care products treat symptoms and root causes, and the facial symptoms cannot be thoroughly improved, so that the nursing instrument is used for assisting nursing products to remove facial wrinkles, dark and color spots, and the skin quality is better improved.
With the development of science and technology, the radio frequency technology has been greatly developed in the beauty treatment field and the weight reduction field, and many radio frequency instruments are available on the market at present, including large radio frequency instruments and small handheld radio frequency instruments. The principle is that tissue heating is localized by a specific frequency, while radio frequency heating is from the surface to the dermis, which is generally understood as the dermis temperature for weight loss or beauty effect of radio frequency to about 42 ℃, but actually when the dermis is raised to 42 ℃, the epidermis temperature is higher.
However, the temperature of the nerves of the epidermis is limited and generally cannot exceed 42 ℃, so that the temperature of the dermis cannot reach 42 ℃, and a good beautifying and weight-losing effect cannot be achieved, for example, if the temperature of the dermis reaches 42 ℃, only scald can be caused due to overhigh temperature of the epidermis. The radio frequency head of the existing radio frequency instrument, which is in direct contact with the skin, usually does not have effective protection measures, so that the skin cannot be cooled, and scalding accidents are easy to happen.
If, the chinese utility model patent of publication number CN207401015U discloses a cosmetic head of radio frequency, which comprises an outer shell, install flexible radio frequency soft board in the shell, flexible radio frequency soft board is connected with the data line and the fixed radio frequency electrode post that stretch out the shell, the one end of radio frequency electrode post stretches out from the shell, the tip that the radio frequency electrode post stretches out is equipped with the hemisphere, be provided with the silica gel cushion between hemisphere and the shell.
The RF electrode column used for heating and directly contacting with human body in the patent is not provided with a cooling structure, so that the temperature of the epidermis layer can not be reduced.
SUMMERY OF THE UTILITY MODEL
Do not have high temperature safeguard measure to the radio frequency head that prior art exists, lead to arousing the problem of scald accident easily, the utility model aims to provide a radio frequency head cooling structure.
In order to achieve the above purpose, the technical scheme of the utility model is that:
a radio frequency head cooling structure comprises a fixing plate, an electrode column, a semiconductor refrigeration sheet and a heat dissipation device; the electrode column and the semiconductor refrigerating sheet are respectively arranged on two opposite side surfaces of the fixed plate, and one end of the electrode column penetrates through the fixed plate to be in contact with the cold end of the semiconductor refrigerating sheet; the heat dissipation device is arranged on the fixing plate and is in contact with the hot end of the semiconductor refrigeration sheet.
Preferably, the heat dissipation device is a cooling water tank, the cooling water tank is made of a heat conduction material, and a water inlet connector and a water outlet connector are arranged on the cooling water tank.
Furthermore, a heat conducting glue is arranged between the cold end of the semiconductor refrigerating sheet and the electrode column.
Furthermore, a heat conducting glue is arranged between the heat radiating device and the hot end of the semiconductor refrigerating sheet.
Preferably, at least two electrode columns are mounted on the fixing plate.
Further, still include temperature sensor and controller, temperature sensor installs the electrode column or the cold junction of semiconductor refrigeration piece, temperature sensor, semiconductor refrigeration piece all with the controller electricity is connected.
Preferably, the model of the semiconductor refrigerating plate is TEC 1-12706.
Preferably, the temperature sensor is MF 5210K.
The utility model also discloses a radio frequency head, include the casing and install radio frequency board in the casing still includes foretell radio frequency head cooling structure, the tip protrusion of electrode post the casing, the electrode post with radio frequency board electricity is connected.
By adopting the technical scheme, due to the arrangement of the electrode columns and the semiconductor refrigerating sheet which are arranged on the two sides of the fixing plate, when the semiconductor refrigerating sheet works, heat on the electrode columns can be transferred to the semiconductor refrigerating sheet, and the heat is transferred to the hot end from the cold end of the semiconductor refrigerating sheet; the heat released by the hot end of the semiconductor refrigerating sheet can be taken away in time by combining the arrangement of the heat radiating device, so that the temperature of the electric pole is reduced, the temperature of the epidermis is controlled, and the temperature of the dermis can be ensured to smoothly meet the requirements of beauty treatment and weight reduction.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a cooling structure of an rf head according to the present invention in one direction;
fig. 2 is a schematic structural view of a cooling structure of an rf head according to another embodiment of the present invention;
fig. 3 is a schematic circuit diagram of a cooling structure of an rf head according to the present invention.
In the figure, 1-electrode column, 2-fixing plate, 3-semiconductor refrigerating plate, 4-heat dissipation device, 5-water inlet joint, 6-water outlet joint and 7-temperature sensor.
Detailed Description
The following describes the present invention with reference to the accompanying drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
It should be noted that, in the description of the present invention, the terms "upper" and "lower" are used for the convenience of describing the structure of the present invention based on the illustration of the drawings, and the description is not intended to limit the present invention since the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation.
In the technical scheme, the terms "first" and "second" are only used for referring to the same or similar structures or corresponding structures with similar functions, and are not used for ranking the importance of the structures, or comparing the sizes or other meanings. In addition, unless expressly stated or limited otherwise, the terms "mounted" and "connected" are to be construed broadly, e.g., the connection may be a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two structures can be directly connected or indirectly connected through an intermediate medium, and the two structures can be communicated with each other. To those skilled in the art, the specific meanings of the above terms in the present invention can be understood in relation to the present scheme in specific terms according to the general idea of the present invention.
As shown in fig. 1 and 2, a radio frequency head cooling structure includes a fixing plate 2, an electrode column 1, a semiconductor cooling plate 3, and a heat sink 4. Among them, the electrode column 1 is a metal column, and the electrode column 1 is preferably a metal having good thermal conductivity, such as copper. While the fixing plate 2 is plastic. The utility model discloses a connect the radio frequency board during electrode column 1 uses for release radio frequency wave, heat epidermis and genuine leather through the radio frequency wave. The electrode column 1 is generally cylindrical, for example in the form used in the present embodiment, but may be of other shapes, for example triangular prism, rectangular parallelepiped or pentagonal prism.
In this embodiment, the electrode column 1 and the semiconductor chilling plate 3 are respectively disposed on two opposite side surfaces of the fixing plate 2, one end of the electrode column 1 penetrates through the fixing plate 2 to contact with the cold end of the semiconductor chilling plate 3, and the cold end of the semiconductor chilling plate 3 tightly contacts with the electrode column 1, so that heat can be efficiently conducted between the two. Wherein, the electrode column 1 is fixed on the fixing plate 2 by welding or a hole-shaft matching mode.
The number of electrode columns 1 may also be more than one, such as 2, 3, 4, 5, 6 or even more; and more than one electrode column 1 is regularly distributed on the fixed plate 2, for example, in a ring or matrix. In the embodiment, four electrode columns 1 are preferably arranged, and the four electrode columns 1 are uniformly distributed on the same circumference.
In another embodiment, a heat conducting glue is arranged between the cold end of the semiconductor refrigeration sheet 3 and the contact surface of the electrode column 1, the heat conducting glue has good heat conducting performance, and the heat conducting glue can eliminate a gap between the semiconductor refrigeration sheet 3 and the electrode column 1 and improve the heat conducting efficiency between the semiconductor refrigeration sheet 3 and the electrode column.
In this embodiment, the heat dissipation device 4 is installed on the fixing plate 2, and the heat dissipation device 4 contacts with the hot end of the semiconductor cooling plate 3, so that the heat generated by the hot end can be taken away by the heat dissipation device 4 in time. The heat dissipation device 4 may be a heat dissipation fan or a cooling water tank, and it is preferable that the heat dissipation device 4 is a cooling water tank in this embodiment, and the cooling water tank is connected to the fixing plate 2 by a bolt, so that the semiconductor chilling plate 3 is sandwiched between the cooling water tank and the fixing plate 2.
Wherein the cooling water tank is made of heat conducting material, such as copper or aluminum in metal, and is provided with a water inlet joint 5 and a water outlet joint 6.
Correspondingly, referring to the method of filling the heat-conducting glue between the semiconductor refrigerating sheet 3 and the electrode column 1, in another embodiment, the heat-conducting glue is also filled between the cooling water tank and the hot end of the semiconductor refrigerating sheet 3, so as to improve the contact area and the heat dissipation efficiency.
For facilitate the use and improve degree of automation, the radio frequency head cooling structure of this embodiment still includes temperature sensor 7 and controller (not shown in the figure), because the cold junction of electrode column 1 and semiconductor refrigeration piece 3 is the lug connection, both intervals are little, therefore temperature sensor 7 installs at the cold junction of electrode column 1 or semiconductor refrigeration piece 3 all can, the temperature homoenergetic of electrode column 1 that temperature sensor 7 detected or the temperature homoenergetic of semiconductor refrigeration piece 3 cold junction can reflect the temperature of electrode column 1. In the present embodiment, however, the temperature sensor 7 is provided so as to be sandwiched between the semiconductor chilling plate 3 and the electrode column 1.
The controller can be selectively arranged on the fixed plate 2 or the cooling water tank; of course, in order to reduce the influence of the temperature on the controller, the controller may be provided as an independent component without being in direct contact with other components, and may be connected to the temperature sensor 7 and the semiconductor cooling plate 3 only by wires.
This temperature sensor 7, foretell semiconductor refrigeration piece 3 all are connected with the controller electricity, as shown in fig. 3 be the utility model discloses a circuit connection schematic diagram.
The model of the semiconductor refrigerating sheet 3 is selected to be TEC 1-12706; the model of the temperature sensor 7 is selected as MF 5210K.
The utility model also discloses a radio frequency head, including the casing with install the radio frequency board in the casing, still include foretell radio frequency head cooling structure, wherein, the tip protrusion casing of electrode column 1 is used for contacting with the human body, and electrode column 1 is connected with the radio frequency board electricity and is in order to release the radio frequency wave of appointed frequency and power under the control of radio frequency board, beautifies or loses weight.
Before the use, the controller sets the working temperature or the working temperature range of the semiconductor refrigerating sheet 3, and the water inlet connector 7 and the water outlet connector 8 are connected to the water inlet and the water outlet of external equipment, and the external equipment can be water supply equipment such as a circulating water pump. When the radio frequency head works, the electrode column 1 releases radio frequency waves to heat the epidermis and the dermis, heat on the electrode column 1 is transferred to the cold end of the semiconductor refrigerating sheet 3, the heat is continuously conducted to the hot end of the semiconductor refrigerating sheet 3 along with the work of the semiconductor refrigerating sheet 3, and the heat concentrated by the hot end is taken away by the cooling water tank, so that the cooling work of the electrode column 1 is completed, the temperature of the epidermis directly contacted with the electrode column 1 is synchronously reduced, and scalding accidents are effectively prevented.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.
Claims (9)
1. A radio frequency head cooling structure is characterized in that: comprises a fixing plate, an electrode column, a semiconductor refrigerating sheet and a heat radiating device; the electrode column and the semiconductor refrigerating sheet are respectively arranged on two opposite side surfaces of the fixed plate, and one end of the electrode column penetrates through the fixed plate to be in contact with the cold end of the semiconductor refrigerating sheet; the heat dissipation device is arranged on the fixing plate and is in contact with the hot end of the semiconductor refrigeration sheet.
2. The rf head cooling structure according to claim 1, wherein: the heat dissipation device is a cooling water tank, the cooling water tank is made of heat conduction materials, and a water inlet connector and a water outlet connector are arranged on the cooling water tank.
3. The rf head cooling structure according to claim 1, wherein: and a heat-conducting glue is arranged between the cold end of the semiconductor refrigerating sheet and the electrode column.
4. The rf head cooling structure according to claim 1, wherein: and a heat-conducting glue is arranged between the heat dissipation device and the hot end of the semiconductor refrigerating sheet.
5. The rf head cooling structure according to claim 1, wherein: at least two electrode columns are arranged on the fixing plate.
6. The radio head cooling structure according to any one of claims 1 to 5, wherein: the electrode column is provided with an electrode column, the semiconductor refrigeration piece is arranged at the cold end of the electrode column, and the temperature sensor and the semiconductor refrigeration piece are electrically connected with the controller.
7. The rf head cooling structure according to claim 6, wherein: the model of the semiconductor refrigerating sheet is TEC 1-12706.
8. The rf head cooling structure according to claim 6, wherein: the model of the temperature sensor is MF 5210K.
9. A radio frequency head, includes the casing and installs the radio frequency board in the casing, its characterized in that: the rf head cooling structure of any one of claims 1-8, further comprising an end of the electrode shaft protruding from the housing, the electrode shaft being electrically connected to the rf plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921704980.8U CN211481768U (en) | 2019-10-12 | 2019-10-12 | Radio frequency head cooling structure and radio frequency head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921704980.8U CN211481768U (en) | 2019-10-12 | 2019-10-12 | Radio frequency head cooling structure and radio frequency head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211481768U true CN211481768U (en) | 2020-09-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921704980.8U Active CN211481768U (en) | 2019-10-12 | 2019-10-12 | Radio frequency head cooling structure and radio frequency head |
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| Country | Link |
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| CN (1) | CN211481768U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113398482A (en) * | 2021-06-16 | 2021-09-17 | 无锡品家科技有限公司 | Radio frequency beauty instrument controlled by ambient temperature and working method thereof |
| CN115060019A (en) * | 2022-04-14 | 2022-09-16 | 永新县博硕电子有限公司 | Cooling device for data line production and cooling method thereof |
-
2019
- 2019-10-12 CN CN201921704980.8U patent/CN211481768U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113398482A (en) * | 2021-06-16 | 2021-09-17 | 无锡品家科技有限公司 | Radio frequency beauty instrument controlled by ambient temperature and working method thereof |
| CN115060019A (en) * | 2022-04-14 | 2022-09-16 | 永新县博硕电子有限公司 | Cooling device for data line production and cooling method thereof |
| CN115060019B (en) * | 2022-04-14 | 2023-02-28 | 永新县博硕电子有限公司 | Cooling device for data line production and cooling method thereof |
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