CN209418981U - A kind of stainless steel cooling chamber for laser semiconductor refrigeration cooling-water machine - Google Patents
A kind of stainless steel cooling chamber for laser semiconductor refrigeration cooling-water machine Download PDFInfo
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- CN209418981U CN209418981U CN201920438449.4U CN201920438449U CN209418981U CN 209418981 U CN209418981 U CN 209418981U CN 201920438449 U CN201920438449 U CN 201920438449U CN 209418981 U CN209418981 U CN 209418981U
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- plate
- laser
- water
- plate body
- semiconductor chilling
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 76
- 238000001816 cooling Methods 0.000 title claims abstract description 23
- 238000005057 refrigeration Methods 0.000 title claims abstract description 20
- 239000010935 stainless steel Substances 0.000 title claims abstract description 20
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 20
- 239000000498 cooling water Substances 0.000 title claims abstract description 19
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 238000005187 foaming Methods 0.000 claims 1
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000003911 water pollution Methods 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 230000002463 transducing effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
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- Semiconductor Lasers (AREA)
Abstract
The utility model discloses a kind of stainless steel cooling chambers for laser semiconductor refrigeration cooling-water machine, including laser water-cooled plate, one end of laser water-cooled plate is equipped with entrance and exit, the interior runner equipped with connection outlet and entrance, the two sides of laser water-cooled plate are respectively equipped with the first plate body and the second plate body, it is folded with the first semiconductor chilling plate between first plate body and laser water-cooled plate, the second semiconductor chilling plate is folded between the second plate body and laser water-cooled plate；First plate body is being located at the opposite side gap arrangement of the first semiconductor chilling plate equipped with the first heat exchange fin, second plate body is being located at the opposite side gap arrangement of the second semiconductor chilling plate equipped with the second heat exchange fin, runner is stainless steel tube, and laser water-cooled plate is aluminum alloy material.The utility model has the advantages that topology layout is reasonable, heat-exchange capacity is strong, versatility is wide, expansion is strong, corrosion resistance is strong, water pollution, flexibility height and long service life will not be caused.
Description
Technical field
It is specially a kind of for laser semiconductor refrigeration cooling-water machine the utility model relates to cooling equipment technical field
Stainless steel cooling chamber.
Background technique
Since laser can generate a large amount of heat at work, causes laser head temperature to rise, lead to laser not
Energy long-term stable operation, traditional heat sink conception have the following two kinds: air-cooled water recycle heat exchanger；Compression refigerating machine.Two kinds
Scheme respectively has limitation: air-cooled type heat exchanger, which can only radiate, to freeze, and temperature can not be lower than environment temperature；And it compresses
Machine is needed using refrigerant, in terms of leading to the problem of environmental protection.And the cooling chamber of semiconductor refrigerating is aluminum manufacture, water quality at present
It degenerates, the general one week time will change cooling water, otherwise laser power be caused to reduce.
Summary of the invention
Technical problem to be solved in the utility model be in view of the above-mentioned state of the art, and provide topology layout conjunction
Reason, heat-exchange capacity is strong, versatility is wide, expansion is strong, flexibility is high and with long service life a kind of for laser semiconductor
The stainless steel cooling chamber of refrigeration cooling-water machine.
Technical solution adopted by the utility model to solve the above technical problems is as follows: a kind of freeze for laser semiconductor
One end of the stainless steel cooling chamber of cooling-water machine, including laser water-cooled plate, laser water-cooled plate is equipped with entrance and exit, is inside equipped with
The runner of connection outlet and entrance, the two sides of laser water-cooled plate are respectively equipped with the first plate body and the second plate body, the first plate body and
It is folded with the first semiconductor chilling plate between laser water-cooled plate, the second half are folded between the second plate body and laser water-cooled plate
Conductor cooling piece；First plate body is being equipped with the first heat exchange fin positioned at the opposite side gap arrangement of the first semiconductor chilling plate,
Second plate body is being located at the opposite side gap arrangement of the second semiconductor chilling plate equipped with the second heat exchange fin, and runner is stainless steel
Pipe, laser water-cooled plate are aluminum alloy material.
To optimize above-mentioned technical proposal, the measure taken further include:
The intrinsic attachment screw of spiral shell between above-mentioned the first plate body and the second plate body.
Above-mentioned laser water-cooled plate is being equipped with foamed material layer perpendicular to the side of the first plate body and the second plate body.
Above-mentioned foamed material layer is enclosed set on the side of the first semiconductor chilling plate and the second semiconductor chilling plate.
Heat conductive silica gel, the second semiconductor chilling plate are coated between above-mentioned the first semiconductor chilling plate and laser water-cooled plate
Heat conductive silica gel is coated between laser water-cooled plate.
Runner in above-mentioned laser water-cooled plate includes three U-shaped bends.
Compared with prior art, a kind of stainless steel for laser semiconductor refrigeration cooling-water machine of the utility model is cooling
One end of room, including laser water-cooled plate, laser water-cooled plate is equipped with entrance and exit, the interior stream equipped with connection outlet and entrance
Road, the two sides of laser water-cooled plate are respectively equipped with the first plate body and the second plate body, press from both sides between the first plate body and laser water-cooled plate
Equipped with the first semiconductor chilling plate, the second semiconductor chilling plate is folded between the second plate body and laser water-cooled plate；First plate
Body is being located at the opposite side gap arrangement of the first semiconductor chilling plate equipped with the first heat exchange fin, and the second plate body is being located at second
The opposite side gap arrangement of semiconductor chilling plate is equipped with the second heat exchange fin, and runner is stainless steel tube, and laser water-cooled plate is
Aluminum alloy material.First plate body and the second plate body pass through the first semiconductor chilling plate and the second semiconductor chilling plate and laser respectively
Heat transfer exchange is realized between device water-cooled plate；By the first heat exchange fin and the second heat exchange fin increase respectively the first plate body and
The heat exchange area of second plate body can substantially efficiently generate the first semiconductor chilling plate and the second semiconductor chilling plate cold
The heat transfer medium being heated in laser water-cooled plate is passed to, in addition semiconductor chilling plate thermal inertia is very small, cooling and heating type
Time is fast, is swift in response, and also can further promote thermal heat transfer capability: using semiconductor chilling plate as heat eliminating medium, semiconductor
Cooling piece group tool there are two types of function, can refrigeration, and can heat, therefore one device of use can replace discrete heating system
And refrigerating system, meet the temperature difference range from positive temperature 100C to 130 DEG C of negative temperature of requirement: semiconductor chilling plate is electric current transducing type
Device is able to achieve high-precision temperature control, is added temperature measurement and control means, be easy by the control of input current
Realize remote control, program-controlled, computer control, convenient for composition automatic control system: the power very little of semiconductor chilling plate passes through series connection
The science combination for merging connection, can design several watts to several hundred Shang kilowatt refrigeration modules.How much progress according to calorific value facilitated
Customization, energy conservation is convenient, promotes its using flexible: and, entire semiconductor refrigerating cooling-water machine engine does not need any refrigeration
Agent, energy continuous work, without pollution sources；There is no rotary part, gyroscopic action will not be generated；There is no mechanical movement, does not slide
Component, when work do not shake, noise, service life are long, installation is easy.With the cooling of existing laser semiconductor refrigeration cooling-water machine
Room is compared, the utility model has the advantages that topology layout is reasonable, heat-exchange capacity is strong, versatility is wide, expansion is strong, corrosion resistance
By force, water pollution, flexibility height and long service life will not be caused.
Detailed description of the invention
Fig. 1 is the positive structure diagram of the utility model；
Fig. 2 is the decomposition diagram of Fig. 1；
Fig. 3 is the schematic perspective view of Fig. 1；
Fig. 4 is the decomposition diagram of Fig. 3；
Fig. 5 is the schematic diagram of internal structure of laser water-cooled plate；
Fig. 6 is the enlarged structure schematic diagram in the portion A in Fig. 1.
Specific embodiment
The embodiments of the present invention are described in further detail below in conjunction with attached drawing.
Fig. 1 to Fig. 6 is the structural schematic diagram of the utility model.
Appended drawing reference therein are as follows: the first heat exchange fin 1, the first plate body 2, the first semiconductor chilling plate 3, attachment screw 4,
Laser water-cooled plate 5, entrance 51, outlet 52, runner 53, U-shaped bend 531, the second semiconductor chilling plate 6, the second plate body 7, the
Two heat exchange fins 8, foamed material layer 9.
Fig. 1 to Fig. 6 is the structural schematic diagram of the utility model, as shown, one kind of the utility model is used for laser
One end of the stainless steel cooling chamber of semiconductor refrigerating cooling-water machine, including laser water-cooled plate 5, laser water-cooled plate 5 is equipped with entrance
51 and outlet 52, the interior runner 53 equipped with connection outlet 52 and entrance 51, the two sides of laser water-cooled plate 5 are respectively equipped with the first plate
Body 2 and the second plate body 7 are folded with the first semiconductor chilling plate 3, the second plate body 7 between first plate body 2 and laser water-cooled plate 5
The second semiconductor chilling plate 6 is folded between laser water-cooled plate 5；First plate body 2 is being located at 3 phase of the first semiconductor chilling plate
Anti- side gap arrangement is equipped with the first heat exchange fin 1, and the second plate body 7 is being located at the opposite side of the second semiconductor chilling plate 6
Gap arrangement is equipped with the second heat exchange fin 8, and runner 53 is stainless steel tube, and laser water-cooled plate 5 is aluminum alloy material.First plate body
2 and second plate body 7 respectively by real between the first semiconductor chilling plate 3 and the second semiconductor chilling plate 6 and laser water-cooled plate 5
Existing heat transfer exchange；Increase the first plate body 2 and the second plate body 7 respectively by the first heat exchange fin 1 and the second heat exchange fin 8
Heat exchange area, can substantially efficiently by the first semiconductor chilling plate 3 and the second semiconductor chilling plate 6 generate it is cold pass to from
The heat transfer medium being heated in laser water-cooled plate 5, in addition semiconductor chilling plate thermal inertia is very small, the cooling and heating type time is fast,
It is swift in response, also can further promote thermal heat transfer capability: using semiconductor chilling plate as heat eliminating medium, semiconductor chilling plate tool
There are two types of function, can refrigeration, and can heat, therefore one device of use can replace discrete heating system and refrigeration system
System, meet the temperature difference range from positive temperature 100C to 130 DEG C of negative temperature of requirement: semiconductor chilling plate is electric current transducing type device, is led to
The control for crossing input current is able to achieve high-precision temperature control, adds temperature measurement and control means, easy to accomplish distant
Control, program-controlled, computer control, convenient for composition automatic control system: the power very little of semiconductor chilling plate merges connection by series connection
Science combination, several watts can be designed to several hundred Shang kilowatt refrigeration modules.Facilitate according to calorific value number be customized, save
Can, it is convenient, promote its using flexible: moreover, entire semiconductor refrigerating cooling-water machine engine does not need any refrigerant, it can be continuous
Work, without pollution sources；There is no rotary part, gyroscopic action will not be generated；There is no mechanical movement, without slide unit, work
When do not shake, noise, service life are long, installation is easy.Compared with the cooling chamber of existing laser semiconductor refrigeration cooling-water machine, this
The advantages of utility model is that topology layout is reasonable, heat-exchange capacity is strong, versatility is wide, expansion is strong, corrosion resistance is strong, Bu Huiyin
Play water pollution, flexibility height and long service life.
In embodiment, the intrinsic attachment screw 4 of spiral shell between the first plate body 2 and the second plate body 7 prevents the first plate body 2 and second
Plate body 7 generates dislocation, influences heat dissipation effect.
In embodiment, laser water-cooled plate 5 is being equipped with foamed material perpendicular to the side of the first plate body 2 and the second plate body 7
Layer 9.Foamed material layer 9 can be effectively heat-insulated, prevents the temperature of laser water-cooled plate 5 from dissipating from side.
In embodiment, foamed material layer 9 is enclosed set on the side of the first semiconductor chilling plate 3 and the second semiconductor chilling plate 6,
Prevent the temperature of the first semiconductor chilling plate 3 and the second semiconductor chilling plate 6 from dissipating from side.
In embodiment, heat conductive silica gel, the second semiconductor are coated between the first semiconductor chilling plate 3 and laser water-cooled plate 5
Heat conductive silica gel is coated between cooling piece 6 and laser water-cooled plate 5.Heat conductive silica gel can enhance thermal heat transfer capability.
In embodiment, the runner 53 in laser water-cooled plate 5 includes three U-shaped bends 531.Three U-shaped bends 531 can fill
Divide the heat exchange of realization laser water-cooled plate 5 first semiconductor chilling plate 3 and the second semiconductor chilling plate 6.
The working principle of the invention: the heat of the heat transfer medium of the inner flowing of laser water-cooled plate 5 is passed to through runner 53
Laser water-cooled plate 5, then the first semiconductor chilling plate 3 and the second semiconductor chilling plate 6 are passed to, then pass to the first plate body 2
With the second plate body 7, radiate eventually by the first heat exchange fin 1 and the second heat exchange fin 8.The stainless steel material of runner 53, significantly
Its anti-corrosion effect is improved, ensure that the water quality of recirculated water is not contaminated.
The most preferred embodiment of the utility model has illustrated, the various change or remodeling made by those of ordinary skill in the art
All without departing from the scope of the utility model.
Claims (6)
1. a kind of stainless steel cooling chamber for laser semiconductor refrigeration cooling-water machine, including laser water-cooled plate (5), feature
Be: one end of the laser water-cooled plate (5) is equipped with entrance (51) and outlet (52), interior to be equipped with connection outlet (52) and entrance
(51) two sides of runner (53), the laser water-cooled plate (5) are respectively equipped with the first plate body (2) and the second plate body (7), institute
It is folded with the first semiconductor chilling plate (3) between the first plate body (2) stated and the laser water-cooled plate (5), described
The second semiconductor chilling plate (6) are folded between two plate bodys (7) and the laser water-cooled plate (5)；First plate body
(2) it is being equipped with the first heat exchange fin (1) positioned at the first semiconductor chilling plate (3) opposite side gap arrangement, described second
Plate body (7) is being equipped with the second heat exchange fin (8) positioned at the second semiconductor chilling plate (6) opposite side gap arrangement, described
Runner (53) is stainless steel tube, and the laser water-cooled plate (5) is aluminum alloy material.
2. a kind of stainless steel cooling chamber for laser semiconductor refrigeration cooling-water machine according to claim 1, feature
It is: the intrinsic attachment screw of spiral shell (4) between first plate body (2) and the second plate body (7).
3. a kind of stainless steel cooling chamber for laser semiconductor refrigeration cooling-water machine according to claim 2, feature
Be: the laser water-cooled plate (5) is equipped with foaming in the side perpendicular to first plate body (2) and the second plate body (7)
Material layer (9).
4. a kind of stainless steel cooling chamber for laser semiconductor refrigeration cooling-water machine according to claim 3, feature
Be: the foamed material layer (9) is enclosed set on first semiconductor chilling plate (3) and the second semiconductor chilling plate (6)
Side.
5. a kind of stainless steel cooling chamber for laser semiconductor refrigeration cooling-water machine according to claim 4, feature
It is: is coated with heat conductive silica gel between first semiconductor chilling plate (3) and the laser water-cooled plate (5), described
Heat conductive silica gel is coated between two semiconductor chilling plates (6) and the laser water-cooled plate (5).
6. a kind of stainless steel cooling chamber for laser semiconductor refrigeration cooling-water machine according to claim 5, feature
Be: the runner (53) in the laser water-cooled plate (5) includes three U-shaped bends (531).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920438449.4U CN209418981U (en) | 2019-04-02 | 2019-04-02 | A kind of stainless steel cooling chamber for laser semiconductor refrigeration cooling-water machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920438449.4U CN209418981U (en) | 2019-04-02 | 2019-04-02 | A kind of stainless steel cooling chamber for laser semiconductor refrigeration cooling-water machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209418981U true CN209418981U (en) | 2019-09-20 |
Family
ID=67946045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920438449.4U Expired - Fee Related CN209418981U (en) | 2019-04-02 | 2019-04-02 | A kind of stainless steel cooling chamber for laser semiconductor refrigeration cooling-water machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209418981U (en) |
-
2019
- 2019-04-02 CN CN201920438449.4U patent/CN209418981U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190920 |