CN211959902U - Integrated radiator - Google Patents
Integrated radiator Download PDFInfo
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- CN211959902U CN211959902U CN202020674892.4U CN202020674892U CN211959902U CN 211959902 U CN211959902 U CN 211959902U CN 202020674892 U CN202020674892 U CN 202020674892U CN 211959902 U CN211959902 U CN 211959902U
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- dissipation mechanism
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- type heat
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Abstract
The utility model provides an integrated radiator, which comprises a cold plate type heat dissipation mechanism, wherein a heating device is arranged on the cold plate type heat dissipation mechanism and absorbs the heat of the heating device; the air type heat dissipation mechanism is connected with the cold plate type heat dissipation mechanism and absorbs the heat of the surrounding air; a cooling source connected to the cold plate heat dissipation mechanism and the air heat dissipation mechanism, the cooling source providing a cooling medium for the cold plate heat dissipation mechanism and the air heat dissipation mechanism; wherein a cooling medium circulates among the cooling source, the air-type heat dissipation mechanism, and the cold plate-type heat dissipation mechanism. The utility model discloses an integrative scheme design of integrated cold plate formula heat dissipation mechanism and air formula heat dissipation mechanism improves the integrated level of product, can simplify the external interface on the one hand, and on the other hand passes through the integrated design, helps reducing cabinet body volume, still solves the cold plate condensation problem of radiator through arranging of radiator cold drawing in addition.
Description
Technical Field
The utility model relates to an integrated radiator belongs to the cooling device field.
Background
The frequency converter product can adopt various cooling modes, such as a liquid cooling mode or an air cooling mode, generally speaking, because the air cooling generally needs to exchange heat with the external air environment of the frequency converter, the frequency converter cooled by the air cooling generally has lower protection level of the shell; the liquid cooling heat dissipation mode generally adopts internal circulation heat dissipation, and does not need heat exchange with the external air environment of the frequency converter, so that the frequency converter cooled by the liquid cooling can obtain higher shell protection level.
However, the radiator using the cooling medium is affected by the cooling medium, the surface temperature of the radiator is usually lower than the internal environment temperature of the frequency converter, when the temperature is as low as the dew point temperature of the internal environment of the frequency converter, a condensation phenomenon may occur on the surface of the cold plate, the condensation may cause a short circuit inside the frequency converter, and the like, which affects the safe operation of the frequency converter.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned technical problem that exists among the prior art, the utility model provides an integrated radiator adopts integrated cold plate formula heat dissipation mechanism and the integrative scheme design of air formula heat dissipation mechanism, improves the integrated level of product, can simplify external tapping on the one hand, and on the other hand passes through the integrated design, improves the integrated degree of product, helps reducing cabinet body volume, and on the other hand also arranges through the mode that air formula heat dissipation mechanism and cold drawing formula heat dissipation mechanism establish ties, solves the cold plate condensation problem of radiator.
In order to realize the above utility model purpose, the utility model provides an integrated radiator, include:
the cold plate type heat dissipation mechanism is provided with a heating device and absorbs the heat of the heating device;
the air type heat dissipation mechanism is connected with the cold plate type heat dissipation mechanism and absorbs the heat of the surrounding air;
a cooling source connected to the cold plate heat dissipation mechanism and the air heat dissipation mechanism, the cooling source providing a cooling medium for the cold plate heat dissipation mechanism and the air heat dissipation mechanism;
wherein a cooling medium circulates among the cooling source, the air-type heat dissipation mechanism, and the cold plate-type heat dissipation mechanism.
The utility model is further improved in that the air type heat dissipation mechanism is connected with the cooling source through a first pipeline, and the cold plate type heat dissipation mechanism is connected with the cooling source through a second pipeline; and a circulating pump is arranged on the first pipeline or the second pipeline.
The utility model discloses a further improvement lies in, in the lower cooling medium of temperature in the cooling source enters into air formula heat dissipation mechanism through first pipeline, flows from air formula heat dissipation mechanism again in the cold drawing formula heat dissipation mechanism, later pass through the second pipeline flows back to the cooling source.
The utility model discloses a further improvement lies in, cold drawing formula heat dissipation mechanism is including two heat-conducting plates that set up side by side, two be provided with the cooling runner between the heat-conducting plate, the entry linkage of cooling runner air formula heat dissipation mechanism, the exit linkage of cooling runner the second pipeline.
The utility model discloses a further improvement lies in, one side setting on the face of heat-conducting plate generate heat the device, the opposite side installation air formula heat dissipation mechanism.
The utility model discloses a further improvement lies in, air formula heat dissipation mechanism is including fixing side by side two fixed plates on the cold plate formula heat dissipation mechanism, two be provided with a plurality of radiating fin between the fixed plate, radiating fin parallel arrangement to set up the clearance that supplies the air flow between two adjacent radiating fin.
The utility model has the further improvement that the inlet of the air type heat dissipation mechanism is arranged on one fixing plate, the outlet is arranged on the other fixing plate, the inlet of the air type heat dissipation mechanism is connected with the first pipeline, and the outlet is connected with the cooling flow channel of the cold plate type heat dissipation mechanism;
the cooling medium enters through the inlet of the air type heat dissipation mechanism, sequentially passes through the heat dissipation fins and then enters into the cold plate type heat dissipation mechanism through the outlet.
The utility model discloses a further improvement lies in, be provided with radiator fan on the air formula heat dissipation mechanism, radiator fan's the direction of blowing is from the device that generates heat one side blow to the opposite side.
The utility model discloses a further improvement lies in, the mechanism that dispels the heat of institute air passes through the screw connection cold drawing formula heat dissipation mechanism.
The utility model discloses a further improvement lies in, coolant is liquid medium or refrigerant.
Compared with the prior art, the utility model has the advantages of:
the utility model discloses a radiator of integration integrates cold drawing formula heat dissipation mechanism and finned evaporator, and the external portion of cabinet only need provide one set of liquid cooling pipeline for the cooling of this integrated radiator is supplied with, has simplified external interface. Meanwhile, the integrated radiator can be used for directly cooling a heating device and cooling the ambient temperature, so that the integration degree of the product is improved, and the effect of improving the power density of a frequency converter product is good. Use this integration radiator simultaneously, the air need not carry out the heat exchange with outside air in the converter, and the converter can improve shell protection level to realize good shielding effect and isolated effect, reduce the pollution that comes from the outside.
The utility model discloses a radiator of integration, in the lower coolant of temperature in the cooling source entered into air formula heat dissipation mechanism through first pipeline, flowed from air formula heat dissipation mechanism again in the cold drawing formula heat dissipation mechanism, later pass through the second pipeline flows back to the cooling source. This circulation mode forms the temperature difference between air formula heat dissipation mechanism and cold drawing formula heat dissipation mechanism, and air formula heat dissipation mechanism's temperature is lower, appears on air formula heat dissipation mechanism surface at condensation point temperature more easily, and vapor in the air changes in condensing on air formula heat dissipation mechanism surface to avoid cold drawing formula heat dissipation mechanism surface to appear condensation phenomenon, avoid the trouble such as short circuit to appear in the device of installing on the cold drawing formula heat dissipation mechanism.
Drawings
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, in which:
fig. 1 is a schematic view of an integrated heat sink according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an integrated heat sink according to an embodiment of the present invention, showing a connection relationship between a cold plate heat dissipation mechanism and an air heat dissipation mechanism;
fig. 3 is a schematic structural diagram of an integrated heat sink according to an embodiment of the present invention, showing a structure of the air-type heat dissipation mechanism with a heat dissipation fan.
In the drawings, like parts are provided with like reference numerals. The figures are not drawn to scale.
The meaning of the reference symbols in the drawings is as follows: 1. the cold plate type heat dissipation mechanism comprises a cold plate type heat dissipation mechanism 2, an air type heat dissipation mechanism 3, a cooling source 11, a cooling flow channel 21, a fixing plate 22, a heat dissipation fin 23, a heat dissipation fan 31, a first pipeline 32, a second pipeline 33 and a circulating pump.
Detailed Description
In order to make the technical solutions and advantages of the present invention more clearly understood, the following description is made in further detail with reference to the accompanying drawings. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not an exhaustive list of all embodiments. And the embodiments and features of the embodiments may be combined with each other without conflict.
Fig. 1 schematically shows a cooling device according to an embodiment of the invention. According to the utility model discloses an integration radiator adopts integrated cold drawing formula heat dissipation mechanism 1 and air formula heat dissipation mechanism 2's an organic whole scheme design, improves the integrated level of product, can simplify external tapping on the one hand, and on the other hand passes through the integrated design, improves the integrated degree of product, helps reducing cabinet body volume, and on the other hand also solves the cold plate condensation problem of radiator through arranging of radiator cold drawing.
Fig. 1 schematically shows an integrated heat sink according to an embodiment of the present invention, which includes a cold-plate heat dissipation mechanism 1, wherein a heat generating device is installed on the cold-plate heat dissipation mechanism 1, and the cold-plate heat dissipation mechanism 1 can absorb heat of the heat generating device. The integrated radiator described in this embodiment further includes an air type heat dissipation mechanism 2, the air type heat dissipation mechanism 2 is fixedly connected to the cold plate type heat dissipation mechanism 1, and the air type heat dissipation mechanism 2 can absorb heat of ambient air. The integrated radiator described in this embodiment further includes a cooling source 3, and a cooling medium is provided in the cooling source 3. The cooling source 3 is connected with the cold plate type heat dissipation mechanism 1 and the air type heat dissipation mechanism 2, and a cooling medium can circularly flow among the cooling source 3, the air type heat dissipation mechanism 2 and the cold plate type heat dissipation mechanism 1.
The cooling source 3 is a container for containing a cooling medium, and the cooling device is arranged on the cooling source 3, so that the cooling medium can be kept at a lower temperature, and the cooling medium entering the air type heat dissipation mechanism 2 is guaranteed to be kept at a lower temperature. The refluxed higher temperature medium can be cooled in the cooling source 3.
When the integrated radiator according to the embodiment is used, the cold plate type heat dissipation mechanism 1 is used for directly installing a heating device, contacts with the heating device, absorbs heat emitted from the heating device, and reduces the temperature of the heating device. The air type heat dissipation mechanism 2 exchanges heat with air, absorbs heat in the air, and reduces the temperature of the air.
In one embodiment, the air type heat sink mechanism 1 is connected to the cooling source 3 through a first pipe 31, and the cold plate type heat sink mechanism 1 is connected to the cooling source 3 through a second pipe 32. A circulating pump 33 is arranged on the first pipeline 31 or the second pipeline 32, and the circulating pump 33 provides power for the circulation of the cooling medium.
In one embodiment, the cooling medium with a lower temperature in the cooling source 3 enters the air-cooled heat dissipation mechanism 2 through the first pipe 31, flows from the air-cooled heat dissipation mechanism 2 into the cold plate type heat dissipation mechanism 1, and then flows back to the cooling source 3 through the second pipe 32.
In the integrated radiator according to the present embodiment, the cooling medium flows through the air-type heat dissipation mechanism 2 first when flowing through the cooling duct, and the temperature of the cooling medium is the lowest. The cooling medium firstly flows through the air type heat dissipation mechanism 2 for heat exchange, then the temperature is slightly increased, and then flows through the cold plate type heat dissipation mechanism 1, and a temperature gradient is formed among different radiators, so that the surface temperature of the air type heat dissipation mechanism 2 is lower than that of the cold plate type heat dissipation mechanism 1. When the air temperature is higher, the condensation point temperature is easier to appear on the surface of the air type heat dissipation mechanism 2, and the water vapor in the air is easier to condense on the surface of the air type heat dissipation mechanism 2, so that the condensation phenomenon on the surface of the cold plate type heat dissipation mechanism 1 is avoided, and the faults of short circuit and the like of devices installed on the cold plate type heat dissipation mechanism 1 are avoided.
In one embodiment, as shown in fig. 1, the cold plate type heat dissipation mechanism 1 includes two heat conduction plates disposed side by side, the heat conduction plates are made of metal material with good heat conductivity, and the two heat conduction plates are disposed in parallel one above the other. The two heat conducting plates are supported by a plurality of supporting plates to keep the distance between the two heat conducting plates. A cooling flow channel 11 is arranged between the two heat conducting plates, an inlet of the cooling flow channel 11 is connected with the air type heat dissipation mechanism 2, and an outlet of the cooling flow channel 11 is connected with the second pipeline 32.
In the integrated heat sink according to the present embodiment, the cooling flow channel 11 may be arranged in a serpentine shape or a spiral shape. The heat conducting plate contacts the heat generating device, so that the heat of the heat generating device is transferred into the cooling flow passage 11 through the heat conducting plate and is dissipated through the cooling medium.
In a preferred embodiment, the heat generating device is arranged on one side of the plate surface of the heat conducting plate, and the air type heat dissipation mechanism 2 is arranged on the other side of the plate surface of the heat conducting plate. In this embodiment, the heat generating device and the air-type heat dissipation mechanism 2 may be arranged side by side, and the heat generated by the heat generating device in the air can be absorbed by the air-type heat sink, so that the temperature of the air around the heat generating device is kept low.
In one embodiment, as shown in fig. 2, the air-type heat dissipation mechanism 2 includes two fixing plates 21 fixed on the cold plate-type heat dissipation mechanism 1 side by side, a plurality of heat dissipation fins 22 are disposed between the two fixing plates 21, the heat dissipation fins 22 are disposed in parallel, and a gap for air to flow is disposed between two adjacent heat dissipation fins 22. The heat radiating fins 22 increase the heat radiating area and improve the heat radiating efficiency.
In a preferred embodiment, the inlet of the air-cooling mechanism 2 is disposed on one of the fixing plates 21, the outlet is disposed on the other fixing plate 21, the inlet of the air-cooling mechanism 2 is connected to the first pipe 31, and the outlet is connected to the cooling channel 11 of the cold-plate cooling mechanism 1. The heat dissipation fins 22 are connected end to end, and the cooling medium enters through the inlet of the air type heat dissipation mechanism 2, sequentially passes through the heat dissipation fins 22, and then enters into the cold plate type heat dissipation mechanism 1 through the outlet.
In this embodiment, the first duct 31, the second duct 32, the cooling duct and the duct in the air-type heat dissipation mechanism 2 form an integrated closed duct, which ensures the heat dissipation effect. The cooling medium flowing out of the cooling source 3 flows in from one end of the pipeline, flows through the air type heat dissipation mechanism 2 and then flows through the cold plate type heat dissipation mechanism 1, and meanwhile, the effect of reducing the ambient temperature of air and the effect of cooling the cold plate mounted devices are achieved.
In one embodiment, as shown in fig. 3, a heat dissipation fan 23 is disposed on the air-type heat dissipation mechanism 2, and the blowing direction of the heat dissipation fan 23 is from one side of the heat generating device to the other side. The direction of the radiating fan 23 is parallel to the direction of the plane of the radiating fins 22, and the radiating wind produced by the radiating fan 23 passes through the gaps between the radiating fins 22, so that the air flow in the gaps between the radiating fins 22 is increased, and the radiating effect is improved. The hot air around the heat generating device is driven by the cooling fan 23 to flow through the cooling fins 22 for heat exchange, thereby improving the cooling efficiency.
In a preferred embodiment, the air-cooled heat dissipation mechanism 2 is connected to the cold plate heat dissipation mechanism 1 through screws. The air type heat dissipation mechanism 2 and the cold plate type heat dissipation mechanism 1 form an integrated radiator through a fastener connection mode. Through combining integrative radiator design, reduced the space volume that needs to occupy of installing air formula heat dissipation mechanism 2 and cold drawing formula heat dissipation mechanism 1 respectively, improved product integration design, only need consider cold drawing formula heat dissipation mechanism 1's installation during the product installation, simplified the installation. Through the mode of screw connection, not only connect firmly, still be convenient for the dismouting. Of course, the air type heat dissipation mechanism 2 and the cold plate type heat dissipation mechanism 1 in the present application may also be connected by other methods such as welding.
In one embodiment, the cooling medium is a liquid medium or a refrigerant. The liquid medium may be water or other cooling liquid.
While the preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, the appended claims are intended to be construed to include preferred embodiments and all such changes and/or modifications as fall within the scope of the invention, and all such changes and/or modifications as are made to the embodiments of the present invention are intended to be covered by the scope of the invention.
Claims (10)
1. An integrated heat sink, comprising:
the cold plate type heat dissipation mechanism (1) is provided with a heating device and absorbs heat of the heating device;
the air type heat dissipation mechanism (2) is connected with the cold plate type heat dissipation mechanism (1), and the air type heat dissipation mechanism (2) absorbs the heat of the surrounding air;
the cooling source (3) is connected with the cold plate type heat dissipation mechanism (1) and the air type heat dissipation mechanism (2), and the cooling source (3) provides a cooling medium for the cold plate type heat dissipation mechanism (1) and the air type heat dissipation mechanism (2);
wherein a cooling medium circulates among the cooling source (3), the air-type heat dissipation mechanism (2), and the cold plate-type heat dissipation mechanism (1).
2. The integrated heat sink according to claim 1, wherein the air-type heat sink mechanism (2) is connected to the cooling source (3) through a first pipe (31), and the cold plate-type heat sink mechanism (1) is connected to the cooling source (3) through a second pipe (32); a circulating pump (33) is arranged on the first pipeline (31) or the second pipeline (32).
3. The integrated heat sink according to claim 2, wherein the cooling medium with lower temperature in the cooling source (3) enters the air cooling mechanism (2) through the first pipe (31), flows from the air cooling mechanism (2) to the cold plate cooling mechanism (1), and then flows back to the cooling source (3) through the second pipe (32).
4. The integrated radiator according to claim 3, wherein the cold plate type heat dissipation mechanism (1) comprises two heat conduction plates arranged side by side, a cooling flow channel (11) is arranged between the two heat conduction plates, an inlet of the cooling flow channel (11) is connected with the air type heat dissipation mechanism (2), and an outlet of the cooling flow channel (11) is connected with the second pipeline (32).
5. The integrated heat sink as claimed in claim 4, wherein the heat generating device is disposed on one side of the plate surface of the heat conducting plate, and the air-type heat dissipating mechanism (2) is mounted on the other side.
6. The integrated heat sink according to claim 4 or 5, wherein the air-type heat dissipation mechanism (2) comprises two fixing plates (21) fixed on the cold plate-type heat dissipation mechanism (1) side by side, a plurality of heat dissipation fins (22) are arranged between the two fixing plates (21), the heat dissipation fins (22) are arranged in parallel, and gaps for air to flow are arranged between two adjacent heat dissipation fins (22).
7. The integrated heat sink according to claim 6, wherein the inlet of the air cooling mechanism (2) is arranged on one fixing plate (21), the outlet is arranged on the other fixing plate (21), the inlet of the air cooling mechanism (2) is connected with the first pipe (31), and the outlet is connected with the cooling flow channel (11) of the cold plate cooling mechanism (1);
the cooling medium enters through the inlet of the air type heat dissipation mechanism (2), sequentially passes through the heat dissipation fins (22) and then enters into the cold plate type heat dissipation mechanism (1) through the outlet.
8. The integrated heat sink according to claim 7, wherein the air-type heat dissipation mechanism (2) is provided with a heat dissipation fan (23), and the blowing direction of the heat dissipation fan (23) is from one side of the heat generating device to the other side.
9. The integrated heat sink according to claim 8, wherein the air-type heat sink mechanism (2) is connected to the cold plate-type heat sink mechanism (1) by screws.
10. The integrated heat sink of claim 9, wherein the cooling medium is a liquid medium or a refrigerant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020674892.4U CN211959902U (en) | 2020-04-28 | 2020-04-28 | Integrated radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020674892.4U CN211959902U (en) | 2020-04-28 | 2020-04-28 | Integrated radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211959902U true CN211959902U (en) | 2020-11-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020674892.4U Active CN211959902U (en) | 2020-04-28 | 2020-04-28 | Integrated radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211959902U (en) |
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2020
- 2020-04-28 CN CN202020674892.4U patent/CN211959902U/en active Active
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