CN213578196U - System for cooling circulating water based on semiconductor refrigeration technology - Google Patents
System for cooling circulating water based on semiconductor refrigeration technology Download PDFInfo
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- CN213578196U CN213578196U CN202022465945.4U CN202022465945U CN213578196U CN 213578196 U CN213578196 U CN 213578196U CN 202022465945 U CN202022465945 U CN 202022465945U CN 213578196 U CN213578196 U CN 213578196U
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Abstract
The utility model relates to a semiconductor refrigeration accuse temperature technical field, concretely relates to system based on semiconductor refrigeration technology makes circulating water cooling, the system includes: the device comprises a water cooling plate, a semiconductor refrigerating device and a power module; wherein, the water-cooling board passes through the fixed bolster setting inside the box, and semiconductor refrigerating plant sets up on the lateral wall of water-cooling board one end, power module sets up at the fixed bolster, and with semiconductor refrigerating plant control connection. The device utilizes the difference in temperature that semiconductor refrigerating plant produced to cool down the inside circulating water of aluminium water-cooling board for the circulating water cooling of anti-oxidation coating spraying equipment of steel billet, the coating preparation jar that can stabilize spraying equipment is within suitable temperature range, and the anti-oxidation coating on guarantee steel billet surface is complete orderly, reduces the oxidation loss of burning of steel billet in the smelting process, thereby has satisfied steel smelting process demand.
Description
Technical Field
The utility model relates to a semiconductor refrigeration accuse temperature technical field, concretely relates to system based on semiconductor refrigeration technology makes circulating water cooling.
Background
The cast steel billet needs to be heated by a heating furnace and then rolled, the heating temperature is more than 1100 ℃, the heating time is more than 2 hours, the steel billet is easy to generate oxidation burning loss in the heating furnace, the burning loss rate is 0.5-1.5%, the burning loss of the steel billet not only affects the yield of the product, but also affects the surface quality of the product, and therefore, a layer of anti-oxidation coating needs to be sprayed on the cast steel billet.
The requirement of the anti-oxidation coating on the environmental temperature is high, and when the temperature is too high, the sprayed anti-oxidation coating cannot form a complete and continuous coating on the surface of the billet. The spraying equipment of the anti-oxidation coating is in a high working environment temperature, so circulating water is needed to cool the surface of the spraying equipment so as to ensure that the internal temperature of the coating preparation tank of the spraying equipment is within a proper temperature range. In the summer season, the temperature of the workshop environment is very high, the initial temperature of the circulating water is high, and the cooling effect is poor.
Based on semiconductor refrigeration, circulating water of the billet anti-oxidation coating spraying equipment is cooled, a coating preparation tank of the spraying equipment can be stabilized within a proper temperature range, the anti-oxidation coating on the surface of a billet is ensured to be complete and orderly, and the oxidation burning loss of the billet in the smelting process is reduced, so that the steel smelting process requirement is met.
Disclosure of Invention
An object of the utility model is to provide a device based on semiconductor refrigeration technology makes circulating water cooling, the device are used for the circulating water cooling of the anti-oxidation coating spraying equipment of steel billet, and the coating preparation jar that can stabilize spraying equipment is within suitable temperature range, and the anti-oxidation coating on guarantee steel billet surface is complete orderly, reduces the oxidation scaling loss of steel billet in the smelting process to steel smelting process demand has been satisfied.
In order to achieve the above purpose, the technical scheme of the utility model is that: a system for cooling circulating water based on semiconductor refrigeration technology, the system comprising: the semiconductor refrigeration device comprises a box body, a water cooling plate, a semiconductor refrigeration device and a power module;
the water cooling plate, the semiconductor refrigerating device and the power supply module are all arranged in the box body;
the water cooling plate is arranged in the box body through a fixing support, and a water inlet and a water outlet which are connected are arranged on the box body;
the semiconductor refrigerating device is arranged on the side wall of one end of the water cooling plate, and the power supply module is arranged on the water cooling plate and is in control connection with the semiconductor refrigerating device.
Furthermore, the two ends of the box body are respectively provided with a door plate which can be disassembled in a portable mode, the door plate is provided with an air suction opening, the side faces of the box body are respectively provided with a louver grid, and the top of the box body is provided with a water inlet pipe and a water outlet pipe.
Further, the water cooling plate comprises a main body, a water circulation loop and a fin structure;
the water circulation loop is arranged in the main body, and the fin structures are arranged in the water circulation loop;
the water circulation loop is formed by connecting at least two U-shaped units end to end.
Furthermore, the semiconductor refrigerating device comprises a radiating fan, a hot end outer cover, radiating fins, a semiconductor refrigerating device and a cooling fin structure;
the hot end outer cover, the radiating fins, the semiconductor refrigerating device and the cooling fins are arranged on the surface of the water cooling plate in a sequentially attaching mode, and the radiating fan is arranged on the radiating fins;
the heat dissipation fan and the heat dissipation fins; and heat-conducting silicone grease is coated among the radiating fin, the semiconductor refrigerating fin, the cooling fin and the water cooling plate.
Further, the semiconductor refrigerating device further comprises a heat insulation layer, and the heat insulation layer is arranged between the radiating fin and the cooling fin.
Further, the heat insulation layer is a heat insulation sponge mat.
Further, the water circulation loop is a copper pipe or an aluminum pipe.
Further, the system also comprises a dust cover, and the dust cover is arranged on the air suction opening.
Further, the main body is made of aluminum.
The utility model provides a circulating water supply system, circulating water cooling system includes water supply pipeline and temperature detecting element, wherein the circulating water adopts foretell system based on semiconductor refrigeration technology to make the circulating water cooling to the circulating water in the water supply pipeline.
The utility model has the advantages that:
(1) the utility model has simple and compact structure, and can be installed and stably operated in a narrow working space;
(2) the utility model has novel refrigeration principle, excellent refrigeration effect, no need of adding refrigerant, environmental protection and reliability;
(3) the utility model discloses easy and simple to handle, operational reliability is high, long service life.
Drawings
Fig. 1 is an internal structure diagram of an apparatus for cooling circulating water based on semiconductor refrigeration technology.
Fig. 2 is an external view of a device for cooling circulating water based on semiconductor refrigeration technology.
Fig. 3 is a structural diagram of the semiconductor refrigeration system of the present invention.
Fig. 4 is a water circulation loop diagram inside the aluminum water cooling plate of the present invention.
Description of the main reference numerals:
the device comprises a box body 1, a fixed support 2, a water cooling plate 3, a semiconductor refrigerating device 4, a water inlet pipe 5, a water outlet pipe 6, a power module 7, a cooling fan 8, a hot end outer cover 9, a cooling fin 10, a semiconductor refrigerating fin 11, a cooling fin 12, a heat insulation layer 13, a dust cover 14, an air suction opening 15, a door plate 16 and a louver grid 17.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings.
As shown in fig. 1, the utility model relates to a system for making circulating water cooling based on semiconductor refrigeration technology, the system includes: the refrigerator comprises a box body 1, a water cooling plate 2, a semiconductor refrigerating device 4 and a power supply module 7;
wherein the water cooling plate 2, the semiconductor refrigerating device 4 and the power module 7 are all arranged in the box body 1,
the water cooling plate 2 is arranged inside the box body 1 through a fixed bracket 3,
the semiconductor refrigerating device 4 is arranged on the side wall of one end of the water cooling plate 2, and the power supply module 7 is arranged on the water cooling plate 2 and is in control connection with the semiconductor refrigerating device 4.
Two ends of the box body 1 are respectively provided with a portable detachable door panel 16, the door panel 16 is provided with an air suction opening 15, and the side surfaces of the box body 1 are respectively provided with a shutter grid 17;
the top of the box body 1 is provided with a water inlet pipe 5 and a water outlet pipe hole 6,
the water cooling plate 3 comprises a main body 3-1, a water circulation loop 3-2 and a fin structure 3-3;
the water circulation loop 3-2 is arranged inside the main body 3-1, and the fin structures 3-3 are arranged inside the water circulation loop 3-2;
the water circulation loop 3-2 is formed by connecting at least two U-shaped units end to end.
The semiconductor refrigerating device 4 comprises a radiating fan 8, a hot end outer cover 9, radiating fins 10, a semiconductor refrigerating device 11 and cooling fins 12;
the hot end outer cover 9, the radiating fins 10, the semiconductor refrigerating device 11 and the cooling fins 12 are arranged on the surface of the water cooling plate 3 in a sequentially attaching mode, and the radiating fan 8 is arranged on the radiating fins 10;
between the heat dissipation fan 8 and the heat dissipation fins 10; and heat-conducting silicone grease is coated among the heat radiating fin 10, the semiconductor refrigerating device 11, the cooling fin 12 and the water cooling plate 2.
The semiconductor refrigeration device 4 further comprises a heat insulation layer 13, and the heat insulation layer 13 is arranged between the heat sink 10 and the cooling fin 3.
The heat insulation layer 13 is a heat insulation sponge mat.
The water circulation loop 2-1 is made of copper.
The system further comprises a dust cover 14, wherein the dust cover 14 is arranged on the air suction opening 15.
The main body 3-1 is made of aluminum.
The utility model provides a circulating water cooling system, the system that adopts foretell system based on semiconductor refrigeration technology to make the circulating water cooling of circulating water cooling system cools down the circulating water.
Example (b):
a device for cooling circulating water based on a semiconductor refrigeration technology comprises a box body 1, an aluminum water cooling plate 3, a fixing support 2, a semiconductor refrigeration device 4, a water inlet pipe 5, a water outlet pipe 6, a power supply module 7 and a dust cover 14. The upper bottom surface of the box body 1 is provided with a water inlet copper pipe hole and a water outlet copper pipe hole for circulating water, and the left side surface and the right side surface of the box body 1 are provided with shutter grids. The front and the back of the box body 1 are preferably designed by adopting a detachable door panel 16 structure, the door panel 16 is connected with the side surface of the box body 1 through a hinge, an air suction opening 15 of a cooling fan of a refrigerating system is formed in the door panel 16, and dust covers 14 are arranged at the positions of the air suction openings 15 at the front and the back of the box body 1. The fixed support 2 is fixedly welded with the lower bottom surface of the box body 1, and the water cooling plate 3 is fixedly connected with the fixed support 2 through bolts. The power supply connection module 7 is fixed on the fixed support 2 by screws.
Referring to fig. 3, the semiconductor cooling device 4 includes a cooling fan 8, a hot-end housing 9, a heat sink 10, a heat insulating layer 13, a semiconductor cooling device 11, and a cooling fin 12. The air blowing port of the cooling fan 8, the hot end outer cover 9, the cooling fin 10, the semiconductor refrigerating device 11 and the cooling fin 12 are arranged on the surface of the aluminum water cooling plate 3 in a sequentially attaching mode. The heat insulation spongy cushion 13 is filled between the radiating fins 10 and the water cooling plate 3, meanwhile, through grooves are formed in the heat insulation layer 13, and the semiconductor refrigeration pieces 11 and the cooling pieces 12 are placed in the through grooves of the heat insulation spongy cushion. The radiating fin 10 and the aluminum water cooling plate 2 are fixed in a bolt connection mode, and the hot end outer cover 9 is fixed on the side face of the radiating fin 10 in a bolt connection mode. The heat radiating fins 10 and the hot end of the semiconductor refrigerating device 11, the cold end of the semiconductor refrigerating device 11, the cooling fins 12 and the water-cooling plate 3 are bonded by heat-conducting silicone grease. The water inlet copper pipe 5 and the water outlet copper pipe 6 are fixed on the upper bottom surface of the water cooling plate 3 in a threaded connection mode. When the utility model discloses the device passes through DC power supply, P-N in the refrigeration piece of semiconductor refrigeration piece 11 becomes the thermocouple pair, produces the peltier effect, forms the hot junction and the cold junction of semiconductor refrigeration piece 11. The heat end of the semiconductor refrigeration piece 11 continuously exchanges heat with the outside air through the radiating fin 10 and the radiating fan 8 to dissipate heat and keep a certain temperature, and the cold energy generated by the cold end of the semiconductor refrigeration piece 11 is transferred to the aluminum water cooling plate 3 through the cooling piece 12, so that the temperature of the circulating water is reduced after passing through the water cooling plate 3.
Referring to fig. 4, a water circulation loop 3-1 is arranged inside the aluminum water cooling plate 3, a fin structure 3-3 is arranged inside the water circulation loop 3-1, and the distribution position of the fin structure 3-3 depends on the distribution position of the semiconductor chilling plate 11. The fin structures 3-3 can increase the contact area between the circulating water and the aluminum water cooling plate 3, and simultaneously control the flow rate of the water circulation to realize the rapid cooling of the circulating water.
The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the invention, but all modifications and changes made by the contents of the present invention or directly used in other fields without departing from the spirit and scope of the present invention are encompassed in the claims of the present invention.
Claims (10)
1. A system for cooling circulating water based on semiconductor refrigeration technology, the system comprising: the semiconductor refrigeration device comprises a box body, a water cooling plate, a semiconductor refrigeration device and a power module;
the water cooling plate, the semiconductor refrigerating device and the power supply module are all arranged in the box body;
the water cooling plate is arranged inside the box body through a fixing support;
the semiconductor refrigerating device is arranged on the side wall of one end of the water cooling plate, and the power supply module is arranged on the water cooling plate and is in control connection with the semiconductor refrigerating device.
2. The system of claim 1, wherein two ends of the box body are respectively provided with a portable detachable door plate, the door plates are provided with air suction openings, and the side surfaces of the box body are respectively provided with a louver grid;
the top of box is equipped with inlet tube and outlet pipe, inlet tube and outlet pipe all with the water-cooling board is connected.
3. The system of claim 1, wherein the water cooled plate comprises a body, a water circulation loop, and a fin structure;
the water circulation loop is arranged in the main body, and the fin structures are arranged in the water circulation loop;
the water circulation loop is formed by connecting at least two U-shaped units end to end.
4. The system of claim 1, wherein the semiconductor refrigeration device comprises a heat dissipation fan, a hot end housing, a heat sink, a semiconductor refrigeration fin, and a cooling fin structure;
the hot end outer cover, the radiating fins, the semiconductor refrigeration fins and the cooling fins are arranged on the surface of the water cooling plate in a sequentially attaching mode, and the radiating fan is arranged on the radiating fins;
the contact surface between the radiating fan and the radiating fin is coated with heat-conducting silicone grease;
the contact surface of the radiating fin and the semiconductor refrigerating device is coated with heat-conducting silicone grease;
the contact surface of the semiconductor refrigerating device and the cooling fin is coated with heat-conducting silicone grease;
and the contact surface of the cooling fin and the water cooling plate is coated with heat-conducting silicone grease.
5. The system of claim 4, wherein the semiconductor refrigeration unit further comprises a thermal insulation layer disposed between the heat sink and the cooling fins.
6. The system of claim 5, wherein the insulating layer is an insulating foam pad.
7. The system of claim 3, wherein the water circulation loop is copper tubing.
8. The system of claim 2, further comprising a dust cover disposed over the air suction opening.
9. The system of claim 3, wherein the body is aluminum.
10. A circulating water supply system, the circulating water cooling system comprises a water supply pipeline and a temperature detection unit, wherein the circulating water in the water supply pipeline is cooled by the system for cooling the circulating water based on the semiconductor refrigeration technology according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022465945.4U CN213578196U (en) | 2020-10-30 | 2020-10-30 | System for cooling circulating water based on semiconductor refrigeration technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022465945.4U CN213578196U (en) | 2020-10-30 | 2020-10-30 | System for cooling circulating water based on semiconductor refrigeration technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213578196U true CN213578196U (en) | 2021-06-29 |
Family
ID=76531344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022465945.4U Active CN213578196U (en) | 2020-10-30 | 2020-10-30 | System for cooling circulating water based on semiconductor refrigeration technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213578196U (en) |
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2020
- 2020-10-30 CN CN202022465945.4U patent/CN213578196U/en active Active
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