CN214199272U - Flat-plate sleeve type nitrogen cooling device - Google Patents

Abstract

The utility model discloses a dull and stereotyped bushing type nitrogen gas cooling device, including the copper pipe, both sides are equipped with respectively about the copper pipe and hug closely last clamp splice aluminum plate and lower clamp splice aluminum plate of copper pipe, go up clamp splice aluminum plate and keep away from copper pipe one side with lower clamp splice aluminum plate and be equipped with a plurality of semiconductor refrigeration pieces, semiconductor refrigeration piece opposite side is equipped with the radiator, it is equipped with the heat insulating sheet to go up clamp splice aluminum plate, be equipped with the heat insulating strip of hugging closely the copper pipe down between clamp splice aluminum plate and the radiator, the copper pipe left and right sides is equipped with the heat insulating strip of hugging closely the copper pipe, and the radiator outside is equipped with the support shell, and the support shell back is equipped with the through-hole, and the through-hole inboard is equipped with the fan, and the through-hole outside is equipped with the fan screen panel. According to the technical scheme, the refrigeration module, the heat dissipation module and the heat transfer control module are organically combined, so that the nitrogen can be sufficiently refrigerated by the device, and the heat dissipation means of the device to the ambient environment is provided to the maximum extent, so that the refrigeration characteristic of the semiconductor is sufficiently exerted, and the service performance and the service life of the produced product are effectively guaranteed.

Description

Flat-plate sleeve type nitrogen cooling device

Technical Field

The utility model relates to a semiconductor refrigeration technology field especially relates to a dull and stereotyped bushing type nitrogen gas cooling device.

Background

Data show that in the production process of certain specific products, a closed production space must be filled with nitrogen to maintain an oxygen-insulated condition, but in the conventional production process, a certain amount of heat is generated, so that the temperature of the closed production space is continuously increased, and the final use performance of the products is seriously influenced. Therefore, how to maintain the conditions of oxygen insulation and constant temperature of the closed production space is a difficult problem to be solved urgently in many fields with high requirements on production environment.

The conventional cooling mode usually adopts liquid cooling or air cooling, but the volume of equipment required by the liquid cooling is higher, the air cooling efficiency is lower, and the requirement on high-efficiency optimization is difficult to meet. The peltier effect means that when a current passes through a loop formed by different conductors, in addition to irreversible joule heat generation, heat absorption and heat release phenomena occur at joints of the different conductors respectively along with the difference of current directions.

Chinese patent document CN105518407B discloses a "gas cooler". Methods, systems, and apparatus are provided that are configured to reduce temperature variation of a cooling fluid where CO2 may have a relatively high specific heat capacity in a gas cooler. Additional cooling fluid may be introduced where the CO2 may have a relatively high specific heat capacity to reduce temperature variations of the cooling fluid. By slowing the temperature change of the cooling fluid where the CO2 may have a relatively high specific heat capacity, a temperature differential between the CO2 and the cooling fluid in the gas cooler may be maintained and/or generated, which facilitates heat exchange between the CO2 and the cooling fluid. Above-mentioned technical scheme adopts cooling fluid to cool off, and the effect is unsatisfactory, if needs to reach better effect, requires highly to equipment volume, has increased the cost.

Disclosure of Invention

The utility model discloses it is bulky mainly to solve original cooling device, and technical problem with high costs provides a dull and stereotyped bushing type nitrogen gas cooling device, through organic combination between refrigeration module, radiating module and each module of heat transfer control module, has both guaranteed the device to the abundant refrigeration of nitrogen gas, furthest again provides the device to the heat dissipation means of surrounding environment, from this full play semiconductor refrigerated characteristic, ensures the performance and the life-span of production product effectively.

The above technical problem of the present invention can be solved by the following technical solutions: the utility model discloses a copper pipe, both sides are equipped with respectively about the copper pipe and hug closely last clamp splice aluminum plate and lower clamp splice aluminum plate of copper pipe, go up clamp splice aluminum plate and keep away from copper pipe one side with clamp splice aluminum plate down and be equipped with a plurality of semiconductor refrigeration pieces, semiconductor refrigeration piece opposite side is equipped with the radiator, go up clamp splice aluminum plate, be equipped with the heat insulating barrier down between clamp splice aluminum plate and the radiator, the copper pipe left and right sides is equipped with the heat insulating strip of hugging closely the copper pipe, and the radiator outside is equipped with the support shell, and the support shell back is equipped with the through-hole, and the through-hole inboard is equipped with the fan, and the through-hole outside is equipped with the fan screen panel. The semiconductor refrigeration piece refrigerates, carries out heat transfer through last clamp splice aluminum plate and clamp splice aluminum plate down, realizes effectively refrigerating to the interior flow through nitrogen gas of copper pipe. The heat insulating strips and the heat insulating sheets made of polyethylene effectively limit the dissipation of cold energy in the upper clamping block aluminum plate and the lower clamping block aluminum plate to the surrounding environment, and simultaneously ensure that the cold energy produced by the semiconductor refrigerating sheets can be transmitted to nitrogen in the sleeve to the maximum extent. The fan that distributes in refrigeration main part one side has fully played the square structure advantage of self, combines the effect of the thermal-insulated material of aluminum plate side, and the fan can significantly reduce blows away aluminum plate's cold volume, can furthest again blow away a large amount of heats that produce between the radiator fin. The fan mesh enclosure is different from a common installation method of directly installing the fan, but passes through the screw through hole of the fan bracket in the middle, then passes through the screw through hole of the fan, and finally is in a special connection structure fixed by a nut. The fan mesh enclosure is arranged on the fan bracket, so that the problem of damage to the semiconductor refrigerating device through the air inlet side of the fan caused by injury due to human error contact or peripheral external interference objects is effectively avoided. The fan mesh enclosure is arranged on the fan bracket, so that the problem of damage to the semiconductor refrigerating device through the air inlet side of the fan caused by injury due to human error contact or peripheral external interference objects is effectively avoided.

Preferably, a groove corresponding to the contour of the copper pipe is arranged on one side, close to the copper pipe, of the upper clamping block aluminum plate and the lower clamping block aluminum plate. The copper pipe filled with nitrogen gas can just penetrate through the circular channel formed by the two grooves. The copper pipe is in contact with the aluminum plate groove, so that the thermal contact resistance between the copper pipe and the aluminum plate is effectively reduced, and the refrigerating efficiency of the semiconductor refrigerating sheet module on the cooling of nitrogen in the copper pipe is better enhanced.

Preferably, the upper side and the lower side of the plurality of semiconductor refrigeration pieces are provided with heat conduction materials. Go up effective seamless connection with the heat conduction material between the contact surface of clamp splice aluminum plate, lower clamp splice aluminum plate and semiconductor refrigeration piece, can effectively reduce the thermal resistance between refrigeration piece and the aluminum plate, strengthen the refrigeration piece greatly to the direct cooling effect of aluminum plate to and the indirect refrigeration effect of refrigeration piece to nitrogen gas. One side of the hot surface of the semiconductor refrigerating sheet, which is in contact with the radiator, is in seamless connection with the heat conducting material, so that the thermal resistance between the refrigerating sheet and the radiator can be effectively reduced, and the efficiency of the radiator for taking away the heat generated by the refrigerating sheet is greatly enhanced.

Preferably, the thickness of the heat insulation sheet is smaller than or equal to that of the semiconductor refrigeration sheet, and a plurality of through holes corresponding to the size of the semiconductor refrigeration sheet are formed in the heat insulation sheet. The heat insulation plates made of special materials are used for isolating the upper clamping block aluminum plate, the lower clamping block aluminum plate and the radiator around the semiconductor refrigeration piece, so that the temperature difference formed between the cold and hot surfaces of the refrigeration piece and the refrigeration energy efficiency ratio of the semiconductor refrigeration piece can be effectively guaranteed, and the cooling effect of nitrogen in a copper pipe is also guaranteed.

Preferably, the front surface of the support shell is not provided with a shell, the back surface of the support shell is provided with a plurality of through holes corresponding to the size of the fan mesh enclosure, and two sides of the support shell are provided with grooves corresponding to the diameter and the position of the copper pipe.

Preferably, one surface of the heat radiator, which is in contact with the heat insulation sheet, is a metal plate, a plurality of metal sheets perpendicular to the metal plate are arranged on the other surface of the metal plate, the metal sheets are perpendicular to the fan, intervals exist between the metal sheets, and the heat radiator is fixedly connected with the heat insulation sheet through screws. The metal sheets are perpendicular to the fan and are spaced from each other to facilitate air flow to remove heat.

The utility model has the advantages that: through the organic combination among the refrigeration module, the heat dissipation module and the heat transfer control module, the device is guaranteed to fully refrigerate nitrogen, and the heat dissipation means of the device to the surrounding environment is provided to the maximum extent, so that the characteristic of semiconductor refrigeration is fully exerted, the requirement on airtight production space oxygen-free and constant-temperature product production conditions is effectively met, a very practical device and technical means are provided for the production field with the requirement on the production conditions of specific products, and the service performance and service life of the produced products can be greatly guaranteed.

Drawings

Fig. 1 is an exploded view of the present invention.

Fig. 2 is a perspective view of an exhaust end of the present invention.

Fig. 3 is a perspective view of an air inlet end of the present invention.

In the figure, a copper pipe is 1, an aluminum plate is arranged on an upper clamping block 2, an aluminum plate is arranged on a lower clamping block 3, a heat insulation strip is 4, a semiconductor refrigeration sheet is 5, a heat insulation sheet is 6, a radiator is 7, a screw is 8, a fan is 9, a bracket shell is 10, and a fan mesh enclosure is 11.

Detailed Description

The technical solution of the present invention is further specifically described below by way of examples and with reference to the accompanying drawings.

Example (b): the flat-plate sleeve type nitrogen cooling device of the embodiment comprises an upper-end aluminum flat plate 2, wherein two sides of the butt joint surface of a lower-end aluminum flat plate 3 are respectively provided with a semicircular groove, and a copper pipe 1 which is introduced with nitrogen can just penetrate through a circular channel formed by the two grooves, as shown in fig. 1, 2 and 3. Wherein the copper pipe and the upper and lower two aluminum plate's recess surface to reach and use the effective seamless joint of heat conducting material between two upper and lower aluminum plate's the contact surface, reach and effectively reduce copper pipe 1 and aluminum plate, and the thermal contact resistance between aluminum plate and the aluminum plate, better reinforcing semiconductor refrigeration piece 5 to the copper intraductal nitrogen refrigerated refrigeration efficiency.

The heat insulation strips 4 made of polyethylene are respectively adhered to the two sides of the aluminum plate, so that the dissipation of cold in the flat plate to the surrounding environment is effectively limited, and meanwhile, the cold produced by the semiconductor refrigerating sheet 5 can be transmitted to nitrogen in the sleeve to the maximum extent. Aluminum plate and refrigeration piece are with heat conducting material seamless joint, can effectively reduce the thermal resistance between refrigeration piece and the aluminum plate, strengthen the refrigeration piece greatly to the direct cooling effect of aluminum plate to and the indirect refrigeration effect of refrigeration piece to nitrogen gas. One side of the hot surface of the refrigeration sheet, which is in contact with the radiator 7, is in seamless connection with the heat conducting material, so that the thermal resistance between the refrigeration sheet and the radiator can be effectively reduced, and the efficiency of the radiator for taking away the heat generated by the refrigeration sheet is greatly enhanced.

The heat insulation plates 6 made of special materials are used for isolating the peripheries of the refrigerating fins, namely the aluminum plates and the radiators 7, so that the temperature difference formed between the cold and hot surfaces of the refrigerating fins and the refrigerating energy efficiency ratio of the semiconductor refrigerating fins 5 can be effectively guaranteed, and the cooling effect on nitrogen in the sleeve is also guaranteed. The fan 13 distributed on one side of the aluminum plate and the radiator fully exerts the advantage of a square structure of the fan, and the fan can greatly reduce the cooling capacity of the aluminum plate and blow away a large amount of heat generated between fins of the radiator to the maximum extent by combining the action of the heat insulation strips 4 on the side surfaces of the aluminum plate.

The fan support is arranged inside the support shell 10, the fan support solves the problem of fixing the fan, and due to the fact that the fan support is extended to be of a special design structure, the top of the fins of the radiator can be covered, wind blown out by the fan can pass through all the fins of the radiator 7 to the maximum extent, and the heat of the radiator is fully discharged to the environment.

The fan mesh enclosure 11 is different from the installation method of the common direct installation on the fan, but the middle part of the fan mesh enclosure 11 passes through a screw through hole of the fan support, then passes through a screw 8 through hole of the fan, and finally is fixed by a nut, the structure can effectively ensure the heat sink 7 and the sucked air, is not influenced by the gap between the fan and the heat sink 7, and leads the air sucked by the fan 9 to be changed into hot air to be dissipated to the surrounding environment through the fins of the heat sink 7 to achieve the purpose of heat dissipation, obviously, if the fan 9 and the fan mesh enclosure 11 are both installed on one side of a sheet metal part of the fan support, the good heat dissipation effect can not be achieved.

The fan mesh enclosure 11 is arranged on the fan bracket, so that the problem that the air inlet side of the fan is damaged by injury due to human error contact or peripheral external interference objects are damaged to the semiconductor refrigerating device is effectively avoided.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Although the terms copper tube, clip aluminum plate, semiconductor chilling plate, etc. are used more herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.

Claims (6)

1. The utility model provides a dull and stereotyped bushing type nitrogen gas cooling device, a serial communication port, including copper pipe (1), both sides are equipped with last clamp splice aluminum plate (2) and lower clamp splice aluminum plate (3) of hugging closely copper pipe (1) respectively about copper pipe (1), go up clamp splice aluminum plate (2) and keep away from copper pipe (1) one side with lower clamp splice aluminum plate (3) and are equipped with a plurality of semiconductor refrigeration pieces (5), and semiconductor refrigeration piece (5) opposite side is equipped with radiator (7), it is equipped with heat insulating sheet (6) to go up clamp splice aluminum plate (2), is equipped with between clamp splice aluminum plate (3) and radiator (7) down, copper pipe (1) left and right sides is equipped with heat insulating strip (4) of hugging closely copper pipe (1), and radiator (7) outside is equipped with support shell (10), and support shell (10) back is equipped with the through-hole, and the through-hole inboard is equipped with fan (9), and the through-hole outside is equipped with fan screen panel (11).

2. The flat-plate sleeve type nitrogen cooling device as claimed in claim 1, wherein the side of the upper clamping block aluminum plate (2) and the lower clamping block aluminum plate (3) close to the copper pipe (1) is provided with a groove corresponding to the contour of the copper pipe (1).

3. The flat-plate sleeve type nitrogen cooling device as claimed in claim 1, wherein the upper and lower sides of the plurality of semiconductor chilling plates (5) are provided with heat conductive materials.

4. The flat-plate sleeve type nitrogen cooling device as claimed in claim 1, wherein the thickness of the heat-insulating sheet (6) is less than or equal to that of the semiconductor refrigerating sheet (5), and a plurality of through holes corresponding to the size of the semiconductor refrigerating sheet (5) are formed in the heat-insulating sheet (6).

5. The flat-plate sleeve type nitrogen cooling device as claimed in claim 1, wherein the front surface of the support shell (10) is free of shell, the back surface of the support shell (10) is provided with a plurality of through holes corresponding to the size of the fan mesh enclosure (11), and two sides of the support shell (10) are provided with grooves corresponding to the diameter and position of the copper pipe (1).

6. The flat-plate sleeve type nitrogen cooling device as claimed in claim 1, wherein one surface of the heat sink (7) contacting the heat insulating sheet (6) is a metal plate, the other surface of the metal plate is provided with a plurality of metal sheets perpendicular to the metal plate, the metal sheets are perpendicular to the fan (9) and spaced from each other, and the heat sink (7) is fixedly connected with the heat insulating sheet (6) through screws (8).

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