CN209820015U - Semiconductor refrigerating and cooling device - Google Patents
Semiconductor refrigerating and cooling device Download PDFInfo
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- CN209820015U CN209820015U CN201920113177.0U CN201920113177U CN209820015U CN 209820015 U CN209820015 U CN 209820015U CN 201920113177 U CN201920113177 U CN 201920113177U CN 209820015 U CN209820015 U CN 209820015U
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- semiconductor refrigeration
- liquid cooling
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- heat dissipation
- cooling device
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Abstract
The utility model provides a semiconductor refrigeration cooling device, which comprises a liquid cooling mechanism, a semiconductor refrigeration mechanism arranged on the liquid cooling mechanism and a heat dissipation mechanism connected to one side of the semiconductor refrigeration mechanism far away from the side connected with the liquid cooling mechanism, wherein the semiconductor refrigeration mechanism comprises a plurality of semiconductor refrigeration pieces and a control mechanism connected with the semiconductor refrigeration pieces and used for driving the semiconductor refrigeration pieces; the cold end of the semiconductor refrigeration piece is connected with the liquid cooling device, and the hot end of the semiconductor refrigeration piece is connected with the heat dissipation mechanism. The utility model discloses a semiconductor refrigeration piece that semiconductor refrigeration mechanism was equipped with according to the Peltier principle for semiconductor refrigeration piece both ends can refrigerate respectively and produce the heat, are connected refrigerated cold junction and liquid cooling mechanism, make the coolant liquid of flowing through liquid cooling mechanism can cool down the cooling under the effect of semiconductor refrigeration piece, and is simple convenient.
Description
Technical Field
The utility model relates to an electron refrigeration plant technical field especially relates to a semiconductor refrigeration cooling device.
Background
The core components of the domestic existing laser depilation instrument, laser stage lamp, laser projector and laser processing equipment are laser luminous sources. The influence of temperature change on the laser is mainly wavelength drift and output instability, and also influences the service life and the light extraction times of the laser. The existing low-power laser light-emitting source adopts a simple mode of natural heat dissipation or heat dissipation by a fan, and for high-power lasers and high-density heat heating pieces, the heat dissipation capacity of the simple heat dissipation modes cannot be met. For this industry, a vapor compression refrigeration technology is often used, and water is used as a cooling carrier. However, the vapor compression refrigeration technology has the defects of environmental pollution, large volume, large noise, vibration, inconvenient installation and maintenance and the like.
SUMMERY OF THE UTILITY MODEL
The utility model provides a semiconductor refrigeration cooling device.
The utility model provides a semiconductor refrigeration cooling device, which comprises a liquid cooling mechanism, a semiconductor refrigeration mechanism arranged on the liquid cooling mechanism and a heat dissipation mechanism connected to one side of the semiconductor refrigeration mechanism far away from the side connected with the liquid cooling mechanism, wherein the semiconductor refrigeration mechanism comprises a plurality of semiconductor refrigeration pieces and a control mechanism connected with the semiconductor refrigeration pieces and used for driving the semiconductor refrigeration pieces; the cold end of the semiconductor refrigeration piece is connected with the liquid cooling device, and the hot end of the semiconductor refrigeration piece is connected with the heat dissipation mechanism.
Furthermore, a plurality of semiconductor refrigeration pieces are connected in series to form a semiconductor refrigeration set, and a plurality of groups of semiconductor refrigeration sets are arranged in parallel.
Furthermore, the liquid cooling mechanism comprises a liquid cooling box provided with a hollow cavity and a cover plate covered with the liquid cooling box.
Furthermore, a plurality of first liquid cooling fins are arranged in the hollow cavity of the liquid cooling box, and the first liquid cooling fins extend from the bottom of the hollow cavity to the outer side of the hollow cavity; a second liquid cooling fin is arranged on one side, connected with the liquid cooling box, of the cover plate, and the second liquid cooling fin extends from the cover plate towards the liquid cooling box; when the cover is closed, the first liquid cooling fins and the second liquid cooling fins are crossed at intervals.
Furthermore, a liquid cooling groove for enabling cooling liquid to move in the same row is formed between the adjacent first liquid cooling fins, and the second liquid cooling fins are inserted into the liquid cooling groove and are spaced from the first liquid cooling fins.
Further, the liquid cooling box is provided with a liquid inlet and a liquid outlet which are communicated with the liquid cooling tank; the liquid inlet and the liquid outlet are both connected with a quick-insertion pipe joint.
Furthermore, the heat dissipation mechanism comprises a heat dissipation plate connected with the hot end of the semiconductor refrigeration piece and a heat dissipation fin arranged on one side of the heat dissipation plate far away from the side connected with the semiconductor refrigeration piece, and the heat dissipation fin extends outwards from the heat dissipation plate.
Further, a heat insulation layer is arranged on the outer side of the liquid cooling box, and the heat insulation layer is made of one or more of sealant, foam and polyurethane.
Furthermore, the semiconductor refrigeration cooling device also comprises a box body used for fixedly installing the liquid cooling mechanism and the heat dissipation mechanism, wherein a heat dissipation fan is arranged outside the box body, and a fan protection cover is arranged outside the heat dissipation fan; and mounting lugs are further arranged on two sides of the box body.
Furthermore, the semiconductor refrigerating sheet is arranged on one side of the liquid cooling box far away from the cover plate and on one side of the cover plate far away from the liquid cooling box.
The utility model has the advantages that: the utility model discloses a semiconductor refrigeration piece that semiconductor refrigeration mechanism was equipped with, according to the Peltier principle for semiconductor refrigeration piece both ends can refrigerate respectively and produce the heat, are connected refrigerated cold junction and liquid cooling mechanism, make the coolant liquid that flows through the liquid cooling mechanism can cool down under the effect of semiconductor refrigeration piece and cool off, simple and convenient, the radiating effect is good, the noise is little, do not vibrate, the environmental protection; meanwhile, the installation and maintenance are simple and convenient; and the heat dissipation mechanism is connected at the hot junction of semiconductor refrigeration piece, is convenient for dispel the heat to the hot junction through heat dissipation mechanism, avoids the high temperature of semiconductor refrigeration piece, can effectively improve the performance and the stability of device.
Drawings
Fig. 1 is a perspective view of an embodiment of the semiconductor refrigeration cooling device of the present invention.
Fig. 2 is a perspective view of another embodiment of the semiconductor refrigeration cooling device of the present invention.
Fig. 3 is a perspective view of another embodiment of the semiconductor refrigeration cooling device of the present invention.
Fig. 4 is a perspective view of still another embodiment of the semiconductor refrigeration cooling device of the present invention.
Fig. 5 is a perspective view of a heat dissipation mechanism according to an embodiment of the semiconductor refrigeration cooling device of the present invention.
Fig. 6 is a perspective view of a cover plate of an embodiment of the semiconductor refrigeration cooling device of the present invention.
Fig. 7 is a perspective view of a liquid cooling box according to an embodiment of the semiconductor refrigeration cooling device of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 ~ fig. 7, the utility model provides a semiconductor refrigeration cooling device, include liquid cooling mechanism 1, install in the semiconductor refrigeration mechanism of liquid cooling mechanism 1 and connect in the semiconductor refrigeration mechanism keep away from the heat dissipation mechanism 2 of the one side of being connected with liquid cooling mechanism 1, semiconductor refrigeration mechanism includes a plurality of semiconductor refrigeration pieces 3 and is connected the control mechanism who is used for driving semiconductor refrigeration piece 3 with semiconductor refrigeration piece 3, the cold junction and the liquid cooling device of semiconductor refrigeration piece 3 are connected, and the hot junction is connected with heat dissipation mechanism 2.
The utility model discloses a semiconductor refrigeration piece 3 that semiconductor refrigeration mechanism was equipped with, according to the Peltier principle, make semiconductor refrigeration piece 3 both ends refrigerate respectively and produce the heat, the cold junction of will refrigerating is connected with liquid cooling mechanism 1, make the coolant liquid flowing through liquid cooling mechanism 1 can cool down under the effect of semiconductor refrigeration piece 3 and cool down, simple and convenient, the radiating effect is good, the noise is little, do not vibrate, the environmental protection; meanwhile, the installation and maintenance are simple and convenient; and the hot junction at semiconductor refrigeration piece 3 is connected heat dissipation mechanism 2, is convenient for dispel the heat to the hot junction through heat dissipation mechanism 2, avoids semiconductor refrigeration piece 3's high temperature, can effectively improve the performance and the stability of device.
In an alternative embodiment, a plurality of semiconductor refrigeration sheets 3 are connected in series to form a semiconductor refrigeration group, and a plurality of semiconductor refrigeration groups are arranged in parallel. Semiconductor refrigeration piece 3 utilizes the peltier principle, can realize the heat production effect of the refrigeration other end of one end, is convenient for provide refrigeration effect, and is simple convenient for liquid cooling box 11.
In an alternative embodiment, the liquid cooling mechanism 1 includes a liquid cooling box 11 having a hollow cavity and a cover plate 12 covering the liquid cooling box 11. A plurality of first liquid cooling fins 111 are arranged in the hollow cavity of the liquid cooling box 11, and the first liquid cooling fins 111 extend from the bottom of the hollow cavity to the outer side of the hollow cavity; a second liquid cooling fin 121 is arranged on one side of the cover plate 12 connected with the liquid cooling box 11, and the second liquid cooling fin 121 extends from the cover plate 12 to the direction of the liquid cooling box 11; when the cover is closed, the first liquid cooling fins 111 and the second liquid cooling fins 121 are crossed and spaced. Adjacent a liquid cooling groove for cooling liquid to go in the same line is formed between the first liquid cooling fins 111, and the second liquid cooling fins 121 are inserted into the liquid cooling groove and spaced from the first liquid cooling fins 111. In the embodiment, the liquid cooling box 11 and the cover plate 12 are arranged, so that the liquid cooling mechanism can be detachably mounted and is convenient to clean and use; the first liquid cooling fins 111 and the second liquid cooling fins 121 are arranged, so that the contact area between the first liquid cooling fins and the cooling liquid can be effectively increased, the cooling effect of the liquid cooling mechanism 1 is further improved, and the liquid cooling mechanism is simple and convenient; the liquid cooling grooves are arranged to facilitate the circulation of cooling liquid, a plurality of liquid cooling grooves can be connected in parallel or in series, and the cross sections of the liquid cooling grooves include but are not limited to round, square or sunflower type; the sealing treatment between the liquid cooling box 11 and the cover plate 12 includes but is not limited to electric welding, brazing, friction welding, sealing ring locking and gluing;
in an alternative embodiment, the liquid cooling tank 11 is provided with a liquid inlet and a liquid outlet which are communicated with the liquid cooling tank; the liquid inlet and the liquid outlet are both connected with a fast inserting pipe joint 13. A quick service coupling 13 is provided to facilitate connection to the coolant line, the quick service coupling 13 including, but not limited to, a quick service type, a pagoda type, and a 360-degree rotatable type.
In an alternative embodiment, the heat dissipation mechanism 2 includes a heat dissipation plate 21 connected to the hot end of the semiconductor chilling plate 3, and a heat dissipation fin 22 installed on a side of the heat dissipation plate 21 away from the side connected to the semiconductor chilling plate 3, where the heat dissipation fin 22 extends outward from the heat dissipation plate 21. The forming process of the heat dissipation fins 22 is extrusion, insert, relieved tooth, welding, and the material is not limited to aluminum, copper, alloy, and the like. The heat dissipation mechanism 2 is arranged, so that heat dissipation is convenient for the hot end of the semiconductor refrigeration sheet 3, and the heat dissipation fins 22 are arranged, so that the heat dissipation area can be increased, and the heat dissipation mechanism is simple and convenient.
In an optional embodiment, a heat insulation layer is arranged on the outer side of the liquid cooling box 11, and the heat insulation layer is made of one or more of a sealant, foam and polyurethane. Set up the insulating layer, can effectively ensure that the temperature of liquid cooling box 11 does not receive external environment influence, increase the stability and the performance of liquid cooling mechanism 1.
In an optional embodiment, the semiconductor refrigeration cooling device further comprises a box body 4 for fixedly installing the liquid cooling mechanism 1 and the heat dissipation mechanism 2, a heat dissipation fan 5 is arranged outside the box body 4, and a fan 5 protective cover 51 is arranged outside the heat dissipation fan 5; and mounting lugs 41 are further arranged on two sides of the box body 4. The heat dissipation fan 5 is arranged, so that air flow among the heat dissipation fins 22 of the heat dissipation mechanism 2 can be further driven, the heat dissipation performance of the heat dissipation mechanism 2 is effectively improved, simplicity and convenience are realized, and the number of the heat dissipation fans 5 can be adjusted; the installation hangers 41 are arranged to facilitate the fixed installation of the box body 4.
In an alternative embodiment, the semiconductor chilling plate 3 is mounted on the side of the liquid cooling box away from the side connected with the cover plate 12 and the side of the cover plate 12 away from the side connected with the liquid cooling box. Specifically, the cold junction of semiconductor refrigeration piece 3 is connected through the heat conduction material between with liquid cooling tank 11 and apron 12, the heat conduction material includes but not limited to silicone grease, heat conduction silica gel pad, heat conduction glue, liquid metal pad. The semiconductor refrigerating pieces 3 are arranged at the two ends of the liquid cooling mechanism 1, so that the refrigerating effect of the liquid cooling mechanism 1 can be further improved.
In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is a more detailed description of the present invention that is presented in conjunction with specific embodiments, and it is not to be understood that the specific embodiments of the present invention are limited to these descriptions. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement.
Claims (10)
1. The semiconductor refrigeration cooling device is characterized by comprising a liquid cooling mechanism, a semiconductor refrigeration mechanism arranged on the liquid cooling mechanism and a heat dissipation mechanism connected to one side, far away from the side connected with the liquid cooling mechanism, of the semiconductor refrigeration mechanism, wherein the semiconductor refrigeration mechanism comprises a plurality of semiconductor refrigeration pieces and a control mechanism connected with the semiconductor refrigeration pieces and used for driving the semiconductor refrigeration pieces; the cold end of the semiconductor refrigeration piece is connected with the liquid cooling device, and the hot end of the semiconductor refrigeration piece is connected with the heat dissipation mechanism.
2. The semiconductor refrigeration cooling device according to claim 1, wherein a plurality of the semiconductor refrigeration pieces are connected in series to form a semiconductor refrigeration group, and a plurality of groups of the semiconductor refrigeration groups are arranged in parallel.
3. The semiconductor refrigeration cooling device according to claim 1, wherein the liquid cooling mechanism comprises a liquid cooling box having a hollow cavity and a cover plate covering the liquid cooling box.
4. The semiconductor refrigeration chiller of claim 3 wherein the hollow chamber of the liquid cooling box contains a plurality of first liquid cooling fins extending from the bottom of the hollow chamber to the outside of the hollow chamber; a second liquid cooling fin is arranged on one side, connected with the liquid cooling box, of the cover plate, and the second liquid cooling fin extends from the cover plate towards the liquid cooling box; when the cover is closed, the first liquid cooling fins and the second liquid cooling fins are crossed at intervals.
5. The semiconductor refrigeration cooling device according to claim 4, wherein a liquid cooling groove for allowing the cooling liquid to flow in the same row is formed between adjacent first liquid cooling fins, and the second liquid cooling fin is inserted into the liquid cooling groove and spaced from the first liquid cooling fins.
6. A semiconductor refrigeration chiller as claimed in claim 5, wherein said liquid cooling tank has a liquid inlet and a liquid outlet communicating with said liquid bath; the liquid inlet and the liquid outlet are both connected with a quick-insertion pipe joint.
7. The semiconductor refrigeration cooling device according to claim 1, wherein the heat dissipation mechanism comprises a heat dissipation plate connected to the hot end of the semiconductor refrigeration plate and a heat dissipation fin mounted on a side of the heat dissipation plate away from the side connected to the semiconductor refrigeration plate, the heat dissipation fin extending outward from the heat dissipation plate.
8. The semiconductor refrigeration cooling device according to claim 3, wherein a heat insulating layer is arranged outside the liquid cooling tank, and the heat insulating layer is made of one or more of a sealant, foam and polyurethane.
9. The semiconductor refrigeration cooling device according to claim 1, further comprising a case for fixedly mounting the liquid cooling mechanism and the heat dissipating mechanism, wherein a heat dissipating fan is disposed outside the case, and a fan protecting cover is disposed outside the heat dissipating fan; and mounting lugs are further arranged on two sides of the box body.
10. The semiconductor refrigeration chiller of claim 3, wherein the semiconductor chilling plates are mounted on both the side of the liquid cooling box remote from the cover plate and the side of the cover plate remote from the liquid cooling box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920113177.0U CN209820015U (en) | 2019-01-23 | 2019-01-23 | Semiconductor refrigerating and cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920113177.0U CN209820015U (en) | 2019-01-23 | 2019-01-23 | Semiconductor refrigerating and cooling device |
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| Publication Number | Publication Date |
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| CN209820015U true CN209820015U (en) | 2019-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920113177.0U Active CN209820015U (en) | 2019-01-23 | 2019-01-23 | Semiconductor refrigerating and cooling device |
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| CN (1) | CN209820015U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113686047A (en) * | 2021-09-01 | 2021-11-23 | 重庆广达自动化设备有限公司 | Heat insulation device for subway electric actuating mechanism |
| CN114153293A (en) * | 2021-11-26 | 2022-03-08 | 中国人民解放军国防科技大学 | Liquid cooling device for adjusting and testing performance of mainboard |
| CN116744546A (en) * | 2023-08-09 | 2023-09-12 | 深圳市凌鑫电子有限公司 | Superconductive heat dissipation battery protection board |
-
2019
- 2019-01-23 CN CN201920113177.0U patent/CN209820015U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113686047A (en) * | 2021-09-01 | 2021-11-23 | 重庆广达自动化设备有限公司 | Heat insulation device for subway electric actuating mechanism |
| CN113686047B (en) * | 2021-09-01 | 2022-05-06 | 重庆广达自动化设备有限公司 | Heat insulation device for subway electric actuating mechanism |
| CN114153293A (en) * | 2021-11-26 | 2022-03-08 | 中国人民解放军国防科技大学 | Liquid cooling device for adjusting and testing performance of mainboard |
| CN116744546A (en) * | 2023-08-09 | 2023-09-12 | 深圳市凌鑫电子有限公司 | Superconductive heat dissipation battery protection board |
| CN116744546B (en) * | 2023-08-09 | 2023-10-24 | 深圳市凌鑫电子有限公司 | Superconductive heat dissipation battery protection board |
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