CN114153293A - Liquid cooling device for adjusting and testing performance of mainboard - Google Patents
Liquid cooling device for adjusting and testing performance of mainboard Download PDFInfo
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- CN114153293A CN114153293A CN202111423678.7A CN202111423678A CN114153293A CN 114153293 A CN114153293 A CN 114153293A CN 202111423678 A CN202111423678 A CN 202111423678A CN 114153293 A CN114153293 A CN 114153293A
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
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Abstract
The invention discloses a liquid cooling device for mainboard performance testing, which comprises a machine frame and a control unit, wherein the machine frame is provided with a mounting position for mounting a tested mainboard and a liquid cooling mechanism for providing liquid cooling heat dissipation for the tested mainboard, a heat conducting partition plate of the liquid cooling mechanism is provided with an air cooling heat dissipation assembly and a semiconductor refrigeration assembly, and control ends of the air cooling heat dissipation assembly and the semiconductor refrigeration assembly are respectively connected with the control unit. The cooling device is integrated on the test board, the liquid after heat dissipation is cooled by a cooling means, the liquid cooling mechanism is used for providing liquid cooling heat dissipation for the tested mainboard and then flowing into the liquid cooling mechanism, the air cooling heat dissipation assembly and the semiconductor cooling assembly on one side of the liquid cooling mechanism are used for dissipating heat of the cooling liquid, and a mode of combining natural air cooling and semiconductor cooling is used, so that a platform and a liquid cooling environment can be provided for some high-performance and high-power chips during adjustment.
Description
Technical Field
The invention relates to test equipment, in particular to a liquid cooling device for mainboard performance debugging, which mainly provides a platform and a liquid cooling environment for some high-performance and high-power chips during debugging.
Background
In a computer system, each motherboard and various chips on the motherboard must be tested before large-scale application to verify the reliability. With the increasing speed of computer updating, the task and difficulty of debugging and testing the motherboard and the chip are also increasing, and especially under the condition that the power consumption of the chip is increasing, the requirements on the test environment are also becoming more and more stringent. The test mode of directly arranging in quick-witted case or rack is unfavorable for the details of test mainboard or chip, hardly knows the holistic circuit condition fast, in order can be more fast and the problem that accurate location chip or mainboard circuit exist, current mode is mainly to be awaited measuring the mainboard and arrange open test frame in to adopt the forced air cooling to dispel the heat to the device on the mainboard. With the increase of the power consumption of the chip, the test platform relying on air cooling is difficult to meet the test requirement of the chip during full-load work, and the test is often influenced by the overheating of the chip. Compared with the conventional solution, the temperature of the chip during full-load work is ensured by adopting liquid cooling, namely, a liquid cooling source is adopted to provide cooling liquid for the test frame for heat dissipation of the chip. However, the pipeline connection of the scheme is complex, the system is large in size, the position of the test board is difficult to move, and inconvenience is brought to the test of the chip and the mainboard.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the invention provides a liquid cooling device for mainboard performance adjustment and test, which integrates refrigeration equipment on a test board, cools liquid after heat dissipation by a refrigeration method, adopts a liquid cooling mode of a liquid cooling mechanism to provide liquid cooling heat dissipation for a tested mainboard and then flows into the liquid cooling mechanism, and dissipates the heat of the cooling liquid through an air cooling heat dissipation component and a semiconductor refrigeration component on one side of the liquid cooling mechanism.
In order to solve the technical problems, the invention adopts the technical scheme that:
the utility model provides a liquid cooling device for mainboard performance accent is surveyed, includes frame and the control unit, be equipped with the installation position that is used for the installation mainboard of being surveyed on the frame and be used for providing the radiating liquid cooling mechanism of liquid cooling for the mainboard of being surveyed, be equipped with air-cooled radiator unit and semiconductor refrigeration subassembly on the heat conduction baffle of liquid cooling mechanism, air-cooled radiator unit and semiconductor refrigeration subassembly's control end links to each other with the control unit respectively.
Optionally, the liquid cooling mechanism includes the circulating pump and the heat transfer water tank integrated as an organic whole with the thermal baffle, be equipped with out water connector and return water connector on the heat transfer water tank, the circulating pump concatenates between heat transfer water tank and play water connector or return water connector, just the control end of circulating pump links to each other with the control unit.
Optionally, a cooling liquid is arranged in the heat exchange water tank, the water outlet connector and the water return connector are respectively provided with a control valve, a control end of the control valve is connected with the control unit, and the heat exchange water tank is provided with a transparent observation window for observing the liquid level.
Optionally, the air-cooled heat dissipation assembly comprises a first heat dissipation fin and a first fan installed on the first heat dissipation fin, the first heat dissipation fin is arranged on the surface of the heat conduction partition plate of the liquid cooling mechanism, and the control end of the first fan is connected with the control unit.
Optionally, the semiconductor refrigeration assembly comprises a second heat radiation fin, a heat radiation base plate, a semiconductor refrigeration piece and a second fan arranged on the second heat radiation fin, the semiconductor refrigeration piece is arranged on the surface of the heat conduction partition plate of the liquid cooling mechanism and is in contact with the heat radiation base plate, the second heat radiation fin is arranged on the surface of the heat radiation base plate, and the control end of the second fan is connected with the control unit.
Optionally, a heat-conducting coupling agent is arranged between the contact surfaces of the semiconductor chilling plate and the heat dissipation substrate.
Optionally, a plurality of first fan positioning columns for installing the first fan are arranged on the first radiating fins, and a plurality of second fan positioning columns for installing the second fan are arranged on the second radiating fins.
Optionally, the number of the semiconductor refrigeration pieces of the semiconductor refrigeration assembly is multiple, and the multiple semiconductor refrigeration pieces are uniformly distributed on the surface of the heat conduction partition plate of the liquid cooling mechanism in an array shape.
Optionally, the installation position is the guide rail, all be equipped with between the top of guide rail and frame and the bottom and reserve the clearance, just it has the wind channel that is used for being surveyed the mainboard refrigeration to reserve between air-cooled radiator unit and the frame.
In addition, the invention also provides an application method of the liquid cooling device for mainboard performance testing, which comprises the following steps:
1) installing a tested mainboard on the installation position, and communicating a liquid cooling pipeline of the tested mainboard with the liquid cooling mechanism;
2) in the testing process, starting a circulating pump and an air-cooled radiating assembly of the liquid cooling mechanism, detecting the temperature of the return cooling liquid flowing back to the liquid cooling mechanism, starting the semiconductor refrigerating assembly if the temperature of the return cooling liquid exceeds a preset threshold value, and otherwise, closing the semiconductor refrigerating assembly; after the test is finished, skipping to execute the next step;
3) and closing the air-cooled heat dissipation assembly and the semiconductor refrigeration assembly.
Compared with the prior art, the invention has the following advantages: the liquid cooling device for mainboard performance regulation comprises a machine frame and a control unit, wherein the machine frame is provided with a mounting position for mounting a mainboard to be tested and a liquid cooling mechanism for providing liquid cooling heat dissipation for the mainboard to be tested, a heat conducting partition plate of the liquid cooling mechanism is provided with an air cooling heat dissipation assembly and a semiconductor refrigeration assembly, and control ends of the air cooling heat dissipation assembly and the semiconductor refrigeration assembly are respectively connected with the control unit, the liquid after heat dissipation is cooled by a refrigeration means, a liquid cooling mode of the liquid cooling mechanism is adopted to provide liquid cooling heat dissipation for the tested mainboard and then the mainboard flows into the liquid cooling mechanism, and the air-cooled radiating assembly and the semiconductor refrigerating assembly on one side of the liquid cooling mechanism are used for radiating the cooling liquid, and a mode of combining natural air cooling and semiconductor refrigerating is adopted, so that a platform and a liquid cooling environment can be provided for some high-performance and high-power chips during adjustment. The liquid cooling device for mainboard performance regulation and test of the invention utilizes liquid cooling to replace air cooling of the traditional test board, greatly improves the heat dissipation efficiency, simultaneously can reduce the area of the radiator on the mainboard, and prevents the local position of the mainboard from being covered by the radiator to influence the test, thereby leading the test to be more convenient. In addition, the semiconductor refrigeration mode for the liquid cooling device for mainboard performance regulation and measurement has the advantages of simple structure, small vibration, low noise and convenient integration.
In the testing process, the application method of the liquid cooling device for testing the performance of the mainboard starts the circulating pump and the air-cooled radiating assembly of the liquid cooling mechanism, detects the temperature of the reflux cooling liquid flowing back to the liquid cooling mechanism, starts the semiconductor refrigerating assembly if the temperature of the reflux cooling liquid exceeds a preset threshold value, and otherwise closes the semiconductor refrigerating assembly, so that the method can realize the following steps: for the condition that the thermal load of the chip is small, the fan is only needed to be started to radiate the cooling liquid, and when the thermal load of the chip is large, the fan and the semiconductor refrigerating piece are simultaneously started to strengthen the radiation of the cooling liquid, so that the heat radiation according to the requirement can be realized, and the effect of reducing the energy consumption can be realized.
Drawings
Fig. 1 is a schematic perspective view of an apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a heat exchange water tank and a heat conducting partition plate in the embodiment of the invention.
Fig. 3 is a schematic structural diagram of a semiconductor refrigeration assembly (without a semiconductor refrigeration piece portion) in an embodiment of the invention.
Illustration of the drawings: 1. a machine frame; 11. an installation position; 2. a liquid cooling mechanism; 20. a thermally conductive spacer; 21. a heat exchange water tank; 22. a water outlet joint; 23. a water return joint; 3. an air-cooled heat dissipation assembly; 31. a first heat radiation fin; 311. a first fan positioning column; 4. a semiconductor refrigeration assembly; 41. a second heat radiation fin; 411. a second fan positioning column; 42. a heat-dissipating substrate; 43. semiconductor refrigeration piece.
Detailed Description
The present invention is described in further detail below with reference to the drawings and specific examples, which are not repeated herein, but the embodiments of the present invention are not limited to the following examples.
As shown in fig. 1, fig. 2 and fig. 3, the liquid cooling apparatus for adjusting and testing the performance of a motherboard in this embodiment includes a machine frame 1 and a control unit, a mounting location 11 for mounting a tested motherboard (as indicated by a mark a in fig. 1) and a liquid cooling mechanism 2 for providing liquid cooling heat dissipation for the tested motherboard are disposed on the machine frame 1, an air-cooled heat dissipation assembly 3 and a semiconductor refrigeration assembly 4 are disposed on a heat conduction partition plate 20 of the liquid cooling mechanism 2, control ends of the air-cooled heat dissipation assembly 3 and the semiconductor refrigeration assembly 4 are respectively connected with the control unit, the air-cooled heat dissipation assembly 3 and the semiconductor refrigeration assembly 4 are mainly used for directly cooling high-temperature water flowing back from a water return joint, and the air-cooled heat dissipation assembly 3 and the semiconductor refrigeration assembly 4 are selectable starting components.
In this embodiment, the liquid cooling mechanism 2 includes a circulation pump and a heat exchange water tank 21 integrated with the heat conductive partition plate 20, the heat exchange water tank 21 is provided with a water outlet connector 22 and a water return connector 23, the circulation pump is connected in series between the heat exchange water tank 21 and the water outlet connector 22 or the water return connector 23, and a control end of the circulation pump is connected to the control unit. The heat exchange water tank 21 and the heat conductive partition 20 may be integrated by direct contact or be designed as a whole as required to enhance heat transfer. The cooling liquid in the heat exchange water tank 21 transfers heat to the air-cooled heat dissipation assembly 3 through the heat conduction partition plate 20, and channels or fins can be added on the heat conduction partition plate 20 as required for enhancing heat transfer. The heat exchange water tank 21 is provided with a water outlet joint 22 and a water return joint 23, and a complete cooling loop can be formed with the cooling pipeline of the tested mainboard through the water outlet joint 22 and the water return joint 23.
In this embodiment, the heat exchange water tank 21 is provided with a cooling liquid, the water outlet joint 22 and the water return joint 23 are both provided with control valves, the control end of the control valve is connected with the control unit, and the heat exchange water tank 21 is provided with a transparent observation window for observing the liquid level.
As an alternative, the cooling liquid in this embodiment is ionized water. However, the cooling liquid of the present invention is not limited to deionized water, and other cooling liquids may be used, but the cooling effect of different cooling liquids may be different.
Referring to fig. 1, in this embodiment, the air-cooled heat dissipation assembly 3 is connected to the machine frame 1 through a water-electricity box (the reference numeral of the liquid cooling mechanism 2 in the figure indicates a component), the control unit and the liquid cooling mechanism 2 are both installed in the water-electricity box, and the control unit includes a controller and a temperature sensor, and is used for providing a water circulation system for the test platform, monitoring the temperature in the water box, adjusting the liquid supply amount, and the like. Meanwhile, a display control screen is arranged, so that the parameter change of the platform can be displayed in real time, and the operation parameters of the testing device can be adjusted according to actual requirements. On frame 1, be equipped with a plurality of water connectors 22 and return water connector 23, confirm the use amount according to actual conditions, water connectors 22 and return water connector 23 also can be regarded as the fluid infusion mouth simultaneously, supply the coolant liquid in the heat exchange water tank 21.
As shown in fig. 2, the air-cooled heat dissipation assembly 3 in this embodiment includes a first heat dissipation fin 31 and a first fan installed on the first heat dissipation fin 31, the first heat dissipation fin 31 is installed on the surface of the heat conductive partition 20 of the liquid cooling mechanism 2, and a control end of the first fan is connected to the control unit.
The first heat dissipation fins 31 are used to increase the heat dissipation area of the system, and as an alternative embodiment, the first heat dissipation fins 31 in this embodiment are rectangular fins, but the first heat dissipation fins 31 of the present invention are not limited to rectangular fins, and different types of fins or enhanced heat dissipation effects are slightly different. As an optional implementation manner, the number of the first fans in this embodiment is 8, and the maximum wind speed of the first fans can reach 12 m/s.
It should be noted that in this embodiment, the shapes of the first heat dissipation fins 31, the first fan positioning columns 311, and the semiconductor chilling plates 43 may be changed according to needs, for example, the shape, size, and number of the first heat dissipation fins 31 are not limited to the form shown in fig. 2, the form of the first fan positioning columns 311 is not limited to the form shown in fig. 2, the arrangement form of the semiconductor chilling plates 43 is not limited to the array arrangement form in the drawing, and various planar or three-dimensional shapes may be constructed.
As shown in fig. 3, in the present embodiment, the semiconductor refrigeration assembly 4 includes a second heat dissipation fin 41, a heat dissipation substrate 42, a semiconductor refrigeration sheet 43, and a second fan installed on the second heat dissipation fin 41, the semiconductor refrigeration sheet 43 is disposed on the surface of the heat conduction partition 20 of the liquid cooling mechanism 2 and is in contact with the heat dissipation substrate 42, the second heat dissipation fin 41 is disposed on the surface of the heat dissipation substrate 42, and a control end of the second fan is connected to the control unit. The second heat dissipation fins 41 are used to increase the heat dissipation area, the semiconductor cooling fins 43 of the heat dissipation substrate 42 are tightly attached, and a heat-conducting coupling agent (such as silicone grease) is disposed between the contact surfaces of the semiconductor cooling fins 43 and the heat dissipation substrate 42 in this embodiment.
In this embodiment, the first heat dissipating fins 31 are provided with a plurality of first fan positioning pillars 311 for installing the first fan, the second heat dissipating fins 41 are provided with a plurality of second fan positioning pillars 411 for installing the second fan, and the first fan and the second fan can be installed and fixed by other positioning structures.
The semiconductor cooling fins 43 are used to further cool the returned cooling fluid. In this embodiment, the number of the semiconductor cooling fins 43 of the semiconductor cooling assembly 4 is multiple, and the multiple semiconductor cooling fins 43 are uniformly distributed on the surface of the heat-conducting partition plate 20 of the liquid cooling mechanism 2 in an array shape.
As an optional implementation manner, the number of the semiconductor refrigeration pieces 43 of the semiconductor refrigeration assembly 4 in this embodiment is 25, the maximum refrigeration capacity of a single piece of the refrigeration piece can reach 30W, and the device can keep the outlet water temperature at about 25 ℃ under the condition that the power consumption of the motherboard chip is 400W. On this basis, through the cold plate structure of reasonable design chip, compare in the forced air cooling, can promote the radiating effect greatly, improve mainboard test environment.
In this embodiment, installation position 11 is the guide rail, all is equipped with the reservation clearance between the top of guide rail and frame 1 and the bottom, and reserves between air-cooled radiator unit 3 and the frame 1 to be used for giving the refrigerated wind channel of mainboard under test. Conventionally, the tested motherboard (as shown by reference sign a in fig. 1) gets power through an external power supply or a matched backplane. In addition, when some electronic components on the mainboard (as shown by reference sign a in fig. 1) to be tested need to be cooled by air, the heat dissipation requirement of the mainboard is met through the air duct between the air-cooled heat dissipation assembly 3 and the machine frame 1, and meanwhile, the heat in the water and electricity box can be taken away, so that the control unit in the water and electricity box is prevented from being overheated.
Refer to fig. 1, 2 and 3. The subrack 1 shown in fig. 1 is designed and processed first, and the air-cooled heat dissipation assembly 3 and the semiconductor refrigeration assembly 4 are installed. And a circulating pump, a heat exchange water tank, a joint and a pipeline in the water and electricity box are connected into a loop. And then, the control line of the circulating pump and the output signal lines of the sensors (temperature sensor, flow sensor, liquid level sensor and the like) in the system are connected to an electric cabinet in the water-electricity box, and the electric cabinet outputs signals to a display control screen. The whole set of test device mainly comprises the following steps in the application process: 1. and (5) preparing for debugging the mainboard. And (5) installing the tested mainboard, switching on a power supply, and installing the water cooling plate. And the inlet and outlet joint on the water cooling plate is connected with the water outlet joint 22 and the water return joint 23 on the testing device, and meanwhile, the controller in the control unit is started, and the circulating pump and the first fan are started. 2. And controlling parameter setting. The rotating speed of the circulating pump and the fan is adjusted and set. According to the temperature of the cooling liquid of the return water joint, whether the semiconductor refrigerating sheet 43 is opened or not is determined, namely when the temperature of the cooling liquid at the outlet is too high, the refrigerating function of the semiconductor refrigerating sheet is opened, and when the temperature is lower (meeting the test requirement), the refrigerating function of the semiconductor refrigerating sheet is closed. 3. And (5) stopping the operation. After the test is finished, the system is closed by one key, so that the operation is simplified. The operation includes, a circulation pump to shut down the system, a blower to shut down the system, and semiconductor refrigeration. Finally, the water outlet joint 22 and the water return joint 23 are disconnected. 4. And (5) liquid supplementing operation. When the cooling liquid in the heat exchange water tank 21 is insufficient, the water outlet joint 22 is connected with the water return joint 23, the other end of the pipeline is connected with the cooling liquid source container, the circulating pump in the water and electricity tank runs for a period of time, and after the cooling liquid in the heat exchange water tank 21 is fully filled, the liquid supplementing device is removed. The liquid supplementing implementation process mainly comprises the following steps: whether the cooling liquid in the heat exchange water tank 21 is sufficient is checked, conventionally, a liquid level meter can be installed in the heat exchange water tank or a visual window is installed on the heat exchange water tank 21, the amount of the supplemented cooling liquid is determined through the vision of the liquid level meter or the observation of the liquid level, and the liquid supplementing operation is implemented. After the liquid supplementing is finished, preparation is carried out, namely the inlet and outlet joint on the water cooling plate is connected with the water outlet joint 22 and the water return joint 23 on the testing device, meanwhile, the controller of the testing device is started, and the circulating pump and the first fan are started. Then, the operation parameters of the device are set, the system is started, and whether the semiconductor chilling plate 43 is started or not is determined according to the actual situation. And after the test is finished, closing the system by one key of the display control screen.
The embodiment further provides an application method of the liquid cooling device for mainboard performance testing, which includes:
1) a tested mainboard is arranged on the installation position 11, and a liquid cooling pipeline of the tested mainboard is communicated with the liquid cooling mechanism 2;
2) in the testing process, starting a circulating pump of the liquid cooling mechanism 2 and the air-cooled radiating assembly 3, detecting the temperature of the return cooling liquid flowing back to the liquid cooling mechanism 2, starting the semiconductor refrigerating assembly 4 if the temperature of the return cooling liquid exceeds a preset threshold value, and otherwise, closing the semiconductor refrigerating assembly 4; after the test is finished, skipping to execute the next step;
3) and closing the air-cooled heat dissipation assembly 3 and the semiconductor refrigeration assembly 4.
As an optional implementation manner, in this embodiment, after the semiconductor refrigeration module 4 is started in step 2), the method further includes the step of dynamically controlling the flow rate of the circulation pump to improve the heat dissipation performance: firstly, inquiring a preset temperature difference curve according to the difference between the reflux cooling liquid temperature and a preset threshold value to obtain a flow instruction, wherein the temperature difference curve is a relation established between the difference between the reflux cooling liquid temperature and the preset threshold value and the flow instruction through pre-calibration; then, the flow is adjusted according to the circulating pump of the obtained flow instruction control liquid cooling mechanism 2 to make the circulating pump of the liquid cooling mechanism 2 output more flows under the condition that the difference between the temperature of the reflux cooling liquid and the preset threshold value is larger, thereby improving the heat dispersion and ensuring the test effect of the mainboard.
The above examples of the present invention are merely examples for clearly illustrating the present invention and do not limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. The utility model provides a liquid cooling device for mainboard performance accent is surveyed, a serial communication port, including frame (1) and the control unit, be equipped with on frame (1) and be used for installing installation position (11) of being surveyed the mainboard and be used for providing radiating liquid cooling mechanism (2) of liquid cooling for being surveyed the mainboard, be equipped with air-cooled radiator unit (3) and semiconductor refrigeration subassembly (4) on heat conduction partition (20) of liquid cooling mechanism (2), the control end of air-cooled radiator unit (3) and semiconductor refrigeration subassembly (4) links to each other with the control unit respectively.
2. The liquid cooling device for mainboard performance testing of claim 1, wherein the liquid cooling mechanism (2) comprises a circulating pump and a heat exchange water tank (21) integrated with the heat conducting partition plate (20), the heat exchange water tank (21) is provided with a water outlet joint (22) and a water return joint (23), the circulating pump is connected in series between the heat exchange water tank (21) and the water outlet joint (22) or the water return joint (23), and a control end of the circulating pump is connected with the control unit.
3. The liquid cooling device for adjusting and testing the performance of the main board according to claim 2, wherein the heat exchange water tank (21) is filled with cooling liquid, the water outlet connector (22) and the water return connector (23) are both provided with control valves, the control ends of the control valves are connected with a control unit, and a transparent observation window for observing the liquid level is installed on the heat exchange water tank (21).
4. The liquid cooling device for mainboard performance testing of claim 1, wherein the air-cooled heat dissipation assembly (3) comprises a first heat dissipation fin (31) and a first fan installed on the first heat dissipation fin (31), the first heat dissipation fin (31) is arranged on the surface of the heat conduction partition plate (20) of the liquid cooling mechanism (2), and a control end of the first fan is connected with the control unit.
5. The liquid cooling device for mainboard performance testing of claim 4, wherein the semiconductor refrigeration assembly (4) comprises second heat dissipation fins (41), a heat dissipation substrate (42), semiconductor refrigeration sheets (43) and a second fan installed on the second heat dissipation fins (41), the semiconductor refrigeration sheets (43) are arranged on the surface of the heat conduction partition plate (20) of the liquid cooling mechanism (2) and are in contact with the heat dissipation substrate (42), the second heat dissipation fins (41) are arranged on the surface of the heat dissipation substrate (42), and a control end of the second fan is connected with the control unit.
6. The liquid cooling device for mainboard performance adjustment and measurement of claim 5, wherein a heat-conducting coupling agent is arranged between the contact surfaces of the semiconductor chilling plates (43) and the heat dissipation substrate (42).
7. The liquid cooling device for mainboard performance testing of claim 6, wherein the first heat dissipating fins (31) are provided with a plurality of first fan positioning pillars (311) for installing a first fan, and the second heat dissipating fins (41) are provided with a plurality of second fan positioning pillars (411) for installing a second fan.
8. The liquid cooling device for mainboard performance adjustment and measurement according to claim 5, wherein the number of the semiconductor cooling plates (43) of the semiconductor cooling assembly (4) is multiple, and the multiple semiconductor cooling plates (43) are uniformly distributed on the surface of the heat conducting partition plate (20) of the liquid cooling mechanism (2) in an array shape.
9. The liquid cooling device for mainboard performance testing of claim 1, characterized in that, installation position (11) is the guide rail, all be equipped with between the top and the bottom of guide rail and frame (1) and reserve the clearance, just it has the wind channel that is used for being surveyed mainboard refrigeration to reserve between air-cooled radiator unit (3) and frame (1).
10. The application method of the liquid cooling device for mainboard performance testing according to any one of claims 1-9, comprising:
1) a tested mainboard is arranged on the mounting position (11), and a liquid cooling pipeline of the tested mainboard is communicated with the liquid cooling mechanism (2);
2) in the testing process, a circulating pump of the liquid cooling mechanism (2) and the air-cooled radiating assembly (3) are started, the temperature of the reflux cooling liquid flowing back to the liquid cooling mechanism (2) is detected, if the temperature of the reflux cooling liquid exceeds a preset threshold value, the semiconductor refrigerating assembly (4) is started, and if not, the semiconductor refrigerating assembly (4) is closed; after the test is finished, skipping to execute the next step;
3) and closing the air-cooled heat dissipation assembly (3) and the semiconductor refrigeration assembly (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111423678.7A CN114153293A (en) | 2021-11-26 | 2021-11-26 | Liquid cooling device for adjusting and testing performance of mainboard |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111423678.7A CN114153293A (en) | 2021-11-26 | 2021-11-26 | Liquid cooling device for adjusting and testing performance of mainboard |
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| CN114153293A true CN114153293A (en) | 2022-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111423678.7A Pending CN114153293A (en) | 2021-11-26 | 2021-11-26 | Liquid cooling device for adjusting and testing performance of mainboard |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103629851A (en) * | 2013-12-04 | 2014-03-12 | 中国科学院光电技术研究所 | Air cooling and liquid cooling dual-purpose heat radiator |
| CN209820015U (en) * | 2019-01-23 | 2019-12-20 | 深圳市华晶温控技术有限公司 | Semiconductor refrigerating and cooling device |
| CN110913654A (en) * | 2019-11-08 | 2020-03-24 | 苏州浪潮智能科技有限公司 | Cabinet type server heat dissipation cooling system |
| CN111176389A (en) * | 2019-12-10 | 2020-05-19 | 中国船舶重工集团公司第七一六研究所 | Semiconductor dehumidification device and liquid cooling server |
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2021
- 2021-11-26 CN CN202111423678.7A patent/CN114153293A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103629851A (en) * | 2013-12-04 | 2014-03-12 | 中国科学院光电技术研究所 | Air cooling and liquid cooling dual-purpose heat radiator |
| CN209820015U (en) * | 2019-01-23 | 2019-12-20 | 深圳市华晶温控技术有限公司 | Semiconductor refrigerating and cooling device |
| CN110913654A (en) * | 2019-11-08 | 2020-03-24 | 苏州浪潮智能科技有限公司 | Cabinet type server heat dissipation cooling system |
| CN111176389A (en) * | 2019-12-10 | 2020-05-19 | 中国船舶重工集团公司第七一六研究所 | Semiconductor dehumidification device and liquid cooling server |
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