CN205450900U - Overall arrangement of water -cooling all -in -one inner structure - Google Patents

Overall arrangement of water -cooling all -in -one inner structure Download PDF

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Publication number
CN205450900U
CN205450900U CN201620191312.XU CN201620191312U CN205450900U CN 205450900 U CN205450900 U CN 205450900U CN 201620191312 U CN201620191312 U CN 201620191312U CN 205450900 U CN205450900 U CN 205450900U
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China
Prior art keywords
mainboard
cooling
heat
water
heat transfer
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Active
Application number
CN201620191312.XU
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Chinese (zh)
Inventor
马梓耀
马鲜
黎正平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen city iron E-sports Technology Co. Ltd.
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Shenzhen Runfeng Technology Co ltd
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Priority to CN201620191312.XU priority Critical patent/CN205450900U/en
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Abstract

The utility model relates to an overall arrangement of water -cooling all -in -one inner structure, concrete technical scheme is: all -in -one inner structure includes cooling part, heat transfer parts, heat dissipation return circuit, power supply unit, mainboard and display card device, and refrigerating fluid among the cooling part feeds through the heat transfer parts through first pipeline, and refrigerating fluid rethread second pipeline flows back in order to form the heat dissipation return circuit among the cooling part, and the heat dissipation is provided with the liquid pump on the return circuit, and the heat transfer parts are installed in the mainboard back, power supply unit installs in the below of mainboard one side, and cooling part installs in the top of mainboard one side, opposite side on the mainboard body is provided with the display card slot, and the notch of display card slot is inserted and is located in the display card slot towards the outside of mainboard body opposite side, display card device. Reasonable overall arrangement can be better the focus of balanced all -in -one organism, the radiating effect of liquid cooling optimization all -in -one.

Description

Water-cooled all-in-one internal structure layout
Technical field
The present invention relates to all-in-one.
Background technology
The internal structure of existing computer all-in-one machine typically all includes mainboard, video card, power supply etc., owing to hardware facility is all to concentrate in a housing with display device, the most reasonably each hardware is disposed, while ensureing that equipment runs well, each hardware facility is made to have good radiating effect, and whole stable being placed of one function, is the problem needing to improve.
Summary of the invention
The technical problem to be solved in the present invention is, it is provided that the all-in-one of a kind of reasonable in internal structure, balance and good heat dissipation effect.
The technical solution adopted for the present invention to solve the technical problems is: water-cooled all-in-one internal structure layout, described all-in-one internal structure includes cooling-part, heat transfer component, heat-radiation loop, supply unit, mainboard and card device, refrigerating fluid in described cooling-part passes through the first pipeline connection to described heat transfer component, described refrigerating fluid is back in described cooling-part form heat-radiation loop by the second pipeline again, being provided with liquid pump on described heat-radiation loop, described heat transfer component is installed on the described mainboard back side;Described supply unit is installed on the lower section of described mainboard side, and described cooling-part is installed on the top of described mainboard side;Opposite side on described mainboard body is provided with card slot, and the notch of described card slot is towards the outside of mainboard body opposite side, and it is interior and parallel with described mainboard that described card device is inserted in described card slot.
Foregoing water-cooled all-in-one internal structure layout, described cooling-part also includes the multiple fin being arranged on its outer surface, described fin be provided above fan.
Foregoing water-cooled all-in-one internal structure layout, described heat transfer component is the can of a hollow, the heat-absorbent surface of described can is close to the heating face of described mainboard, and described can is provided with the water inlet matched with described first pipeline and the outlet matched with described second pipeline.
Foregoing water-cooled all-in-one internal structure layout, described cooling-part is cold type.
Implement technical scheme, at least there is following beneficial effect: the refrigerating fluid in the cooling-part of water-cooling radiating structure passes through the first pipeline connection to heat transfer component, then refrigerating fluid is back in cooling-part form heat-radiation loop by the second pipeline again, the heat on mainboard can promptly be taken away by refrigerating fluid in heat-radiation loop, and refrigerating fluid can recycle so that mainboard heat radiation is in time;Its weight of supply unit is relatively big, and the lower section being arranged on mainboard side is conducive to maintaining the center of gravity of all-in-one;And card slot is provided in opposite side on mainboard, after the insertion of such card device, it keeps flat relative to mainboard, effectively reduces footprint, and all-in-one body is thinning, and center of gravity is difficult to unbalance.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is schematic diagram of the present utility model;
In figure, mark is described as follows:
1, all-in-one body;2, mainboard;3, cooling-part;4, supply unit;5, heat transfer component;6, the first pipeline;7, the second pipeline;8, card device.
Detailed description of the invention
In order to be more clearly understood from the technical characteristic of the present invention, purpose and effect, now comparison accompanying drawing describes the detailed description of the invention of the present invention in detail.
Water-cooled all-in-one internal structure layout as shown in Figure 1, described all-in-one internal structure includes cooling-part 3, heat transfer component 5, heat-radiation loop, supply unit 4, mainboard 2 and card device 8, refrigerating fluid in described cooling-part 3 is communicated to described heat transfer component 5 by the first pipeline 6, described refrigerating fluid is back in described cooling-part 3 by the second pipeline 7 to form heat-radiation loop again, being provided with liquid pump (power resources of refrigerating fluid) on described heat-radiation loop, described heat transfer component 5 is installed on described mainboard 2 back side;Described supply unit 4 is installed on the lower section of described mainboard 2 side, and described cooling-part 3 is installed on the top of described mainboard 2 side;Opposite side on described mainboard 2 body is provided with card slot, and the notch of described card slot is towards the outside of mainboard 2 body opposite side, and it is interior and parallel with described mainboard 2 that described card device 8 is inserted in described card slot.
Refrigerating fluid in the cooling-part 3 of water-cooling radiating structure is communicated to heat transfer component 5 by the first pipeline 6 under the driving of liquid pump, then refrigerating fluid is back in cooling-part 3 form heat-radiation loop by the second pipeline 7 again, the heat on mainboard 2 can promptly be taken away by refrigerating fluid in heat-radiation loop, and refrigerating fluid can recycle, mainboard 2 is made to dispel the heat in time, thus there is the experience of the all-in-one of this water-cooling radiating structure more preferably, service life is longer.Its weight of supply unit 4 is relatively big, and the lower section being arranged on mainboard 2 side is conducive to maintaining the center of gravity of all-in-one;And card slot is provided in opposite side on mainboard 2, after the insertion of such card device 8, it keeps flat relative to mainboard 2, effectively reduces footprint, and all-in-one body 1 is thinning, and center of gravity is difficult to unbalance.
In certain embodiments, described cooling-part 3 also includes the multiple fin being arranged on its outer surface, described fin be provided above fan.Strengthening area of dissipation by multiple fin, fan can optimize the refrigeration of cooling-part 3 timely by the dissipating heat on fin.
In certain embodiments, described heat transfer component 5 is the can of a hollow, the heat-absorbent surface of described can is close to the heating face of described mainboard 2, and described can is provided with the water inlet matched with described first pipeline 6 and the outlet matched with described second pipeline 7.
In certain embodiments, described cooling-part 3 is cold type.Cold type is common cooling-part 3.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various change, combines and change.All within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. made, within should be included in scope of the presently claimed invention.

Claims (4)

1. water-cooled all-in-one internal structure layout, it is characterized in that: described all-in-one internal structure includes cooling-part, heat transfer component, heat-radiation loop, supply unit, mainboard and card device, refrigerating fluid in described cooling-part passes through the first pipeline connection to described heat transfer component, described refrigerating fluid is back in described cooling-part form heat-radiation loop by the second pipeline again, being provided with liquid pump on described heat-radiation loop, described heat transfer component is installed on the described mainboard back side;Described supply unit is installed on the lower section of described mainboard side, and described cooling-part is installed on the top of described mainboard side;Opposite side on described mainboard body is provided with card slot, and the notch of described card slot is towards the outside of mainboard body opposite side, and it is interior and parallel with described mainboard that described card device is inserted in described card slot.
2. water-cooled all-in-one internal structure layout as claimed in claim 1, it is characterised in that: described cooling-part also includes the multiple fin being arranged on its outer surface, described fin be provided above fan.
3. water-cooled all-in-one internal structure layout as claimed in claim 1, it is characterized in that: described heat transfer component is the can of a hollow, the heat-absorbent surface of described can is close to the heating face of described mainboard, and described can is provided with the water inlet matched with described first pipeline and the outlet matched with described second pipeline.
4. water-cooled all-in-one internal structure layout as claimed in claim 1, it is characterised in that: described cooling-part is cold type.
CN201620191312.XU 2016-03-14 2016-03-14 Overall arrangement of water -cooling all -in -one inner structure Active CN205450900U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620191312.XU CN205450900U (en) 2016-03-14 2016-03-14 Overall arrangement of water -cooling all -in -one inner structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620191312.XU CN205450900U (en) 2016-03-14 2016-03-14 Overall arrangement of water -cooling all -in -one inner structure

Publications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106376219A (en) * 2016-09-26 2017-02-01 郑州航空工业管理学院 Heat dissipation apparatus used for big-data all-in-one machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106376219A (en) * 2016-09-26 2017-02-01 郑州航空工业管理学院 Heat dissipation apparatus used for big-data all-in-one machine
CN106376219B (en) * 2016-09-26 2017-09-29 郑州航空工业管理学院 Heat abstractor for big data all-in-one

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C14 Grant of patent or utility model
TR01 Transfer of patent right

Effective date of registration: 20161221

Address after: 518000 A block, Central Avenue, Xixiang street, Baoan District street, Guangdong, Shenzhen, China 3C

Patentee after: Shenzhen city iron E-sports Technology Co. Ltd.

Address before: 518000 Guangdong, Baoan, Central District, Hoi Sau Road, No. 19 international business building on the West Bank, 1502

Patentee before: SHENZHEN RUNFENG TECHNOLOGY CO., LTD.